CN105566882A - High-binding-force electroplating engineering plastic - Google Patents
High-binding-force electroplating engineering plastic Download PDFInfo
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- CN105566882A CN105566882A CN201610158473.3A CN201610158473A CN105566882A CN 105566882 A CN105566882 A CN 105566882A CN 201610158473 A CN201610158473 A CN 201610158473A CN 105566882 A CN105566882 A CN 105566882A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses a high-binding-force electroplating engineering plastic which comprises a polycarbonate resin, a polystyrene resin, erucyl amide, an MPI resin, a polyolefin elastomer, calcium stearate, a coupling agent, 8 parts of conductive filler, a compatilizer and aids. The electroplating engineering plastic disclosed by the invention has higher hydrophilicity and higher binding force for the coating. The product prepared from the engineering plastic has the advantages of favorable electric properties, favorable mechanical properties, favorable high-temperature resistance and the like, and thus, has excellent comprehensive properties.
Description
Technical field
The present invention relates to a kind of engineering plastics.More particularly, the present invention relates to a kind of electroplating engineering plastics with high-bond.
Background technology
Along with the application of the developing rapidly of industry, plastic electroplating is increasingly extensive, become one of important means of surface decoration in plastic prod; Compared with metallic article, plastic electroplating goods not only can realize good metal-like, and can product weight be alleviated, effectively improve plastics outward appearance and ornamental while, also improve its electricity, heat and anti-corrosion etc. in performance, nowadays in the Application Areas of engineering plastics, plastic electroplating goods have a wide range of applications scope.
In electroplating process, coarsening solution is primarily of the vitriol oil and chromic acid composition, there is strong oxidizing property, by oxidation material surface, material is become wetting ability by hydrophobicity, reduces the contact angle on surface, coarsening solution is sprawled on surface, uniform etachable material surface, this improves material surface wetting ability by electroplate liquid.With the article surface of palladium colloidal deposition after hydrophilic treatment of electric charge, produce chemical nickel in the position of palladium colloid, for providing riveted point when subsequent metal deposition is electroplated.
There is the inconsistent phenomenon of wetting ability in the surface after traditional plating coarsening solution process, cause palladium colloidal deposition limited amount, and skewness, cause material and intermetallic bonding force deficiency, how modification is carried out to improve the suction plating ability of engineering plastics to engineering plastics, improve it and need to be inquired into further to the bonding force of coating.
Summary of the invention
An object of the present invention is to provide a kind of electroplating engineering plastics, this project plastics can improve its hydrophilicity and the bonding force to coating, and the product of preparation has good electric property, mechanical property and resistance to elevated temperatures etc., excellent combination property.
In order to realize, according to these objects of the present invention and other advantage, providing a kind of electroplating engineering plastics with high-bond, comprise the component of following weight part:
Polycarbonate resin 20 ~ 40 parts;
Polystyrene resin 10 ~ 30 parts;
Erucicamide 1 ~ 8 part;
MPI resin 5 ~ 20 parts;
Polyolefin elastomer 2 ~ 5 parts;
Calcium stearate 1 ~ 4 part;
Coupling agent 1 ~ 5 part;
Conductive filler material 2 ~ 8 parts;
Compatilizer 1 ~ 3 part;
Auxiliary agent 1 ~ 2 part.
Preferably, the relative molecular weight of described polycarbonate resin is 17000 ~ 30000g/mol, and second-order transition temperature is 140 ~ 150 DEG C.
Preferably, described polystyrene molecular weight is 50000 ~ 200000.
Preferably, described MPI resin reacts obtained dimaleoyl imino polyimide resin by the Isosorbide-5-Nitrae of mol ratio 1:2:7-12:5-10-bis-(2,4-diamino phenoxy) benzene, maleic anhydride, aromatic dianhydride, aromatic diamine.
Preferably, described compatilizer is selected from one or more in maleic anhydride graft polyhexamethylene adipamide resin, maleic anhydride grafted polyethylene resin, maleic anhydride graft Copolycarbonate resin.
Preferably, described conductive filler material is selected from one or more in Graphene, graphitized carbon black, copper powder, aluminium powder, silver powder, nickel powder, silver-plated copper powder, silver-plated nickel powder, silver-plated glass beads.
