CN105175965A - Lithium molybdate nano-rod electronic packaging material - Google Patents
Lithium molybdate nano-rod electronic packaging material Download PDFInfo
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- CN105175965A CN105175965A CN201510560165.9A CN201510560165A CN105175965A CN 105175965 A CN105175965 A CN 105175965A CN 201510560165 A CN201510560165 A CN 201510560165A CN 105175965 A CN105175965 A CN 105175965A
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Abstract
The invention discloses a lithium molybdate nano-rod electronic packaging material, and belongs to the technical field of electronic packaging materials. The lithium molybdate nano-rod electronic packaging material comprises, by mass, 65-80% of lithium molybdate nano-rods, 8-12% of polyvinyl alcohol, 0.05-0.5% of sodium fatty alcohol polyoxyethylene ether carboxylate, 4-8% of aluminum isopropoxide, 4-8% of microcrystalline paraffin and 3-7% of water, the diameter of the lithium molybdate nano-rods is 50-100nm, and the length of the lithium molybdate nano-rods is 1-3[mu]m. The lithium molybdate nano-rod electronic packaging material has the characteristics of good insulation property, excellent ageing and corrosion resistance, high heat conduction coefficient, small heat expansion coefficient, good workability, simple preparation process and low preparation temperature, and has good application prospect in the field of electronic packaging materials.
Description
Technical field
The invention belongs to electronic package material technical field, be specifically related to a kind of lithium molybdate nanometer rod electronic package material.
Background technology
Along with electronics miniaturization, multifunction and high performance, more and more higher to the requirement of electronic package material.As desirable electronic package material, the features such as requirement has that thermal expansivity is little, thermal conductivity is high, good insulating, ageing-resistant and fine corrosion resistance, easily processing, can play fixing seal, make electronics from the ability of the interference of external environment, the life-span of improving electronics and enhancing environmental adaptation.
National inventing patent " electronic devices and components ceramics powder used for packing material and production method thereof " (national inventing patent number: ZL201210396718.8), using the composite oxides containing barium oxide, boron oxide, silicon oxide, aluminum oxide, zinc oxide, zirconium white, titanium oxide as raw material, obtains ceramic electronic packaged material at 800-1000 DEG C of sintering.National inventing patent " the solar cell package material that a kind of heat conduction is weather-proof " (national inventing patent number: ZL201210089355.3) discloses using ethylene-vinyl acetate copolymer, ethylenic copolymer, acrylate modified silicates weighting agent, peroxide linking agent, phenols or phosphite ester kind antioxidant and hindered amine light stabilizer as raw material, through batch mixing, melt extrude, casting film-forming and splitting winding four technological processs have prepared the weather-proof battery packaging material of a kind of heat conduction.National inventing patent " a kind of high power LED package epoxy resin composite and preparation method thereof " (national inventing patent number: ZL201310180484.8) discloses using modifying epoxy resin by organosilicon, cycloaliphatic epoxy resin, hydrogenated bisphenol A epoxy resin, defoamer, solidifying agent and polyvalent alcohol etc. as raw material, at 80-150 DEG C of solidification 0.5-3h, after the demoulding, obtain epoxy resin composite packaged material in 90-160 DEG C of solidification 1-10h.
, there is the shortcoming being difficult to process, preparation temperature is high in the features such as intensity is high, thermal expansivity is little although inorganic non-metallic electronic package material has, ageing-resistant performance is good.Polymer electronic package material has easy processing, good insulating, feature that preparation temperature is low, but also there is the shortcomings such as thermal expansivity is large, loss of properties on aging.Therefore, single-material is difficult to the requirement meeting electronic package material performance.
Summary of the invention
The object of the invention is to overcome the above problems, there is provided lithium molybdate nanometer rod as main raw material, introduce polyvinyl alcohol, fatty alcohol-polyoxyethylene ether carboxylic acid sodium, aluminum isopropylate, microcrystalline wax and water, thermal expansivity be little, thermal conductivity is high to obtaining having, good insulating, ageing-resistant and fine corrosion resistance, easily processing and the low lithium molybdate nanometer rod electronic package material of preparation temperature.
The mass percent of lithium molybdate nanometer rod electronic package material provided by the present invention is composed as follows:
Lithium molybdate nanometer rod 65-80%, polyvinyl alcohol 8-12%, fatty alcohol-polyoxyethylene ether carboxylic acid sodium 0.05-0.5%, aluminum isopropylate 4-8%, microcrystalline wax 4-8%, water 3-7%.
The diameter of lithium molybdate nanometer rod of the present invention is 50-100nm, length is 1-3 μm.
The concrete preparation method of lithium molybdate nanometer rod provided by the present invention is as follows:
Using Sodium orthomolybdate, lithium acetate as raw material, water is solvent, wherein the mol ratio of Sodium orthomolybdate and lithium acetate is 1:1, Sodium orthomolybdate, lithium acetate and water Homogeneous phase mixing to be placed in reaction vessel and to seal, in temperature 120-180 DEG C, insulation 12-48h, wherein the weight of Sodium orthomolybdate and lithium acetate is not more than 50% of water weight.
The concrete preparation method of lithium molybdate nanometer rod electronic package material provided by the present invention is as follows:
Lithium molybdate nanometer rod, polyvinyl alcohol, fatty alcohol-polyoxyethylene ether carboxylic acid sodium, aluminum isopropylate, microcrystalline wax and water is taken according to mass ratio, then polyvinyl alcohol is soluble in water, by mechanical stirring, other raw material is mixed with polyvinyl alcohol solution again, and be placed in grinding tool impact briquetting, at 80-120 DEG C, insulation 24-72h, after naturally cooling, obtain lithium molybdate nanometer rod electronic package material.
