CN101775138A - Novel polytriazoles imide resin and preparation method thereof - Google Patents
Novel polytriazoles imide resin and preparation method thereof Download PDFInfo
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- CN101775138A CN101775138A CN200910045230A CN200910045230A CN101775138A CN 101775138 A CN101775138 A CN 101775138A CN 200910045230 A CN200910045230 A CN 200910045230A CN 200910045230 A CN200910045230 A CN 200910045230A CN 101775138 A CN101775138 A CN 101775138A
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- 150000003949 imides Chemical class 0.000 title claims abstract description 75
- 238000002360 preparation method Methods 0.000 title claims abstract description 40
- 239000011347 resin Substances 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 title claims abstract description 32
- -1 azide compound Chemical class 0.000 claims abstract description 46
- 238000006243 chemical reaction Methods 0.000 claims abstract description 33
- 239000002904 solvent Substances 0.000 claims abstract description 24
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 20
- 230000003197 catalytic effect Effects 0.000 claims abstract description 9
- 238000012719 thermal polymerization Methods 0.000 claims abstract description 8
- 238000006736 Huisgen cycloaddition reaction Methods 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 63
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 62
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 50
- 239000000243 solution Substances 0.000 claims description 33
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 32
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 30
- 238000003756 stirring Methods 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 24
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 22
- 239000003054 catalyst Substances 0.000 claims description 22
- 239000008367 deionised water Substances 0.000 claims description 22
- 229910021641 deionized water Inorganic materials 0.000 claims description 22
- 229920000642 polymer Polymers 0.000 claims description 22
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 18
- 230000015572 biosynthetic process Effects 0.000 claims description 16
- 238000003786 synthesis reaction Methods 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- 239000008139 complexing agent Substances 0.000 claims description 9
- 239000011541 reaction mixture Substances 0.000 claims description 9
- 235000010378 sodium ascorbate Nutrition 0.000 claims description 9
- 229960005055 sodium ascorbate Drugs 0.000 claims description 9
- PPASLZSBLFJQEF-RKJRWTFHSA-M sodium ascorbate Substances [Na+].OC[C@@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RKJRWTFHSA-M 0.000 claims description 9
- PPASLZSBLFJQEF-RXSVEWSESA-M sodium-L-ascorbate Chemical compound [Na+].OC[C@H](O)[C@H]1OC(=O)C(O)=C1[O-] PPASLZSBLFJQEF-RXSVEWSESA-M 0.000 claims description 9
- PXIPVTKHYLBLMZ-UHFFFAOYSA-N Sodium azide Chemical compound [Na+].[N-]=[N+]=[N-] PXIPVTKHYLBLMZ-UHFFFAOYSA-N 0.000 claims description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 8
- 150000008282 halocarbons Chemical class 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 7
- 238000006352 cycloaddition reaction Methods 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000000746 purification Methods 0.000 claims description 6
- 238000001226 reprecipitation Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 125000002355 alkine group Chemical group 0.000 claims description 4
- 230000018044 dehydration Effects 0.000 claims description 4
- 238000006297 dehydration reaction Methods 0.000 claims description 4
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical class CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 claims description 4
- 239000012046 mixed solvent Substances 0.000 claims description 4
- 238000007363 ring formation reaction Methods 0.000 claims description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000376 reactant Substances 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 2
- 239000012024 dehydrating agents Substances 0.000 claims description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 2
- 238000010534 nucleophilic substitution reaction Methods 0.000 claims description 2
- 239000003960 organic solvent Substances 0.000 claims description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 claims 2
- 229940113088 dimethylacetamide Drugs 0.000 claims 2
- 239000002798 polar solvent Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 abstract description 28
- 229920001721 polyimide Polymers 0.000 abstract description 28
- 238000013461 design Methods 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000004377 microelectronic Methods 0.000 abstract description 3
- GTCLFEMMPGBNOI-UHFFFAOYSA-N 2-phenylethynamine Chemical group NC#CC1=CC=CC=C1 GTCLFEMMPGBNOI-UHFFFAOYSA-N 0.000 abstract 1
- 125000001425 triazolyl group Chemical group 0.000 abstract 1
- 150000002466 imines Chemical class 0.000 description 22
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 13
- 150000003852 triazoles Chemical class 0.000 description 13
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 11
- 238000005160 1H NMR spectroscopy Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- ZEEHTZPHMVRWHO-UHFFFAOYSA-N 2-ethynyl-4-phenylisoindole-1,3-dione Chemical compound C(#C)N1C(C=2C(C1=O)=C(C=CC=2)C1=CC=CC=C1)=O ZEEHTZPHMVRWHO-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 230000009477 glass transition Effects 0.000 description 8
- 238000011160 research Methods 0.000 description 7
- 230000004580 weight loss Effects 0.000 description 7
- FZTDWZQGFQIIDA-UHFFFAOYSA-N ethoxyethane;isoindole-1,3-dione Chemical compound CCOCC.C1=CC=C2C(=O)NC(=O)C2=C1 FZTDWZQGFQIIDA-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010992 reflux Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- NNKQLUVBPJEUOR-UHFFFAOYSA-N 3-ethynylaniline Chemical group NC1=CC=CC(C#C)=C1 NNKQLUVBPJEUOR-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 150000001345 alkine derivatives Chemical class 0.000 description 4
- 150000001540 azides Chemical class 0.000 description 4
- 238000012650 click reaction Methods 0.000 description 4
- 150000004985 diamines Chemical class 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 238000000967 suction filtration Methods 0.000 description 4
- KXFBLYGHUVFKRM-UHFFFAOYSA-N 1-(azidomethyl)-4-[4-(azidomethyl)phenyl]benzene Chemical group C1=CC(CN=[N+]=[N-])=CC=C1C1=CC=C(CN=[N+]=[N-])C=C1 KXFBLYGHUVFKRM-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000012065 filter cake Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000011157 advanced composite material Substances 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 125000000852 azido group Chemical group *N=[N+]=[N-] 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- CKJNUZNMWOVDFN-UHFFFAOYSA-N methanone Chemical compound O=[CH-] CKJNUZNMWOVDFN-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- MWYDOXLDDPKKCP-UHFFFAOYSA-N 1,4-bis(azidomethyl)benzene Chemical compound [N-]=[N+]=NCC1=CC=C(CN=[N+]=[N-])C=C1 MWYDOXLDDPKKCP-UHFFFAOYSA-N 0.000 description 1
- ZZHIDJWUJRKHGX-UHFFFAOYSA-N 1,4-bis(chloromethyl)benzene Chemical compound ClCC1=CC=C(CCl)C=C1 ZZHIDJWUJRKHGX-UHFFFAOYSA-N 0.000 description 1
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005882 aldol condensation reaction Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 1
- 238000010462 azide-alkyne Huisgen cycloaddition reaction Methods 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000009903 catalytic hydrogenation reaction Methods 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000412 dendrimer Substances 0.000 description 1
- 229920000736 dendritic polymer Polymers 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 238000012869 ethanol precipitation Methods 0.000 description 1
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- 238000007429 general method Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000005457 ice water Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- 230000005389 magnetism Effects 0.000 description 1
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- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 230000004044 response Effects 0.000 description 1
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Landscapes
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
本发明公开了一种主链结构中含三唑环的聚酰亚胺即聚三唑酰亚胺及其制备方法,首先,设计并合成二元叠氮化合物;其次,以二元酸酐和间氨基苯乙炔为原料,设计并合成端炔基酰亚胺化合物;第三,利用端炔基酰亚胺化合物与叠氮化合物以等摩尔量在溶剂中进行1,3-偶极环加成聚合反应,或采用热聚合反应,或采用催化聚合反应合成新的聚三唑酰亚胺;本发明制备的聚三唑酰亚胺树脂既具有良好的加工性能,又具有较高的热稳定性,同时还具有良好的机械性能和电学性能,并体现了聚三唑树脂的高耐腐蚀性、高粘结力等特点,在航空、航天、微电子、汽车、船舶工业等领域有广泛的应用前景。The invention discloses a polyimide containing a triazole ring in the main chain structure, that is, polytriazole imide and a preparation method thereof. Firstly, a binary azide compound is designed and synthesized; secondly, a binary acid anhydride and meta Use aminophenylacetylene as raw material to design and synthesize terminal alkynyl imide compounds; thirdly, use terminal alkynyl imide compounds and azide compounds in equimolar amounts to carry out 1,3-dipolar cycloaddition polymerization in a solvent reaction, or adopt thermal polymerization reaction, or adopt catalytic polymerization reaction to synthesize new polytriazole imide; The polytriazole imide resin prepared by the present invention not only has good processability, but also has higher thermal stability, At the same time, it also has good mechanical properties and electrical properties, and reflects the characteristics of high corrosion resistance and high adhesion of polytriazole resins. It has broad application prospects in aviation, aerospace, microelectronics, automobiles, shipbuilding industries and other fields. .
