CN105170550A - Cleaning device and etching system - Google Patents

Cleaning device and etching system Download PDF

Info

Publication number
CN105170550A
CN105170550A CN201510568134.8A CN201510568134A CN105170550A CN 105170550 A CN105170550 A CN 105170550A CN 201510568134 A CN201510568134 A CN 201510568134A CN 105170550 A CN105170550 A CN 105170550A
Authority
CN
China
Prior art keywords
ultrasonic wave
vibration plate
cleaning device
wave vibration
isolation channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510568134.8A
Other languages
Chinese (zh)
Other versions
CN105170550B (en
Inventor
郝慧敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Ordos Yuansheng Optoelectronics Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201510568134.8A priority Critical patent/CN105170550B/en
Publication of CN105170550A publication Critical patent/CN105170550A/en
Application granted granted Critical
Publication of CN105170550B publication Critical patent/CN105170550B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00Accessories or details of general applicability for machines or apparatus for cleaning
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The invention discloses a cleaning device and an etching system. The cleaning device comprises an ultrasonic generating device and an isolating layer, wherein the isolating layer is arranged on the outer part of the ultrasonic generating device; the ultrasonic generating device is used for generating and emitting ultrasonic waves and carrying out ultrasonic cleaning on an aeration tube; and the isolating layer is used for isolating the ultrasonic generating device from an etching solution in an etching slot to prevent the ultrasonic generating device from contacting the etching solution. According to the technical scheme adopted by the invention, the ultrasonic generating device can be used for quickly and conveniently cleaning the aeration tube in the etching slot, so that the operation rate of the etching system is improved. Meanwhile, the isolating layer can effectively protect the ultrasonic generating device to prevent the ultrasonic generating device from being corroded by the etching solution, so that the service life of the cleaning device is guaranteed.

