CN105171537A - Ultrasonic vibration polishing grinding head device capable of restraining medium frequency errors of optical elements - Google Patents
Ultrasonic vibration polishing grinding head device capable of restraining medium frequency errors of optical elements Download PDFInfo
- Publication number
- CN105171537A CN105171537A CN201510636296.0A CN201510636296A CN105171537A CN 105171537 A CN105171537 A CN 105171537A CN 201510636296 A CN201510636296 A CN 201510636296A CN 105171537 A CN105171537 A CN 105171537A
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- CN
- China
- Prior art keywords
- ultrasonic vibration
- mill
- grinding head
- flexible hinge
- bistrique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/002—Grinding heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
Abstract
The invention discloses an ultrasonic vibration polishing grinding head device capable of restraining medium frequency errors of optical elements. The ultrasonic vibration polishing grinding head device comprises a polishing tool body, a grinding disc, flexible hinge grinding heads and an ultrasonic vibration device capable of driving the polishing tool body for conducting ultrasonic vibration. The grinding disc is rotationally installed on the polishing tool body. A plurality of holes are formed in the grinding disc. The flexible hinge grinding heads are installed in the holes through flexible hinges. Compared with the prior art that corrugated strips are likely to be introduced and medium frequency errors are likely to be generated during traditional small grinding head polishing, the ultrasonic vibration grinding head device enables the whole grinding disc to move in disorder through matching of ultrasonic vibration and movement of the flexible hinge grinding heads, and therefore the medium frequency errors can be effectively removed.
Description
Technical field
The present invention relates to a kind of ultrasonic vibration polishing small abrasive nose, especially relate to a kind of ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error.
Background technology
Along with the development of science and technology and the raising of manufacture level, and under the traction of national significant optical engineering duty and O-E Products demand growth, high-precision optical element is applied to every field more and more widely.Particularly in the middle of large-scale optical engineering, apply a large amount of high-precision optical elements, as: space flight and aviation, strong laser device etc., these are had higher requirement to the precision of optical element.
Optical element surface quality mainly paid close attention to low frequency face shape error and Frequency Surface roughness in the past, also few to the concern of intermediate frequency error.But along with optical element application is diversified and the raising of required precision, people recognize the harm of intermediate frequency error gradually.The light beam high frequency modulated that the intermediate frequency error of optical element can cause and non-linear gain, can focus power by what cause the thread destruction of optical element and reduce light beam, for emerging X-ray optics, the small angle scattering that intermediate frequency error produces greatly can reduce the resolution ratio of optical system.Therefore light laser optical system needs to control the intermediate frequency error of optical element.
Polishing is last procedure in optical element Precision Machining, and the final Accuracy of precision to optical element of therefore polishing is huge, becomes the emphasis of research.In numerous finishing methods, maximum technology is applied in computer-controlled small abrasive nose polishing.Traditional small abrasive nose polishing both retouch intermediate frequency error also can revise low frequency aberration, but also can leave undulatory remaining at polished surface and form intermediate frequency error.Ultrasonic vibrating machining effectively can improve surface quality, reduces cutting force, is especially applicable to the processing of the difficult-to-machine materials such as hard fragility.
Chinese patent application CN1373698A discloses a kind of micro burnishing apparatus adopting ultrasonic vibration, to surface of the work polishing, case hardness increased by polishing bulb under ultrasonic vibration.But this device is only for improving product surface roughness.Chinese patent application CN103817563A discloses a kind of ultrasonic vibration auxiliary polishing device and using method thereof of superhard material micro-structure surface.It is low that it mainly solves mechanical polishing efficiency, and machined surface quality inequality and micro-structural sharply locate the problem of destructible.But it is only applicable to micro-structural, be not be applicable to optical element processing.Chinese patent application CN103551927A discloses a kind of device and processing method of electrophoresis assisting ultrasonic vibratory drive grain motion polishing micropore.Although this front case also belongs to ultrasonic vibration polishing, need electrophoresis to assist, mechanism is different.
Chinese patent CN102873628A discloses a kind of helix machining path for the polishing of numerical control small tool, and this patent reduces intermediate frequency error by changing machining path.CN103317424A discloses a kind of flexible polishing head, and this front case removes intermediate frequency error by the structure changing rubbing head.CN104175192A discloses the how annular self adaptation grinding head for polishing of one, and this front case, by changing the structure of rubbing head, makes bistrique surface more mate with surface of the work, reduces intermediate frequency error with this.