Description
【技术领域】【Technical field】
本发明涉及化学化工和材料技术领域,涉及一种新的聚三唑酰亚胺树脂及其制备方法,具体地说,是一种利用二端炔基酰亚胺化合物和二叠氮化合物经1,3-偶极环加成聚合反应制备新型的聚三唑酰亚胺树脂。The present invention relates to the technical fields of chemistry, chemical engineering and materials, and relates to a new polytriazole imide resin and its preparation method, specifically, a method of using two-terminal alkynyl imide compounds and diazide compounds via 1 , 3-dipolar cycloaddition polymerization to prepare a new type of polytriazole imide resin.
【背景技术】【Background technique】
20世纪60年代后期,Baldwin等人在研究中发现,分子结构中同时具有叠氮基和炔基的化合物可以发生1,3-偶极环加成聚合反应,生成1,4取代和1,5取代的线型三唑树脂,形成的聚合物具有高的热稳定性。20世纪80年代,Mock等人发现用一些带氨基的试剂催化时,叠氮-炔基的1,3-偶极环加成反应只生成1,4取代的三唑环结构。前苏联以及国内的北京理工大学等利用叠氮和炔反应来制备新型含能粘合剂。2002年,华东理工大学黄发荣实验室开始研究炔与叠氮的反应,并利用炔和叠氮的热反应来制备聚三唑树脂。同年,Sharpless等人报道了用一价铜盐(Cu(I))催化的叠氮-炔基的1,3-偶极加成反应,发现催化的加成反应速率提高了106倍,并且具有立构选择性,只生成1,4-二取代的1,2,3-三唑化合物,Sharpless提出了Click化学概念。In the late 1960s, Baldwin et al. found in their research that compounds with both azido and alkynyl groups in their molecular structures can undergo 1,3-dipolar cycloaddition polymerization reactions to generate 1,4 substitutions and 1,5 Substituted linear triazole resins that form polymers with high thermal stability. In the 1980s, Mock et al. found that the 1,3-dipolar cycloaddition reaction of azide-alkynyl groups only produced 1,4-substituted triazole ring structures when catalyzed by some reagents with amino groups. The former Soviet Union and Beijing Institute of Technology in China used the reaction of azide and alkyne to prepare a new type of energetic adhesive. In 2002, Huang Farong's laboratory of East China University of Science and Technology began to study the reaction of alkyne and azide, and used the thermal reaction of alkyne and azide to prepare polytriazole resin. In the same year, Sharpless et al reported the 1,3-dipolar addition reaction of azide-alkynyl catalyzed by monovalent copper salt (Cu(I)), and found that the catalytic addition reaction rate increased by 10 6 times, and It has stereoselectivity and only generates 1, 4-disubstituted 1, 2, 3-triazole compounds. Sharpless proposed the concept of Click chemistry.
Cli ck反应是化学中简单而高效的合成反应,是近乎完美的化学反应,其特点是反应条件简单,一般情况下对水和氧气不敏感,起始原料和试剂容易得到,产率高,产物易分离。叠氮-炔基的1.3-偶极环加成反应是典型的Click反应,成为材料科学研究中的热点。Hawker,Sharpless等人率先将Huisgen1,3-偶极环加成反应应用于树状大分子的合成。之后,人们利用Click反应相继合成了线型、交联型、星型、以及超支化等新型分子结构的聚合物。Click反应作为一种重要的合成方法在材料合成中还与其它聚合方法,如活性聚合、原子转移自由基聚合方法相结合,广泛用于新型高分子材料的设计与制备。The Click reaction is a simple and efficient synthetic reaction in chemistry. It is a nearly perfect chemical reaction. It is characterized by simple reaction conditions, generally insensitive to water and oxygen, easy access to starting materials and reagents, high yields, and products. Easy to separate. The 1.3-dipolar cycloaddition reaction of azide-alkynyl is a typical Click reaction and has become a hotspot in material science research. Hawker, Sharpless et al took the lead in applying Huisgen1,3-dipolar cycloaddition reaction to the synthesis of dendrimers. Afterwards, polymers with new molecular structures such as linear, cross-linked, star, and hyperbranched were successively synthesized by using the Click reaction. As an important synthetic method, Click reaction is also combined with other polymerization methods, such as living polymerization and atom transfer radical polymerization, in material synthesis, and is widely used in the design and preparation of new polymer materials.
华东理工大学黄发荣实验室将叠氮基与炔基在较低温度下发生的1,3-偶极环加成反应应用于含三唑环的聚合物合成中,成功地开发了含1,4-二取代和1,5-二取代-1,2,3-三唑环的线型、交联固化型可低温固化的聚三唑树脂。研究结果表明,热交联固化的聚三唑树脂具有优异的加工性能、热性能和机械性能。最近,唐本忠等人也利用非催化叠氮和炔的环加成反应,制备了重均分子量为2~3万的含苯环线型聚三唑功能材料。The Huang Farong laboratory of East China University of Science and Technology applied the 1,3-dipolar cycloaddition reaction of azido group and alkynyl group at a lower temperature to the synthesis of polymers containing triazole rings, and successfully developed a 1,4 - Linear, cross-linked curable low temperature curable polytriazole resins of disubstituted and 1,5-disubstituted-1,2,3-triazole rings. The research results show that thermally cross-linked and cured polytriazole resins have excellent processability, thermal properties and mechanical properties. Recently, Tang Benzhong and others also used the non-catalytic cycloaddition reaction of azide and alkyne to prepare a linear polytriazole functional material with a weight average molecular weight of 20,000 to 30,000.
三唑环作为一个刚性的芳香环,具有良好的耐热性、耐热氧化性和耐化学性,三唑环对金属具有良好的粘结性,可广泛地用作金属材料的防腐蚀涂层。As a rigid aromatic ring, the triazole ring has good heat resistance, thermal oxidation resistance and chemical resistance. The triazole ring has good adhesion to metals and can be widely used as an anti-corrosion coating for metal materials. .
聚酰亚胺材料是一类分子主链上含有五元酰亚胺环的高分子材料,不仅具有良好的耐热性能,而且还具有优良的尺寸稳定性、氧化稳定性、耐化学药品腐蚀性、耐辐照性、及良好的机械性能和介电性能,因此具有突出的应用价值,被广泛应用于航空航天、电气电子、交通运输等领域。Polyimide material is a kind of polymer material containing five-membered imide ring in the molecular main chain. It not only has good heat resistance, but also has excellent dimensional stability, oxidation stability and chemical corrosion resistance. , radiation resistance, and good mechanical and dielectric properties, so it has outstanding application value and is widely used in aerospace, electrical and electronic, transportation and other fields.
目前,聚酰亚胺的应用形式有:At present, the application forms of polyimide are:
①薄膜制造。杜邦公司在60年代发展起来的Kapton薄膜是聚酰亚胺最早的商品之一;随后,日本Unitika公司先后开发了Upilex-R和Upilex-S薄膜,这些薄膜具有低收缩率、低热胀系数、低吸水率,以及耐水解性能和优异的机械性能。① Film manufacturing. The Kapton film developed by DuPont in the 1960s was one of the earliest products of polyimide; subsequently, the Japanese Unitika company successively developed Upilex-R and Upilex-S films, which have low shrinkage, low thermal expansion coefficient, and low Water absorption, as well as hydrolysis resistance and excellent mechanical properties.
②涂料制造。作为绝缘漆或耐高温的涂料使用。② Paint manufacturing. Used as insulating varnish or high temperature resistant coating.
③先进复合材料制造。作为耐高温的树脂基复合材料而广泛地应用于航天航空业的结构件及发动机零部件上。③Manufacturing of advanced composite materials. As a high-temperature resistant resin-based composite material, it is widely used in structural parts and engine parts in the aerospace industry.
④纤维制造。制造的纤维弹性模量仅次于碳纤维,是先进复合材料的增强剂。④ fiber manufacturing. The modulus of elasticity of the manufactured fiber is second only to that of carbon fiber, and it is a reinforcing agent for advanced composite materials.
⑤泡沫及工程塑料制造。前者用作既耐高温又耐低温的隔热隔音材料,后者主要用于自润滑、密封、绝缘及结构材料。⑤ Manufacture of foam and engineering plastics. The former is used as a heat and sound insulation material that is resistant to high temperature and low temperature, and the latter is mainly used for self-lubricating, sealing, insulating and structural materials.
⑥另外,聚酰亚胺作为功能材料,还广泛地应用于微电子器件、液晶显示器、非线性光电材料等领域。⑥In addition, as a functional material, polyimide is also widely used in the fields of microelectronic devices, liquid crystal displays, and nonlinear optoelectronic materials.