Description

Cleaning device and etch system
Technical field
The present invention relates to Display Technique field, particularly a kind of cleaning device and etch system.
Background technology
When frit being processed into substrate glass, when needing to utilize etching solution to carry out reduction processing, to form satisfactory substrate glass.
Wherein, carrying out in reduction processing process, for promoting the reaction rate of etching solution and glass and reacting homogeneity, often arrange some aeration tubes in the bottom of etching bath, these aeration tubes are provided with the venthole that several apertures are less than 1mm.But, along with the carrying out of reduction processing, the fluosilicate (i.e. glass sand) generated after etching solution and glass reaction can be deposited on bottom etching bath, now, aeration tube also can deposit some fluosilicates, thus cause the blocking of venthole, the problems such as bubble agitation effect declines, and frit etching is uneven.
For solving the problems of the technologies described above, in prior art, just a manual cleaning need be carried out to aeration tube at set intervals often.But, adopt the mode of this manual cleaning, not only consuming time longer, and operating difficulties, especially for some corner location, cleaning difficulty is larger
Summary of the invention
The invention provides a kind of cleaning device and etch system, can clean the aeration tube in etching fast, easily.
For achieving the above object, the invention provides a kind of cleaning device, for cleaning the aeration tube in etching bath, comprising: ultrasonic generator and separation layer, described separation layer is arranged on the outside of described ultrasonic generator;
Described ultrasonic generator for generation of and launch ultrasonic wave, to carry out Ultrasonic Cleaning to described aeration tube;
Described separation layer, for isolating the etching solution in described ultrasonic generator and described etching bath, contacts with described etching solution to avoid ultrasonic generator.
Alternatively, described ultrasonic generator comprises: ultrasonic wave vibration plate and wire, and described wire is connected with ultrasonic wave vibration plate;
Described wire is used for, to described ultrasonic wave vibration plate electric energy transmitting after being connected with power supply, producing ultrasonic wave for described ultrasonic wave vibration plate.
Alternatively, described separation layer is the cold Teflon film being plated on the surface of described ultrasonic wave vibration plate.
Alternatively, described separation layer is isolation channel, and described ultrasonic wave vibration plate is positioned at described isolation channel, is provided with ultrasound conductive medium between described isolation channel and described ultrasonic wave vibration plate;
Described ultrasonic wave vibration plate for generation of and launch ultrasonic wave, carry out Ultrasonic Cleaning with the described aeration tube that the distance between the bottom to described isolation channel is in preset range.
Alternatively, also comprise: supporting construction, described supporting construction is arranged at the bottom of described isolation channel, and described supporting construction is for supporting described ultrasonic wave vibration plate.
Alternatively, the bottom of described isolation channel is provided with the microscope carrier for carrying pending frit, the region that the upper surface that described supporting construction is positioned at described microscope carrier in the orthographic projection of the upper surface of described microscope carrier limits.
Alternatively, also comprise: fixed structure, described fixed structure is arranged between described ultrasonic wave vibration plate and the sidewall of described isolation channel;
Described fixed structure is used for the sidewall of described ultrasonic wave vibration plate and described isolation channel to fix.
Alternatively, the material of described isolation channel is: polytetrafluoroethylene (PTFE) or polypropylene.
Alternatively, the thickness of the bottom of described isolation channel is less than or equal to 1mm.
Alternatively, described ultrasound conductive medium is the aqueous solution.
Alternatively, purple litmus reagent is dissolved with in the described aqueous solution.
Alternatively, described preset range comprises: 0 ~ 150mm.
Alternatively, also comprise: snap joint, described snap joint is through described separation layer, and the two ends of described snap joint are connected with described ultrasonic wave vibration plate and described wire respectively.
Alternatively, the outer setting of described wire has stainless steel spool, and described stainless steel spool is connected with described snap joint near one end of described separation layer, is connected with described snap joint to make the described wire in described stainless steel spool.
Alternatively, described stainless steel spool is provided with hand handle away from one end of described separation layer.
Alternatively, the surface of described snap joint and described stainless steel spool is provided with protective layer, and the material of described protective layer is plastics.
Alternatively, the material of described ultrasonic wave vibration plate is 316L stainless steel.
For achieving the above object, present invention also offers a kind of etch system, comprising: cleaning device, described cleaning device adopts above-mentioned cleaning device.
The present invention has following beneficial effect:
