CN105142085B - A kind of directive property MEMS microphone and audio signal reception device - Google Patents
A kind of directive property MEMS microphone and audio signal reception device Download PDFInfo
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- CN105142085B CN105142085B CN201510603146.XA CN201510603146A CN105142085B CN 105142085 B CN105142085 B CN 105142085B CN 201510603146 A CN201510603146 A CN 201510603146A CN 105142085 B CN105142085 B CN 105142085B
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Abstract
The invention discloses a kind of directive property MEMS microphones, comprising: opens up the pcb board of at least one logical sound slot inside plate body along board direction, the end of logical sound slot is located in the plate face of pcb board, sound hole in sound hole and second in formation first；The outside of sound hole is covered each by the first shell of setting and second housing in sound hole and second in first, is respectively provided with outer sound hole on the first shell and second housing；Fixed setting asic chip and MEMS chip, asic chip are connected with MEMS chip by gold thread inside first shell or second housing, and asic chip is connected on pcb board by gold thread.Logical sound slot is integrated on pcb board by the device, and the channel without setting additional components as sound transmission, the logical sound slot being arranged on pcb board can be realized said effect, reduce to the greatest extent required component under conditions of ensuring sound transmission range difference.At the same time, the audio signal reception device with the directive property MEMS microphone has above-mentioned technique effect.
Description
Technical field
The present invention relates to audio signal reception device technical fields, concretely relate to a kind of directive property MEMS microphone, in addition, this
Invention further relates to a kind of audio signal reception device including above-mentioned directive property MEMS microphone.
Background technique
MEMS (Micro Electro Mechanical System) microphone is the element based on MEMS technology manufacture, is briefly exactly a capacitor
Device is integrated on micro- silicon wafer, can be manufactured using Surface Mount technique, be able to bear very high Reflow Soldering Reflow Soldering temperature, held
It is easily integrated with CMOS technology and other voicefrequency circuits, and there is improved noise removing performance and good RF and EMI to inhibit
Performance.Many advantages, the especially application of middle and high end mobile phone have been embodied using the product of this technology in numerous applications
In.The sound sensitive that the sound that directional microphone transmits specific direction is transmitted than other directions is much.Directional microphone
It is respectively communicated with opening at the both ends of diaphragm, the vibration of diaphragm is open depending on the pressure difference at both ends from two according to phase relation
In the sound that transmits can arrive separately at vibrating diaphragm and offset.
As shown in Figure 1, being the structure sectional view of common directive property MEMS microphone, wherein all parts, which are each attached to, connects
Line plate, and also set up shell on terminal plate and all components are covered into sealing.In order to make two suffered sound of MEMS piece
Pressure is different, and the two sides that two pieces of plates with through slot are respectively communicated to MEMS piece are arranged in the lower section of terminal plate.
Due to needing that two parts are additionally arranged in the lower section of terminal plate in the prior art, will increase whole microphone at
This, and entire manufacturing process flow can be extended.
Therefore it is transaudient how to design a kind of more simpler directive property MEMS of structure on the basis of guaranteeing directive property
Device reduces production cost, is those skilled in the art's problem to be solved.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of directive property MEMS microphones, comprising:
The pcb board of at least one logical sound slot is opened up inside plate body along board direction, the end of the logical sound slot is located at described
In the plate face of pcb board, sound hole in sound hole and second in formation first；
The outside of sound hole is covered each by the first shell of setting and second housing, institute in sound hole and described second in described first
It states and is respectively provided with outer sound hole on the first shell and the second housing；
Fixed setting asic chip and MEMS chip, the asic chip inside first shell or the second housing
It is connected with the MEMS chip by gold thread, the asic chip is connected on the pcb board by gold thread.
Optionally, sound hole in the outer sound hole and described first opened up on first shell opens up on the second housing
Outer sound hole and described second in sound hole position be located on same vertical line.
Optionally, sound hole is located at the center of the MEMS chip bottom in sound hole or described second in described first.
Optionally, the asic chip and the MEMS chip are fixedly installed on the pcb board.
Optionally, the asic chip and the MEMS chip are fixedly installed on outside first shell or described second
On the inner wall of shell.
Optionally, it is vertically arranged and leads between first shell and the pcb board or the second housing and the pcb board
Even part, the asic chip pass through the company's of leading part and connect with the pcb board.
Optionally, damping is arranged in the outside of the outer sound hole on first shell and/or the second housing.