但是,大量的研究表明,聚酰亚胺的分子链刚性较大,分子链间的作用力很强,分子链紧密堆砌,往往使聚酰亚胺难熔难溶。针对这一缺点,人们进行了大量的研究,采用多种方法来改善聚酰亚胺的性能。近年来,通过单体的分子设计,在分子结构中引入特殊结构单元(如,柔顺性结构单元、大侧基或亲溶剂基团、扭曲和非共平面结构)、引入芳杂环、氟硅等元素,或通过共聚等方式对聚酰亚胺进行改性。目前,已经研究和开发的聚酰亚胺有:However, a large number of studies have shown that the molecular chains of polyimide are relatively rigid, the force between molecular chains is very strong, and the molecular chains are tightly packed, which often makes polyimide infusible and insoluble. In response to this shortcoming, a lot of research has been carried out, and various methods have been used to improve the performance of polyimide. In recent years, through the molecular design of monomers, special structural units (such as flexible structural units, large side groups or solvophilic groups, twisted and non-coplanar structures), introduction of aromatic heterocycles, fluorosilicone, etc. have been introduced into the molecular structure. and other elements, or modify polyimide by means of copolymerization. At present, the polyimides that have been researched and developed are:
①在二酐或二胺单体中引入柔性结构单元以提高聚酰亚胺分子链的流动性,或改善聚酰亚胺的溶解性和熔融性;① Introduce flexible structural units into dianhydride or diamine monomers to improve the fluidity of polyimide molecular chains, or improve the solubility and melting properties of polyimide;
②在聚酰亚胺中引入扭曲和非共平面结构,使形成的聚酰亚胺分子链段发生扭曲,减小或破坏聚酰亚胺分子主链的共轭体系,降低分子间的作用力,从而提高聚酰亚胺的溶解性;②Introduce twisted and non-coplanar structures into polyimide to distort the formed polyimide molecular chain segments, reduce or destroy the conjugated system of the polyimide molecular main chain, and reduce the intermolecular force , thereby improving the solubility of polyimide;
③在分子主链上引入大的侧基或亲溶剂基,降低聚合物分子链的堆积密度,使溶剂分子容易渗入,从而具有良好的溶解性。③Introduce large side groups or solvophilic groups on the molecular main chain to reduce the packing density of polymer molecular chains, so that solvent molecules can easily penetrate, thus having good solubility.
近年来,在聚合物的分子主链中引入芳杂环结构已经成为研究的热点。在聚酰亚胺的分子主链中引入芳杂环结构单元不仅可以在保持其优异机械性能和耐热性能的同时显著改善其加工性能,而且还可以改善其在电、磁等方面的性能。目前引入芳杂环结构比较多的是吡啶环。吡啶环是一个刚性的芳杂环分子,具有芳香性、对称性、碱性和极性。研究结果表明,主链含吡啶环的聚酰亚胺不仅具有优异的热稳定性、化学稳定性,而且还具有良好的溶解性和成膜性。制备主链含吡啶环的聚酰亚胺主要是通过设计、合成含吡啶环的二酐或二胺单体来实现的。John等人通过Claisen-Schmidt反应得到了含吡啶环的二硝基化合物,再经Pd/C催化加氢还原便得到含吡啶二胺。兰州大学的李彦锋等人合成了含吡啶环的系列聚酰亚胺。但是,含吡啶环单体的合成难度大、产率低、成本高,这在很大程度上阻碍了主链含吡啶环的聚酰亚胺的发展。In recent years, the introduction of aromatic heterocyclic structures into the molecular backbone of polymers has become a research hotspot. The introduction of aromatic heterocyclic structural units into the molecular backbone of polyimide can not only significantly improve its processing performance while maintaining its excellent mechanical properties and heat resistance, but also improve its electrical and magnetic properties. At present, the pyridine ring is more frequently introduced into the aromatic heterocycle structure. The pyridine ring is a rigid aromatic heterocyclic molecule with aromaticity, symmetry, basicity and polarity. The research results show that the polyimide with pyridine ring in the main chain not only has excellent thermal stability and chemical stability, but also has good solubility and film-forming properties. The preparation of polyimides containing pyridine rings in the main chain is mainly achieved by designing and synthesizing dianhydride or diamine monomers containing pyridine rings. John et al obtained a dinitro compound containing a pyridine ring through the Claisen-Schmidt reaction, and then obtained a pyridine-containing diamine through Pd/C catalytic hydrogenation reduction. Yanfeng Li of Lanzhou University and others synthesized a series of polyimides containing pyridine rings. However, the synthesis of monomers containing pyridine rings is difficult, the yield is low, and the cost is high, which largely hinders the development of polyimides containing pyridine rings in the main chain.
聚酰亚胺在合成上具有多种途径,芳香二酐与二胺的缩聚反应是制备聚酰亚胺的通用方法,它往往需要高温热处理才能使其亚胺化完全,大多限于在薄膜及涂料方面的应用。此外,由于聚酰胺酸溶液在储存时对温度较敏感,缩聚反应的方法受到了很大的限制,因此,合成可熔融加工或可溶性的聚酰亚胺就成了研究的重点。There are many ways to synthesize polyimide. The polycondensation reaction of aromatic dianhydride and diamine is a general method for preparing polyimide. It often requires high temperature heat treatment to complete its imidization. Most of them are limited to films and coatings. aspects of application. In addition, because the polyamic acid solution is sensitive to temperature during storage, the method of polycondensation reaction is greatly limited. Therefore, the synthesis of melt-processable or soluble polyimide has become the focus of research.
【发明内容】【Content of invention】
本发明的目的在于通过分子设计与合成提供一种机械性能和耐热性能优异、可溶可熔的加工性能大大改善,有电、磁方面的特殊性能、并且易加工的新的聚三唑酰亚胺树脂;本发明的再一目的是,提供所述聚三唑酰亚胺树脂的制备方法,从而保证聚酰亚胺更为广泛的应用。The purpose of the present invention is to provide a new polytriazole acid with excellent mechanical properties and heat resistance, greatly improved soluble and fusible processing properties, special properties in electricity and magnetism, and easy processing through molecular design and synthesis. Imine resin; Another object of the present invention is to provide a preparation method of the polytriazole imide resin, thereby ensuring a wider application of polyimide.
为实现上述目的,本发明采取的技术方案是:For realizing above-mentioned object, the technical scheme that the present invention takes is:
一种聚三唑酰亚胺树脂,其化学结构式为:A kind of polytriazole imide resin, its chemical structural formula is:
n=20~100,n=20~100,
式中,In the formula,
在所述的聚三唑酰亚胺树脂中,端炔基酰亚胺化合物的结构如下:In the polytriazole imide resin, the structure of the terminal alkynyl imide compound is as follows:
在所述的聚三唑酰亚胺树脂中,叠氮化合物的结构如下:In described polytriazole imide resin, the structure of azide compound is as follows:
为实现上述目的,本发明采取的技术方案是:For realizing above-mentioned object, the technical scheme that the present invention takes is:
一种聚三唑酰亚胺树脂的制备方法,其特征在于,以端炔基酰亚胺化合物和叠氮化合物通过炔-叠氮的Click化学环加成聚合反应来制备聚三唑酰亚胺,采用催化聚合反应或热聚合反应,其制备步骤为:A kind of preparation method of polytriazole imide resin is characterized in that, polytriazole imide is prepared by the Click chemical cycloaddition polymerization reaction of alkyne-azide with terminal alkynyl imide compound and azide compound , using catalytic polymerization or thermal polymerization, the preparation steps are:
(1)制备叠氮化合物(1) Preparation of azide compounds
以叠氮化钠和卤代烃为原料,通过亲核取代反应制备叠氮化合物,其制备过程为:在溶液中进行叠氮化合物的合成,溶剂选用N,N’-二甲基甲酰胺(DMF)、苯、甲苯、二甲基亚砜(DMSO)、或四氢呋喃(THF);在反应釜中加入甲苯和DMF的混合溶剂,两者的体积比为甲苯∶DMF=1∶1~2,加入量为每摩尔卤代烃加800~1500mL混合溶剂;加入卤代烃,卤代烃为氯化物、溴化物或碘化物;反应原料叠氮化钠与卤代烃的投料当量比为1.0~3.0∶1.0,反应温度为20~80℃,反应时间为2~10h,其结构式为:Using sodium azide and halogenated hydrocarbons as raw materials, the azide compound is prepared by nucleophilic substitution reaction. The preparation process is as follows: the synthesis of the azide compound is carried out in the solution, and the solvent is selected from N, N'-dimethylformamide ( DMF), benzene, toluene, dimethyl sulfoxide (DMSO), or tetrahydrofuran (THF); add the mixed solvent of toluene and DMF in the reactor, the volume ratio of the two is toluene: DMF=1: 1~2, The amount of addition is 800-1500mL of mixed solvent per mole of halogenated hydrocarbon; add halogenated hydrocarbon, which is chloride, bromide or iodide; the equivalent ratio of reaction raw materials sodium azide to halogenated hydrocarbon is 1.0- 3.0:1.0, the reaction temperature is 20-80°C, the reaction time is 2-10h, and its structural formula is:
