A kind of electrodepositable PA66-PPO-MPI engineering plastic alloy and preparation method thereof
Technical field
The invention belongs to engineering plastic alloy field, particularly a kind of electrodepositable PA66-PPO-MPI engineering plastic alloy and preparation method thereof.
Background technology
The ecology potential of engineering plastics must be closely related with various new and high technology, is also important symbol and the basic substance of national science and technology and industrial level simultaneously.The consumption of automobile engineering plastics is one of marks of the national Trend of Auto Manufacturing Technologies level of measurement one.Over nearly more than 30 years, the consumption of automobile plastic is in continuous increase in the world.
The development of current new-energy automobile, mainly to save energy and reduce the cost as aim, just necessarily requires automotive light weight technology.And in worldwide, PA66/PPO alloy material is mainly produced is Sabic company, its trade mark is Noryl*GTX series, and it is the alloy material of polymeric amide (PA) and Noryl (PPO).It combines the chemical resistant properties of the dimensional stability of PPO material, thermotolerance and PA polymkeric substance and easy processing characteristics.This makes this type of itself have the material of excellent in chemical resistance, has possessed again the thermotolerance required by good hardness, impact resistance and on-line spray.
The plastic of body of a motor car, beater or beat-up is exactly an important breakthrough of automotive light weight technology.Alloy engineering plastics general at present can not meet the process for processing of beater or beat-up as PC/ABS, PC/PBT, PA/ABS, PA66/PPO alloy etc., mainly shortcoming is: strong and unyielding property is inadequate, can not electroplate, heat-resisting low, and size is unstable.
Nylon is most important automotive industry engineering plastics.Automobile component are also the maximum consumption markets of PA engineering plastics, exceed 1/3rd of aggregate consumption.Along with people are to the development of improving constantly of requiring of automotive performance and PA engineering plastics self, automobile PA is just in the trend risen year by year.The parts that automobile can use PA (comprising modified product) make have electric connector etc. in door handle, shell, fan, wheelhouse portions, flow deflector, upholstery, water storage equipment lid, line card, various car.
MODIFIED PP O is mainly used in making the automobile component with high-strength, high tenacity and good electrical property, and moisture absorption is little, can be used as automobile valve bonnet, fuel tank conducting plates, transformer and wind motor vane etc.And PA66/PPO alloy processibility is good, high-strength, high tenacity, the little processing that can be used as automobile exterior trimming parts of moisture absorption.
About the research of PA66/PPO alloy, existing many disclosed bibliographical informations:
People's [researchs of the composition and performance relation of PPO/PA66 alloy system matrix such as beam literary riddles, the academic dissertation of Beijing University of Chemical Technology's Electrical and Mechanical Engineering College], be primarily characterized in that: have studied polyphenylene oxide (PPO) and the relation between nylon66 fiber (PA66) two matrix proportion of composing and alloy property.Result shows, when expanding material TGDDM and SEBS-g-MA consumption certain, when the quality proportioning of two matrix component is 5:5, co-mixing system has good comprehensive mechanical property.
The Chinese invention patent CN200910182012.X of Zhang Wei discloses and a kind ofly does polyblend of toughness PPE and PA66 and preparation method thereof, be primarily characterized in that: the invention discloses a kind of method of synthesizing high logarithmic viscosity number PPTA, in ul-trasonic irradiation environment, carry out following steps successively, a. obtain solution system, first by solubility promoter stirring and dissolving in polar solvent, and then add Ursol D continue stirring and dissolving, obtain solution system; B low-temperature polycondensation, continues to stir by gained solution system in a step, in low temperature environment, adds p-phthaloyl chloride and carry out polycondensation, add acid absorber subsequently; C slaking, transfers to slaking in water-bath by the system of gained in b step, stirs simultaneously, finally obtains evengranular high logarithmic viscosity number PPTA resin; The present invention improves the combined coefficient of PPTA and the logarithmic viscosity number of PPTA, and contributes to reducing costs.
The Chinese invention patent ZL2010101405464 of the people such as Xu Dong discloses a kind of high-strength PPO/PA66 alloy material and preparation method thereof, is primarily characterized in that: high-strength PPO/PA66 alloy material is made up of following component by weight percentage: polyphenylene oxide resin 20%-40%; Nylon 66 20%-40%; Compatilizer 5%-10%; Toughner 5%-10%; Glass fibre 5%-15%; Glass microballon 5%-15%; Mica powder 5%-15%; Oxidation inhibitor 0.2%-0.4%; Other auxiliary agent 0.5%-1%.The present invention is by adopting glass fibre compound glass microballon, and mica powder strengthens PPO/PA66 alloy, obtained material excellent combination property, not only intensity is high, good heat resistance, easily sprays, also have splendid dimensional stability, warpage rate is low simultaneously, is applicable to shaping large scale structure product and heating part.
