CN106497487A - A kind of molybdic acid indium nanometer rods high-temperature seal adhesive - Google Patents
A kind of molybdic acid indium nanometer rods high-temperature seal adhesive Download PDFInfo
- Publication number
- CN106497487A CN106497487A CN201610959075.1A CN201610959075A CN106497487A CN 106497487 A CN106497487 A CN 106497487A CN 201610959075 A CN201610959075 A CN 201610959075A CN 106497487 A CN106497487 A CN 106497487A
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- CN
- China
- Prior art keywords
- nanometer rods
- molybdic acid
- acid indium
- indium nanometer
- seal adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J173/00—Adhesives based on macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C09J159/00 - C09J171/00; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses a kind of molybdic acid indium nanometer rods high-temperature seal adhesive, belongs to encapsulant technical field.The mass percent composition of the molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:Molybdic acid indium nanometer rods 35 50%, polyketone resin 20 25%, amino silicon oil emulsion 20 25%, potassium methyl silicate 10 15%;A diameter of 50 100nm of the molybdic acid indium nanometer rods, length are 12 μm.Using corrosion-resistant, dystectic molybdic acid indium nanometer rods as inorganic filler, used as adhesive, potassium methyl silicate prepares molybdic acid indium nanometer rods high-temperature seal adhesive as waterproofing agent to the present invention for polyketone resin and amino silicon oil emulsion.The fluid sealant has good sealing, resistance to ag(e)ing, high temperature resistant, corrosion resistance, heat stability, anti-flammability and water resistance, has a good application prospect in the high temperature such as material, chemical industry, metallurgy, the container of Korrosionsmedium, valve and seal for pipe joints field.
Description
Technical field
The invention belongs to encapsulant technical field, and in particular to a kind of molybdic acid indium nanometer rods high-temperature seal adhesive.
Background technology
Fluid sealant is the sealing for the field such as material, chemical industry, metallurgy container, valve and the various seams of pipeline or hole,
To prevent gas, liquid and solids passage, so as to playing sealing, waterproof, fire prevention, anticorrosion, preventing the work(such as seam accumulation foreign body
Energy.National inventing patent " a kind of high-temperature seal adhesive and preparation method thereof " (national inventing patent application number:
200810058057.1) disclose with PVC paste shape resin, alkyd resin, soybean oil, stabilizer, liquid white oil, soda foaming agent
As primary raw material prepared a kind of meet that food safety, sealing property be excellent and sterilizing time up to 45 minutes for sealing
The fluid sealant of food, can use at a temperature of less than 128 DEG C.A kind of national inventing patent " the weather-proof rubber of oil resistant low temperature resistant
Encapsulant and its preparation method and application " (national inventing patent application number:201410281338.9) disclose with mixed milling type
Polyurethane, nitrile rubber or epichlorohydrin rubber, white carbon black, ether ester plasticizer (adipic acid two (Butoxyethoxy second) ester, adipic acid
Polyester), acid-acceptor (magnesium oxide, calcium oxide), antitack agent (stearic acid, calcium stearate, fatty acid soaps, fatty acid amide), 2,
2,4- trimethyl -1,2- dihyaroquinoline polymers, diphenylamines substitutive derivative, 2-mercaptobenzimidazole, peroxide (peroxide
Change the double tertiary fourths of diisopropylbenzene (DIPB), di-tert-butyl peroxide, 1,1- di-t-butyl peroxy -3,3,5- trimethyl thiacyclohexanes, 1,4-
Base peroxy isopropyl base benzene), assistant crosslinking agent (1,2- polybutadiene, N, a N '-penylene BMI, triallyl isocyanide urea
Acid esters, trifunctional methacrylate) a kind of weather-proof rubber packing material of oil resistant has been prepared for raw material.Conventional at present is poly-
Urethane, usually less than 100 DEG C of the use temperature of oil type fluid sealant.
Due to the continuous extension of fluid sealant application, in some special occasions, such as elevated temperature vessel, pipeline and valve,
Except require with bonding and sealing two kinds of functions in addition to, in addition it is also necessary to good high temperature resistant, ageing-resistant, corrosion-resistant, thermally-stabilised,
The several functions such as fire-retardant and water-fast, and existing fluid sealant is difficult to while meeting requirements above.
Content of the invention
The invention aims to problem above is solved, using molybdic acid indium nanometer rods, polyketone resin, amino silicon oil emulsion
With potassium methyl silicate as raw material, be desirably to obtain with good sealing, high temperature resistant, ageing-resistant, corrosion-resistant, heat stability,
The molybdic acid indium nanometer rods high-temperature seal adhesive of fire-retardant and water resistance.
The mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive provided by the present invention is as follows:
Molybdic acid indium nanometer rods 35-50%, polyketone resin 20-25%, amino silicon oil emulsion 20-25%, potassium methyl silicate 10-
15%.
Further, a diameter of 50-100nm of the molybdic acid indium nanometer rods, length are 1-2 μm.
The concrete preparation method of molybdic acid indium nanometer rods provided by the present invention is as follows:
Using sodium molybdate, indium sulfate as raw material, water is solvent, and wherein sodium molybdate is 1 with the mol ratio of indium sulfate:1, by molybdenum
Sour sodium, indium sulfate are placed in after uniformly being mixed with water in reaction vessel and are sealed, and in temperature 120-200 DEG C, are incubated 12-48h, wherein
Sodium molybdate is not more than the 50% of water weight with the weight of indium sulfate.