其中,in,
(2)制备端炔基酰亚胺化合物(2) Preparation of terminal alkynyl imide compounds
通过酸酐与带炔基的胺化合物反应,再以乙酸酐脱水环化,合成端炔基酰亚胺化合物,其制备过程分两步反应进行:The terminal alkynyl imide compound is synthesized by reacting an acid anhydride with an amine compound with an alkyne group, followed by dehydration and cyclization with acetic anhydride. The preparation process is divided into two steps:
第一步,将芳香酸酐和带炔基的芳香胺在有机溶剂(丙酮等)中反应生成酰胺酸;The first step, reacts aromatic acid anhydride and aromatic amine with alkyne group in organic solvent (acetone etc.) to generate amic acid;
第二步,以乙酸酐作为脱水剂、三乙胺为催化剂进行脱水环化,生成端炔基酰亚胺化合物;The second step is to use acetic anhydride as a dehydrating agent and triethylamine as a catalyst for dehydration and cyclization to generate terminal alkynyl imide compounds;
这些操作应在惰性气体,如氮气、氦气或氩气等保护条件下进行,最后,用丙酮洗涤,提纯处理制备所得的端炔基酰亚胺化合物,其结构式为:These operations should be carried out under the protective conditions of inert gas, such as nitrogen, helium or argon, and finally, wash with acetone and purify the prepared terminal alkynyl imide compound. Its structural formula is:
其中:in:
(3)制备聚三唑酰亚胺(3) Preparation of polytriazole imide
用制取的二端炔基酰亚胺化合物与二叠氮化合物以等摩尔量在溶剂中进行1,3-偶极环加成聚合反应,聚合反应或采用热聚合反应,或采用催化聚合反应;Carry out 1,3-dipolar cycloaddition polymerization in a solvent with the prepared two-terminal alkynyl imide compound and diazide compound in an equimolar amount, and the polymerization reaction is either a thermal polymerization reaction or a catalytic polymerization reaction ;
所述的溶剂为N,N’-二甲基甲酰胺(DMF)、N,N’-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)或N-甲基吡咯烷酮(NMP)的一种或多种;Described solvent is N, N'-dimethylformamide (DMF), N, N'-dimethylacetamide (DMAc), dimethylsulfoxide (DMSO) or N-methylpyrrolidone (NMP) one or more of
所述的热聚合反应为:将等摩尔的二端炔基酰亚胺化合物和二叠氮化合物加入到三口烧瓶中,加入溶剂,配制成质量浓度为5~50%的混合液(优选为15-30%),搅拌充分后,升温至70~120℃(优选为80~100℃),搅拌反应12~48小时(优选为24~36小时),得到聚合物溶液;冷却至室温后将反应溶液倒入乙醇中沉淀,得到白色产物;抽滤,并用热乙醇洗涤后,在100℃真空干燥箱内干燥过夜,得到聚三唑酰亚胺树脂;The thermal polymerization reaction is as follows: adding equimolar two-terminal alkynyl imide compounds and diazide compounds into a three-necked flask, adding a solvent, and preparing a mixed solution with a mass concentration of 5-50% (preferably 15 -30%), after fully stirring, heat up to 70-120°C (preferably 80-100°C), stir and react for 12-48 hours (preferably 24-36 hours), to obtain a polymer solution; after cooling to room temperature, react Pour the solution into ethanol to precipitate to obtain a white product; filter it with suction, wash it with hot ethanol, and dry it in a vacuum oven at 100°C overnight to obtain a polytriazole imide resin;
所述的催化聚合反应为:将等摩尔数的端炔基酰亚胺化合物和二叠氮化合物加入到三口烧瓶中,加入溶剂DMF、DMAc、DMSO或N-甲基吡咯烷酮,使反应物质量浓度达到5~50%(优选为15~30%),搅拌充分后,升温至20~80℃(优选为40~60℃);再加入CuSO45H2O和抗坏血酸钠催化剂,加入量分别为炔基化合物摩尔数的5%和10%,同时加入与端炔基酰亚胺化合物摩尔数等量的三乙胺络合剂,恒温下搅拌反应2~8小时(优选为3~4小时),得到粘稠的聚合物溶液;冷却至室温后将反应混合物倒入去离子水中即可得纤维状的聚三唑酰亚胺树脂,同时用去离子水反复浸泡洗涤,除去催化剂和三乙胺,抽滤,并用热乙醇洗涤后,在100℃真空干燥箱中干燥过夜,得到高分子量的聚三唑酰亚胺,然后溶解在二甲基乙酰胺、二甲基亚砜或N-甲基吡咯烷酮中再沉淀提纯,干燥后得到聚三唑酰亚胺树脂,其化学反应方程式为:The catalytic polymerization reaction is as follows: adding equimolar alkynyl imide compounds and diazide compounds into a three-necked flask, adding solvent DMF, DMAc, DMSO or N-methylpyrrolidone, so that the mass concentration of the reactants 5% to 50% (preferably 15% to 30%), after stirring fully, heat up to 20 ~ 80°C (preferably 40°C to 60°C); then add CuSO 4 5H 2 O and sodium ascorbate catalyst, the addition amount is respectively 5% and 10% of the number of moles of the base compound, while adding a triethylamine complexing agent equivalent to the number of moles of the terminal alkynyl imide compound, stirring and reacting at a constant temperature for 2 to 8 hours (preferably 3 to 4 hours), A viscous polymer solution is obtained; after cooling to room temperature, the reaction mixture is poured into deionized water to obtain a fibrous polytriazole imide resin, and simultaneously soaked and washed repeatedly with deionized water to remove the catalyst and triethylamine, Suction filtration, and after washing with hot ethanol, dry overnight in a vacuum oven at 100°C to obtain high molecular weight polytriazole imide, which is then dissolved in dimethylacetamide, dimethyl sulfoxide or N-methylpyrrolidone Reprecipitate and purify in medium, and obtain polytriazole imide resin after drying, and its chemical reaction equation is:
n=20~100,n=20~100,
式中:In the formula:
本发明一种新的聚三唑酰亚胺树脂具有以下优点:A kind of new polytriazole imide resin of the present invention has the following advantages:
(1)将三唑环引入到聚酰亚胺的主链结构中,使聚三唑酰亚胺树脂易溶易熔,具有良好的加工性能;(1) The triazole ring is introduced into the main chain structure of the polyimide, so that the polytriazole imide resin is soluble and fusible, and has good processability;
(2)具有较高的热稳定性,其热分解温度Td5达360℃,玻璃化转变温度(Tg)可在200℃以上;(2) It has high thermal stability, its thermal decomposition temperature T d5 can reach 360 °C, and the glass transition temperature (T g ) can be above 200 °C;
(3)既具有良好的机械性能,又具有良好的电学性能;(3) It has both good mechanical properties and good electrical properties;
(4)具有耐腐蚀性、高粘结力等功能特性,在航空、航天、微电子、汽车、船舶工业等领域有广泛的应用前景。(4) It has functional properties such as corrosion resistance and high adhesion, and has broad application prospects in the fields of aviation, aerospace, microelectronics, automobiles, and shipbuilding industries.
本发明一种聚三唑酰亚胺树脂的制备方法的积极效果是:The positive effect of the preparation method of a kind of polytriazole imide resin of the present invention is:
(1)Click化学环加成聚合反应条件温和可控,可在简单的条件下进行,对水和氧气不敏感,无需氮气、氦气或氩气等保护;(1) Click chemical cycloaddition polymerization reaction conditions are mild and controllable, it can be carried out under simple conditions, it is not sensitive to water and oxygen, and does not need protection such as nitrogen, helium or argon;
(2)端炔基酰亚胺化合物容易制备,在较低温度下即能完全亚胺化,避免了聚酰亚胺合成的高温亚胺化及其副反应;(2) The alkynyl-terminated imide compound is easy to prepare, and can be completely imidized at a relatively low temperature, avoiding the high-temperature imidization and side reactions of polyimide synthesis;
(3)Click化学环加成反应具有完全性和专一性,加成反应不影响其它官能团,具有很好的兼容性,通过合理的分子设计可在聚三唑酰亚胺中方便地引入反应性的活性基团,如羧基,羟基等;(3) The Click chemical cycloaddition reaction is complete and specific, and the addition reaction does not affect other functional groups, and has good compatibility. Through reasonable molecular design, the reaction can be easily introduced into polytriazole imide Sexual active groups, such as carboxyl, hydroxyl, etc.;
(4)聚合过程中无小分子物质放出,无副反应或副产物产生,易合成高分子量的聚酰亚胺。(4) No small molecular substances are released during the polymerization process, no side reactions or by-products are produced, and high molecular weight polyimides are easily synthesized.
【具体实施方式】【Detailed ways】
以下通过9个实施例对本发明的制备方法进行具体地描述,其目的在于更好理解本发明的内容,但本发明的保护范围不限于以下实施例。The preparation method of the present invention is specifically described below through 9 examples, the purpose of which is to better understand the content of the present invention, but the protection scope of the present invention is not limited to the following examples.
