CN106497487A - A kind of molybdic acid indium nanometer rods high-temperature seal adhesive - Google Patents

A kind of molybdic acid indium nanometer rods high-temperature seal adhesive Download PDF

Info

Publication number
CN106497487A
CN106497487A CN201610959075.1A CN201610959075A CN106497487A CN 106497487 A CN106497487 A CN 106497487A CN 201610959075 A CN201610959075 A CN 201610959075A CN 106497487 A CN106497487 A CN 106497487A
Authority
CN
China
Prior art keywords
nanometer rods
molybdic acid
acid indium
indium nanometer
seal adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610959075.1A
Other languages
Chinese (zh)
Inventor
裴立宅
魏天
林飞飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui University of Technology AHUT
Original Assignee
Anhui University of Technology AHUT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui University of Technology AHUT filed Critical Anhui University of Technology AHUT
Priority to CN201610959075.1A priority Critical patent/CN106497487A/en
Publication of CN106497487A publication Critical patent/CN106497487A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J173/00Adhesives based on macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C09J159/00 - C09J171/00; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • C09J183/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Sealing Material Composition (AREA)

Abstract

The invention discloses a kind of molybdic acid indium nanometer rods high-temperature seal adhesive, belongs to encapsulant technical field.The mass percent composition of the molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:Molybdic acid indium nanometer rods 35 50%, polyketone resin 20 25%, amino silicon oil emulsion 20 25%, potassium methyl silicate 10 15%;A diameter of 50 100nm of the molybdic acid indium nanometer rods, length are 12 μm.Using corrosion-resistant, dystectic molybdic acid indium nanometer rods as inorganic filler, used as adhesive, potassium methyl silicate prepares molybdic acid indium nanometer rods high-temperature seal adhesive as waterproofing agent to the present invention for polyketone resin and amino silicon oil emulsion.The fluid sealant has good sealing, resistance to ag(e)ing, high temperature resistant, corrosion resistance, heat stability, anti-flammability and water resistance, has a good application prospect in the high temperature such as material, chemical industry, metallurgy, the container of Korrosionsmedium, valve and seal for pipe joints field.