The invention provides a kind of cleaning device and etch system, wherein this cleaning device comprises: ultrasonic generator and separation layer, and separation layer is arranged on the outside of ultrasonic generator; Ultrasonic generator for generation of and launch ultrasonic wave, to carry out Ultrasonic Cleaning to aeration tube; Separation layer, for isolating the etching solution in ultrasonic generator and etching bath, contacts with etching solution to avoid ultrasonic generator.Technical scheme of the present invention, by utilizing ultrasonic generator, can be cleaned the aeration tube in etching bath fast, easily, and then promotes etch system mobility.Meanwhile, separation layer effectively can protect ultrasonic generator, to avoid ultrasonic generator to be etched corrosion, thus ensure that the service life of cleaning device.
Accompanying drawing explanation
The structural representation of the cleaning device that Fig. 1 provides for the embodiment of the present invention one;
Fig. 2 is the top view of cleaning device in Fig. 1;
The structural representation of the cleaning device that Fig. 3 provides for the embodiment of the present invention two.
Detailed description of the invention
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, cleaning device provided by the invention and etch system are described in detail.
Embodiment one
The structural representation of the cleaning device that Fig. 1 provides for the embodiment of the present invention one, Fig. 2 is the top view of cleaning device in Fig. 1, as depicted in figs. 1 and 2, this cleaning device is used for cleaning the aeration tube 2 in etching bath 1, comprise: ultrasonic generator 3 and separation layer, separation layer is arranged on the outside of ultrasonic generator 3; Ultrasonic generator 3 for generation of and launch ultrasonic wave, to carry out Ultrasonic Cleaning to aeration tube 2; Separation layer, for isolating the etching solution in ultrasonic generator 3 and etching bath 5, contacts with etching solution 6 to avoid ultrasonic generator 3.
Technical scheme of the present invention, by utilizing ultrasonic generator 3, can be cleaned the aeration tube 2 in etching bath 1 fast, easily.Meanwhile, separation layer can effectively protect ultrasonic generator 3, to avoid ultrasonic generator 3 to be etched corrosion, thus ensure that the service life of cleaning device.
In the present embodiment, ultrasonic generator 3 specifically comprises: ultrasonic wave vibration plate 302 and wire 301, and wire 301 is connected with ultrasonic wave vibration plate 302; Wire 301 for after being connected with power supply to ultrasonic wave vibration plate 302 electric energy transmitting, produce ultrasonic wave for ultrasonic wave vibration plate 302.
Shown in Figure 1, this separation layer is isolation channel 5, and ultrasonic wave vibration plate 302 is positioned at isolation channel 5, is provided with ultrasound conductive medium 8 between isolation channel 5 and ultrasonic wave vibration plate 302; Ultrasonic wave vibration plate 302 for generation of and launch ultrasonic wave, carry out Ultrasonic Cleaning with the aeration tube 2 that the distance between the bottom to isolation channel 5 is in preset range.In the present embodiment, alternatively, the material of ultrasonic wave vibration plate 302 is 316L stainless steel, adopts 316L stainless steel to prepare ultrasonic wave vibration plate 302, while output ultrasonic wave is stablized in guarantee, can also effectively reduce equipment cost.
Be described in detail to the cleaning process of cleaning device provided by the invention and principle below.
First, isolation channel 5 is moved in etching bath 1 (having etching solution 6 in etching bath 1); Then, the wire 301 in ultrasonic generator 3 is connected with power supply; Now, ultrasonic wave vibration plate 302 produces ultrasonic wave, and this ultrasonic wave is passed to isolation channel 5 by ultrasound conductive medium 8, and is perforated through isolation channel 5, and the ultrasonic wave being perforated through isolation channel 5 is passed to aeration tube 2 place by etching solution 6, thus cleans aeration tube 2; Finally, to be cleaned complete after, isolation channel 5 is shifted out etching bath 1.
In the present embodiment, alternatively, to be the material of isolation channel 5 be the material of isolation channel 5: polytetrafluoroethylene (PTFE) or polypropylene.Because polytetrafluoroethylene (PTFE) or polypropylene have good etching resistant liquid corrosivity, therefore effectively can isolate ultrasonic wave vibration plate 302 and etching solution 6, thus play the effect of protection ultrasonic wave vibration plate 302.It should be noted that, although ultrasonic wave is not easy to penetrate high molecule plastic, but inventor finds in actual experiment, polytetrafluoroethylene (PTFE) or polypropylene is adopted to prepare isolation channel 5, and its thickness is when being less than or equal to 1mm, the ultrasonic wave having small part can penetrate out, and within the scope of isolation channel 5 outer distance isolation channel 5 outer surface 0 ~ 150mm, the ultrasonic wave penetrating isolation channel 5 still possesses cleaning function.Therefore, based on for protecting the protection demand of ultrasonic wave vibration plate 302 and the cleaning demand to aeration tube 2, in the present embodiment, Selection utilization polytetrafluoroethylene (PTFE) or polypropylene isolation channel 5 can be prepared.