根据以上所述的一种聚三唑酰亚胺树脂的制备方法的制备步骤进行了以下的实验与验证。According to the preparation steps of the preparation method of a polytriazole imide resin described above, the following experiments and verifications were carried out.
实施例1Example 1
(1)1,4-二叠氮甲基苯的合成(A1)(1) Synthesis of 1,4-diazidemethylbenzene (A1)
在三口烧瓶中加入1,4-二氯甲基苯50mmol、NaN3150mmol、甲苯20ml和DMF 20ml,在搅拌下加热到70~75℃,恒温反应3h,反应结束后将反应产物冷却至室温,倒入200ml去离子水中,在冰冻条件下静置过夜析出白色片状晶体,过滤,滤饼用去离子水洗涤,干燥后得白色粉末状固体,产率为90.0%,mp.26.0~27.5℃。Add 50mmol of 1,4-dichloromethylbenzene, 150mmol of NaN 3 , 20ml of toluene and 20ml of DMF into a three-necked flask, heat to 70-75°C under stirring, and react at constant temperature for 3h. After the reaction, cool the reaction product to room temperature. Pour into 200ml of deionized water, stand overnight under freezing conditions to precipitate white flaky crystals, filter, wash the filter cake with deionized water, and dry to obtain a white powdery solid with a yield of 90.0%, mp.26.0~27.5°C .
(2)双(N-乙炔基苯基)-双酚A醚邻苯二甲酰亚胺的合成(B1)(2) Synthesis of bis(N-ethynylphenyl)-bisphenol A ether phthalimide (B1)
在装有搅拌、恒压漏斗和球形冷凝管的250ml四口烧瓶中加入双酚A型二酐(BPADA)20mmol,间氨基苯乙炔40mmol,加入50ml丙酮为溶剂,加热回流6小时后再加入50ml的乙酸酐,并加入75ml的三乙胺做催化剂,在80℃回流6小时,反应完后冷却、沉淀,再用丙酮洗涤,抽滤、干燥得产物,产率为92%;FTIR(cm-1):3254(≡C-H),1776(C=O反对称伸缩),1714(C=O对称伸缩,亚胺I),1384(C-N-C,亚胺II),748(C=O);1H-NMR(DMSO):7.2~8.0(Ar-H),4.31(≡CH),1.67(-CH3),其结构式为:Add 20mmol of bisphenol A dianhydride (BPADA) and 40mmol of m-aminophenylacetylene into a 250ml four-neck flask equipped with stirring, constant pressure funnel and spherical condenser, add 50ml of acetone as a solvent, heat and reflux for 6 hours and then add 50ml acetic anhydride, and added 75ml of triethylamine as a catalyst, refluxed at 80 ° C for 6 hours, cooled and precipitated after the reaction, washed with acetone, filtered and dried to obtain the product, the yield was 92%; FTIR (cm - 1 ): 3254 (≡CH), 1776 (C=O anti-symmetric stretching), 1714 (C=O symmetrical stretching, imine I), 1384 (CNC, imine II), 748 (C=O); 1 H -NMR(DMSO): 7.2~8.0(Ar-H), 4.31(≡CH), 1.67(-CH 3 ), its structural formula is:
(3)聚三唑酰亚胺PTAI-A1-B1的制备(3) Preparation of polytriazole imide PTAI-A1-B1
将1,4-二叠氮甲基苯10mmol、双(N-乙炔基苯基)-双酚A醚邻苯二甲酰亚胺10mmol和DMAc 30ml加入反应器中,充分搅拌溶解后形成透明的溶液,升温至60℃,再加入催化剂CuSO4·5H2O 0.5mmol,抗坏血酸钠1mmol和络合剂三乙胺10mmol,并在60℃下搅拌反应2小时,得到粘稠的聚合物溶液;冷却至室温后将反应混合物缓慢倒入去离子水中,即得丝状的聚三唑酰亚胺,同时用去离子水浸泡洗涤三次,除去催化剂和三乙胺,抽滤,并用热乙醇洗涤后,在100℃真空干燥箱中干燥过夜,得白色的聚三唑酰亚胺;然后溶解在DMAc中进行重沉淀提纯、干燥,得到聚三唑酰亚胺,FTIR(cm-1):1777(C=O反对称伸缩),1722(C=O对称伸缩,亚胺I),1372(C-N-C,亚胺II),744(C=O);1H-NMR(DMSO):8.52(三唑环上的H),7.2~8.0(Ar-H),5.62(CH2),1.68(-CH3);其结构式为:Add 10mmol of 1,4-diazidemethylbenzene, 10mmol of bis(N-ethynylphenyl)-bisphenol A ether phthalimide and 30ml of DMAc into the reactor, stir well and dissolve to form a transparent Solution, heated up to 60°C, then added catalyst CuSO 4 5H 2 O 0.5mmol, sodium ascorbate 1mmol and complexing agent triethylamine 10mmol, and stirred and reacted at 60°C for 2 hours to obtain a viscous polymer solution; cooling After reaching room temperature, slowly pour the reaction mixture into deionized water to obtain filamentous polytriazole imide, soak and wash it with deionized water three times at the same time, remove the catalyst and triethylamine, suction filter, and wash with hot ethanol, Dry overnight in a vacuum oven at 100°C to obtain white polytriazole imide; then dissolve it in DMAc for reprecipitation purification and dry to obtain polytriazole imide, FTIR (cm -1 ): 1777 (C =O anti-symmetric stretching), 1722 (C=O symmetrical stretching, imine I), 1372 (CNC, imine II), 744 (C=O); 1 H-NMR (DMSO): 8.52 (triazole ring H), 7.2~8.0 (Ar-H), 5.62 (CH 2 ), 1.68 (-CH 3 ); its structural formula is:
制得的聚合物的数均分子量Mn:35500(GPC),Mw/Mn=2.78;特性粘数(30℃下0.5g/dl的DMAc溶液)0.42,吸水率为1.71%;聚三唑酰亚胺PTAI-A2-B1具有良好的溶解性,在室温下易溶于DMF、DMAc、DMSO和NMP等溶剂。The number average molecular weight Mn of the obtained polymer: 35500 (GPC), Mw/Mn=2.78; Intrinsic viscosity (0.5g/dl DMAc solution at 30 ℃) 0.42, water absorption rate 1.71%; The amine PTAI-A2-B1 has good solubility and is easily soluble in solvents such as DMF, DMAc, DMSO and NMP at room temperature.
实施例2Example 2
(1)4,4’-二叠氮甲基联苯的合成(A2)(1) Synthesis of 4,4'-diazidomethylbiphenyl (A2)
在三口烧瓶中加入4,4’-二氯甲基联苯50mmol、NaN3150mmol、苯20ml和DMF 20ml,在搅拌下加热到75℃,恒温反应3h,反应结束后将反应产物冷却至室温,倒入200ml去离子水中,静置过夜,析出白色固体,过滤,滤饼用去离子水洗涤,干燥后得白色粉末状固体,产率为89.0%,熔点67~71℃。Add 50mmol of 4,4'-dichloromethylbiphenyl, 150mmol of NaN 3 , 20ml of benzene and 20ml of DMF into a three-necked flask, heat to 75°C under stirring, and react at constant temperature for 3h. After the reaction, cool the reaction product to room temperature. Pour it into 200ml of deionized water, let stand overnight, a white solid precipitates out, filter, wash the filter cake with deionized water, and dry to obtain a white powdery solid with a yield of 89.0% and a melting point of 67-71°C.