Optionally, environmental sealing glue outside the gold thread that the asic chip is connect with the pcb board.
Optionally, distance meets predetermined value between sound hole in sound hole and described second in described first.
The present invention also provides a kind of audio signal reception devices, including directive property MEMS microphone described in any of the above embodiments.
Directive property MEMS microphone is needed through the two sides of MEMS chip by different acoustic pressures respectively from not Tongfang
To sound, directive property is embodied, it is in order to reach this purpose, different by length when needing that sound is made to pass to MEMS chip
Path, the present invention in order to realize said effect in the case where reducing device volume, therefore on pcb board be arranged along plate face side
To the logical sound slot of extension, logical sound slot end is provided in the plate face of pcb board, sound in sound hole and second in formation first
Hole, the outside of sound hole is covered each by the first shell of setting and second housing in sound hole and second in first, and sound is by outside first
The outer sound hole opened up on shell and second housing passes in first sound hole in sound hole and second, is arranged with MEMS chip in second housing
For inside, sound enters the internal outer side contacts with MEMS chip from the outer sound hole on second housing, and sound is from the first shell
On outer sound hole enter inside and along the interior side contacts of logical sound slot and MEMS chip, since the distance that sound passes through is different, transmitting
Acoustic pressure when to MEMS chip is not also identical, and MEMS chip is made to generate vibration, passes through the finger that different extent of vibration reflects sound
Tropism.Logical sound slot is integrated on pcb board by the device, the channel without setting additional components as sound transmission, on pcb board
The logical sound slot being arranged can be realized said effect, reduce to the greatest extent required component under conditions of ensuring sound transmission range difference,
Structure is simpler, keeps product more frivolous, reduces production cost.At the same time, with the directive property MEMS microphone
Audio signal reception device has above-mentioned technique effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of MEMS microphone in the prior art；
Fig. 2 is a kind of the schematic diagram of the section structure of directive property MEMS microphone provided by the present invention；
Fig. 3 is the schematic diagram of the section structure of another directive property MEMS microphone provided by the present invention；
Fig. 4 is the schematic diagram of the section structure of the third directive property MEMS microphone；
Fig. 5 is the schematic diagram of the section structure of the 4th kind of directive property MEMS microphone.
Wherein:
Pcb board 1, logical sound slot 11, the company's of leading part 12, the first shell 21, second housing 22, asic chip 3, sealant 31,
MEMS chip 4, damping 5.
Specific embodiment
Core of the invention is to provide a kind of directive property MEMS microphone, which ensure that sound transmission approach
On the basis of simplify structure, keep product more frivolous, reduce production cost.In addition, another core of the invention is to provide one
Kind has the audio signal reception device of above-mentioned MEMS microphone.
In order to make those skilled in the art more fully understand technical solution provided by the present invention, below in conjunction with attached drawing
MEMS microphone of the invention is described in detail with specific embodiment.
The present invention provides a kind of directive property MEMS microphone, the main component of the device includes pcb board 1, the first shell
21, second housing 22 and the asic chip 3 and MEMS chip 4 that are fixed inside the first shell 21 or second housing 22.
Open up at least one logical sound slot 11 with the plate of pcb board 1, it is multiple can also be with logical sound slot 11 is located at the inside of pcb board 1, two sides
End is respectively positioned in the plate face of pcb board 1, sound hole in sound hole and second in formation first, and sound hole is logical in sound hole and second in first
Logical sound slot 11 is crossed to be mutually communicated.In general, sound hole needs on the same side of pcb board 1 in sound hole and second in first,
To receive the source of sound in same direction, certainly, it is not excluded that the structure on different sides is set, these are included in
Within invention which is intended to be protected.The specific structure of sound hole and size can in sound hole and second in logical sound slot 11, first
It is correspondingly improved according to the actual size of pcb board 1, section can be round, ellipse or rectangle etc., and the present invention is herein
It is not specifically limited.In addition, the mode of communicating of sound hole and logical sound slot 11 may be configured as in sound hole and logical sound slot 11, second in first
Round-corner transition, right angle transition etc., above design method, and can be optimized accordingly on basis herein, but belong to this
The design concept of invention.In addition, the manufacture about logical sound slot 11, can be formed by way of etching on pcb board 1,
Groove can also be first opened up on pcb board 1, and strip of paper used for sealing, the bottom of strip of paper used for sealing and the bottom of groove then is fixedly installed at the top of groove
Gap is reserved as sound hole in sound hole and second in first, herein, sound in sound hole and second in first not in contact with, both ends
Both holes can be collectively referred to as interior sound hole.