Preferably, described oxidation inhibitor is Triethylene glycol two [β-(3-tertiary butyl-4-hydroxy-5-aminomethyl phenyl) propionic ester], four [β-(3,5-di-t-butyl 4-hydroxy phenyl) propionic acid] pentaerythritol ester, three (2,4-di-tert-butyl-phenyl) phosphorous acid ester, one or more in two stearyl alcohol pentaerythritol diphosphites.
Preferably, described coupling agent is selected from one or more in 3-aminopropyl triethoxysilane, 3-aminopropyl trimethoxysilane, glycidoxypropyl group triethoxyl silane, glycidoxy trimethylammonium TMOS.
The present invention at least comprises following beneficial effect: the invention provides a kind of electroplating engineering plastics with high-bond, by add relative molecular weight be the polycarbonate resin of 17000 ~ 30000g/mol, excellent heat stability, simultaneously excellent for electrodepositable performance, the polycarbonate resin of this molecular weight can not cause overreact, produce gel, cause the defects such as plating pit; By adding MPI resin, plastic part surface can be made to form the electrospinning rete that there is a large amount of submicron order holes, improve its hydrophilicity and the bonding force to coating, be through the plastics hydrophilicity after modification and have remarkable raising, there is good stability, inhale plating ability greatly to strengthen, the bonding force of coating is greatly improved, and long service life; Breach the defect of traditional modified plastics, there is very strong practical value.
Part is embodied by explanation below by other advantage of the present invention, target and feature, part also will by research and practice of the present invention by those skilled in the art is understood.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, can implement according to this with reference to specification sheets word to make those skilled in the art.
Should be appreciated that used hereinly such as " to have ", other element one or more do not allotted in " comprising " and " comprising " term or the existence of its combination or interpolation.
Embodiment 1: a kind of electroplating engineering plastics with high-bond, component is as follows: polycarbonate resin (molecular weight 17000) 20 parts; Polystyrene resin 10 parts; Erucicamide 1 part; MPI resin 5 parts; Polyolefin elastomer 2 parts; Calcium stearate 1 part; Coupling agent 1 part; Conductive filler material 2 parts; Compatilizer 1 part; Auxiliary agent 1 part.
Embodiment 2: a kind of electroplating engineering plastics with high-bond, component is as follows: polycarbonate resin (molecular weight 25000) 30 parts; Polystyrene resin 20 parts; Erucicamide 5 parts; MPI resin 15 parts; Polyolefin elastomer 3 parts; Calcium stearate 2 parts; Coupling agent 4 parts; Conductive filler material 6 parts; Compatilizer 2 parts; Auxiliary agent 1.5 parts.
Embodiment 3: a kind of electroplating engineering plastics with high-bond, component is as follows: polycarbonate resin (molecular weight 17000) 40 parts; Polystyrene resin 30 parts; Erucicamide 8 parts; MPI resin 20 parts; Polyolefin elastomer 5 parts; Calcium stearate 4 parts; Coupling agent 5 parts; Conductive filler material 8 parts; Compatilizer 3 parts; Auxiliary agent 2 parts.
Embodiment 4: a kind of electroplating engineering plastics with high-bond, component is as follows: polycarbonate resin (molecular weight 30000) 40 parts; Polystyrene resin 30 parts; Erucicamide 8 parts; MPI resin 20 parts; Polyolefin elastomer 5 parts; Calcium stearate 4 parts; Coupling agent 5 parts; Conductive filler material 8 parts; Compatilizer 3 parts; Auxiliary agent 2 parts.
Comparative example 1: its component is identical with embodiment 1, difference is that the molecular weight of described polycarbonate resin is 10000.
Comparative example 2: its component is identical with embodiment 1, difference is that the molecular weight of described polycarbonate resin is 50000.
Comparative example 3: its component is identical with embodiment 1, difference is not add MPI resin.
