CN105142085A - Directivity MEMS microphone and radio device - Google Patents
Directivity MEMS microphone and radio device Download PDFInfo
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- CN105142085A CN105142085A CN201510603146.XA CN201510603146A CN105142085A CN 105142085 A CN105142085 A CN 105142085A CN 201510603146 A CN201510603146 A CN 201510603146A CN 105142085 A CN105142085 A CN 105142085A
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Abstract
A directivity MEMS microphone disclosed by the present invention comprises a PCB of which the board body interior is equipped with at least one sound propagation groove along a board surface direction, and the end parts of the sound propagation grooves are located on the board surface of the PCB to form a first inner sound hole and a second inner sound hole. The exteriors of the first and second inner sound holes are covered with a first shell and a second shell respectively, and the first and second shells are both equipped with the outer sound holes. An ASIC chip and an MEMS chip are fixedly arranged in the first or second shell and are connected via a gold thread, and the ASIC chip is connected with the PCB via a gold thread. According to a device of the present invention, the sound propagation grooves are integrated on the PCB without needing to arrange the additional parts as the sound propagation channels, and the sound propagation grooves on the PCB can realized the above effects, thereby guaranteeing the situation that the needed components are reduced as much as possible on the condition that a sound propagation distance is poor. Meanwhile, a radio device possessing the directivity MEMS microphone possesses the above technical effects.
Description
Technical field
The present invention relates to audio signal reception device technical field, specifically relate to a kind of directive property MEMS microphone, in addition, the invention still further relates to a kind of audio signal reception device comprising above-mentioned directive property MEMS microphone.
Background technology
MEMS (Micro Electro Mechanical System) microphone is the element manufactured based on MEMS technology, be exactly briefly that a capacitor is integrated on micro-silicon wafer, Surface Mount technique can be adopted to manufacture, very high Reflow Soldering Reflow Soldering temperature can be born, easily with CMOS technology and other voicefrequency circuit mutually integrated, and there is the noise removing performance of improvement and good RF and EMI rejection.The product of this technology is adopted to embody many advantages in numerous applications, particularly in the application of middle and high end mobile phone.The sound sensitive that the sound that directional microphone transmits specific direction transmits than other directions many.Directional microphone is in the two ends of diaphragm difference open communication, and the vibration of diaphragm, according to phase relation, depends on the pressure differential at two ends, and the sound transmitted from two openings can arrive vibrating diaphragm respectively and offset.
As shown in Figure 1, be the structure cutaway view of common directive property MEMS microphone, wherein all parts is all fixed on terminal block, and on terminal block, also arranges shell all parts are all covered sealing.In order to make two of MEMS sheet suffered acoustic pressures different, the both sides that two pieces of flat boards with groove are communicated to MEMS sheet are respectively set in the below of terminal block.
Owing to needing additionally to arrange two parts in the below of terminal block in prior art, the cost of overall microphone can be increased, and whole manufacturing process flow can be extended.
Therefore how designing the simpler directive property MEMS microphone of structure on a kind of basis ensureing directive property, reducing production cost, is the problem that those skilled in the art needs to solve.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of directive property MEMS microphone, comprising:
The inner pcb board offering at least one logical sound groove along direction, plate face of plate body, the end of described logical sound groove is positioned on the plate face of described pcb board, sound hole in sound hole and second in formation first;
In described first, in sound hole and described second, the outside of sound hole covers respectively and arranges the first shell and second housing, and described first shell and described second housing all arrange outer sound hole;
Described first shell or described second housing inside are fixedly installed asic chip and MEMS chip, and described asic chip is connected by gold thread with described MEMS chip, and described asic chip is connected on described pcb board by gold thread.
Alternatively, in the outer sound hole and described second in the outer sound hole and described first described first shell offered, sound hole, described second housing offered, sound hole position lays respectively on same vertical line.
Alternatively, in sound hole or described second, sound hole is positioned at the central authorities bottom described MEMS chip in described first.