(2)聚三唑酰亚胺PTAI-A2-B1的制备(2) Preparation of polytriazole imide PTAI-A2-B1
将4,4’-二叠氮甲基联苯10mmol、双(N-乙炔基苯基)-双酚A醚邻苯二甲酰亚胺10mmol和DMAc 40ml加入反应器中,形成透明的溶液,充分搅拌溶解后升温至60℃,再加入催化剂CuSO4·5H2O 0.5mmol,抗坏血酸钠1.0mmol和络合剂三乙胺10.0mmol,并在60℃下搅拌反应4小时,得到粘稠的聚合物溶液;冷却至室温后将反应混合物缓慢倒入去离子水中,即得丝状的聚三唑酰亚胺,同时用去离子水浸泡洗涤三次,除去催化剂和三乙胺,抽滤,并用热乙醇洗涤后,在100℃真空干燥箱中干燥过夜,得白色的联苯型的聚三唑酰亚胺;然后溶解在DMAc中进行重沉淀提纯,干燥得到聚三唑酰亚胺;FTIR(cm-1):1777(C=O反对称伸缩),1722(C=O的对称伸缩,亚胺I),1372(C-N-C,亚胺II),744(C=O);1H-NMR(DMSO):8.52(三唑环上的H),7.2~8.0(Ar-H),5.62(CH2),1.67(-CH3),其结构式为:Add 10mmol of 4,4'-diazidomethylbiphenyl, 10mmol of bis(N-ethynylphenyl)-bisphenol A ether phthalimide and 40ml of DMAc into the reactor to form a transparent solution. After fully stirring and dissolving, heat up to 60°C, then add catalyst CuSO 4 5H 2 O 0.5mmol, sodium ascorbate 1.0mmol and complexing agent triethylamine 10.0mmol, and stir and react at 60°C for 4 hours to obtain a viscous polymer solution; after cooling to room temperature, slowly pour the reaction mixture into deionized water to obtain filamentous polytriazole imide, soak and wash with deionized water three times at the same time, remove the catalyst and triethylamine, filter with suction, and heat After washing with ethanol, dry overnight in a vacuum oven at 100°C to obtain white biphenyl-type polytriazole imides; then dissolve in DMAc for reprecipitation and purification, and dry to obtain polytriazole imides; FTIR (cm -1 ): 1777 (C=O anti-symmetric stretching), 1722 (C=O symmetric stretching, imine I), 1372 (CNC, imine II), 744 (C=O); 1 H-NMR (DMSO ): 8.52 (H on the triazole ring), 7.2~8.0 (Ar-H), 5.62 (CH 2 ), 1.67 (-CH 3 ), its structural formula is:
制得的聚合物的数均分子量Mn:13000(GPC),Mw/Mn=1.73;特性粘数(30℃下0.5g/dl的DMAc溶液)0.36,其吸水率为1.62%;聚三唑酰亚胺PTAI-A2-B1在室温下易溶于DMF、DMAc、DMSO和NMP等溶剂。The number average molecular weight Mn of the polymer obtained: 13000 (GPC), Mw/Mn=1.73; Intrinsic viscosity (0.5g/dl DMAc solution under 30 ℃) 0.36, and its water absorption rate is 1.62%; Polytriazole acid The imine PTAI-A2-B1 is easily soluble in solvents such as DMF, DMAc, DMSO and NMP at room temperature.
实施例3Example 3
(1)4,4’-二叠氮甲基二苯醚的合成(A3)(1) Synthesis of 4,4'-diazidomethyl diphenyl ether (A3)
在三口烧瓶中加入4,4’-二氯甲基二苯醚50mmol、NaN3150mmol、甲苯20ml和DMF 20ml,在搅拌下加热到75℃,恒温反应4h,反应结束后将反应产物冷却至室温,倒入200ml去离子水中,静置过夜,析出白色固体,过滤,滤饼用去离子水洗涤,干燥后得白色粉末状固体,产率为85.0%。Add 50mmol of 4,4'-dichloromethyldiphenyl ether, 150mmol of NaN 3 , 20ml of toluene and 20ml of DMF into a three-necked flask, heat to 75°C under stirring, and react at constant temperature for 4h. After the reaction, cool the reaction product to room temperature , poured into 200ml of deionized water, let it stand overnight, a white solid was precipitated, filtered, the filter cake was washed with deionized water, and dried to obtain a white powdery solid with a yield of 85.0%.
(2)聚三唑酰亚胺PTAI-A3-B1的制备(2) Preparation of polytriazole imide PTAI-A3-B1
将4,4’-二叠氮甲基二苯醚10mmol、双(N-乙炔基苯基)-双酚A醚邻苯二甲酰亚胺10mmol和DMAc 40ml加入反应器中,形成透明的溶液,充分搅拌溶解后升温至60℃,再加入催化剂CuSO4·5H2O 0.5mmol,抗坏血酸钠1.0mmol和络合剂三乙胺10.0mmol,并在60℃下搅拌反应8小时,得到粘稠的聚合物溶液;冷却至室温后将反应混合物缓慢倒入去离子水中,即得丝状的聚三唑酰亚胺;后处理与实例2相同,干燥得到聚三唑酰亚胺;FTIR(cm-1)同实例2,其结构式为:Add 10mmol of 4,4'-diazidomethyl diphenyl ether, 10mmol of bis(N-ethynylphenyl)-bisphenol A ether phthalimide and 40ml of DMAc into the reactor to form a transparent solution , fully stirred and dissolved and heated to 60°C, then added catalyst CuSO 4 ·5H 2 O 0.5mmol, sodium ascorbate 1.0mmol and complexing agent triethylamine 10.0mmol, and stirred and reacted at 60°C for 8 hours to obtain viscous Polymer solution; After being cooled to room temperature, the reaction mixture is slowly poured into deionized water to obtain filamentous polytriazole imides; aftertreatment is the same as in Example 2, and drying obtains polytriazole imides; FTIR ( cm- 1 ) with example 2, its structural formula is:
制得的聚三唑酰亚胺PTAI-A3-B1溶于DMF、DMAc、DMSO和NMP等溶剂,特性粘数(30℃下0.5g/dl的DMAc溶液):0.30,玻璃化转变温度为200℃,5%热失重温度为350℃(N2)。The prepared polytriazole imide PTAI-A3-B1 is soluble in solvents such as DMF, DMAc, DMSO and NMP, the intrinsic viscosity (0.5g/dl DMAc solution at 30°C): 0.30, and the glass transition temperature is 200 °C, 5% thermal weight loss temperature is 350 °C (N 2 ).
实施例4Example 4
(1)双(N-乙炔基苯基邻苯二甲酰亚胺)醚的合成(B2)(1) Synthesis of bis(N-ethynylphenylphthalimide) ether (B2)
在装有搅拌、恒压漏斗和球形冷凝管的250ml四口烧瓶中加入4,4’-氧双邻苯二甲酸酐12.4g(0.04mol),间氨基苯乙炔11.23g(0.096mol),加入100ml丙酮为溶剂,加热回流4小时后再加入50ml的乙酸酐,并加入75ml的三乙胺做催化剂,在80℃回流4小时,反应完后冷却,加入到200ml的乙醇中沉淀,抽滤,再用丙酮洗涤,抽滤,再干燥得产物,在低温下(冰水浴中)搅拌30分钟,抽滤得到白色产物,再用乙醇洗涤,真空干燥,产率为96%;FTIR(cm-1):3254(≡C-H),1776(C=O反对称伸缩),1714(C=O对称伸缩,亚胺I),1384(C-N-C,亚胺II),1230(-O-),748(C=O);1H-NMR(DMSO):7.1~8.0(Ar-H),4.32(≡CH),其结构式为:Add 12.4g (0.04mol) of 4,4'-oxydiphthalic anhydride and 11.23g (0.096mol) of m-aminophenylacetylene into a 250ml four-necked flask equipped with stirring, constant pressure funnel and spherical condenser, and add 100ml of acetone was used as the solvent, heated and refluxed for 4 hours, then added 50ml of acetic anhydride, and 75ml of triethylamine was added as a catalyst, refluxed at 80°C for 4 hours, cooled after the reaction, added to 200ml of ethanol for precipitation, suction filtration, Wash with acetone, filter with suction, and dry to obtain the product, stir at low temperature (in an ice-water bath) for 30 minutes, filter with suction to obtain a white product, wash with ethanol, and dry in vacuo. The yield is 96%; FTIR (cm -1 ): 3254 (≡CH), 1776 (C=O anti-symmetric stretching), 1714 (C=O symmetrical stretching, imine I), 1384 (CNC, imine II), 1230 (-O-), 748 (C =O); 1 H-NMR (DMSO): 7.1~8.0 (Ar-H), 4.32 (≡CH), its structural formula is:
(2)聚三唑酰亚胺PTAI-A1-B2的制备(2) Preparation of polytriazole imide PTAI-A1-B2
将1,4-二叠氮甲基苯10mmol、双(N-乙炔基苯基邻苯二甲酰亚胺)醚10mmol和DMSO 30ml加入反应器中,形成浑浊的混合液,充分搅拌后升温至60℃,再加入催化剂CuSO4·5H2O 0.5mmol,抗坏血酸钠1.0mmol和络合剂三乙胺10.0mmol,并在60℃下搅拌反应4小时,得到粘稠的聚合物溶液;冷却至室温后将反应混合物缓慢倒入500mL的去离子水中,即得细丝状的聚三唑酰亚胺,同时用去离子水浸泡洗涤三次,除去催化剂和三乙胺,抽滤,并用热乙醇洗涤后,在100℃真空干燥箱中干燥过夜,得淡黄色的聚三唑酰亚胺;然后溶解在DMAc中进行重沉淀提纯、干燥,得到聚三唑酰亚胺;FTIR(cm-1):1777(C=O反对称伸缩),1722(C=O的对称伸缩,亚胺I),1372(C-N-C,亚胺II),1230(-O-),744(C=O);1H-NMR(DMSO):8.52(三唑环上的H),7.2~8.0(Ar-H),5.61(-CH2);其结构式为:Add 10mmol of 1,4-diazidemethylbenzene, 10mmol of bis(N-ethynylphenylphthalimide) ether and 30ml of DMSO into the reactor to form a turbid mixed solution, which is heated up to 60°C, then add catalyst CuSO 4 ·5H 2 O 0.5mmol, sodium ascorbate 1.0mmol and complexing agent triethylamine 10.0mmol, and stir and react at 60°C for 4 hours to obtain a viscous polymer solution; cool to room temperature Finally, slowly pour the reaction mixture into 500mL of deionized water to obtain filamentous polytriazole imide, soak and wash it with deionized water three times at the same time, remove the catalyst and triethylamine, filter with suction, and wash with hot ethanol , dried overnight in a vacuum oven at 100°C to obtain light yellow polytriazole imide; then dissolved in DMAc for reprecipitation purification and drying to obtain polytriazole imide; FTIR (cm -1 ): 1777 (C=O anti-symmetric stretching), 1722 (symmetric stretching of C=O, imine I), 1372 (CNC, imine II), 1230 (-O-), 744 (C=O); 1 H-NMR (DMSO): 8.52 (H on the triazole ring), 7.2~8.0 (Ar-H), 5.61 (-CH 2 ); its structural formula is:
制得的聚三唑酰亚胺在室温下溶于DMF、DMAc、DMSO和NMP等溶剂,特性粘数(30℃下0.5g/dl的DMAc溶液)0.46,玻璃化转变温度为230℃,5%热失重温度为360℃(N2)。The prepared polytriazole imide is soluble in solvents such as DMF, DMAc, DMSO and NMP at room temperature, the intrinsic viscosity (0.5g/dl DMAc solution at 30°C) is 0.46, and the glass transition temperature is 230°C, 5 The % thermal weight loss temperature is 360°C (N 2 ).