The preparation method of each embodiment and comparative example is as follows:
One, polycarbonate, polystyrene resin, oxidation inhibitor, erucicamide, MPI resin, polyolefin elastomer, calcium stearate, coupling agent, conductive filler material, compatilizer and auxiliary agent are added in mixing and blending machine mix;
Two, then mixture is passed through the blended granulation of twin screw extruder, the electroplating engineering plastics of obtained high-bond, wherein, the barrel zone temperature of forcing machine is 200 ~ 260 DEG C, and screw speed is 200 ~ 600rpm.
The electroplating engineering material injection of the high-bond above embodiment and comparative example prepared is shaped to standard-sized model, then electroplates, and in the coarsening solution of plating, the concentration of the vitriol oil and chromic acid is 400g/l, and Coarsening Temperature is 68 DEG C, and coarsening time is 13min.
As shown in table 1, above embodiment and comparative example are tested, content measurement is as follows, and test result refers to table 1.
Table 1 test result
| Project | Unit | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Comparative example 1 | Embodiment 2 | Comparative example 3 |
| Contact angle | 67.8 | 65.2 | 64.1 | 62.9 | 81.2 | 83.4 | 70.1 | |
| Plating bonding force | N/cm | 10.7 | 12.2 | 12.9 | 13.2 | 6.1 | 5.2 | 9.8 |
| Tensile strength | MPa | 56.3 | 57.4 | 55.3 | 56.4 | 53.2 | 54.7 | 40.2 |
| Flexural strength | MPa | 80.3 | 79.7 | 78.3 | 81.3 | 77.2 | 78.5 | 68.9 |
Although embodiment of the present invention are open as above, but it is not restricted to listed in specification sheets and embodiment utilization, it can be applied to various applicable the field of the invention completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the present invention is not limited to specific details.
Claims (8)
1. there are electroplating engineering plastics for high-bond, it is characterized in that, comprise the component of following weight part:
Polycarbonate resin 20 ~ 40 parts;
Polystyrene resin 10 ~ 30 parts;
Erucicamide 1 ~ 8 part;
MPI resin 5 ~ 20 parts;
Polyolefin elastomer 2 ~ 5 parts;
Calcium stearate 1 ~ 4 part;
Coupling agent 1 ~ 5 part;
Conductive filler material 2 ~ 8 parts;
Compatilizer 1 ~ 3 part;
Auxiliary agent 1 ~ 2 part.
2. have the electroplating engineering plastics of high-bond as claimed in claim 1, it is characterized in that, the relative molecular weight of described polycarbonate resin is 17000 ~ 30000g/mol, and second-order transition temperature is 140 ~ 150 DEG C.
3. have the electroplating engineering plastics of high-bond as claimed in claim 1, it is characterized in that, described polystyrene molecular weight is 50000 ~ 200000.
4. there are the electroplating engineering plastics of high-bond as claimed in claim 1, it is characterized in that, described MPI resin is by 1 of mol ratio 1:2:7-12:5-10, the dimaleoyl imino polyimide resin that two (2, the 4-diamino phenoxy) benzene of 4-, maleic anhydride, aromatic dianhydride, aromatic diamine reaction obtain.
5. there are the electroplating engineering plastics of high-bond as claimed in claim 1, it is characterized in that, described compatilizer is selected from one or more in maleic anhydride graft polyhexamethylene adipamide resin, maleic anhydride grafted polyethylene resin, maleic anhydride graft Copolycarbonate resin.
6. there are the electroplating engineering plastics of high-bond as claimed in claim 1, it is characterized in that, described conductive filler material is selected from one or more in Graphene, graphitized carbon black, copper powder, aluminium powder, silver powder, nickel powder, silver-plated copper powder, silver-plated nickel powder, silver-plated glass beads.
7. there are the electroplating engineering plastics of high-bond as claimed in claim 1, it is characterized in that, described oxidation inhibitor is Triethylene glycol two [β-(3-tertiary butyl-4-hydroxy-5-aminomethyl phenyl) propionic ester], four [β-(3,5-di-t-butyl 4-hydroxy phenyl) propionic acid] pentaerythritol ester, three (2,4-di-tert-butyl-phenyl) phosphorous acid ester, one or more in two stearyl alcohol pentaerythritol diphosphites.
