CN105169554B - A kind of preparation method of vision prosthesis flexible nervus pad - Google Patents
A kind of preparation method of vision prosthesis flexible nervus pad Download PDFInfo
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- CN105169554B CN105169554B CN201510582927.5A CN201510582927A CN105169554B CN 105169554 B CN105169554 B CN 105169554B CN 201510582927 A CN201510582927 A CN 201510582927A CN 105169554 B CN105169554 B CN 105169554B
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Abstract
The present invention provides a kind of preparation method of vision prosthesis flexible nervus pad, including：One layer of parylene film is deposited in substrate；Patterned thin metal layer is formed using sputtering, photoetching and ion beam etch process, spin coating photoresist simultaneously exposes all solder joint holes, the Parylene below solder joint hole is etched away by reactive ion etching；Using being lithographically formed annular polyimides on each endless metal solder joint of pad end, and expose the golden region of part around endless metal solder joint hole；Above annular polyimides endless metal thin layer is formed using sputtering, photoetching and ion beam etch process；The connection of the upper and lower annular layer gold of annular polyimides is realized by plating metal technique；One layer of parylene film of deposition is used for encapsulating, and exposes endless metal conductive window, then whole electrode of the release including pad from substrate by reactive ion etching.This invention ensures that the transparency of electrode, hypotonicity and biocompatibility.
Description
Technical field
The present invention relates to a kind of microelectrode preparation method in biomedical engineering technology field, in particular it relates to a kind of poly-
The preparation method for the vision prosthesis flexible nervus pad that paraxylene and polyimides combine.
Background technology
Progress and intersection with subjects such as biomedical technology, bionics techniques, electronic technology, pass through nerve prosthesis reparation
Optic nerve function, recover blind visual and be possibly realized.Implanted flexible nervus directly acts on tissue inner cell, lining
Bottom material needs good biocompatibility, corrosion resistance, insulating properties, water proofing property, good pliability, elasticity and stress,
Being most commonly used to the organic polymer material that retina prosthese makes flexible nervus at present has polyimides
(Polyimide), Parylene (Parylene), dimethyl silicone polymer (PDMS) etc..What existing literature was reported at present regards
Feel most of prosthese flexible nervus using stretch-proof mechanical property is prominent, (glass transition temperature is up to Good Heat-resistance
360~410 DEG C) backing material of the polyimides as whole electrode.Relative to polyimides and PDMS, Parylene
Advantage is：Imperforate conformality, relatively lower seepage of water, there is American Pharmacopeia (USP) VI levels and intraocular biofacies
Capacitive, and it is fully transparent, observed when being easy to operation to be implanted into, but its heat resistance is poor (only 160 DEG C of glass transition temperature).
Sui Xiaohong et al. are in " Evaluation of a MEMS-based dual metal-layer
thin-film microelectrode array for suprachoroidal electrical stimulation”
Neural Systems and Rehabilitation Engineering, IEEE Transactions on, 21 (4), 524-
In 531 (2013), a kind of 60 passage epichoroidal space microelectrodes using photosensitive polyimide as base material are described
Array, made using two-layer electrode technique, electrode material is titanium/platinum (Ti/Pt), bottom, intermediate layer and top layer thick polyimide
Degree is respectively 10 microns, 5 microns and 5 microns, and whole electrode is manufactured using polyimides completely, although ensure that in pad and paint
Short time high temperature effect will not cause to damage to electrode in envelope curve welding process, but this material is not fully transparent, for
Surgical procedure and clinical follow can all cause certain inconvenience, and certain limitation be present in moistureproof, mechanical performance etc..
Damien C.Rodger et al. are in " Flexible parylene-based multielectrode array
technology for high-density neural stimulation and recording”Sensors and
Actuators B:Chemical, 13 (2), in 449-460 (2008), describe and a kind of be based on Parylene (Parylene
C) the flexible microelectrode arrays for being used for vision prosthesis and stimulating of insulation-encapsulated, electrode material is titanium/platinum (Ti/Pt), devises list
The Parylene thickness of two kinds of electrodes of metal level and double-metal layer, two kinds of electrode under-layers and top layer is respectively that 8 microns and 7 are micro-
Meter, the strata paraxylene thickness among double-metal layer electrode is 1 micron.Demonstrated in text Parylene C have it is relatively low
Permeability and good biocompatibility, while the heat resistance that also refer to Parylene C is poor.