The quantity for the shell being covered on pcb board 1 unlike traditional set-up mode is varied, the sound in first
The outside of sound hole is covered each by the first shell 21 of setting and second housing 22 in hole and second, makes the first shell 21 and second housing
22 are tightly connected with pcb board 1, do not interspace, and open up through-hole on the shell of the first shell 21 and second housing 22 respectively as outer
The shape approximation of sound hole, the first shell 21 and second housing 22 is cylindric, and outer sound hole is opened in the top of cylinder under normal circumstances
End, to receive the sound issued from same direction, correspondingly, the first shell 21 and second housing 22 may also be configured to other shapes
Shape, outer sound hole can also be provided with other positions.It should be noted that outer sound hole can be on the first shell 21 and second housing 22
It is respectively set one, may be alternatively provided as two or more, these set-up modes are all possible.Outer sound hole respectively with first in sound
Sound hole is used cooperatively in hole and second.It, can be by the logical of logical 11 end of sound slot if being provided with multiple logical sound slots 11 on pcb board 1
Sound hole is separately positioned in the first shell 21 and second housing 22, and multiple shells can also additionally be arranged and individually set interior sound hole
It sets in corresponding shell, and correspondence opens up outer sound hole on shell.
Asic chip 3 and MEMS chip 4 are fixedly installed in the inside of the first shell 21 or second housing 22, in the present invention
The first shell 21 and second housing 22 for distinguish two shells, be arranged in which shell.3 He of asic chip is set
The settable size and distance according to inner body of the shell structure of MEMS chip 4 is oppositely disposed larger, and not set part
Shell it is settable smaller, guarantee for interior sound hole to be wrapped in, to simplify size.
Asic chip 3 is connected with MEMS chip 4 by gold thread, and asic chip 3 is connected on pcb board 1 further through gold thread, will
Information is successively transmitted.Since gold thread is very thin, the probability of damage is reduced when in order to impact device, in asic chip 3 and PCB
Environmental sealing glue 31 outside the gold thread that plate 1 connects, sealant 31 play the role of buffering to gold thread after air-drying, play guarantor to gold thread
Protect effect.
In the present invention, all parts can be connected and fixed by tin cream or dispensing, such as the first shell 21 and pcb board 1,
Picture can be used in the fixation of the connection of second housing 22 and pcb board 1, asic chip 3 and pcb board 1, MEMS chip 4 and pcb board 1
Tin cream or mode for dispensing glue are realized, can specifically be selected according to actual working environment.
Further, in the present invention in the outer sound hole and first opened up on the first shell 21 when sound hole position in such as attached drawing
On same vertical vertical line, sound hole is on same vertical line in the outer sound hole opened up on second housing 22 and second, purpose
Be to make sound from be passed in outer sound hole after the first shell 21 or second housing 22 can with first in sound in sound hole or second
Hole is corresponding, reduces unnecessary obstruction, keeps the transmission effect of sound more preferable.
It is internally provided with MEMS chip 4 in the first shell 21 or second housing 22, in the shell of setting MEMS chip 4
Being provided in first sound hole, perhaps sound hole needs for sound hole in sound hole or second in first to be correspondingly arranged at this time in second
The lower center position of MEMS chip 4 guarantees that centre is directed at interior sound hole when MEMS chip 4 is fixedly mounted, makes interior sound
Hole is directed at the center of MEMS chip 4 with outer sound hole simultaneously, and the effect of 4 induction vibration of MEMS chip can be more preferable.
As shown in Fig. 2, for the sectional structure chart of directive property MEMS microphone provided in an embodiment of the present invention.Its
Middle asic chip 3 and MEMS chip 4 are fixedly mounted in the plate face of pcb board 1, and asic chip 3 and MEMS chip 4 pass through picture tin
Cream or mode for dispensing glue and pcb board 1 are fixed, and downward, such as same bowl tips upside down on PCB to the groove of MEMS chip 4 at this time
On plate 1.It is illustrated so that asic chip 3 and MEMS chip 4 are mounted in second housing 22 as an example, outer sound hole on second housing 22
The sound of middle transmitting is passed directly to the top-side of MEMS chip 4, passes through from the sound transmitted in outer sound hole on the first shell 21
Enclosure interior is entered sound hole in first, and is transmitted along logical sound slot 11, is spread out of using sound hole in second, is passed to MEMS chip 4
Bottom sides, since the path that two parts sound transmitted from same sound source have passed through different length is transmitted to MEMS chip
4 two sides, therefore can the two sides of MEMS chip 4 be caused with different acoustic pressures, so that MEMS chip 4 is generated vibration, thus identifies
The directive property of alternative sounds.The analog signal that MEMS chip 4 generates is transmitted in asic chip 3 by gold thread, by asic chip 3
Digital signal is converted analog signals into, and then is transmitted on pcb board 1 and exports.As shown in Fig. 2, sealant 31 at this time is in half
It is spherical, it is bonded on pcb board 1.