The concrete preparation method of molybdic acid indium nanometer rods high-temperature seal adhesive provided by the present invention is as follows:
Molybdic acid indium nanometer rods, polyketone resin, amino silicon oil emulsion and potassium methyl silicate are weighed according to mass ratio, then will
The mixing of polyketone resin, amino silicon oil emulsion and potassium methyl silicate, is subsequently added into molybdic acid indium nanometer rods, and mechanical agitation 4-8 hour is mixed
Close uniformly, finally given molybdic acid indium nanometer rods high-temperature seal adhesive.
Compared with prior art, the present invention has following technique effect:
1st, the present invention is using corrosion-resistant, dystectic molybdic acid indium nanometer rods as inorganic filler, polyketone resin and amido silicon oil
Used as adhesive, potassium methyl silicate can prepare molybdic acid indium nanometer rods high-temperature seal adhesive as waterproofing agent to emulsion.This sealing
Glue has good sealing, resistance to ag(e)ing, high temperature resistant, corrosion resistance, heat stability, anti-flammability and water resistance, material,
The high temperature such as chemical industry, metallurgy, the container of Korrosionsmedium, valve and seal for pipe joints field have a good application prospect.
2nd, the present invention is adopted molybdic acid indium nanometer rods fusing point is high, corrosion resistance is strong, good stability, nontoxic and pollution-free, gathers
Ketone resin, amino silicon oil emulsion and potassium methyl silicate are the raw materials of batch production, it is possible to achieve molybdic acid indium nanometer rods elevated-temperature seal
Prepared by the batch of glue.
Description of the drawings
Fig. 1 is the SEM image of molybdic acid indium nanometer rods high-temperature seal adhesive prepared by embodiment 1;
Molybdic acid indium nanometer rods high-temperature seal adhesive is made up of nanometer rods and random granule as can be seen from Fig., nanometer rods straight
Footpath is 50-100nm, and length is 1-2 μm.
Specific embodiment
Below in conjunction with specific embodiment in detail the present invention is described in detail, but the present invention is not limited to following embodiments.
Embodiment 1
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 2
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 3
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 4
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 5
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 6
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 7
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 8
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
The characteristic parameter of the embodiment of the present invention 1 to 8 gained molybdic acid indium nanometer rods high-temperature seal adhesive of embodiment is as shown in table 1:
Table 1
Project | Molybdic acid indium nanometer rods fluid sealant |
Outward appearance | Fine and smooth, homogeneous paste |
Surface drying time (min) | 15-30 |
Extrudability (mL/min) | 70-150 |
Tensile strength (MPa) | ≥10 |
70 DEG C × 70h hot air agings | Tensile strength changes 1-2% |
Sealed operating pressure (MPa) | ≤50 |
Alkali resistance | 48h is without exception in the 1mol/L NaOH solutions |
Acid resistance | 48h is without exception in the 1mol/L HCl solutions |
Resistance to water | 96h is without exception |
Using temperature (DEG C) | ≤300 |
Claims (2)
1. a kind of molybdic acid indium nanometer rods high-temperature seal adhesive, it is characterised in that:By percentage to the quality, the formula of the high-temperature seal adhesive
As follows:
2. a kind of molybdic acid indium nanometer rods high-temperature seal adhesive as claimed in claim 1, it is characterised in that:The molybdic acid indium nanometer rods
A diameter of 50-100nm, length are 1-2 μm.
Priority Applications (1)
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CN201610959075.1A CN106497487A (en) | 2016-10-28 | 2016-10-28 | A kind of molybdic acid indium nanometer rods high-temperature seal adhesive |
Applications Claiming Priority (1)
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CN201610959075.1A CN106497487A (en) | 2016-10-28 | 2016-10-28 | A kind of molybdic acid indium nanometer rods high-temperature seal adhesive |
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Publication Number | Publication Date |
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CN106497487A true CN106497487A (en) | 2017-03-15 |
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CN201610959075.1A Pending CN106497487A (en) | 2016-10-28 | 2016-10-28 | A kind of molybdic acid indium nanometer rods high-temperature seal adhesive |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109179508A (en) * | 2018-11-20 | 2019-01-11 | 安阳师范学院 | A kind of rare earth β-diketone complex3+Adulterate wolframic acid indium nano material and its preparation method and application |
CN109781800A (en) * | 2019-01-25 | 2019-05-21 | 青岛大学 | A kind of gas sensor and preparation method thereof based on metal molybdate nanocomposite |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102676096A (en) * | 2012-05-23 | 2012-09-19 | 江苏省东泰精细化工有限责任公司 | Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide |
CN105086912A (en) * | 2015-09-06 | 2015-11-25 | 安徽工业大学 | Strontium stannate nanorods composite electronic packaging material |
CN105175965A (en) * | 2015-09-06 | 2015-12-23 | 安徽工业大学 | Lithium molybdate nano-rod electronic packaging material |
-
2016
- 2016-10-28 CN CN201610959075.1A patent/CN106497487A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102676096A (en) * | 2012-05-23 | 2012-09-19 | 江苏省东泰精细化工有限责任公司 | Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide |
CN105086912A (en) * | 2015-09-06 | 2015-11-25 | 安徽工业大学 | Strontium stannate nanorods composite electronic packaging material |
CN105175965A (en) * | 2015-09-06 | 2015-12-23 | 安徽工业大学 | Lithium molybdate nano-rod electronic packaging material |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109179508A (en) * | 2018-11-20 | 2019-01-11 | 安阳师范学院 | A kind of rare earth β-diketone complex3+Adulterate wolframic acid indium nano material and its preparation method and application |
CN109781800A (en) * | 2019-01-25 | 2019-05-21 | 青岛大学 | A kind of gas sensor and preparation method thereof based on metal molybdate nanocomposite |
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Application publication date: 20170315 |