Alternatively, described asic chip and described MEMS chip are all fixedly installed on described pcb board.
Alternatively, described asic chip and described MEMS chip are all fixedly installed on the inwall of described first shell or described second housing.
Alternatively, described first shell and described pcb board or vertically arrange the company's of leading part between described second housing and described pcb board, described in described asic chip passes through, the company's of leading part is connected with described pcb board.
Alternatively, the arranged outside damping of the outer sound hole on described first shell and/or described second housing.
Alternatively, the gold thread outer wrap fluid sealant that is connected with described pcb board of described asic chip.
Alternatively, in sound hole and described second, the spacing of sound hole meets predetermined value in described first.
The present invention also provides a kind of audio signal reception device, comprises the directive property MEMS microphone described in above-mentioned any one.
Directive property MEMS microphone needs to be subject to different acoustic pressures with respectively from different directions sound by the both sides of MEMS chip, embody directive property, in order to reach this object, through path that length is different when needing to make sound to pass to MEMS chip, the present invention is in order to realize above-mentioned effect when reducing device volume, therefore the logical sound groove extended along direction, plate face is set on pcb board, the opening of logical sound groove end is opened on the plate face of pcb board, sound hole in sound hole and second in formation first, in first, in sound hole and second, the outside of sound hole covers respectively and arranges the first shell and second housing, sound to pass in first sound hole in sound hole and second by the outer sound hole that the first shell and second housing are offered, second housing is arranged on inner for MEMS chip, sound enters contact outside that is inner and MEMS chip from the outer sound hole second housing, sound enters inner and the logical sound groove in edge and MEMS chip interior side contacts from the outer sound hole the first shell, the distance passed through due to sound is different, acoustic pressure when being delivered to MEMS chip is not identical yet, MEMS chip is made to produce vibration, by the directive property of different extent of vibration reflection sound.Logical sound groove is integrated on pcb board by this device, the passage of additional components as sound transmission need not be set, the logical sound groove that pcb board is arranged can realize above-mentioned effect, under the condition guaranteeing sound transmission range difference, make required component reduce as far as possible, structure is simpler, make product more frivolous, reduce production cost.Meanwhile, the audio signal reception device with this directive property MEMS microphone has above-mentioned technique effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of MEMS microphone in prior art;
Fig. 2 is the cross-sectional view of a kind of directive property MEMS microphone provided by the present invention;
Fig. 3 is the cross-sectional view of another kind of directive property MEMS microphone provided by the present invention;
Fig. 4 is the cross-sectional view of the third directive property MEMS microphone;
Fig. 5 is the cross-sectional view of the 4th kind of directive property MEMS microphone.
Wherein:
Pcb board 1, logical sound groove 11, the company's of leading part 12, first shell 21, second housing 22, asic chip 3, fluid sealant 31, MEMS chip 4, damping 5.
Embodiment
Core of the present invention is to provide a kind of directive property MEMS microphone, and this device simplifies the structure on the basis that ensure that sound transmission approach, makes product more frivolous, reduces production cost.In addition, another core of the present invention is to provide a kind of audio signal reception device with above-mentioned MEMS microphone.
In order to make those skilled in the art understand technical scheme provided by the present invention better, below in conjunction with accompanying drawing and concrete execution mode, MEMS microphone of the present invention is described in detail.