As shown in figure 3, in another embodiment, asic chip 3 and MEMS chip 4 are fixed at the first shell 21
Or on the inner wall of second housing 22, under normal circumstances, asic chip 3 and MEMS chip 4 are each attached to the inner wall of shell
Top, be also not excluded for shell certainly and be set as situation when other forms on the side wall of position.Also to be fixed on second housing 22
For on inner wall, MEMS chip 4 has at this time groove towards the outer sound hole on second housing 22, such as same bowl just put,
The sound transmitted from sound hole outer on second housing 22 is passed directly in the groove of MEMS chip 4, by outer on the first shell 21
The sound transmitted in sound hole successively passes through sound hole in the first shell 21, first, sound hole in logical sound slot 11, second, finally passes to
MEMS chip 4 vibrates MEMS chip 4 by the acoustic pressure of two sides, and signal is transferred in pcb board 1 by asic chip 3
Output.With the amplitude direction in a upper embodiment on the contrary, being handled in signal processing in the present embodiment.It seals at this time
Glue 31 is Nian Jie with the inner wall of second housing 22.
By above-mentioned two embodiment it is further contemplated that the mounting means of above-mentioned two situations is combined, may be used also
The situation as shown in Fig. 4 or Fig. 5 is obtained, asic chip 3 is separately mounted on different components from MEMS chip 4, this
Similar deformations are shall fall within entirely within the scope of of the invention protect a bit.
When on the inner wall that asic chip 3 is fixed on to the first shell 21 or second housing 22, due to the limit in structure
System, can not direct fixed bonding when asic chip 3 is connect with pcb board 1 by gold thread, it is also necessary in the first shell 21 and pcb board 1
Or the company's of leading part 12 is vertically arranged between second housing 22 and pcb board 1, as shown in figure 3, the top of the company's of leading part 12 and second housing
22 inner walls are fixed, and bottom and pcb board 1 are fixed, are also connected with gold thread in the bottom of the company's of leading part 12, connect asic chip 3 and pcb board 1
It is logical.The company's of leading part 12 not only may be configured as situation shown in Fig. 3, can also be deformed as needed, and right-angle folding kinking is such as set as
Structure, side are fixed on the side wall of second shell 22, and the other side is fixed on pcb board 1, as long as the knot of phase same-action can be played
Structure is all possible.
Preferably, damping 5 can also be arranged on the outside of the outer sound hole of the first shell 21 and/or second housing 22, setting exists
Inside can also be to be only set to outside and facilitate adjusting, without dismantling shell, attached drawing given by the present invention is only in first shell
Damping 5 is provided on body 21.
In addition, since the sound of the wherein side of MEMS chip 4 is needed by leading to sound slot 11, sound hole and second in first
The distance between interior sound hole needs to meet preset numerical value, MEMS chip 4 can either be made to generate enough acoustic pressures, and will not make sound
Sound transmitting is too long to decay.In multiple pads that the bottom of pcb board 1 is also set up, for welding.
In addition, including above-mentioned directive property MEMS microphone, can be realized the present invention also provides a kind of audio signal reception device
The technical effect that above-mentioned MEMS microphone can reach, the other structures of the audio signal reception device can refer to the prior art, the present invention
Details are not described herein.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, this hair
It is bright to be not intended to be limited to the embodiments shown herein, and be to fit to and the principles and novel features disclosed herein phase
Consistent widest scope.