To sum up, yet there are no the device and method utilizing ultrasonic vibration polishing control both optical element intermediate frequency error.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of ultrasonic vibration polishing grinding head apparatus that effectively can suppress optical element intermediate frequency error.
For solving the problems of the technologies described above, technical solution of the present invention is:
Suppress a ultrasonic vibration polishing grinding head apparatus for optical element intermediate frequency error, comprise that buffer is concrete, mill, flexible hinge bistrique and buffer can be driven specifically to carry out the ultrasonic vibration apparatus of ultrasonic vibration; This mill be rotatably installed in this buffer concrete on, which is provided with some holes, described flexible hinge bistrique is arranged in this hole by flexible hinge.
Preferably, described mill is arranged in the concrete dead eye of described buffer by bearing, and by be fixed on this buffer concrete on bearing (ball) cover locate this bearing.
Preferably, described mill is rotated by a driven by motor.
Preferably, described mill is provided with mill spindle, and the axle of described motor is connected with this grinding head shaft.
Preferably, described motor is fixed in a gripper shoe, and this gripper shoe is then specifically connected with described buffer.
Preferably, the grinding face of described mill and flexible hinge bistrique is arranged on polishing pad.
Preferably, described polishing pad is pasted on described mill and flexible hinge bistrique respectively by PUR.
Preferably, described ultrasonic vibration apparatus comprises piezoelectric ceramics, supersonic generator, transducer and ultrasonic transformer; This piezoelectric ceramics is installed on the concrete side side plate of buffer, specifically closely againsts with buffer; This supersonic generator is connected on transducer by holding wire, and transducer is connected with ultrasonic transformer again, and last ultrasonic transformer is connected on piezoelectric ceramics by holding wire.
Preferably, be provided with coolant pipe further, the mouth of pipe of this coolant pipe is towards mill; Be provided with the mill cover plate of ring-type above described mill, this mill cover plate and mill closely cooperate.
Preferably, be provided with syndeton further, this syndeton is the connecting plate being fixed on described buffer concrete side side plate, is provided with buffer substrate tablet between this side plate and connecting plate.
Preferably, described flexible hinge bistrique is provided with different quantity, arrangement mode or elastic modelling quantity according to actual conditions.
Preferably, in the middle of described mill, be provided with the flexible hinge bistrique described in, be provided with multiple described flexible hinge bistrique in the flexible hinge bistrique periphery radioactivity of centre, and be positioned in the middle of mill, from the flexible hinge bistrique of periphery, there is different elastic modelling quantity.
After adopting such scheme, compared with the prior art, the present invention has following outstanding advantages:
1) intermediate frequency error can be suppressed.Undulatory striped is easily introduced in traditional small abrasive nose polishing, and produce intermediate frequency error, flexible hinge bistrique of the present invention does random movement under ultrasonic vibration effect, therefore assorted wrong without chapter by coordinating the motion of ultrasonic vibration and flexible hinge bistrique to make overall mill move, thus can effectively remove intermediate frequency error.
2) polished surface mass effect is good.Traditional small abrasive nose polishing is simple rotarily drive polishing pad by motor and remove material, and ultrasonic vibration is introduced wherein by the present invention, utilizes the advantage of ultrasonic vibration to obtain better surface quality.
3) versatility is good.This grinding head device only need change the structure of connecting plate, can with comprise robot, manipulator and Digit Control Machine Tool with the use of.
4) good cooling results.The present invention adopts cooling fluid built-in, and which makes cooling fluid more effectively to enter in polishing area, reaches better polishing effect.
In a word, the present invention combines setting by ultrasonic vibration and flexible, hinged bistrique, changes motion principle, effectively can eliminate the corrugated striped that traditional small abrasive nose stays, and effectively reduces the intermediate frequency error of optical element polishing.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention;
Fig. 2 is the grinding head for polishing structural representation of the embodiment of the present invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Disclosed is a kind of ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error, as shown in Figures 1 and 2, is preferred embodiment of the present invention.Described ultrasonic vibration polishing grinding head apparatus comprises that buffer is concrete 1, mill 4, flexible hinge bistrique 6 and buffer concrete 1 can be driven to carry out the ultrasonic vibration apparatus of ultrasonic vibration.Wherein:
Described mill 4 is rotatably installed on described buffer concrete 1, and this mill 4 is provided with some holes 41, and described flexible hinge bistrique 6 is arranged in this hole 41 by flexible hinge.Preferably, this mill 4 can be arranged in the dead eye of buffer concrete 1 by bearing 2, and locates this bearing 2 by the bearing (ball) cover 9 be fixed on buffer concrete 1, and this bearing (ball) cover 9 can be fixed on buffer concrete 1 by head bolts 8.