The invention provides a kind of directive property MEMS microphone, the critical piece of this device comprises pcb board 1, first shell 21, second housing 22 and is fixedly installed on asic chip 3 and the MEMS chip 4 of the first shell 21 or second housing 22 inside.At least one logical sound groove 11 offered with it by the plate of pcb board 1, multiple also passable, logical sound groove 11 is positioned at the inside of pcb board 1, and the end of both sides is all positioned on the plate face of pcb board 1, sound hole in sound hole and second in formation first, in first, in sound hole and second, sound hole is mutually through by logical sound groove 11.In general; in first, in sound hole and second, sound hole needs to be positioned on the same side of pcb board 1, to receive from the source of sound on same direction, certainly; do not get rid of the structure be arranged on different sides, these are included within invention which is intended to be protected.The structure that in logical sound groove 11, first, in sound hole and second, sound hole is concrete and size can be improved accordingly according to the actual size of pcb board 1, and cross section can be circle, ellipse or rectangle etc., and the present invention is not specifically limited at this.In addition, in first, in sound hole and logical sound groove 11, second, the mode of communicating of sound hole and logical sound groove 11 can be set to round-corner transition, right angle transition etc., above design, and can optimize accordingly on this basis, but all belongs to design concept of the present invention.In addition, about the manufacture of logical sound groove 11, can be shaping by the mode of etching on pcb board 1, also first groove can be offered on pcb board 1, then be fixedly installed strip of paper used for sealing at the top of groove, the bottom of strip of paper used for sealing does not contact with the bottom of groove, and two ends reserve space as sound hole in sound hole and second in first, in this article, in sound hole and second, sound hole can be referred to as interior sound hole in first.
Change to some extent with the quantity of traditional set-up mode unlike the shell covered on pcb board 1, in first, in sound hole and second, the outside of sound hole covers respectively and arranges the first shell 21 and second housing 22, first shell 21 and second housing 22 are tightly connected with pcb board 1, do not interspace, the housing of the first shell 21 and second housing 22 is offered respectively through hole as outer sound hole, the shape approximation of the first shell 21 and second housing 22 is cylindric, generally outer sound hole is opened in the top of cylinder, to receive the sound sent from same direction, correspondingly, first shell 21 and second housing 22 also can be set to other shapes, outer sound hole also can be opened in other positions.It should be noted that outer sound hole can arrange one respectively on the first shell 21 and second housing 22, also can be set to two or more, these set-up modes are all fine.Outer sound hole respectively with first in sound hole and second sound hole with the use of.If be provided with multiple logical sound groove 11 on pcb board 1, can the continuant orifice of logical sound groove 11 end be separately positioned in the first shell 21 and second housing 22, also additionally can arrange multiple housing interior sound hole to be individually arranged in corresponding housing, and correspondence offers outer sound hole on housing.
Be fixedly installed asic chip 3 and MEMS chip 4 in the inside of the first shell 21 or second housing 22, the first shell 21 in the present invention and second housing 22, for distinguishing two housings, are arranged in which housing.The shell structure arranging asic chip 3 and MEMS chip 4 can arrange and relatively arrange comparatively large according to the size of inner body and distance, and the housing not arranging part can arrange less, in ensureing interior sound hole to be wrapped in, to simplify size.
Asic chip 3 is connected by gold thread with MEMS chip 4, and asic chip 3 is connected on pcb board 1 by gold thread again, information is successively transmitted.Because gold thread is very thin, reduce the probability damaged when being subject to make device impacting, at the gold thread outer wrap fluid sealant 31 that asic chip 3 is connected with pcb board 1, air-dry rear effect gold thread being played to buffering of fluid sealant 31, plays protected effect to gold thread.
In the present invention, all parts is connected and fixed by tin cream or some glue, the such as connection of the first shell 21 and pcb board 1, second housing 22 and pcb board 1, asic chip 3 realizes with the fixing mode of picture tin cream or some glue that all can adopt of pcb board 1 with pcb board 1, MEMS chip 4, specifically can select according to actual working environment.
Further, in the outer sound hole and first offered on the first shell 21 in the present invention, sound hole is on same vertical vertical line during position in such as accompanying drawing, in the outer sound hole that second housing 22 is offered and second, sound hole is on same vertical curve, object can be corresponding with sound hole in sound hole in first or second after being to make sound import the first shell 21 or second housing 22 into from outer sound hole, reduce unnecessary obstruction, make the transmission effect of sound better.