The content of the invention
For in the prior art the defects of, it is an object of the invention to provide a kind of polymeric material of two kinds of excellent performances of combination
Material --- the advantage of Parylene (Parylene C) and polyimides (Polyimide), for making vision prosthesis flexibility
The preparation method of the pad portion of nerve microelectrode, and electrode site and lead portion are only encapsulated using Parylene, the party
Method both ensure that the transparency, hypotonicity and the good biocompatibility of whole electrode, also ensure that pad in welding process
In will not be because of high-temperature damage electrode.
To realize object above, the present invention provides a kind of preparation method of vision prosthesis flexible nervus pad, institute
The method of stating comprises the following steps：
The first step, one layer of parylene film is deposited in substrate；
Second step, using sputtering, photoetching and ion beam etch process form patterned thin conductive metal layer, spin coating photoetching
Glue simultaneously exposes all solder joint holes, and the parylene film below solder joint hole is etched away by reactive ion etching；
3rd step, on each endless metal solder joint of pad end using being lithographically formed internal diameter and external diameter is respectively greater than solder joint
The annular polyimides of hole internal diameter and external diameter, and expose the localized metallic region around endless metal solder joint hole；
4th step, sputtering, photoetching and ion beam etch process formation and annular polyamides are utilized above annular polyimides
The thin metal layer of the same shape of imines；
5th step, annular polyimides upper annular thin metal layer and endless metal solder joint realized by plating metal technique
Connection；
One layer of 6th step, deposition parylene film are used for encapsulating, and expose endless metal by reactive ion etching
Conductive window, then whole electrode of the release including pad from substrate.
Preferably, in the first step, described substrate is times in silicon chip, sheet glass, quartz plate or metal and alloy sheet
One kind, using corresponding delivery mode when finally discharging electrode using different substrates.
Preferably, in the first step, the thickness of described parylene film is 5~20 microns, as insulating barrier；Poly- pair
The thickness of dimethylbenzene film is actually needed determination according to electrode.
It is highly preferred that described parylene film uses chemical vapor deposition, so as to advantageously form size uniformity,
The stable parylene film of property.
Preferably, in second step, described thin metal layer is electrodes conduct passage layers, and material selection gold, platinum, platinoiridita close
Gold, titanium oxide, yttrium oxide, indium tin oxide；Thin metal layer thickness is 100~300 nanometers.
Preferably, in second step, the power and etch period of described reactive ion etching are according to lower floor's Parylene
Film thickness is determined, it is necessary to the very thin film of Parylene is etched through completely, in order to weld.
Preferably, in the 3rd step, described annular polyimides photoetching uses Photosensitive photoresist, and thickness is 2~10 micro-
Rice, it is heat-resisting when being welded with guarantee, Parylene electrode is played a protective role.
Preferably, in the 4th step, described thin metal layer thickness is 100~300 nanometers, and the thin metal layer is covered in poly-
Prepared above acid imide for plating in next step.
Preferably, in the 5th step, before described plating metal, one layer of titanium and one layer of gold are first deposited as shorting layer, thickness
For 30~50 nanometers；As template layer, thickness is 10~30 microns for one layer of spin coating, photoetching photosensitive polyimide again.
It is highly preferred that the thickness of coating of the plating metal is 2~10 microns, gold larger in welding hole when being welded with guarantee
Belong to contact area, realize more firm welding.
Preferably, in the 6th step, the thickness of described parylene film is 5~20 microns, as polymer insulation
Layer.
Preferably, in the 6th step, described endless metal conductive window is and the concentric circle in solder joint hole.
Compared with prior art, the present invention has following beneficial effect：
The present invention has played Parylene and the preferable polymeric material of both biocompatibilities of polyimides each
Advantage, used on the whole high transparency, hypotonicity it is good Parylene encapsulation while, play polyimides it is heat-resisting
Characteristic, electrode pad portion is effectively improved, ensure that pad will not be damaged to electrode in welding process because of high temperature, and
And preparation method of the present invention is extended in other such as artificial cochlea's type nerve microelectrodes and used.