Polyimide is developed in the sixties, and the most frequently used one is obtained by pyromellitic acid anhydride and aromatic diamine.Containing multiple aromatic heterocycle structural unit in polyimide molecule, therefore its thermotolerance is splendid, and its second-order transition temperature is more than 260 DEG C usually.Polyimide resin is a family macromolecule material with extremely excellent heat resistance.Conventional polyimide structures, its heat decomposition temperature, generally all more than 500 DEG C, also has obdurability simultaneously.Therefore, also usually for thermosetting resin, as the heat-resisting plasticized modifier of epoxy resin, bimaleimide resin etc.
About the research of polyimide material, existing many disclosed bibliographical informations:
Chinese invention patent CN101921482A discloses a kind of thermoset polyimide resin and preparation method thereof, and this resin is made up of component A and B component, and its weight ratio is 1:2-6; Wherein component A is the thick dimaleoyl imino polyimide resin solution of homogeneous phase transparent, solid content 10%-25%; B component is four dimaleoyl imino dihydroxyphenyl propane solution, solid content 30%-40%; The preparation method of dimaleoyl imino polyimide resin liquid (component A) comprises following two steps: (1) is by 2, two [the 4-(2 of 2-, 4-diamino phenoxy) phenyl] propane and strong polar non-proton organic solvent put into reactor, under room temperature, after stirring and dissolving is complete, add maleic anhydride pressed powder, stirred at ambient temperature is to dissolving completely, continue stirring reaction after 0.5 hour, add aromatic dicarboxylic anhydride, stirred at ambient temperature reaction 5-8 hour, obtains the resin solution that homogeneous phase transparent is thick; (2) add azeotropy dehydrant, azeotropic reflux water-dividing stirring reaction, after 6-8 hour, obtains the dimaleoyl imino polyimide resin liquid that homogeneous phase transparent is thick; The preparation method of four dimaleoyl imino dihydroxyphenyl propane solution (B component) comprises following two steps: (1) is by 2, two [the 4-(2 of 2-, 4-diamino phenoxy) phenyl] propane and strong polar non-proton organic solvent put into reactor, under room temperature, after stirring and dissolving is complete, add maleic anhydride pressed powder, stirred at ambient temperature is to dissolving completely, continue stirring reaction after 3 hours, obtain homogeneous phase transparent solution; (2) add azeotropy dehydrant, azeotropic reflux water-dividing stirring reaction, after 5 hours, obtains four dimaleoyl imino dihydroxyphenyl propane solution of homogeneous phase transparent.
The thermoset polyimide resin that the present invention obtains not only can be applicable to the matrix resin of the matrix material of high-temperature resistance adhesive and glass fiber reinforcement, and can be applicable to the matrix resin of carbon fiber, the fibre-reinforced advanced composite material of the contour performance of aramid fiber.
Chinese invention patent CN101973147A discloses a kind of preparation method of high-temperature resistant polyimide glass fabric laminated board, under mainly comprising the steps: (1) room temperature, be 1 of 1:2 by mol ratio, 4-two (2,4-diamino phenoxy) benzene and maleic anhydride add in strong polar non-proton organic solvent, after stirred at ambient temperature reacts 1 hour, add aromatic diamine monomer, after stirring and dissolving is complete, add aromatic dicarboxylic anhydride, stirred at ambient temperature reacts 3 hours, add initiator, stirring and dissolving, obtains the thick resin solution of homogeneous phase transparent, i.e. component A; (2) be that Isosorbide-5-Nitrae-bis-(2,4-diamino phenoxy) benzene of 1:4 and maleic anhydride add in strong polar non-proton organic solvent by mol ratio, after stirred at ambient temperature reacts 2 hours, obtain the resin solution of homogeneous phase transparent, i.e. B component; (3), when using, under room temperature, A, B component are mixed, obtain polyimide precursor resin solution, use woven fiber glass impregnating resin solution, preliminary drying semicure obtains prepreg, enters the thermofixation of high-temperature high-pressure machine, obtain high-temperature resistant polyimide glass fabric laminated board after stacked.