First shell 21 or second housing 22 inside are provided with MEMS chip 4, sound hole in sound hole or second is provided with in first in the housing that MEMS chip 4 is set, sound hole correspondence in sound hole or second in first is now needed to be arranged on the lower center position of MEMS chip 4, namely sound hole in the aligning of centre is ensured when fixedly mounting MEMS chip 4, make interior sound hole aim at the center of MEMS chip 4 with outer sound hole, the effect of MEMS chip 4 induction vibration can be better simultaneously.
As shown in Figure 2, the sectional structure chart of directive property MEMS microphone for providing in an embodiment of the present invention.Wherein asic chip 3 and MEMS chip 4 are all fixedly mounted on the plate face of pcb board 1, asic chip 3 and MEMS chip 4 fixing with pcb board 1 by the mode of picture tin cream or some glue, now the groove of MEMS chip 4 downward, as same bowl tips upside down on pcb board 1.Be arranged in second housing 22 for asic chip 3 and MEMS chip 4 and be described, the sound transmitted in the upper outside sound hole of second housing 22 directly passes to the top-side of MEMS chip 4, the sound transmitted from the upper outside sound hole of the first shell 21 through enclosure interior through entering sound hole in first, and transmit along logical sound groove 11, in second, sound hole spreads out of again, pass to the bottom sides of MEMS chip 4, the path that have passed through different length due to two parts sound transmitted from same sound source is delivered to the both sides of MEMS chip 4, therefore different acoustic pressures can be caused to the both sides of MEMS chip 4, MEMS chip 4 is made to produce vibration, identify the directive property of alternative sounds thus.The analog signal that MEMS chip 4 produces is delivered in asic chip 3 through gold thread, by asic chip 3, analog signal is converted to digital signal, and then is delivered to output on pcb board 1.As shown in Figure 2, fluid sealant 31 now, in hemispherical, is bonded on pcb board 1.
As shown in Figure 3, in another embodiment, asic chip 3 and MEMS chip 4 are all fixedly installed on the inwall of the first shell 21 or second housing 22, under normal circumstances, asic chip 3 and MEMS chip 4 are all fixed on the top of the inwall of housing, certainly also do not get rid of the situation on the sidewall of position when housing is set to other forms.Also to be fixed on second housing 22 inwall, now the groove that has of MEMS chip 4 is towards the outer sound hole on second housing 22, as same the bowl just put, the sound transmitted from the upper outside sound hole of second housing 22 directly passes in the groove of MEMS chip 4, the sound transmitted in the upper outside sound hole of the first shell 21 is sound hole in sound hole, logical sound groove 11, second in the first shell 21, first successively, finally pass to MEMS chip 4, by the acoustic pressure of both sides, MEMS chip 4 is vibrated, and signal is passed to output in pcb board 1 through asic chip 3.Contrary with the amplitude direction in a upper embodiment in the present embodiment, carry out when signal transacting processing.Now fluid sealant 31 is bonding with the inwall of second housing 22.
Can be expected further by above-mentioned two embodiments; the mounting means of above-mentioned two situations is combined; also can obtain the situation as shown in Fig. 4 or Fig. 5; be arranged on different parts respectively by asic chip 3 and MEMS chip 4, these similar distortion all should fall within the scope that the present invention protects.
Time on inwall asic chip 3 being fixed on the first shell 21 or second housing 22, due to structural restriction, cannot direct fixed bonding when asic chip 3 is connected by gold thread with pcb board 1, also need at the first shell 21 and pcb board 1 or between second housing 22 and pcb board 1, vertically the company's of leading part 12 be set, as shown in Figure 3, top and second housing 22 inwall of the company's of leading part 12 are fixed, bottom is fixed with pcb board 1, also connect gold thread in the bottom of the company's of leading part 12, asic chip 3 is communicated with pcb board 1.The company's of leading part 12 not only can be set to the situation shown in Fig. 3, also can be out of shape as required, as being set to right-angle bending structure, side is fixed on the sidewall of the second housing 22, opposite side is fixed on pcb board 1, as long as the structure that can play phase same-action is all fine.