实施例5Example 5
聚三唑酰亚胺PTAI-A2-B2的制备Preparation of polytriazole imide PTAI-A2-B2
将4,4’-二叠氮甲基联苯10mmol、双(N-乙炔基苯基邻苯二甲酰亚胺)醚10mmol和NMP 50ml加入反应器中,形成浑浊的混合液,充分搅拌后升温至60℃,再加入催化剂CuSO4·5H2O 0.5mmol,抗坏血酸钠1mmol和络合剂三乙胺10mmol,并在60℃下搅拌反应4小时,得到粘稠的聚合物溶液;冷却至室温后将反应混合物缓慢倒入500ml的去离子水中,即得细丝状的聚三唑酰亚胺,同时用去离子水浸泡洗涤三次,除去催化剂和三乙胺,抽滤,并用热乙醇洗涤后,在100℃真空干燥箱中干燥过夜,得淡黄色的聚三唑酰亚胺;然后溶解NMP中进行重沉淀提纯,干燥得到聚三唑酰亚胺;FTIR(cm-1):1777(C=O反对称伸缩),1724(C=O的对称伸缩,亚胺I),1378(C-N-C,亚胺II),1232(-O-),754(C=O);1H-NMR(DMSO):8.5(三唑环上的H),7.2~8.0(Ar-H),5.6(-CH2);其结构式为:Add 10mmol of 4,4'-diazidomethylbiphenyl, 10mmol of bis(N-ethynylphenylphthalimide) ether and 50ml of NMP into the reactor to form a turbid mixed solution. After fully stirring Heat up to 60°C, then add catalyst CuSO 4 ·5H 2 O 0.5mmol, sodium ascorbate 1mmol and complexing agent triethylamine 10mmol, and stir and react at 60°C for 4 hours to obtain a viscous polymer solution; cool to room temperature Finally, slowly pour the reaction mixture into 500ml of deionized water to obtain filamentous polytriazole imide, soak and wash it with deionized water three times at the same time, remove the catalyst and triethylamine, filter it with suction, and wash it with hot ethanol , dried overnight in a vacuum oven at 100°C to obtain pale yellow polytriazole imide; then dissolved in NMP for reprecipitation and purification, and dried to obtain polytriazole imide; FTIR (cm -1 ): 1777 (C =O anti-symmetric stretching), 1724 (symmetric stretching of C=O, imine I), 1378 (CNC, imine II), 1232 (-O-), 754 (C=O); 1 H-NMR (DMSO ): 8.5 (H on the triazole ring), 7.2~8.0 (Ar-H), 5.6 (-CH 2 ); its structural formula is:
制得的聚三唑酰亚胺在室温下溶于DMF、DMAc、DMSO和NMP等溶剂,特性粘数(30℃下0.5g/dl的DMAc溶液)0.35,玻璃化转变温度为210℃,5%热失重温度为358℃(N2)。The prepared polytriazole imide is soluble in solvents such as DMF, DMAc, DMSO and NMP at room temperature, the intrinsic viscosity (0.5g/dl DMAc solution at 30°C) is 0.35, and the glass transition temperature is 210°C, 5 The % thermal weight loss temperature is 358°C (N 2 ).
实施例6Example 6
(1)双(N-乙炔基苯基邻苯二甲酰亚胺)甲酮的合成(B3)(1) Synthesis of bis(N-ethynylphenylphthalimide)methanone (B3)
在装有搅拌、恒压漏斗和球形冷凝管的250ml四口烧瓶中加入3,3’,4,4’二苯甲酮四羧酸二酐12.4g(0.04mol),间氨基苯乙炔11.23g(0.096mol),加入100ml丙酮为溶剂,加热回流4小时后再加入50ml的乙酸酐,并加入75ml三乙胺做催化剂,在80℃回流4小时,反应完后冷却,加入到200ml的乙醇中沉淀,抽滤,再用丙酮洗涤,抽滤,再干燥得产物,产率为96%;FTIR(cm-1):3267(≡C-H),1778(C=O反对称伸缩),1720(C=O,对称伸缩I),1640(酮基C=O),1384(C-N-C,II),748(C=O);1H-NMR:7.2~8.0(Ar-H),4.3(≡CH),其结构式为:Add 12.4g (0.04mol) of 3,3',4,4'benzophenone tetracarboxylic dianhydride and 11.23g of m-aminophenylacetylene into a 250ml four-neck flask equipped with stirring, constant pressure funnel and spherical condenser (0.096mol), add 100ml of acetone as a solvent, heat and reflux for 4 hours, then add 50ml of acetic anhydride, and add 75ml of triethylamine as a catalyst, reflux at 80°C for 4 hours, cool after the reaction, and add to 200ml of ethanol Precipitation, suction filtration, washing with acetone, suction filtration, and drying to obtain the product with a yield of 96%; FTIR (cm -1 ): 3267 (≡CH), 1778 (C=O anti-symmetric stretching), 1720 (C =O, symmetrical stretching I), 1640 (keto group C=O), 1384 (CNC, II), 748 (C=O); 1 H-NMR: 7.2~8.0 (Ar-H), 4.3 (≡CH) , whose structure is:
(2)聚三唑酰亚胺PTAI-A1-B3的制备(2) Preparation of polytriazole imide PTAI-A1-B3
将1,4-二叠氮甲基苯10mmol、双(N-乙炔基苯基邻苯二甲酰亚胺)甲酮10mmol和DMAc 30ml加入反应器中,形成浑浊的混合液,充分搅拌后升温至60℃,再加入催化剂CuSO4·5H2O 0.5mmol,抗坏血酸钠1mmol和络合剂三乙胺10mmol,并在60℃下搅拌反应3小时,得到粘稠的聚合物溶液;后处理方法与实施例4相同,得到淡黄色的聚三唑酰亚胺;FTIR(cm-1):1779(C=O反对称伸缩),1725(C=O的对称伸缩,亚胺I),1640(酮基C=O),1374(C-N-C,亚胺II),752(C=O);1H-NMR(DMSO):8.5(三唑环上的H),7.2~8.0(Ar-H),5.6(-CH2);其结构式为:Add 10mmol of 1,4-diazidemethylbenzene, 10mmol of bis(N-ethynylphenylphthalimide)methanone and 30ml of DMAc into the reactor to form a turbid mixed solution, stir well and then raise the temperature to 60°C, then add catalyst CuSO 4 5H 2 O 0.5mmol, sodium ascorbate 1mmol and complexing agent triethylamine 10mmol, and stir and react at 60°C for 3 hours to obtain a viscous polymer solution; the post-treatment method is the same as The same as in Example 4, the light yellow polytriazole imide was obtained; FTIR (cm -1 ): 1779 (C=O anti-symmetric stretching), 1725 (C=O symmetrical stretching, imine I), 1640 (ketone C=O), 1374 (CNC, imine II), 752 (C=O); 1 H-NMR (DMSO): 8.5 (H on the triazole ring), 7.2~8.0 (Ar-H), 5.6 (-CH 2 ); its structural formula is:
制得的聚三唑酰亚胺溶于DMF、DMAc、DMSO和NMP等溶剂,特性粘数(30℃下0.5g/dl的DMAc溶液)0.40,玻璃化转变温度为230℃,5%热失重温度为355℃(N2)。The prepared polytriazole imide is soluble in solvents such as DMF, DMAc, DMSO and NMP, the intrinsic viscosity (0.5g/dl DMAc solution at 30°C) is 0.40, the glass transition temperature is 230°C, and 5% thermal weight loss The temperature was 355°C (N 2 ).