Description

A kind of molybdic acid indium nanometer rods high-temperature seal adhesive
Technical field
The invention belongs to encapsulant technical field, and in particular to a kind of molybdic acid indium nanometer rods high-temperature seal adhesive.
Background technology
Fluid sealant is the sealing for the field such as material, chemical industry, metallurgy container, valve and the various seams of pipeline or hole, To prevent gas, liquid and solids passage, so as to playing sealing, waterproof, fire prevention, anticorrosion, preventing the work(such as seam accumulation foreign body Energy.National inventing patent " a kind of high-temperature seal adhesive and preparation method thereof " (national inventing patent application number: 200810058057.1) disclose with PVC paste shape resin, alkyd resin, soybean oil, stabilizer, liquid white oil, soda foaming agent As primary raw material prepared a kind of meet that food safety, sealing property be excellent and sterilizing time up to 45 minutes for sealing The fluid sealant of food, can use at a temperature of less than 128 DEG C.A kind of national inventing patent " the weather-proof rubber of oil resistant low temperature resistant Encapsulant and its preparation method and application " (national inventing patent application number:201410281338.9) disclose with mixed milling type Polyurethane, nitrile rubber or epichlorohydrin rubber, white carbon black, ether ester plasticizer (adipic acid two (Butoxyethoxy second) ester, adipic acid Polyester), acid-acceptor (magnesium oxide, calcium oxide), antitack agent (stearic acid, calcium stearate, fatty acid soaps, fatty acid amide), 2, 2,4- trimethyl -1,2- dihyaroquinoline polymers, diphenylamines substitutive derivative, 2-mercaptobenzimidazole, peroxide (peroxide Change the double tertiary fourths of diisopropylbenzene (DIPB), di-tert-butyl peroxide, 1,1- di-t-butyl peroxy -3,3,5- trimethyl thiacyclohexanes, 1,4- Base peroxy isopropyl base benzene), assistant crosslinking agent (1,2- polybutadiene, N, a N '-penylene BMI, triallyl isocyanide urea Acid esters, trifunctional methacrylate) a kind of weather-proof rubber packing material of oil resistant has been prepared for raw material.Conventional at present is poly- Urethane, usually less than 100 DEG C of the use temperature of oil type fluid sealant.
Due to the continuous extension of fluid sealant application, in some special occasions, such as elevated temperature vessel, pipeline and valve, Except require with bonding and sealing two kinds of functions in addition to, in addition it is also necessary to good high temperature resistant, ageing-resistant, corrosion-resistant, thermally-stabilised, The several functions such as fire-retardant and water-fast, and existing fluid sealant is difficult to while meeting requirements above.
Content of the invention
The invention aims to problem above is solved, using molybdic acid indium nanometer rods, polyketone resin, amino silicon oil emulsion With potassium methyl silicate as raw material, be desirably to obtain with good sealing, high temperature resistant, ageing-resistant, corrosion-resistant, heat stability, The molybdic acid indium nanometer rods high-temperature seal adhesive of fire-retardant and water resistance.
The mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive provided by the present invention is as follows:
Molybdic acid indium nanometer rods 35-50%, polyketone resin 20-25%, amino silicon oil emulsion 20-25%, potassium methyl silicate 10- 15%.
Further, a diameter of 50-100nm of the molybdic acid indium nanometer rods, length are 1-2 μm.
The concrete preparation method of molybdic acid indium nanometer rods provided by the present invention is as follows:
Using sodium molybdate, indium sulfate as raw material, water is solvent, and wherein sodium molybdate is 1 with the mol ratio of indium sulfate:1, by molybdenum Sour sodium, indium sulfate are placed in after uniformly being mixed with water in reaction vessel and are sealed, and in temperature 120-200 DEG C, are incubated 12-48h, wherein Sodium molybdate is not more than the 50% of water weight with the weight of indium sulfate.
The concrete preparation method of molybdic acid indium nanometer rods high-temperature seal adhesive provided by the present invention is as follows:
Molybdic acid indium nanometer rods, polyketone resin, amino silicon oil emulsion and potassium methyl silicate are weighed according to mass ratio, then will The mixing of polyketone resin, amino silicon oil emulsion and potassium methyl silicate, is subsequently added into molybdic acid indium nanometer rods, and mechanical agitation 4-8 hour is mixed Close uniformly, finally given molybdic acid indium nanometer rods high-temperature seal adhesive.
Compared with prior art, the present invention has following technique effect:
1st, the present invention is using corrosion-resistant, dystectic molybdic acid indium nanometer rods as inorganic filler, polyketone resin and amido silicon oil Used as adhesive, potassium methyl silicate can prepare molybdic acid indium nanometer rods high-temperature seal adhesive as waterproofing agent to emulsion.This sealing Glue has good sealing, resistance to ag(e)ing, high temperature resistant, corrosion resistance, heat stability, anti-flammability and water resistance, material, The high temperature such as chemical industry, metallurgy, the container of Korrosionsmedium, valve and seal for pipe joints field have a good application prospect.
2nd, the present invention is adopted molybdic acid indium nanometer rods fusing point is high, corrosion resistance is strong, good stability, nontoxic and pollution-free, gathers Ketone resin, amino silicon oil emulsion and potassium methyl silicate are the raw materials of batch production, it is possible to achieve molybdic acid indium nanometer rods elevated-temperature seal Prepared by the batch of glue.
Description of the drawings
Fig. 1 is the SEM image of molybdic acid indium nanometer rods high-temperature seal adhesive prepared by embodiment 1;
Molybdic acid indium nanometer rods high-temperature seal adhesive is made up of nanometer rods and random granule as can be seen from Fig., nanometer rods straight Footpath is 50-100nm, and length is 1-2 μm.
Specific embodiment
Below in conjunction with specific embodiment in detail the present invention is described in detail, but the present invention is not limited to following embodiments.
Embodiment 1
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 2
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 3
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 4
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 5
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 6
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 7
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
Embodiment 8
Determine that the mass percent composition of molybdic acid indium nanometer rods high-temperature seal adhesive is as follows:
The characteristic parameter of the embodiment of the present invention 1 to 8 gained molybdic acid indium nanometer rods high-temperature seal adhesive of embodiment is as shown in table 1:
Table 1
Project Molybdic acid indium nanometer rods fluid sealant
Outward appearance Fine and smooth, homogeneous paste
Surface drying time (min) 15-30
Extrudability (mL/min) 70-150
Tensile strength (MPa) ≥10
70 DEG C × 70h hot air agings Tensile strength changes 1-2%
Sealed operating pressure (MPa) ≤50
Alkali resistance 48h is without exception in the 1mol/L NaOH solutions
Acid resistance 48h is without exception in the 1mol/L HCl solutions
Resistance to water 96h is without exception
Using temperature (DEG C) ≤300

Claims (2)