As preferably, also in the outer sound hole arranged outside damping 5 of the first shell 21 and/or second housing 22, inner side can be arranged on also passable, just be arranged at that outside is convenient to be regulated, without the need to dismantling housing, the accompanying drawing given by the present invention is all only provided with damping 5 on the first housing 21.
In addition, due to MEMS chip 4 wherein side sound need by logical sound groove 11, therefore the numerical value that the distance demand fulfillment in first in sound hole and second between sound hole is preset, can either make MEMS chip 4 produce enough acoustic pressures, can not make again that transmission sound is long to decay.The multiple pads also arranged in the bottom of pcb board 1, for welding.
In addition, present invention also offers a kind of audio signal reception device, include above-mentioned directive property MEMS microphone, can realize the technique effect that above-mentioned MEMS microphone can reach, other structures of this audio signal reception device can with reference to prior art, and the present invention does not repeat them here.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein, can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a directive property MEMS microphone, is characterized in that, comprising:
The inner pcb board (1) offering at least one logical sound groove (11) along direction, plate face of plate body, the end of described logical sound groove (11) is positioned on the plate face of described pcb board (1), formed be connected first in sound hole in sound hole and second;
In described first, in sound hole and described second, the outside of sound hole covers respectively and arranges the first shell (21) and second housing (22), and described first shell (21) and described second housing (22) all arrange outer sound hole;
Described first shell (21) or described second housing (22) inside are fixedly installed asic chip (3) and MEMS chip (4), described asic chip (3) is connected by gold thread with described MEMS chip (4), and described asic chip (3) is connected on described pcb board (1) by gold thread.
2. directive property MEMS microphone according to claim 1, it is characterized in that, in the outer sound hole and described second in the outer sound hole and described first that described first shell (21) is offered, sound hole, described second housing (22) offered, sound hole lays respectively on same vertical line.
3. directive property MEMS microphone according to claim 2, is characterized in that, in described first, in sound hole or described second, sound hole is positioned at the central authorities of described MEMS chip (4) bottom.
4. directive property MEMS microphone according to claim 3, is characterized in that, described asic chip (3) and described MEMS chip (4) are all fixedly installed on described pcb board (1).
5. directive property MEMS microphone according to claim 3, it is characterized in that, described asic chip (3) and described MEMS chip (4) are all fixedly installed on the inwall of described first shell (21) or described second housing (22).
6. directive property MEMS microphone according to claim 5, it is characterized in that, described first shell (21) and described pcb board (1) or vertically arrange the company's of leading part (12) between described second housing (22) and described pcb board (1), described in described asic chip (3) passes through, the company's of leading part (12) is connected with described pcb board (1).
7. the directive property MEMS microphone according to any one of claim 1 to 6, is characterized in that, the arranged outside damping (5) of the outer sound hole on described first shell (21) and/or described second housing (22).
8. directive property MEMS microphone according to claim 7, is characterized in that, the gold thread outer wrap fluid sealant (31) that described asic chip (3) is connected with described pcb board (1).
9. directive property MEMS microphone according to claim 7, is characterized in that, in described first, in sound hole and described second, the spacing of sound hole meets predetermined value.
10. an audio signal reception device, is characterized in that, comprises the directive property MEMS microphone described in any one of claim 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510603146.XA CN105142085B (en) | 2015-09-21 | 2015-09-21 | A kind of directive property MEMS microphone and audio signal reception device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510603146.XA CN105142085B (en) | 2015-09-21 | 2015-09-21 | A kind of directive property MEMS microphone and audio signal reception device |
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| Publication Number | Publication Date |
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| CN105142085A true CN105142085A (en) | 2015-12-09 |
| CN105142085B CN105142085B (en) | 2019-04-23 |
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| CN201510603146.XA Active CN105142085B (en) | 2015-09-21 | 2015-09-21 | A kind of directive property MEMS microphone and audio signal reception device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115668983A (en) * | 2020-04-22 | 2023-01-31 | 哈曼国际工业有限公司 | Micro-electro-mechanical system (MEMS) microphone assembly |
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