It should be noted that, in the etching bath 1 of reality, the bottom of this etching bath 1 is provided with microscope carrier 7, and this microscope carrier 7 is for carrying etched frit.For this reason, when the cleaning device provided utilizing the present embodiment cleans aeration tube 2, can will this microscope carrier 7 be utilized to carry isolation channel 5.After in isolation channel 5 placement with microscope carrier 7, by wire 301, electric energy is delivered to ultrasonic wave vibration plate 302, thus carries out the cleaning to aeration tube 2.For ensureing that the ultrasonic wave that ultrasonic wave vibration plate 302 produces can clean the aeration tube 2 of below after penetrating isolation channel 5, then can pre-set the height of microscope carrier 7, to make after isolation channel 5 is positioned on microscope carrier 7, distance between the bottom of aeration tube 2 and the bottom of isolation channel 5 is in preset range, and this preset range comprises: 0 ~ 150mm.
For making ultrasonic wave vibration plate 302 can be placed in isolation channel 5, also comprise in the cleaning device that the present embodiment provides: supporting construction 11, supporting construction 11 is arranged at the bottom of isolation channel, and supporting construction 11 is for supporting ultrasonic wave vibration plate 302.But, because the isolation channel 5 in the present embodiment is prepared by polytetrafluoroethylene (PTFE) or polypropylene, and the thickness of the bottom of isolation channel 5 is less than or equal to 1mm, then after ultrasonic wave vibration plate 302 starts vibration, the vibration of supporting construction 11 can be caused, and the vibration of supporting construction 11 can cause the bottom of isolation channel 5 and the generation deformation of the position of corresponding supporting construction 11, thus have impact on the service life of isolation channel 5.
For solving the problems of the technologies described above, relative set can be carried out to the position of the supporting construction 11 in isolation channel 5 in the present embodiment, particularly, when isolation channel 5 is positioned on microscope carrier 7, the region that supporting construction 11 limits at the upper surface that the orthographic projection of the upper surface of microscope carrier 7 is positioned at microscope carrier 7 is made.Now, microscope carrier 7 is positioned at the below of supporting construction 11, and microscope carrier 7 effectively can limit supporting construction 11 and produce vibration, and then effectively avoids the bottom of isolation channel 5 to produce deformation, supporting construction 11 also can be made to support ultrasonic wave vibration plate 302 more quietly simultaneously.Alternatively, this cleaning device also comprises: fixed structure 10, fixed structure 10 is arranged between the side of ultrasonic wave vibration plate 302 and the sidewall of isolation channel 5, ultrasonic wave vibration plate 302 and isolation channel 5 can be fixed by this fixed structure 10, thus can effectively avoid ultrasonic wave vibration plate 302 occurred level in the hyperacoustic process of generation to move.
In the present embodiment, alternatively, ultrasound conductive medium 8 is the aqueous solution.Not only cost is low as ultrasound conductive medium 8 to adopt the aqueous solution, nor can cause corrosion to ultrasonic wave vibration plate 302.Further, purple litmus reagent is dissolved with in the aqueous solution.After isolation channel 5 creates breakage, etching solution 6 can enter isolation channel 5, now purple litmus reagent can redden, whether operating personnel can change based on the color of this purple litmus reagent, thus whether detection and isolation has breakage, and then effectively can enter isolation channel 5 post-etching ultrasonic wave vibration plate 302 by early warning etching solution 6.
Find in the cleaning process of reality, isolation channel 5 can drive wire 301 to move in the process moved into or shift out etching bath 1, now wire 301 be easy to occur to bend, be wound around, the problem such as wearing and tearing.For solving this technical problem, be connected between ultrasonic wave vibration plate 302 with wire 301 by snap joint 4 in the present embodiment, particularly, snap joint 4 is through the sidewall of isolation channel 5, one end that snap joint 4 is positioned at isolation channel 5 is connected with ultrasonic wave vibration plate 302, and one end that snap joint 4 is positioned at outside isolation channel 5 is connected with wire 301.
Further, have stainless steel spool 12 in the outer setting of wire 301, this stainless steel spool 12 can play the effect of guardwire.When stainless steel spool 12 is connected with snap joint 4 one end be positioned at outside isolation channel 5 near one end of isolation channel 5, the wire in stainless steel spool 12 can be made to be connected with snap joint 4; When stainless steel spool 12 is separated with snap joint 4 one end be positioned at outside isolation channel 5 near one end of isolation channel 5, the wire in stainless steel spool 12 and snap joint can be made to disconnect.
In addition, move for convenience of controlling isolation channel 5 in the vertical direction, can arrange hand 9 at stainless steel spool 12 away from one end of isolation channel 5, this hand is the corrosion resistant hard material formation of 9 employing.By manipulator grip hand handle, isolation channel can be driven to move accordingly.