Brief description of the drawings
The detailed description made by reading with reference to the following drawings to non-limiting example, further feature of the invention,
Objects and advantages will become more apparent upon：
(a)-(f) is the single solder joint preparation technology of vision prosthesis flexible nervus of one embodiment of the invention in Fig. 1
Flow chart；
(a)-(f) is the vision prosthesis flexible nervus entirety pad preparation technology of one embodiment of the invention in Fig. 2
Three-dimensional flow figure；
Fig. 3 is the single solder joint annular polyimides partial enlarged drawing of one embodiment of the invention, wherein：(a) it is axonometric drawing,
(b) it is top view.
Embodiment
With reference to specific embodiment, the present invention is described in detail.Following examples will be helpful to the technology of this area
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill to this area
For personnel, without departing from the inventive concept of the premise, various modifications and improvements can be made.These belong to the present invention
Protection domain.
Embodiment 1
In Fig. 1 shown in (a)-(f), the present embodiment provides the vision prosthesis that a kind of Parylene and polyimides combine
The preparation method of flexible nervus pad, is prepared according to the following steps：
1. as shown in (a) in Fig. 1, it is micro- that a strata paraxylene (Parylene C) film 5~20 is deposited on a silicon substrate
Rice；
2. as shown in (b) in Fig. 1, on the parylene film of first step deposition, sputtering, photoetching and ion beam are utilized
Etching technics forms patterned metal film layer, and the material of metal film layer is golden (Au), and thickness is 100~300 nanometers；For
Ensure inert metal gold and bottom Parylene good adhesion, it is necessary to which first depositing one layer of active metal chromium (Cr) is used as seed
Layer, thickness are 10~30 nanometers；Spin coating photoresist simultaneously exposes 25 solder joint holes, and institute is etched away by reactive ion etching (RIE)
There is the Parylene below solder joint hole；
3. as shown in (c) in Fig. 1, at pad end on each annular gold solder point, using being lithographically formed internal diameter and external diameter point
Not great Yu solder joint hole internal diameter (0.5334 millimeter) and external diameter (0.9 millimeter) annular polyimides (Polyimide), take it here
Internal diameter and external diameter are respectively 0.7~0.8 millimeter and 1.2~1.4 millimeters, and the difference in internal diameters in annular polyimides and solder joint hole is formed
Annular section, the golden region of part as exposed；
4. as shown in (d) in Fig. 1, formed above annular polyimides using sputtering, photoetching and ion beam etch process
With the annular au film coating of the same shape size of annular polyimides, thickness is 100~300 nanometers；
5. as shown in (e) in Fig. 1, annular polyimides upper annular au film coating and lower section ring are realized by electroplating gold process
The connection of shape gold solder point, one layer of titanium and one layer of gold (Ti/Au) are first deposited before plating, as shorting layer, thickness is 30~50 nanometers；
One layer of spin coating, photoetching photosensitive polyimide again, as template layer (sacrifice layer), thickness is 10~30 microns；Electroplate the plating of gold
Thickness degree is 2~10 microns, and specific thickness and electroplating time and current density are associated；
6. as shown in (f) in Fig. 1, deposit one layer of 5~20 microns of parylene film and be used for encapsulating, pass through reactive ion
Etching exposes golden ring conductive window and pad profile, finally whole electrode of the release including pad from silicon substrate.
It is that the whole pad of the present embodiment vision prosthesis flexible nervus (includes 25 in Fig. 2 shown in (a)-(f)
Solder joint) three-dimensional process schematic flow sheet, can with clear and intuitive see the preparation process of whole electrode pad, final effect is such as
In Fig. 2 shown in (f).
An independent solder joint in (c) in Fig. 2 is amplified, as shown in figure 3, wherein：(a) it is single solder joint annular polyimides
Partial enlargement axonometric drawing, (b) be its top view, it is necessary to explanation be annular polyimides in photolithography patterning, it is sub- in polyamides
The single annular gold solder point and its connecting position of wires that amine covers in, reserve the gap of one and wire same widths, ensure under
When one step is electroplated, in gap also can electric plated with gold, play and avoid junction from breaking, strengthen the effect of bonding strength.