Compared with prior art, the present invention has following technique effect:
1, the present invention is using lithium molybdate nanometer rod, polyvinyl alcohol, fatty alcohol-polyoxyethylene ether carboxylic acid sodium, aluminum isopropylate, microcrystalline wax and water as raw material, the electronic package material that inorganic nonmetallic nanometer material and macromolecular material are compounded to form can be prepared, the features such as this electronic package material has that thermal expansivity is little, thermal conductivity is high, ageing-resistant and fine corrosion resistance, easily processing, good insulating, have a good application prospect in Electronic Packaging field.
2, the preparation temperature of lithium molybdate nanometer rod electronic package material of the present invention is 80-120 DEG C, and lower than the preparation temperature of inorganic non-metallic packaged material, preparation process is simple, decreases processing step and energy consumption, reduces production cost.
Accompanying drawing explanation
Fig. 1 is the SEM image of lithium molybdate nanometer rod electronic package material prepared by embodiment 1;
Lithium molybdate nanometer rod electronic package material is made up of nanometer rod and random particle as can be seen from Fig., and the diameter of nanometer rod is 50-100nm, length is 1-3 μm.
Embodiment
Below in conjunction with specific embodiment in detail the present invention is described in detail, but the present invention is not limited to following embodiment.
Embodiment 1
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
Embodiment 2
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
Embodiment 3
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
Embodiment 4
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
Embodiment 5
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
Embodiment 6
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
Embodiment 7
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
Embodiment 8
Determine that the mass percent of lithium molybdate nanometer rod electronic package material is composed as follows:
The embodiment of the present invention 1 is as shown in table 1 to the characteristic parameter of embodiment 8 gained lithium molybdate nanometer rod electronic package material:
Table 1
Claims (2)
1. a lithium molybdate nanometer rod electronic package material, is characterized in that: by percentage to the quality, and the formula of this electronic package material is as follows:
2. a kind of lithium molybdate nanometer rod electronic package material as claimed in claim 1, is characterized in that: the diameter of described lithium molybdate nanometer rod is 50-100nm, length is 1-3 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510560165.9A CN105175965B (en) | 2015-09-06 | 2015-09-06 | Lithium molybdate nano-rod electronic packaging material |
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| CN201510560165.9A CN105175965B (en) | 2015-09-06 | 2015-09-06 | Lithium molybdate nano-rod electronic packaging material |
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| CN105175965A true CN105175965A (en) | 2015-12-23 |
| CN105175965B CN105175965B (en) | 2017-05-10 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106479410A (en) * | 2016-10-28 | 2017-03-08 | 安徽工业大学 | A kind of barium aluminate nanometer sheet combined high temperature fluid sealant |
| CN106479404A (en) * | 2016-10-28 | 2017-03-08 | 安徽工业大学 | A kind of zinc molybdate nanometer rods combined high temperature fluid sealant |
| CN106497461A (en) * | 2016-10-28 | 2017-03-15 | 安徽工业大学 | Metaantimmonic acid lanthanum nanosphere high-temperature seal adhesive |
| CN106497487A (en) * | 2016-10-28 | 2017-03-15 | 安徽工业大学 | A kind of molybdic acid indium nanometer rods high-temperature seal adhesive |
| CN106634708A (en) * | 2016-10-28 | 2017-05-10 | 安徽工业大学 | Copper indate nanowire composite high-temperature sealant |
Citations (2)
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| CN102623687A (en) * | 2012-04-09 | 2012-08-01 | 华中科技大学 | Preparation method for high-capacity molybdenum dioxide anode material and application of high-capacity molybdenum dioxide anode material |
| CN103788478A (en) * | 2012-11-01 | 2014-05-14 | 合肥杰事杰新材料股份有限公司 | ATO filled polymer matrix composite material and preparation method thereof |
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2015
- 2015-09-06 CN CN201510560165.9A patent/CN105175965B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102623687A (en) * | 2012-04-09 | 2012-08-01 | 华中科技大学 | Preparation method for high-capacity molybdenum dioxide anode material and application of high-capacity molybdenum dioxide anode material |
| CN103788478A (en) * | 2012-11-01 | 2014-05-14 | 合肥杰事杰新材料股份有限公司 | ATO filled polymer matrix composite material and preparation method thereof |
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| 李言荣主编: "《电子材料》", 31 January 2013, 清华大学出版社 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106479410A (en) * | 2016-10-28 | 2017-03-08 | 安徽工业大学 | A kind of barium aluminate nanometer sheet combined high temperature fluid sealant |
| CN106479404A (en) * | 2016-10-28 | 2017-03-08 | 安徽工业大学 | A kind of zinc molybdate nanometer rods combined high temperature fluid sealant |
| CN106497461A (en) * | 2016-10-28 | 2017-03-15 | 安徽工业大学 | Metaantimmonic acid lanthanum nanosphere high-temperature seal adhesive |
| CN106497487A (en) * | 2016-10-28 | 2017-03-15 | 安徽工业大学 | A kind of molybdic acid indium nanometer rods high-temperature seal adhesive |
| CN106634708A (en) * | 2016-10-28 | 2017-05-10 | 安徽工业大学 | Copper indate nanowire composite high-temperature sealant |
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| CN105175965B (en) | 2017-05-10 |
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