实施例7Example 7
聚三唑酰亚胺PTAI-A2-B3的制备Preparation of polytriazole imide PTAI-A2-B3
制备过程与实施例6聚三唑酰亚胺PTAI-A1-B3的制备类同,但在60℃下搅拌反应4小时,得到淡黄色的聚三唑酰亚胺;FTIR(cm-1)同实施例6;其结构式为:The preparation process is similar to the preparation of polytriazole imide PTAI-A1-B3 in Example 6, but stirred and reacted at 60°C for 4 hours to obtain light yellow polytriazole imide; FTIR (cm -1 ) is the same as Embodiment 6; Its structural formula is:
制得的聚三唑酰亚胺溶于DMF、DMAc、DMSO和NMP等溶剂,特性粘数(30℃下0.5g/dl的DMAc溶液)0.30,玻璃化转变温度为235℃,5%热失重温度为360℃(N2)。The prepared polytriazole imide is soluble in solvents such as DMF, DMAc, DMSO and NMP, the intrinsic viscosity (0.5g/dl DMAc solution at 30°C) is 0.30, the glass transition temperature is 235°C, and 5% thermal weight loss The temperature was 360°C (N 2 ).
实施例8Example 8
(1)双(N-乙炔基苯基邻苯二甲酰亚胺)六氟异丙烷的合成(B4)(1) Synthesis of bis(N-ethynylphenylphthalimide) hexafluoroisopropane (B4)
在装有搅拌、恒压漏斗和球形冷凝管的250ml四口烧瓶中加入4,4’-六氟亚异丙基邻苯二甲酸酐40mmol,间氨基苯乙炔96mmol,加入100ml丙酮为溶剂,加热回流4小时后再加入50ml的乙酸酐,并加入75ml三乙胺做催化剂,在80℃回流4小时,反应完后加入到500ml的去离子水中,搅拌沉淀,抽滤,得到白色产物,再用乙醇洗涤,真空干燥得产物,产率为90%;FTIR(cm-1):1782(C=O反对称伸缩),1724(C=O的对称伸缩,亚胺I),1384(C-N-C,II亚胺),1136(-CF3),753(C=O);1H-NMR(DMSO):7.2~8.0(Ar-H),4.30(≡CH),其结构式为:Add 40mmol of 4,4'-hexafluoroisopropylidene phthalic anhydride, 96mmol of m-aminophenylacetylene in a 250ml four-neck flask equipped with stirring, constant pressure funnel and spherical condenser, add 100ml of acetone as a solvent, and heat After refluxing for 4 hours, add 50ml of acetic anhydride, and add 75ml of triethylamine as a catalyst, reflux at 80°C for 4 hours, add to 500ml of deionized water after the reaction, stir and precipitate, and filter with suction to obtain a white product, which is then used Washed with ethanol and dried in vacuum to obtain the product with a yield of 90%; FTIR (cm -1 ): 1782 (C=O anti-symmetric stretching), 1724 (C=O symmetrical stretching, imine I), 1384 (CNC, II imine), 1136(-CF 3 ), 753(C=O); 1 H-NMR(DMSO): 7.2~8.0(Ar-H), 4.30(≡CH), its structural formula is:
(2)聚三唑酰亚胺PTAI-A1-B4的制备(2) Preparation of polytriazole imide PTAI-A1-B4
将1,4-二叠氮甲基苯10mmol、双(N-乙炔基苯基邻苯二甲酰亚胺)六氟异丙烷10mmol和DMF 30ml加入反应器中,形成透明的溶液,充分搅拌溶解后升温至60℃,再加入催化剂CuSO4·5H2O 0.5mmol,抗坏血酸钠1mmol和络合剂三乙胺10mmol,并在60℃下搅拌反应4小时,得到粘稠的聚合物溶液,冷却至室温后将反应混合物缓慢倒入500mL的去离子水中,即得丝状的聚三唑酰亚胺,同时用去离子水浸泡洗涤三次,除去催化剂和三乙胺,抽滤,并用热乙醇洗涤后在100℃真空干燥箱中干燥过夜,得到白色的聚三唑酰亚胺,然后溶解在DMF中进行重沉淀提纯,干燥得到聚三唑酰亚胺;FTIR(cm-1):1782(C=O反对称伸缩),1724(C=O的对称伸缩,亚胺I),1375(C-N-C,亚胺II),1136(-CF3),752(C=O);1H-NMR(DMSO):8.53(三唑环上的H),7.2~8.0(Ar-H),5.61(-CH2),其结构式为:Add 10mmol of 1,4-diazidomethylbenzene, 10mmol of bis(N-ethynylphenylphthalimide)hexafluoroisopropane and 30ml of DMF into the reactor to form a transparent solution, fully stir to dissolve After heating up to 60°C, add catalyst CuSO 4 ·5H 2 O 0.5mmol, sodium ascorbate 1mmol and complexing agent triethylamine 10mmol, and stir and react at 60°C for 4 hours to obtain a viscous polymer solution, which was cooled to After room temperature, slowly pour the reaction mixture into 500mL of deionized water to obtain filamentous polytriazole imide, soak and wash it with deionized water three times at the same time, remove the catalyst and triethylamine, filter with suction, and wash with hot ethanol Dry overnight in a vacuum oven at 100°C to obtain white polytriazole imide, which is then dissolved in DMF for reprecipitation and purification, and dried to obtain polytriazole imide; FTIR (cm -1 ): 1782 (C= O anti-symmetric stretching), 1724 (symmetric stretching of C=O, imine I), 1375 (CNC, imine II), 1136 (-CF 3 ), 752 (C=O); 1 H-NMR (DMSO) : 8.53 (H on the triazole ring), 7.2~8.0 (Ar-H), 5.61 (-CH 2 ), its structural formula is:
制得的聚三唑酰亚胺溶于DMF、DMAc、DMSO和NMP等溶剂,特性粘数(30℃下0.5g/dl的DMAc溶液)0.30,玻璃化转变温度为235℃,5%热失重温度为360℃(N2)。The prepared polytriazole imide is soluble in solvents such as DMF, DMAc, DMSO and NMP, the intrinsic viscosity (0.5g/dl DMAc solution at 30°C) is 0.30, the glass transition temperature is 235°C, and 5% thermal weight loss The temperature was 360°C (N 2 ).
实施例9Example 9
热聚合制备聚三唑酰亚胺PTAI’-A1-B1Preparation of polytriazole imide PTAI'-A1-B1 by thermal polymerization
将1,4-二叠氮甲基苯10mmol、双(N-乙炔基苯基)-双酚A醚邻苯二甲酰亚胺10mmol和DMAc 30ml加入反应器中,充分搅拌溶解后形成透明的溶液,升温至100℃,并在100℃下搅拌反应24小时,得到聚合物溶液;冷却至室温后将反应混合物倒入200ml的乙醇中沉淀,即得到白色产物,抽滤,并用热乙醇洗涤后,在100℃真空干燥箱中干燥过夜,得到聚三唑酰亚胺;FTIR(cm-1):1777(C=O反对称伸缩),1722(C=O对称伸缩,亚胺I),1372(C-N-C,亚胺II),1150(-CH3),744(C=O);1H-NMR(DMSO):8.4~8.5(三唑环上的H),7.2~8.0(Ar-H),5.62(CH2),1.68(-CH3),其结构式为:Add 10mmol of 1,4-diazidemethylbenzene, 10mmol of bis(N-ethynylphenyl)-bisphenol A ether phthalimide and 30ml of DMAc into the reactor, stir well and dissolve to form a transparent solution, heated to 100°C, and stirred and reacted at 100°C for 24 hours to obtain a polymer solution; after cooling to room temperature, the reaction mixture was poured into 200ml of ethanol to precipitate to obtain a white product, which was filtered by suction and washed with hot ethanol , dried overnight in a vacuum oven at 100°C to obtain polytriazole imide; FTIR (cm -1 ): 1777 (C=O anti-symmetric stretching), 1722 (C=O symmetrical stretching, imine I), 1372 (CNC, imine II), 1150 (-CH 3 ), 744 (C=O); 1 H-NMR (DMSO): 8.4-8.5 (H on the triazole ring), 7.2-8.0 (Ar-H) , 5.62(CH 2 ), 1.68(-CH 3 ), its structural formula is:
制得的聚三唑酰亚胺PTAI’-A1-B1具有良好的溶解性,在室温下易溶于DMF、DMAc、DMSO和NMP等溶剂;特性粘数(30℃下0.5g/dl的DMAc溶液)0.28;玻璃化转变温度为180℃,5%热失重温度为360℃(N2)。The obtained polytriazole imide PTAI'-A1-B1 has good solubility, and is easily soluble in solvents such as DMF, DMAc, DMSO and NMP at room temperature; solution) 0.28; the glass transition temperature is 180°C, and the 5% thermal weight loss temperature is 360°C (N 2 ).
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