The present embodiment combines polymeric material --- Parylene (Parylene C) and the polyamides of two kinds of excellent performances
The advantage of imines (Polyimide), for making the pad portion of vision prosthesis flexible nervus, and electrode site and draw
Line part is only encapsulated using Parylene, and this method both ensure that the transparency, hypotonicity and the good life of whole electrode
Thing compatibility, it also ensure that pad will not be because of high-temperature damage electrode in welding process.
Embodiment 2
It is flexible that the present embodiment provides the vision prosthesis that a kind of Parylene and polyimides similar to Example 1 combine
The preparation method of nerve microelectrode pad, detailed process are as follows：
1st, 5~20 microns of a strata paraxylene (Parylene C) film is deposited on a glass substrate；
2nd, on the parylene film of deposition, formed using sputtering, photoetching and ion beam etch process patterned
Metal film layer, the material of metal film layer is platinum (Pt), and thickness is 100~300 nanometers；For increase inert metal platinum and bottom
For the adhesiveness of Parylene, it is necessary to first deposit one layer of titanium (Ti), thickness is 100 nanometers；Carved by reactive ion etching (RIE)
Parylene below all solder joint holes of eating away；
3rd, at pad end on each annular platinum solder joint, using being lithographically formed internal diameter and external diameter is respectively greater than solder joint hole internal diameter
With the annular polyimides (Polyimide) of external diameter, take its internal diameter here and external diameter be respectively 0.7~0.8 millimeter and 1.2~
1.4 millimeters, the annular section that the difference in internal diameters in polyimides and solder joint hole is formed, the local platinum region as exposed；
4th, formed above annular polyimides using sputtering, photoetching and ion beam etch process and annular polyimides is same
The annular platinum thin layer of sample shape size, thickness are 100~300 nanometers；
5th, the connection of annular polyimides upper annular platinum thin layer and lower endless platinum solder joint is realized by electroplatinizing technique,
One layer of titanium and one layer of platinum (Ti/Pt) are first deposited before plating, as shorting layer, thickness is 30~50 nanometers；One layer of spin coating, photoetching again
Photosensitive polyimide, as template layer, thickness is 10~30 microns；The thickness of coating of electroplatinizing is 2~10 microns；
6th, one layer of 5~20 microns of parylene film are deposited to be used for encapsulating, annular is exposed by reactive ion etching
Platinum conductive window and pad profile, the whole electrode including pad is finally discharged from glass substrate.
It should be pointed out that the above embodiment of the present invention is only some embodiments, the skill according to described in this specification
Art content, for example change material type, parameter etc., it can realize the purpose of the present invention.
The present invention has played Parylene and the preferable polymeric material of both biocompatibilities of polyimides each
Advantage, used on the whole high transparency, hypotonicity it is good Parylene encapsulation while, play polyimides it is heat-resisting
Characteristic, electrode pad portion is effectively improved, ensure that pad will not be damaged to electrode in welding process because of high temperature, and
And preparation method of the present invention is extended in other such as artificial cochlea's type nerve microelectrodes and used.
The specific embodiment of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (10)
1. a kind of preparation method of vision prosthesis flexible nervus pad, it is characterised in that methods described includes following step
Suddenly：
The first step, one layer of parylene film is deposited in substrate；
Second step, using sputtering, photoetching and ion beam etch process patterned thin conductive metal layer is formed, spin coating photoresist is simultaneously
Expose all solder joint holes, the parylene film below solder joint hole is etched away by reactive ion etching；
3rd step, on each endless metal solder joint of pad end using being lithographically formed annular polyimides, the annular polyamides
Imines internal diameter is more than solder joint hole internal diameter, and the annular polyimides external diameter is more than solder joint hole external diameter, and exposes endless metal solder joint
Localized metallic region around hole；
4th step, sputtering, photoetching and ion beam etch process formation and annular polyimides are utilized above annular polyimides
The thin metal layer of same shape size；
5th step, annular polyimides upper annular thin metal layer and lower endless metal solder joints realized by plating metal technique
Connection；
One layer of 6th step, deposition parylene film are used for encapsulating, and expose endless metal conduction by reactive ion etching
Window, then whole electrode of the release including pad from substrate.