In the present embodiment, the wire 301 that outer cover can be equipped with stainless steel spool 12 is arranged on the top of etching bath 1.Before cleaning starts, when first utilizing overhead traveling crane to be moved to directly over etching bath 1 by initial position by isolation channel 5; Then stainless steel spool 12/ wire 301 is connected with ultrasonic wave vibration plate 302; Then utilize manipulator to grasp hand on stainless steel wire pipe 12 9, and overhead traveling crane is removed; Then on the microscope carrier 7 utilizing manipulator control isolation channel 5 to be displaced downwardly in etching bath 1 again; Finally be energized by wire 301, ultrasonic wave vibration plate 302 produces ultrasonic wave, to carry out Ultrasonic Cleaning to aeration tube 2.After cleaning terminates, first by wire 301 power-off; Then utilize on manipulator control isolation channel 5 and move, to leave etching bath 1; Then by cleaning device after tank soaks, with the etching solution that clean surface is residual, finally manipulator is separated 9 with hand; Then stainless steel spool 12/ wire 301 is separated with ultrasonic wave vibration plate 302 again; Finally utilize overhead traveling crane that isolation channel 5 is moved to initial position by directly over etching bath 1.
From foregoing, because wire 301 only can move by the vertical direction, and move distance is shorter, therefore can effectively reduce wire 301 and occur risk that is bending, that be wound around, wear and tear.
In addition, in cleaning process, because snap joint 4 and stainless steel spool 12 are exposed in processing environment (the having corrosive gas of etching solution evaporation generation) always, therefore easily there is the phenomenon that snap joint 4 and stainless steel spool 12 are corroded, and then affect the service life of equipment.For solving this technical problem; protective layer (attached not shown) can be set on the surface of snap joint and stainless steel spool 12 in the present embodiment; the material of this protective layer is polypropylene plastics, and then can effectively avoid snap joint 4 and stainless steel spool 12 to be corroded in processing environment.
The embodiment of the present invention one provides a kind of cleaning device, comprising: ultrasonic generator and separation layer, and separation layer is arranged on the outside of ultrasonic generator; Ultrasonic generator for generation of and launch ultrasonic wave, to carry out Ultrasonic Cleaning to aeration tube; Separation layer, for isolating the etching solution in ultrasonic generator and etching bath, contacts with etching solution to avoid ultrasonic generator.Technical scheme of the present invention, by utilizing ultrasonic generator, can be cleaned the aeration tube in etching bath fast, easily, and then promotes the mobility of etch system.Meanwhile, separation layer effectively can protect ultrasonic generator, to avoid ultrasonic generator to be etched corrosion, thus ensure that the service life of cleaning device.
Embodiment two
The structural representation of the cleaning device that Fig. 3 provides for the embodiment of the present invention two, as shown in Figure 3, the difference of the cleaning device provided in this cleaning device and above-described embodiment one is, in cleaning device shown in Fig. 3, separation layer is the cold Teflon film 13 being plated on the surface of ultrasonic wave vibration plate 302, now can be directly positioned over by the ultrasonic wave vibration plate 302 being coated with Teflon film 13 on the microscope carrier 7 in etching bath.
Because Teflon film 13 has good corrosion resistance, etching solution 6 thus can be effectively avoided to corrode ultrasonic wave vibration plate 302.Meanwhile, the ultrasonic wave that ultrasonic wave vibration plate 302 produces can effectively penetrate Teflon film 13, and is passed to aeration tube 2 place by etching solution 6, thus cleans aeration tube 2.
In the present embodiment, wire 301 is inevitably immersed in etching solution, and for ensureing that wire 301 is not corroded, then need to arrange protective layer (attached not shown) at the outermost layer of wire 301, alternatively, the material of protective layer is plastics.
Certainly; also snap joint 4 can be set between wire 301 and ultrasonic wave vibration plate 302 in the present embodiment; stainless steel wire pipe 12 (it is outer that protective layer is arranged on stainless steel spool 12) is set outside wire; and on stainless steel spool, hand is set 9; snap joint in the present embodiment 4, stainless steel spool 12 and hand see the description in above-described embodiment one, can be repeated no more the related content of 9 herein.
The embodiment of the present invention two provides a kind of cleaning device, comprising: ultrasonic wave vibration plate and the wire be connected with ultrasonic wave vibration plate, and wherein the surface of ultrasonic wave vibration plate is coated with Teflon film, wire outer setting matcoveredn.The ultrasonic wave that technical scheme of the present invention is produced by ultrasonic wave vibration plate, can clean the aeration tube in etching bath fast, easily, and then promotes the mobility of etch system.Meanwhile, Teflon film effectively can protect ultrasonic generator, to avoid ultrasonic generator to be etched corrosion, thus ensure that the service life of cleaning device
Embodiment three
The embodiment of the present invention three provides a kind of etch system, comprise: cleaning device, described cleaning device adopts the cleaning device in above-described embodiment one or embodiment two, the concrete structure of this cleaning device and cleaning process see the description in above-described embodiment one or embodiment two, can repeat no more herein.
The embodiment of the present invention three provides a kind of cleaning etch system, comprises the cleaning device in above-described embodiment one or embodiment two, because this cleaning device can clean the aeration tube in etching bath fast, easily, therefore improves the mobility of etch system.
Be understandable that, the illustrative embodiments that above embodiment is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.