Yu Xinhai, Xu Meifang, Fan Liangzi [the fabrication & properties research of maleimide side base Kapton, insulating material, 2011, (4), 1-3] disclose preparation and the performance study thereof of a kind of maleimide side base polyimide, principal character is: utilize 2, two [the 4-(2 of 2-, 4-diamino phenoxy) phenyl] propane (BDAPPP) monomer, maleic anhydride (MA), 4, 4 '-diaminodiphenyl oxide (44ODA) and 3, 3 ', 4, polyamic acid resin (MPAA) solution of 4 '-tetracarboxylic acid biphenyl dianhydride (BPDA) synthesis obtained maleinamic acid side base, through film, hot imidization, obtain tough and tensile transparent maleimide side base Kapton (MPI), and its performance is studied.
The Chinese invention patent CN101560298A (2009-10-21) of Yu Xinhai discloses a kind of thermoplastic fluorine-containing fully aromatic polyimide powder and preparation method thereof, be primarily characterized in that: under the effect of catalyzer, by fluorinated aromatic binary primary amine and aromatic dicarboxylic anhydride in phenol solvent, react 5 hours-10 hours, pour in the precipitating agent under high-speed stirring state while hot, separate out pressed powder, filtration, washing, immersion, filtration, drying, acquisition thermoplastic fluorine-containing fully aromatic polyimide powder.Thermoplastic fluorine-containing fully aromatic polyimide powder solubility of the present invention is good, it is the high performance heat resistant plasticized modifier of the thermosetting resins such as epoxy resin, unsaturated polyimides resin, unsaturated polyester resin, have a good application prospect, and simple to operate, cost is low, environmental friendliness, be applicable to industrial production.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of electrodepositable PA66-PPO-MPI engineering plastic alloy and preparation method thereof, the method operating procedure is simple, production cost is low, product has good electric property, mechanical property and resistance to elevated temperatures etc., excellent combination property, can be applicable to the parts such as new-energy automobile beater or beat-up, door handle, safety lever, have broad application prospects.
A kind of electrodepositable PA66-PPO-MPI engineering plastic alloy of the present invention, is made up of the PA66 resin of mass ratio 100:30-100:5-15:10-50:10-30:1-5, PPO resin, MPI resin, conductive filler material, compatilizer and auxiliary agent; Wherein, MPI resin reacts obtained dimaleoyl imino polyimide resin by the Isosorbide-5-Nitrae of mol ratio 1:2:7-12:5-10-bis-(2,4-diamino phenoxy) benzene, maleic anhydride, aromatic dianhydride, aromatic diamine.
Described PA66 resin is the polyhexamethylene adipamide resin obtained by polycondensation by 1,6-hexanediamine and 1,6-hexanodioic acid.
Described PPO resin is by the polyphenylene oxide resin of 2,6-xylenol by self polycondensation.
Described conductive filler material is selected from one or more in Graphene, graphitized carbon black, copper powder, aluminium powder, silver powder, nickel powder, silver-plated copper powder, silver-plated nickel powder, silver-plated glass beads.
Described compatilizer is selected from one or more in maleic anhydride graft polyhexamethylene adipamide resin, maleic anhydride graft polyphenylene oxide resin, maleic anhydride graft SIS/SEBS resin.
Described auxiliary agent is selected from four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester, β-positive octadecanol ester of (3,5-di-tert-butyl-hydroxy phenyl) propionic acid, three (2,4-di-tert-butyl-phenyl) phosphorous acid ester, 2,6 di tert butyl 4 methyl phenol, N, N '-bis-[3-(3,5-di-tert-butyl-hydroxy phenyl) propionyl] hexanediamine, two (the 2-hydroxyl-3-tertiary butyl-5-aminomethyl phenyl) methane, 4,4 '-thiobis (6-tert-butyl-m-cresol), two (3,5-di-tert-butyl-hydroxy phenyl) the propionic acid hydrazine of 1,2-, Tyox B, the polymkeric substance of succinic acid and 4-hydroxyl-2,2,6,6-tetramethyl--1-piperidine alcohols, two (2,2,6,6-tetramethyl--4-piperidyl) sebate, two (3,5-di-tert-butyl-4-hydroxyl benzyl monoethyl phosphate) nickel, 2,4 dihydroxyl benzophenone, Octabenzone, ESCALOL 567, 2-(2 '-hydroxyl-5 '-aminomethyl phenyl) benzotriazole, 2-(2 '-hydroxyl-3 '-the tertiary butyl-5 '-aminomethyl phenyl)-5-chlorinated benzotriazole, 2-(2 '-hydroxyl-3 ', 5 '-diamyl phenyl) benzotriazole, 2-(2 '-hydroxyl-5 '-tertiary octyl phenyl) benzotriazole, 2-PHENYLBENZIMIDAZOLE-5-SULFONIC ACID, 2-[2 '-hydroxyl-3 ', 5 '-bis-(alpha, alpha-dimethylbenzyl) phenyl] benzotriazole, one or more in 2-(2H-benzotriazole-2-)-6-(dodecyl)-4-methylphenol.