The rotation of this mill 4 can be driven by a motor 13.Particularly, this mill 4 is provided with mill spindle 6, and this grinding head shaft 6 can be connected to mill 4 centre position by mill screw 7, and axle and the grinding head shaft 6 of described motor 13 can adopt key to be connected, thus band movable grinding disc 4 rotates.Described motor 13 can utilize motor screw 12 to be fixed in a gripper shoe 10, and this gripper shoe 10 is reliably connected with supporting screw 11 with buffer concrete 1.
Further, the grinding face of described mill 4 and flexible hinge bistrique 5 is arranged on polishing pad 22, and this polishing pad 22 can be pasted on mill 4 and flexible hinge bistrique 5 respectively by PUR.
Described ultrasonic vibration apparatus carries out ultrasonic vibration in order to drive buffer concrete 1, and then is with movable grinding disc 4 and flexible hinge bistrique 5 to vibrate.Particularly, this ultrasonic vibration apparatus comprises piezoelectric ceramics 14, supersonic generator 15, transducer 16 and ultrasonic transformer 17; This piezoelectric ceramics 14 is installed on the side side plate of buffer concrete 1, closely againsts with buffer concrete 1; This supersonic generator 15 is connected on transducer 16 by holding wire, and transducer 16 is connected with ultrasonic transformer 17 again, and last ultrasonic transformer 17 is connected on piezoelectric ceramics 14 by holding wire.
During use, polishing grinding head apparatus of the present invention can be arranged on the end effector of robot, manipulator or Digit Control Machine Tool by syndeton.Particularly, this syndeton can for being fixed on the connecting plate 19 of the concrete 1 side side plate of buffer.For reducing the impact of ultrasonic vibration on robot or Position Accuracy for NC Machines, buffer substrate tablet 18 can be set between the side plate of buffer concrete 1 and connecting plate 19 as far as possible, and by attachment screw 20, concrete for buffer 1, buffer substrate tablet 18 be connected with connecting plate 19.
Be provided with coolant pipe 21 further, the mouth of pipe of this coolant pipe 21 is towards mill 4, and this coolant pipe 21 can be arranged in described gripper shoe 10.Overflow to prevent cooling fluid and reduce cooling effect, can be provided with the mill cover plate 3 of ring-type above described mill 4, this mill cover plate 3 closely cooperates with mill 4.
During work, be fixed on the ring flange of end effector of robot by connecting plate 19, robot is moved to polishing position.Motor 13 open belt movable grinding disc 4 rotates, and cooling fluid is opened, and by coolant pipe 21, cooling fluid is transported to mill 4 inside, ensures its cooling effect.The ultrasonic signal that supersonic generator 15 produces reaches piezoelectric ceramics 14 place by holding wire, transducer 16 and ultrasonic transformer 17, and piezoelectric ceramics 14 produces ultrasonic vibration, and then drives buffer concrete 1 to carry out ultrasonic vibration.The polishing pad 22 be pasted onto on mill 4 and flexible hinge bistrique 5 also has ultrasonic vibration, and then carries out polishing to optical element while carrying out rotating.Meanwhile, because the elastic reaction of flexible hinge will make flexible hinge bistrique 5 not only ultrasonic vibration in each hole of mill 4, and certain random file is had.Therefore, in polishing process, the running orbit of these flexible hinge bistriques 5 will make overall mill 4 move assorted mistake without chapter, grind away the initial corrugated striped produced, the final intermediate frequency error reducing small abrasive nose.