Claims (18)

1. a cleaning device, for cleaning the aeration tube in etching bath, is characterized in that, comprising: ultrasonic generator and separation layer, and described separation layer is arranged on the outside of described ultrasonic generator;
Described ultrasonic generator for generation of and launch ultrasonic wave, to carry out Ultrasonic Cleaning to described aeration tube;
Described separation layer, for isolating the etching solution in described ultrasonic generator and described etching bath, contacts with described etching solution to avoid ultrasonic generator.
2. cleaning device according to claim 1, is characterized in that, described ultrasonic generator comprises: ultrasonic wave vibration plate and wire, and described wire is connected with ultrasonic wave vibration plate;
Described wire is used for, to described ultrasonic wave vibration plate electric energy transmitting after being connected with power supply, producing ultrasonic wave for described ultrasonic wave vibration plate.
3. cleaning device according to claim 2, is characterized in that, described separation layer is the cold Teflon film being plated on the surface of described ultrasonic wave vibration plate.
4. cleaning device according to claim 2, is characterized in that, described separation layer is isolation channel, and described ultrasonic wave vibration plate is positioned at described isolation channel, is provided with ultrasound conductive medium between described isolation channel and described ultrasonic wave vibration plate;
Described ultrasonic wave vibration plate for generation of and launch ultrasonic wave, carry out Ultrasonic Cleaning with the described aeration tube that the distance between the bottom to described isolation channel is in preset range.
5. cleaning device according to claim 4, is characterized in that, also comprises: supporting construction, and described supporting construction is arranged at the bottom of described isolation channel, and described supporting construction is for supporting described ultrasonic wave vibration plate.
6. cleaning device according to claim 5, it is characterized in that, the bottom of described isolation channel is provided with the microscope carrier for carrying pending frit, the region that the upper surface that described supporting construction is positioned at described microscope carrier in the orthographic projection of the upper surface of described microscope carrier limits.
7. cleaning device according to claim 4, is characterized in that, also comprises: fixed structure, and described fixed structure is arranged between described ultrasonic wave vibration plate and the sidewall of described isolation channel;
Described fixed structure is used for the sidewall of described ultrasonic wave vibration plate and described isolation channel to fix.
8. cleaning device according to claim 4, is characterized in that, the material of described isolation channel is: polytetrafluoroethylene (PTFE) or polypropylene.
9. cleaning device according to claim 4, is characterized in that, the thickness of the bottom of described isolation channel is less than or equal to 1mm.
10. cleaning device according to claim 4, is characterized in that, described ultrasound conductive medium is the aqueous solution.
11. cleaning devices according to claim 10, is characterized in that, are dissolved with purple litmus reagent in the described aqueous solution.
12. cleaning devices according to claim 4, is characterized in that, described preset range comprises: 0 ~ 150mm.
13. cleaning devices according to claim 3 or 4, is characterized in that, also comprise: snap joint, and described snap joint is through described separation layer, and the two ends of described snap joint are connected with described ultrasonic wave vibration plate and described wire respectively.
14. cleaning devices according to claim 13, it is characterized in that, the outer setting of described wire has stainless steel spool, and described stainless steel spool is connected with described snap joint near one end of described separation layer, is connected with described snap joint to make the described wire in described stainless steel spool.
15. cleaning devices according to claim 14, is characterized in that, described stainless steel spool is provided with hand handle away from one end of described separation layer.
16. cleaning devices according to claim 14, is characterized in that, the surface of described snap joint and described stainless steel spool is provided with protective layer, and the material of described protective layer is plastics.
17. cleaning devices according to claim 2, is characterized in that, the material of described ultrasonic wave vibration plate is 316L stainless steel.
18. 1 kinds of etch systems, is characterized in that, comprising: as the cleaning device as described in arbitrary in the claims 1-17.
CN201510568134.8A 2015-09-08 2015-09-08 Cleaning device and etch system Expired - Fee Related CN105170550B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510568134.8A CN105170550B (en) 2015-09-08 2015-09-08 Cleaning device and etch system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510568134.8A CN105170550B (en) 2015-09-08 2015-09-08 Cleaning device and etch system