Described aromatic dianhydride is selected from pyromellitic acid anhydride, 3, 3 ', 4, 4 '-tetracarboxylic diphenyl ether dianhydride, 3, 3 ', 4, 4 '-tetracarboxylic biphenyl dianhydride, 3, 3 ', 4, 4 '-tetracarboxylic benzophenone dianhydride, 3, 3 ', 4, 4 '-tetracarboxylic diphenyl sulfone dianhydride, 2, 2-two (3, 4-dicarboxyphenyi) hexafluoropropane dianhydride, 2, two [the 4-(3 of 2-, 4-di carboxyl phenyloxy) phenyl] propane dianhydride, 2, two [the 4-(3 of 2-, 4-di carboxyl phenyloxy) phenyl] hexafluoropropane dianhydride, 1, 4-two (3, 4-di carboxyl phenyloxy) benzene dianhydride, 1, 3-two (3, 4-di carboxyl phenyloxy) benzene dianhydride, 4, 4 '-bis-(3, 4-di carboxyl phenyloxy) diphenyl sulfone dianhydride, 4, 4 '-bis-(3, 4-di carboxyl phenyloxy) benzophenone dianhydride, 4, 4 '-bis-(3, 4-di carboxyl phenyloxy) biphenyl dianhydride, 4, 4 '-bis-(3, 4-di carboxyl phenyloxy) one or more in diphenyl ether dianhydride.
Described aromatic diamine is selected from Ursol D, mphenylenediamine, O-Phenylene Diamine, methylresorcinol diamines, trimethylammonium mphenylenediamine, dimethyl-p-phenylenediamine, 4,4 '-diaminodiphenylmethane, 3,3 '-dimethyl-4,4 '-diaminodiphenylmethane, 4,4 '-diaminodiphenyl oxide, 3,4 '-diaminodiphenyl oxide, 3,3 '-diaminodiphenyl oxide, DDS, 3,3 '-diaminodiphenylsulfone(DDS), 4,4 '-benzidine, two (4-amino-benzene oxygen) benzene of 1,3-, Isosorbide-5-Nitrae-bis-(4-amino-benzene oxygen) benzene, two (3-amino-benzene oxygen) benzene of 1,3-, Isosorbide-5-Nitrae-bis-(3-amino-benzene oxygen) benzene, two [4-(4-amino-benzene oxygen) phenyl] propane of 2,2-, two [4-(3-amino-benzene oxygen) phenyl] propane of 2,2-, two [4-(4-amino-benzene oxygen) phenyl] HFC-236fa of 2,2-, two [4-(3-amino-benzene oxygen) phenyl] HFC-236fa of 2,2-, 4,4 '-bis-(4-amino-benzene oxygen)-3,3 ', 5,5 '-tetramethyl biphenyl, 4,4 '-bis-(4-amino-benzene oxygen) biphenyl, 4,4 '-bis-(3-amino-benzene oxygen) biphenyl, 4,4 '-bis-(4-amino-benzene oxygen) phenyl ether, 4,4 '-bis-(3-amino-benzene oxygen) phenyl ether, 4,4 '-bis-(4-amino-benzene oxygen) ditane, 4,4 '-bis-(3-amino-benzene oxygen) ditane, 4,4 '-bis-(4-amino-benzene oxygen) sulfobenzide, 4,4 '-bis-(3-amino-benzene oxygen) sulfobenzide, 2,2 '-two (trifluoromethyl)-4,4 '-benzidine, Isosorbide-5-Nitrae-bis-(2-trifluoromethyl-4-aminophenoxyl) benzene, Isosorbide-5-Nitrae-bis-(3-trifluoromethyl-4-aminophenoxyl) benzene, two (2-trifluoromethyl-4-aminophenoxyl) benzene of 1,3-, two (3-trifluoromethyl-4-aminophenoxyl) benzene of 1,3-, two [4-(2-trifluoromethyl-4-aminophenoxyl) phenyl] propane of 2,2-, two [4-(3-trifluoromethyl-4-aminophenoxyl) phenyl] propane of 2,2-, two [4-(2-trifluoromethyl-4-aminophenoxyl)-2, the 6-3,5-dimethylphenyls] propane of 2,2-, two [4-(3-trifluoromethyl-4-aminophenoxyl)-2, the 6-3,5-dimethylphenyls] propane of 2,2-, two [4-(2-trifluoromethyl-4-aminophenoxyl) phenyl] HFC-236fa of 2,2-, two [4-(3-trifluoromethyl-4-aminophenoxyl) phenyl] HFC-236fa of 2,2-, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl) ditane, 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl) ditane, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl) biphenyl, 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl)-3,3 ', 5,5 '-tetramethyl biphenyl, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl) biphenyl, 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl)-3,3 ', 5,5 '-tetramethyl biphenyl, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl) phenyl ether, 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl) phenyl ether, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl) sulfobenzide, 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl) sulfobenzide, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl)-3,3 ', 5,5 '-tetramethyl diphenyl sulfone, 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl)-3,3 ', 5,5 '-tetramethyl diphenyl sulfone, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl) diphenyl sulfide, 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl) diphenyl sulfide, 4,4 '-bis-(2-trifluoromethyl-4-aminophenoxyl) benzophenone, one or more of 4,4 '-bis-(3-trifluoromethyl-4-aminophenoxyl) benzophenone.
The preparation method of a kind of electrodepositable PA66-PPO-MPI engineering plastic alloy of the present invention, comprises the steps:
(1) by 1, 4-two (2, 4-diamino phenoxy) benzene and strong polar non-proton organic solvent add in reactor, after stirred at ambient temperature dissolves, ice-water bath is cooled to less than 5 DEG C, add maleic anhydride and aromatic dianhydride, stirring reaction is after 1 hour-2 hours, add aromatic diamine, continue stirring reaction 2.5 hours-4 hours, add dewatering agent and catalyzer subsequently, remove ice-water bath, be heated to 90 DEG C-100 DEG C, stirring reaction 4 hours-8 hours, add precipitating agent, stir 1 hour, filter, with washing with acetone 2 times-3 times, 90 DEG C of vacuum-dryings, obtain MPI resin,
(2) with coupling agent aqueous solution process conductive filler material, its concrete technology is: coupling agent aqueous solution and conductive filler material are put into reactor, after stirring 1 hour-2 hours in 60 DEG C-80 DEG C, be cooled to room temperature, filter, at 100 DEG C, drying 1 hour-2 hours, namely obtains the conductive filler material of coupling agent treatment; Wherein, the mass ratio of coupling agent aqueous solution and conductive filler material is 4-8:1;
(3) PA66 resin, PPO resin, MPI resin, conductive filler material, compatilizer and auxiliary agent are mixed, adopt twin screw extruder, carry out high-temperature fusion mixing at 270 DEG C-290 DEG C, granulation, obtain electrodepositable PA66-PPO-MPI engineering plastic alloy.
Strong polar non-proton organic solvent in described step (1) is selected from one or more in DMF, N,N-dimethylacetamide, METHYLPYRROLIDONE, N-ethyl-2-pyrrolidone, dimethyl sulfoxide (DMSO); Wherein, the mass ratio of strong polar non-proton organic solvent and total reactant is 3-5:1; The quality of total reactant refers to the quality sum of Isosorbide-5-Nitrae-bis-(2,4-diamino phenoxy) benzene, maleic anhydride, aromatic dianhydride and aromatic diamine.
Dewatering agent in described step (1) is selected from one or more in diacetyl oxide, propionic anhydride, butyryl oxide, trifluoroacetic anhydride (TFAA), chloracetic acid acid anhydride, dicyclohexylcarbodiimide; Wherein, the mol ratio of dewatering agent and aromatic dianhydride is 2.5-3.5:1.
Catalyzer in described step (1) is selected from one or more in triethylamine, Tributylamine, pyridine, picoline, lutidine, dipyridyl, methyl dipyridyl; Wherein, the mol ratio of catalyzer and aromatic dianhydride is 0.01-0.1:1.