The present invention according to actual optical components manufacturing procedure and required precision, can change different polishing pads 22 and flexible hinge bistrique 5.And the quantity of flexible hinge bistrique 5, arrangement mode or elastic modelling quantity can be changed according to actual conditions, also can change the physical property of its flexible hinge, to change its kinetic characteristic.Coordinate simultaneously and change the signal frequency of supersonic generator 15 and the movement locus of buffer concrete 1, more reasonably can reduce the intermediate frequency error of optical element.More preferably, the flexible hinge bistrique 5 described in one is provided with in the middle of described mill 4, be provided with multiple described flexible hinge bistrique 5 in the flexible hinge bistrique 5 periphery radioactivity of centre, and be positioned in the middle of mill 4, from the flexible hinge bistrique 5 of periphery, there is different elastic modelling quantity.
The syndetons such as described connecting plate 19 can according to connecting its fit form of type change of machine, can jointly control the movement locus of ultrasonic vibration small abrasive nose with the equipment such as industrial robot or Digit Control Machine Tool.
Described supersonic generator 15 can produce the ultrasonic signal of different frequencies according to the technological requirement of reality, make piezoelectric ceramics 14 produce the ultrasonic vibration of different frequency through transducer 16 and ultrasonic transformer 17.And the position of piezoelectric ceramics 14 on buffer concrete 1 can be changed according to technological requirement, the ultrasonic vibration of different directions can be produced.
The above is only preferred embodiment of the present invention, not imposes any restrictions technical scope of the present invention, therefore the change in every case done according to claim of the present invention and description or modification, all should belong within scope that patent of the present invention contains.
Claims (10)
1. can suppress a ultrasonic vibration polishing grinding head apparatus for optical element intermediate frequency error, it is characterized in that: comprise buffer concrete (1), mill (4), flexible hinge bistrique (6) and buffer can be driven specifically to carry out the ultrasonic vibration apparatus of ultrasonic vibration; This mill (4) is rotatably installed on this buffer concrete (1), and which is provided with some holes (41), described flexible hinge bistrique (6) is arranged in this hole by flexible hinge.
2. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, it is characterized in that: described mill (4) is arranged in the dead eye of described buffer concrete (1) by bearing (2), and by be fixed on this buffer concrete on bearing (ball) cover (9) locate this bearing (2).
3. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, is characterized in that: described mill (4) is by a motor (13) driven rotary; Described mill (4) is provided with mill spindle (6), and the axle of described motor (13) is connected with this grinding head shaft; Described motor (13) is fixed in a gripper shoe (10), and this gripper shoe is then connected with described buffer concrete (1).
4. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, is characterized in that: described mill (4) and the grinding face of flexible hinge bistrique (5) are arranged on polishing pad (22).
5. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 4, is characterized in that: described polishing pad (22) is pasted on described mill (4) and flexible hinge bistrique (5) respectively by PUR.
6. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, is characterized in that: described ultrasonic vibration apparatus comprises piezoelectric ceramics (14), supersonic generator (15), transducer (16) and ultrasonic transformer (17); This piezoelectric ceramics (14) is installed on the side side plate of buffer concrete (1), specifically closely againsts with buffer; This supersonic generator (15) is connected on transducer (16) by holding wire, and transducer is connected with ultrasonic transformer (17) again, and last ultrasonic transformer (17) is connected on piezoelectric ceramics (14) by holding wire.
7. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, is characterized in that: be provided with coolant pipe (21) further, the mouth of pipe of this coolant pipe is towards mill (4); Described mill (4) top is provided with the mill cover plate (3) of ring-type, and this mill cover plate and mill closely cooperate.
8. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, it is characterized in that: be provided with syndeton further, this syndeton, for being fixed on the connecting plate (19) of described buffer concrete (1) side side plate, is provided with buffer substrate tablet (18) between this side plate and connecting plate.
9. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, is characterized in that: described flexible hinge bistrique (5) is provided with different quantity, arrangement mode or elastic modelling quantity according to actual conditions.