Publications (2)

Publication Number Publication Date
CN105170550A true CN105170550A (en) 2015-12-23
CN105170550B CN105170550B (en) 2017-08-29

Family

ID=54893239

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510568134.8A Expired - Fee Related CN105170550B (en) 2015-09-08 2015-09-08 Cleaning device and etch system

Country Status (1)

Country Link
CN (1) CN105170550B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109317565A (en) * 2018-10-09 2019-02-12 徐召辉 A kind of sealing device and its application method equipped with punch-pin stamping die
CN110153097A (en) * 2019-05-17 2019-08-23 深圳市华星光电技术有限公司 Apparatus cleaning method, device and developing apparatus
CN111018096A (en) * 2019-12-28 2020-04-17 张梅 Aeration system maintenance device and method with two-dimensional dissolved oxygen detection and online cleaning functions
CN111558248A (en) * 2020-04-28 2020-08-21 苏州晋昌胶粘制品有限公司 Cleaning device of high-efficiency filter recovery system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020062839A1 (en) * 2000-06-26 2002-05-30 Steven Verhaverbeke Method and apparatus for frontside and backside wet processing of a wafer
JP2004247752A (en) * 2004-04-14 2004-09-02 Pre-Tech Co Ltd Closed manufacturing equipment and method of treating cleaned substrate by using this equipment
CN1735467A (en) * 2002-11-18 2006-02-15 雷瑟夫公司 Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
US7237564B1 (en) * 2003-02-20 2007-07-03 Lam Research Corporation Distribution of energy in a high frequency resonating wafer processing system
CN101121170A (en) * 2007-09-10 2008-02-13 张家港市超声电气有限公司 Ultrasonic cleaning groove and its processing method
CN201921856U (en) * 2010-12-03 2011-08-10 河南师范大学 Ultrasonic cleaning machine for cleaning micro-porous aerator
CN102319694A (en) * 2011-07-11 2012-01-18 苏州赤诚洗净科技有限公司 Isolated conduction ultrasonic cleaning device
CN103586232A (en) * 2013-11-14 2014-02-19 无锡南方声学工程有限公司 Ultrasonic cleaning device applied to disc-shaped filter in polyester film industry