Precipitating agent in described step (1) is selected from one or more in methyl alcohol, ethanol, propyl alcohol, Virahol, ethylene glycol, ethylene glycol monomethyl ether, glycol dimethyl ether, ethylene glycol monoethyl ether, ethylene glycol diethyl ether, methylethylketone; Wherein, the mass ratio of precipitating agent and strong polar non-proton organic solvent is 2-5:1.
Acetone in described step (1) and the mass ratio of strong polar non-proton organic solvent are 0.5-1:1.
The mass percent concentration of the coupling agent aqueous solution in described step (2) is 1% ~ 10%.
Described coupling agent is selected from one or more in 3-aminopropyl triethoxysilane, 3-aminopropyl trimethoxysilane, glycidoxypropyl group triethoxyl silane, glycidoxy trimethylammonium TMOS.
beneficial effect
(1) preparation technology of the present invention is simple, cost is low, easy to operate, reaction raw materials convenient sources, can complete preparation process in general-purpose equipment, is conducive to realizing suitability for industrialized production;
(2) the present invention has good over-all properties, has high temperature tolerance, molding processibility, excellent electric property and mechanical property etc.;
(3) the present invention can be applicable to the parts such as new-energy automobile beater or beat-up, door handle, safety lever, has broad application prospects.
Embodiment
Below in conjunction with specific embodiment, set forth the present invention further.Should be understood that these embodiments are only not used in for illustration of the present invention to limit the scope of the invention.In addition should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the application's appended claims limited range equally after the content of having read the present invention's instruction.
Embodiment 1
By 32.2 grams of (0.1 moles) 1, 4-two (2, 4-diamino phenoxy) benzene and 1245 grams of N, N-N,N-DIMETHYLACETAMIDE adds in reactor, after stirred at ambient temperature dissolves, ice-water bath is cooled to less than 5 DEG C, add 19.6 grams of (0.2 mole) maleic anhydrides and 217.0 grams of (0.7 moles) 3, 3 ', 4, 4 '-tetracarboxylic diphenyl ether dianhydride, stirring reaction is after 1 hour, add 146.0 grams of (0.5 moles) 1, two (4-amino-benzene oxygen) benzene of 3-, continue stirring reaction 4 hours, add 183.6 grams of (1.8 moles) diacetyl oxides and 0.65 gram of (0.007 mole) picoline subsequently, remove ice-water bath, be heated to 100 DEG C, stirring reaction 4 hours, add 2490 grams of methyl alcohol, rapid stirring 1 hour, filter, with 625 grams of washing with acetones 2 times-3 times, 90 DEG C of vacuum-drying 3 hours, obtain 384.5 grams of MPI resins (theoretical yield is 389.6 grams), be denoted as MPI-1, yield is 98.7%.
Embodiment 2
By 32.2 grams of (0.1 moles) 1, 4-two (2, 4-diamino phenoxy) benzene, 3000 grams of METHYLPYRROLIDONEs and 690 grams of N, dinethylformamide adds in reactor, after stirred at ambient temperature dissolves, ice-water bath is cooled to less than 5 DEG C, add 19.6 grams of (0.2 mole) maleic anhydrides, 260.2 grams of (0.5 moles) 2, two [the 4-(3 of 2-, 4-di carboxyl phenyloxy) phenyl] propane dianhydride and 217.0 grams of (0.7 moles) 3, 3 ', 4, 4 '-tetracarboxylic diphenyl ether dianhydride, stirring reaction is after 2 hours, add 180.0 grams of (0.9 moles) 3, 4 '-diaminodiphenyl oxide and 29.2 grams of (0.1 moles) 1, two (3-amino-benzene oxygen) benzene of 3-, continue stirring reaction 2.5 hours, add 428.4 grams of (4.2 moles) diacetyl oxides and 9.48 grams of (0.12 mole) pyridines subsequently, remove ice-water bath, be heated to 90 DEG C, stirring reaction 8 hours, add 18450 grams of ethanol, rapid stirring 1 hour, filter, with 3690 grams of washing with acetones 2 times-3 times, 90 DEG C of vacuum-drying 5 hours, obtain 689.4 grams of MPI resins (theoretical yield is 695.0 grams), be denoted as MPI-2, yield is 99.2%.