Claims (8)
1. a kind of directive property MEMS microphone characterized by comprising
The pcb board (1) of at least one logical sound slot (11), the end position of the logical sound slot (11) are opened up inside plate body along board direction
In in the plate face of the pcb board (1), forming in first to be connected sound hole in sound hole and second；
The outside of sound hole is covered each by setting the first shell (21) and second housing in sound hole and described second in described first
(22), outer sound hole is respectively provided on first shell (21) and the second housing (22)；
Fixed setting asic chip (3) and MEMS chip (4), institute inside first shell (21) or the second housing (22)
It states asic chip (3) and is connected with the MEMS chip (4) by gold thread, the asic chip (3) is connected to described by gold thread
On pcb board (1)；
Sound hole in the outer sound hole and described first opened up on first shell (21), opened up on the second housing (22) it is outer
Sound hole is located on same vertical line in sound hole and described second；
The asic chip (3) is fixed on the inner wall of the second housing (22), the second housing (22) and the pcb board
(1) it is vertically arranged between the company's of leading part (12), the bottom of the company's of leading part (12) connects the gold thread of the asic chip (3), makes institute
Asic chip (3) is stated to be connected to the pcb board (1).
2. directive property MEMS microphone according to claim 1, which is characterized in that sound hole or described second in described first
Interior sound hole is located at the center of the MEMS chip (4) bottom.
3. directive property MEMS microphone according to claim 2, which is characterized in that the asic chip (3) and described
MEMS chip (4) is fixedly installed on the pcb board (1).
4. directive property MEMS microphone according to claim 2, which is characterized in that the asic chip (3) and described
MEMS chip (4) is fixedly installed on the inner wall of first shell (21) or the second housing (22).
5. directive property MEMS microphone according to any one of claims 1 to 4, which is characterized in that in first shell
(21) the outside setting damping (5) of the outer sound hole and/or on the second housing (22).
6. directive property MEMS microphone according to claim 5, which is characterized in that the asic chip (3) and the PCB
Environmental sealing glue (31) outside the gold thread of plate (1) connection.
7. directive property MEMS microphone according to claim 5, which is characterized in that sound hole and described second in described first
Distance meets predetermined value between interior sound hole.
8. a kind of audio signal reception device, which is characterized in that including the described in any item directive property MEMS microphones of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510603146.XA CN105142085B (en) | 2015-09-21 | 2015-09-21 | A kind of directive property MEMS microphone and audio signal reception device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510603146.XA CN105142085B (en) | 2015-09-21 | 2015-09-21 | A kind of directive property MEMS microphone and audio signal reception device |
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| Publication Number | Publication Date |
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| CN105142085A CN105142085A (en) | 2015-12-09 |
| CN105142085B true CN105142085B (en) | 2019-04-23 |
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| CN201042077Y (en) * | 2007-05-26 | 2008-03-26 | 歌尔声学股份有限公司 | Silicon capacitance microphone |
| CN101651918A (en) * | 2009-06-19 | 2010-02-17 | 瑞声声学科技(深圳)有限公司 | Capacitance type microphone |
| CN103686568A (en) * | 2013-12-23 | 2014-03-26 | 山东共达电声股份有限公司 | Directional MEMS (Micro Electro Mechanical Systems) microphone and sound receiving device |
| CN103888880A (en) * | 2014-03-31 | 2014-06-25 | 山东共达电声股份有限公司 | Directional MEMS microphone |
| CN205081969U (en) * | 2015-09-21 | 2016-03-09 | 山东共达电声股份有限公司 | Directive property MEMS microphone and radio reception device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100740462B1 (en) * | 2005-09-15 | 2007-07-18 | 주식회사 비에스이 | Directional silicon condenser microphone |
| CN201274566Y (en) * | 2008-09-26 | 2009-07-15 | 瑞声声学科技(深圳)有限公司 | MEMS microphone |
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2015
- 2015-09-21 CN CN201510603146.XA patent/CN105142085B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201042077Y (en) * | 2007-05-26 | 2008-03-26 | 歌尔声学股份有限公司 | Silicon capacitance microphone |
| CN101651918A (en) * | 2009-06-19 | 2010-02-17 | 瑞声声学科技(深圳)有限公司 | Capacitance type microphone |
| CN103686568A (en) * | 2013-12-23 | 2014-03-26 | 山东共达电声股份有限公司 | Directional MEMS (Micro Electro Mechanical Systems) microphone and sound receiving device |
| CN103888880A (en) * | 2014-03-31 | 2014-06-25 | 山东共达电声股份有限公司 | Directional MEMS microphone |
| CN205081969U (en) * | 2015-09-21 | 2016-03-09 | 山东共达电声股份有限公司 | Directive property MEMS microphone and radio reception device |
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| CN105142085A (en) | 2015-12-09 |
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