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020062839A1 (en) * 2000-06-26 2002-05-30 Steven Verhaverbeke Method and apparatus for frontside and backside wet processing of a wafer
CN1735467A (en) * 2002-11-18 2006-02-15 雷瑟夫公司 Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
US7237564B1 (en) * 2003-02-20 2007-07-03 Lam Research Corporation Distribution of energy in a high frequency resonating wafer processing system
JP2004247752A (en) * 2004-04-14 2004-09-02 Pre-Tech Co Ltd Closed manufacturing equipment and method of treating cleaned substrate by using this equipment
CN101121170A (en) * 2007-09-10 2008-02-13 张家港市超声电气有限公司 Ultrasonic cleaning groove and its processing method
CN201921856U (en) * 2010-12-03 2011-08-10 河南师范大学 Ultrasonic cleaning machine for cleaning micro-porous aerator
CN102319694A (en) * 2011-07-11 2012-01-18 苏州赤诚洗净科技有限公司 Isolated conduction ultrasonic cleaning device
CN103586232A (en) * 2013-11-14 2014-02-19 无锡南方声学工程有限公司 Ultrasonic cleaning device applied to disc-shaped filter in polyester film industry

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109317565A (en) * 2018-10-09 2019-02-12 徐召辉 A kind of sealing device and its application method equipped with punch-pin stamping die
CN109317565B (en) * 2018-10-09 2020-09-11 金爵五金塑胶(深圳)有限公司 Sealing device for stamping die and using method thereof
CN110153097A (en) * 2019-05-17 2019-08-23 深圳市华星光电技术有限公司 Apparatus cleaning method, device and developing apparatus
CN111018096A (en) * 2019-12-28 2020-04-17 张梅 Aeration system maintenance device and method with two-dimensional dissolved oxygen detection and online cleaning functions
CN111018096B (en) * 2019-12-28 2022-08-12 张梅 Aeration system maintenance device and method with two-dimensional dissolved oxygen detection and online cleaning functions
CN111558248A (en) * 2020-04-28 2020-08-21 苏州晋昌胶粘制品有限公司 Cleaning device of high-efficiency filter recovery system

Also Published As

Publication number Publication date
CN105170550B (en) 2017-08-29

Similar Documents

Publication Publication Date Title
CN105170550A (en) Cleaning device and etching system
CN100364910C (en) Surface treating solution for fine processing of glass base plate having a plurality of components
WO2008136537A1 (en) Steel sheet rinsing method, and steel sheet continuous rinsing apparatus
US20030133851A1 (en) Ultrasonic cleaning apparatus
US20110056512A1 (en) Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method
JP2013516059A (en) Method and apparatus for processing a silicon substrate
US20160207812A1 (en) Scale treatment apparatus
JP2023093710A (en) Ultrasound degreasing equipment
US8567417B2 (en) Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method
CN205312241U (en) Store liquid case
CN202438487U (en) Washing machine of clamping apparatus
CN107267956B (en) Nozzle cleaning method
CN203203859U (en) Tetrafluoroethylene silicon wafer etching device
CN218371759U (en) Etching groove device and wet etching equipment
CN202212378U (en) Ultrasonic cleaning equipment for galvanized steel wires
EP3877098B1 (en) Ultrasound degreasing management
JP2006303042A (en) Substrate surface processing apparatus
CN111318509A (en) Bubbling cleaning tank for metal mask plate cleaning system
JP7295490B2 (en) Ultrasonic treatment method and ultrasonic treatment apparatus
CN204342888U (en) A kind of pickling tub
CN102110590A (en) Method for using deionized water as wetting agent in oxide corrosion of semiconductor device
KR20220074945A (en) Method and apparatus for continuous cleaning of moving steel strips
CN104591328A (en) Method for removing foams from circulating culture water body
CN204968981U (en) Supersound foam remover
JP2007234825A (en) Cleaning method of substrate processing apparatus

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170829