1. a kind of molybdic acid indium nanometer rods high-temperature seal adhesive, it is characterised in that:By percentage to the quality, the formula of the high-temperature seal adhesive As follows:
2. a kind of molybdic acid indium nanometer rods high-temperature seal adhesive as claimed in claim 1, it is characterised in that:The molybdic acid indium nanometer rods A diameter of 50-100nm, length are 1-2 μm.
CN201610959075.1A 2016-10-28 2016-10-28 A kind of molybdic acid indium nanometer rods high-temperature seal adhesive Pending CN106497487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610959075.1A CN106497487A (en) 2016-10-28 2016-10-28 A kind of molybdic acid indium nanometer rods high-temperature seal adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610959075.1A CN106497487A (en) 2016-10-28 2016-10-28 A kind of molybdic acid indium nanometer rods high-temperature seal adhesive

Publications (1)

Publication Number Publication Date
CN106497487A true CN106497487A (en) 2017-03-15

Family

ID=58322379

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610959075.1A Pending CN106497487A (en) 2016-10-28 2016-10-28 A kind of molybdic acid indium nanometer rods high-temperature seal adhesive

Country Status (1)

Country Link
CN (1) CN106497487A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109179508A (en) * 2018-11-20 2019-01-11 安阳师范学院 A kind of rare earth β-diketone complex3+Adulterate wolframic acid indium nano material and its preparation method and application
CN109781800A (en) * 2019-01-25 2019-05-21 青岛大学 A kind of gas sensor and preparation method thereof based on metal molybdate nanocomposite

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102676096A (en) * 2012-05-23 2012-09-19 江苏省东泰精细化工有限责任公司 Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide
CN105086912A (en) * 2015-09-06 2015-11-25 安徽工业大学 Strontium stannate nanorods composite electronic packaging material
CN105175965A (en) * 2015-09-06 2015-12-23 安徽工业大学 Lithium molybdate nano-rod electronic packaging material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102676096A (en) * 2012-05-23 2012-09-19 江苏省东泰精细化工有限责任公司 Preparation method of organosilicon conductive adhesive containing nanorod-shaped zinc oxide
CN105086912A (en) * 2015-09-06 2015-11-25 安徽工业大学 Strontium stannate nanorods composite electronic packaging material
CN105175965A (en) * 2015-09-06 2015-12-23 安徽工业大学 Lithium molybdate nano-rod electronic packaging material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109179508A (en) * 2018-11-20 2019-01-11 安阳师范学院 A kind of rare earth β-diketone complex3+Adulterate wolframic acid indium nano material and its preparation method and application
CN109781800A (en) * 2019-01-25 2019-05-21 青岛大学 A kind of gas sensor and preparation method thereof based on metal molybdate nanocomposite

Similar Documents

Publication Publication Date Title
CN106594413B (en) A kind of layer of structure resistant to corrosion rubber liner
CN104356563A (en) High-temperature/pressure-resistant vapor-resistant fluororubber compounded rubber
CN106497487A (en) A kind of molybdic acid indium nanometer rods high-temperature seal adhesive
CN109651975B (en) Preparation method of nano calcium carbonate for double-component silane modified polyether sealant
CN104610682A (en) Composite PVC water hose and preparation method thereof
CN101602927A (en) The bottom bonding material that is used for chimney and flue rotproofing
CN106084580A (en) A kind of carbon nanotube/polytetrafluoroethylcomposite valve sealing ring of double thin property
CN103642455B (en) A kind of non-drying sealing compound
CN102516913A (en) Environment-friendly flame-retardant fold adhesive and preparation method thereof
CN106479404A (en) A kind of zinc molybdate nanometer rods combined high temperature fluid sealant
CN104927703A (en) Adhesive for steel-plastic composite pipe and preparation method of adhesive
CN103275434A (en) Water supply flexible pipe manufactured by polyvinyl chloride plastics
CN106634708A (en) Copper indate nanowire composite high-temperature sealant
CN106543920A (en) Zinc antimonates nanosphere combined high temperature fluid sealant
CN106188992A (en) A kind of preparation method of microcrystalline Cellulose modification fluorubber
CN106084582A (en) A kind of CNT teflon valve sealing ring of low creep
CN106543931A (en) Anti-oxidant aqueous impervious container fluid sealant of a kind of antirust and preparation method thereof
CN208900779U (en) A kind of DN80 three-port check damper
CN106497461A (en) Metaantimmonic acid lanthanum nanosphere high-temperature seal adhesive
CN106051157B (en) A kind of MULTILAYER COMPOSITE gasket seal for biochemical equipment
CN108548020A (en) A kind of carbon fiber rubber tube of high-strength high temperature-resistant
CN106398065A (en) Anti-aging carbon nanotube-polytetrafluoroethylene valve sealing ring
CN105949687A (en) High-toughness carbon nano-polytetrafluoroethylene valve sealing ring
CN108070339A (en) A kind of bi-component eliminates the unusual smell hollow glass silicone sealant
CN103113643B (en) Method for preparing palm ash-epoxidized natural rubber composite material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170315