10. the ultrasonic vibration polishing grinding head apparatus suppressing optical element intermediate frequency error according to claim 1, it is characterized in that: in the middle of described mill (4), be provided with the flexible hinge bistrique (5) described in, be provided with multiple described flexible hinge bistrique (5) in flexible hinge bistrique (5) the periphery radioactivity of centre, and be positioned in the middle of mill (4), from the flexible hinge bistrique of periphery, there is different elastic modelling quantity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510636296.0A CN105171537B (en) | 2015-09-30 | 2015-09-30 | It can inhibit the ultrasonic vibration polishing grinding head apparatus of optical element intermediate frequency error |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510636296.0A CN105171537B (en) | 2015-09-30 | 2015-09-30 | It can inhibit the ultrasonic vibration polishing grinding head apparatus of optical element intermediate frequency error |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105171537A true CN105171537A (en) | 2015-12-23 |
| CN105171537B CN105171537B (en) | 2019-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510636296.0A Expired - Fee Related CN105171537B (en) | 2015-09-30 | 2015-09-30 | It can inhibit the ultrasonic vibration polishing grinding head apparatus of optical element intermediate frequency error |
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| Country | Link |
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| CN (1) | CN105171537B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110842660A (en) * | 2019-11-26 | 2020-02-28 | 东台施迈尔新材料科技有限公司 | Ceramic part surface vibration polishing device |
| CN111185816A (en) * | 2020-01-10 | 2020-05-22 | 中国工程物理研究院激光聚变研究中心 | Two-dimensional random vibration polishing machine tool and polishing method thereof |
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|---|---|---|---|---|
| GB491610A (en) * | 1936-04-10 | 1938-09-06 | Georges Fernand Brendel | Improvements in or relating to grinding and polishing machines for hard materials |
| CN1077406A (en) * | 1992-04-02 | 1993-10-20 | 株式会社关西工厂工业 | The method and apparatus of polished board |
| US5993300A (en) * | 1997-08-18 | 1999-11-30 | Hashimoto; Hiroshi | Ultrasonic vibration composite processing tool |
| DE4447162B4 (en) * | 1994-12-29 | 2004-07-08 | Günther Böhler GmbH | Device for processing surfaces |
| CN1517178A (en) * | 2003-01-27 | 2004-08-04 | 京特・伯勒尔有限公司 | Surface treatment device |
| JP2005096016A (en) * | 2003-09-24 | 2005-04-14 | Japan Science & Technology Agency | Vibration polishing method and device |
| CN2912913Y (en) * | 2006-06-06 | 2007-06-20 | 广东科达机电股份有限公司 | Major diameter grinding head for polishing |
| CN2920537Y (en) * | 2006-07-03 | 2007-07-11 | 陆永添 | Polishing grinding wheel head capable of automatic fitting processed object surface |
| CN204954499U (en) * | 2015-09-30 | 2016-01-13 | 厦门理工学院 | Ultrasonic vibration polish grinding head device that can restrain optical element intermediate frequency error |
-
2015
- 2015-09-30 CN CN201510636296.0A patent/CN105171537B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB491610A (en) * | 1936-04-10 | 1938-09-06 | Georges Fernand Brendel | Improvements in or relating to grinding and polishing machines for hard materials |
| CN1077406A (en) * | 1992-04-02 | 1993-10-20 | 株式会社关西工厂工业 | The method and apparatus of polished board |
| DE4447162B4 (en) * | 1994-12-29 | 2004-07-08 | Günther Böhler GmbH | Device for processing surfaces |
| US5993300A (en) * | 1997-08-18 | 1999-11-30 | Hashimoto; Hiroshi | Ultrasonic vibration composite processing tool |
| CN1517178A (en) * | 2003-01-27 | 2004-08-04 | 京特・伯勒尔有限公司 | Surface treatment device |
| JP2005096016A (en) * | 2003-09-24 | 2005-04-14 | Japan Science & Technology Agency | Vibration polishing method and device |
| CN2912913Y (en) * | 2006-06-06 | 2007-06-20 | 广东科达机电股份有限公司 | Major diameter grinding head for polishing |
| CN2920537Y (en) * | 2006-07-03 | 2007-07-11 | 陆永添 | Polishing grinding wheel head capable of automatic fitting processed object surface |
| CN204954499U (en) * | 2015-09-30 | 2016-01-13 | 厦门理工学院 | Ultrasonic vibration polish grinding head device that can restrain optical element intermediate frequency error |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110842660A (en) * | 2019-11-26 | 2020-02-28 | 东台施迈尔新材料科技有限公司 | Ceramic part surface vibration polishing device |
| CN111185816A (en) * | 2020-01-10 | 2020-05-22 | 中国工程物理研究院激光聚变研究中心 | Two-dimensional random vibration polishing machine tool and polishing method thereof |
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| Publication number | Publication date |
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| CN105171537B (en) | 2019-03-01 |
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