8. there are the electroplating engineering plastics of high-bond as claimed in claim 1, it is characterized in that, described coupling agent is selected from one or more in 3-aminopropyl triethoxysilane, 3-aminopropyl trimethoxysilane, glycidoxypropyl group triethoxyl silane, glycidoxy trimethylammonium TMOS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610158473.3A CN105566882B (en) | 2016-03-21 | 2016-03-21 | A kind of electroplating engineering plastics with high-bond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610158473.3A CN105566882B (en) | 2016-03-21 | 2016-03-21 | A kind of electroplating engineering plastics with high-bond |
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| CN105566882A true CN105566882A (en) | 2016-05-11 |
| CN105566882B CN105566882B (en) | 2017-07-21 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106317667A (en) * | 2016-09-22 | 2017-01-11 | 沈阳建筑大学 | Preparation method of conductive polystyrene particles |
| CN107603045A (en) * | 2017-09-28 | 2018-01-19 | 安徽炳辰吸塑有限公司 | A kind of plastic sheeting raw material and its preparation technology |
| CN107674416A (en) * | 2017-09-19 | 2018-02-09 | 江门市德众泰工程塑胶科技有限公司 | Liquid crystal polymer material for environment-protection electroplating and preparation method thereof |
| CN109233261A (en) * | 2018-07-25 | 2019-01-18 | 宁波伊德尔新材料有限公司 | A kind of special-purpose nylon and its preparation process of electrodepositable automobile inside door handle |
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| CN103602053A (en) * | 2013-11-05 | 2014-02-26 | 上海锦湖日丽塑料有限公司 | Easily-electroplated electroplating PC (polycarbonate)/ABS (acrylonitrile butadiene styrene) alloy material and preparation method thereof |
| CN105153692A (en) * | 2015-08-11 | 2015-12-16 | 东华大学 | Platable PA66-PPO-MPI (polyamide 66-polyphenylene oxide-polyimide film with maleimide side groups) engineering plastic alloy and preparation method thereof |
| CN105153693A (en) * | 2015-08-11 | 2015-12-16 | 东华大学 | Platable MPI (polyimide film with maleimide side groups) modified engineering plastic alloy and preparation method thereof |
| CN105385140A (en) * | 2015-12-21 | 2016-03-09 | 上海锦湖日丽塑料有限公司 | Electroplating PC/ABS alloy material with large binding force and preparing method thereof |
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2016
- 2016-03-21 CN CN201610158473.3A patent/CN105566882B/en not_active Expired - Fee Related
Patent Citations (4)
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| CN103602053A (en) * | 2013-11-05 | 2014-02-26 | 上海锦湖日丽塑料有限公司 | Easily-electroplated electroplating PC (polycarbonate)/ABS (acrylonitrile butadiene styrene) alloy material and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106317667A (en) * | 2016-09-22 | 2017-01-11 | 沈阳建筑大学 | Preparation method of conductive polystyrene particles |
| CN106317667B (en) * | 2016-09-22 | 2018-08-14 | 沈阳建筑大学 | A kind of preparation method of conducting polyaniline particle |
| CN107674416A (en) * | 2017-09-19 | 2018-02-09 | 江门市德众泰工程塑胶科技有限公司 | Liquid crystal polymer material for environment-protection electroplating and preparation method thereof |
| CN107674416B (en) * | 2017-09-19 | 2020-06-23 | 江门市德众泰工程塑胶科技有限公司 | Liquid crystal polymer material for environment-friendly electroplating and preparation method thereof |
| CN107603045A (en) * | 2017-09-28 | 2018-01-19 | 安徽炳辰吸塑有限公司 | A kind of plastic sheeting raw material and its preparation technology |
| CN109233261A (en) * | 2018-07-25 | 2019-01-18 | 宁波伊德尔新材料有限公司 | A kind of special-purpose nylon and its preparation process of electrodepositable automobile inside door handle |
| CN109233261B (en) * | 2018-07-25 | 2020-11-20 | 宁波伊德尔新材料有限公司 | Special nylon capable of plating automobile inner door handle and preparation process thereof |
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| CN105566882B (en) | 2017-07-21 |
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Granted publication date: 20170721 Termination date: 20180321 |