Embodiment 3
Be that reactor put into by the 3-aminopropyl triethoxysilane aqueous solution of 1%, 50.0 grams of silver-plated copper powders and 50.0 grams of silver powder by 400 gram mass percentage concentrations, stir at 60 DEG C after 1 hour, be cooled to room temperature, filter, drying 1 hour at 100 DEG C, namely obtain the conductive filler material of 100.0 grams of coupling agent treatment, be denoted as ECF-1.
Be that the 3-aminopropyl triethoxysilane aqueous solution of 3%, 60.0 grams of silver-plated copper powders and 40.0 grams of aluminium powders put into reactor by 400 gram mass percentage concentrations, stir at 80 DEG C after 2 hours, be cooled to room temperature, filter, drying 2 hours at 100 DEG C, namely obtain the conductive filler material of 100.0 grams of coupling agent treatment, be denoted as ECF-2.
Be that the glycidoxypropyl group triethoxyl silane aqueous solution of 5%, 30.0 grams of graphene powders and 70.0 grams of silver-plated glass beads put into reactor by 800 gram mass percentage concentrations, stir at 70 DEG C after 2 hours, be cooled to room temperature, filter, drying 2 hours at 100 DEG C, namely obtain the conductive filler material of 100.0 grams of coupling agent treatment, be denoted as ECF-3.
Be that reactor put into by the glycidoxypropyl group triethoxyl silane aqueous solution of 10%, 20.0 grams of graphene powders and 80.0 grams of silver powder by 800 gram mass percentage concentrations, after stirring 1 hour in 80 DEG C, be cooled to room temperature, filter, drying 1 hour at 100 DEG C, namely obtain the conductive filler material of 100.0 grams of coupling agent treatment, be denoted as ECF-4.
Embodiment 4
By 1000 grams of PA66 resins, 300 grams of PPO resins, 50 grams of MPI-1 resins, 100 grams of ECF-1 conductive filler materials, 50 grams of maleic anhydride graft polyhexamethylene adipamide resins and 50 grams of maleic anhydride graft polyphenylene oxide resins, 5 gram of four [β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester and 5 grams of 2-(2 '-hydroxyl-5 '-aminomethyl phenyl) benzotriazole mixing, adopt twin screw extruder, high-temperature fusion mixing is carried out at 270 DEG C, granulation, obtain 1560 grams of electrodepositable PA66-PPO-MPI engineering plastic alloys, be denoted as PPMA-1.Its performance data is as shown in table 1.
By 1000 grams of PA66 resins, 500 grams of PPO resins, 50 grams of MPI-1 resins, 50 grams of MPI-2 resins, 100 grams of ECF-2 conductive filler materials, 100 grams of ECF-3 conductive filler materials, 100 grams of ECF-4 conductive filler materials, 120 grams of maleic anhydride graft polyhexamethylene adipamide resins and 80 grams of maleic anhydride graft polyphenylene oxide resins, 18 gram three (2, 4-di-tert-butyl-phenyl) and phosphorous acid ester and 12 grams of 2-(2 '-hydroxyl-5 '-tertiary octyl phenyl) benzotriazole mixing, adopt twin screw extruder, high-temperature fusion mixing is carried out at 280 DEG C, granulation, obtain 2130 grams of electrodepositable PA66-PPO-MPI engineering plastic alloys, be denoted as PPMA-2.Its performance data is as shown in table 1.
By 1000 grams of PA66 resins, 1000 grams of PPO resins, 50 grams of MPI-1 resins, 100 grams of MPI-2 resins, 300 grams of ECF-1 conductive filler materials, 200 grams of ECF-3 conductive filler materials, 200 grams of maleic anhydride graft polyhexamethylene adipamide resins and 100 grams of maleic anhydride graft polyphenylene oxide resins, 10 gram of four [β-(3, 5-di-tert-butyl-hydroxy phenyl) propionic acid] pentaerythritol ester, 20 gram 1, 2-two (3, 5-di-tert-butyl-hydroxy phenyl) and propionic acid hydrazine and 20 grams of 2-(2 '-hydroxyl-5 '-aminomethyl phenyl) benzotriazole mixing, adopt twin screw extruder, high-temperature fusion mixing is carried out at 290 DEG C, granulation, obtain 3000 grams of electrodepositable PA66-PPO-MPI engineering plastic alloys, be denoted as PPMA-3.Its performance data is as shown in table 1.
The performance data of table 1 electrodepositable PA66-PPO-MPI engineering plastic alloy