A kind of 2. preparation method of vision prosthesis flexible nervus pad according to claim 1, it is characterised in that
Described substrate is any of silicon chip, sheet glass, quartz plate, metal, alloy sheet.
A kind of 3. preparation method of vision prosthesis flexible nervus pad according to claim 1, it is characterised in that
In the first step, the thickness of described parylene film is 5~20 microns；Described parylene film uses chemical gas
Mutually deposit.
A kind of 4. preparation method of vision prosthesis flexible nervus pad according to claim 1, it is characterised in that
In second step, described thin conductive metal layer is electrodes conduct passage layers, material selection gold, platinum, platinumiridio, titanium oxide, oxygen
Change iridium, indium tin oxide；Thin conductive metal layer thickness is 100~300 nanometers.
A kind of 5. preparation method of vision prosthesis flexible nervus pad according to claim 1, it is characterised in that
In second step, the power and etch period of described reactive ion etching determine according to lower floor's parylene film thickness.
A kind of 6. preparation method of vision prosthesis flexible nervus pad according to claim 1, it is characterised in that
In 3rd step, described annular polyimides, photoetching uses Photosensitive photoresist, and thickness is 2~10 microns.
A kind of 7. preparation method of vision prosthesis flexible nervus pad according to claim 1, it is characterised in that
In 4th step, described thin metal layer thickness be 100~300 nanometers, the thin metal layer is covered in be above polyimides under
The plating of one step is prepared.
8. a kind of preparation method of vision prosthesis flexible nervus pad according to claim any one of 1-7, its
Be characterised by, in the 5th step, before described plating metal, first deposit one layer of titanium and one layer of gold and be used as shorting layer, thickness for 30~
50 nanometers；As template layer, thickness is 10~30 microns for one layer of spin coating, photoetching photosensitive polyimide again.
A kind of 9. preparation method of vision prosthesis flexible nervus pad according to claim 8, it is characterised in that
The thickness of coating of the plating metal is 2~10 microns.
10. a kind of preparation method of vision prosthesis flexible nervus pad according to claim any one of 1-7, its
It is characterised by, in the 6th step：
The thickness of the parylene film is 5~20 microns；
Described endless metal conductive window be and the concentric circle in solder joint hole.
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| CN106054519B (en) * | 2016-07-07 | 2020-08-25 | 深圳先进技术研究院 | Method for preparing three-dimensional microelectrode array by using photoresist |
| KR20200016327A (en) * | 2017-06-07 | 2020-02-14 | 가부시키가이샤 아사히 덴카 겐큐쇼 | Flexible composite film, flexible circuit film using the same |
| CN107807148A (en) * | 2017-10-23 | 2018-03-16 | 河海大学 | Outsourcing AEM build-in type concrete chloride ion sensor and preparation and method of testing |
| CN108261605B (en) * | 2018-02-13 | 2021-07-30 | 山东大学 | Flexible single-layer conductive microstructure artificial cochlea electrode and manufacturing method thereof |
| CN111134831A (en) * | 2019-12-31 | 2020-05-12 | 上海交通大学 | Flexible MEMS (micro-electromechanical systems) extensible sensor based on serpentine line and preparation method thereof |
| CN113038724A (en) * | 2021-03-02 | 2021-06-25 | 微智医疗器械有限公司 | Manufacturing method of circuit board, circuit board and electronic equipment |
| CN112993716B (en) * | 2021-04-09 | 2022-07-12 | 西北工业大学 | Thermal stripping auxiliary extensible flexible neural electrode interface integration process |
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| CN101073687A (en) * | 2007-05-18 | 2007-11-21 | 中国科学院上海微系统与信息技术研究所 | High-purity implanting planar array microelectrode and its production |
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| US20140172051A1 (en) * | 2012-12-14 | 2014-06-19 | Satinderpall S. Pannu | Single layer polymer microelectrode array |
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| CN101073687A (en) * | 2007-05-18 | 2007-11-21 | 中国科学院上海微系统与信息技术研究所 | High-purity implanting planar array microelectrode and its production |
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