CN105140168A - Carrying platform and wafer thickness detecting device - Google Patents
Carrying platform and wafer thickness detecting device Download PDFInfo
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- CN105140168A CN105140168A CN201410234654.0A CN201410234654A CN105140168A CN 105140168 A CN105140168 A CN 105140168A CN 201410234654 A CN201410234654 A CN 201410234654A CN 105140168 A CN105140168 A CN 105140168A
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Abstract
The present invention provides a carrying platform and a wafer thickness detecting device. The carrying platform is used for carrying a wafer in detecting the thickness of the wafer by a detection unit. The carrying platform comprises a platform body. The upper surface of the platform body is provided with multiple bosses which are arranged along the periphery with intervals. The upper surfaces of the multiple bosses are used for supporting the wafer together, and the upper surface of each of the bosses is provided with a positioning projection used for positioning the wafer placed at the upper surfaces of the multiple bosses. According to the carrying platform provided by the invention, a manipulator is used for automatically carry out wafer taking and placing, and thus the fully automation of wafer thickness detection can be realized.
Description
Technical field
The present invention relates to semiconductor processing technology field, particularly, relate to a kind of carrying platform and wafer thickness checkout gear.
Background technology
The carry out tool of etching depth in the etching technics of wafer (such as Silicon Wafer) on wafer thickness direction to follow-up etching procedure has a direct impact.In order to obtain etching depth accurately, improving the accuracy of etching technics, usually needing before wafer is etched, the thickness of wafer is detected.The method detecting wafer thickness sets sampled point on wafer surface diverse location, and gather the wafer thickness of each sample point, then obtained the thickness of this wafer by data analysis.
The structural representation of the existing a kind of wafer thickness checkout gear of Fig. 1.As shown in Figure 1, wafer thickness checkout gear comprise for bearing wafer carrying platform 10, for detect the wafer thickness of sample point detector lens 11 and for driving carrying platform 10 to move, aim at the driving mechanism of detector lens 11 one by one to make each sampled point in wafer surface.Wherein, the type of drive that this driving mechanism adopts rectilinear motion and rotary motion to combine, realizes detecting all standing of optional position on substrate surface.Particularly, this driving mechanism comprises electric rotating machine 16, electric rotating machine fixed platform 12, line slideway 13, slide block 14 and linear electric motors 15.In the process detecting wafer thickness, first, linear electric motors 15 drive slide block 14 linearly guide rail 13 moving linearly, slide block 14 drives the electric rotating machine fixed platform 12 and the synchronous moving linearly of electric rotating machine 16 that are attached thereto, to make carrying platform 10 along the radial motion of wafer surface, until stop motion behind the appointment circumference place on detector lens 11 alignment wafer surface.Then, electric rotating machine 16 drives carrying platform 10 rotation, aims at detector lens 11 one by one to make above-mentioned appointment each sampled point circumferentially.
In order to ensure the accuracy of detection of wafer thickness checkout gear, respectively carrying platform 10 and the relative position of detector lens 11 and the relative position of carrying platform 10 and wafer are calibrated with regard to needing.For this reason, above-mentioned carrying platform 10 adopts following structure, as shown in Figure 2, carrying platform 10 adopts cross thin-slab structure, the upper surface of carrying platform 10 is provided with two elongated channels 101 of square crossing, and the center superposition of the crosspoint of two elongated channels 101 and carrying platform 10 upper surface, in order to calibrate the relative position of carrying platform 10 and detector lens 11 in a calibration process.And, in the orthogonal both direction of the upper surface of carrying platform 10 (namely, along orthogonal two length directions of cross thin plate) on be symmetrically distributed with many registration post installing hole 102, in order to install the reference column (not shown) for limiting the position of wafer on carrying platform 10 upper surface, and the reference column be arranged in the reference column installing hole 102 of different row can position the wafer of different size.
Inevitably there is following problem in above-mentioned carrying platform 10, that is: in actual applications
Because above-mentioned carrying platform 10 adopts thin-slab structure, its upper surface is plane, this makes to utilize the transmitting devices such as manipulator automatically to carry out getting the operation of sheet or film releasing, and only manually can carry out the operation of getting sheet or film releasing, thus the full-automation that cannot realize wafer thickness detects.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art, propose a kind of carrying platform and wafer thickness checkout gear, it can utilize manipulator automatically to carry out picking and placeing the operation of wafer, thus can realize the full-automation of wafer thickness detection.
A kind of carrying platform is provided for realizing object of the present invention, for the bearing wafer when detecting unit detects wafer thickness, described carrying platform comprises platform body, be provided with the multiple boss be intervally arranged along its circumference at the upper surface of described platform body, the upper surface of described multiple boss is used for common support wafer; Further, be provided with positioning convex at the upper surface of each boss, the wafer in order to the upper surface being opposite to described multiple boss positions.
Preferably, described in each, the inner surface of positioning convex is arc surface, and described arc surface is mutually vertical with the upper surface of described boss, and the radius of described arc surface is equal with the radius of described wafer; Or described arc surface tilts relative to the upper surface of described boss, and the radius of described each position of arc surface in the vertical direction from top to bottom reduces gradually, and the least radius of described arc surface is equal with the radius of described wafer.
Preferably, the upper surface of each described boss is provided with slip-proofing device, in order to adopt the fixing mode of friction, described wafer is fixed on described boss.
Preferably, described slip-proofing device comprises cushion rubber or rubber cushion.
Preferably, centre bore is provided with, for installation manipulator locating piece at the center of described platform body upper surface; Described manipulator locating piece is used for positioning the relative position between described manipulator and described carrying platform.
Preferably, also be provided with along spaced four elongate trench of its circumference at described platform body upper surface, every bar elongate trench center line in the longitudinal direction extends along the radial direction of described platform body upper surface, and adjacent two elongate trench are mutually vertical; Every bar elongate trench has default linearity, and has preset vertical degree between adjacent two elongate trench; The length direction of wherein two elongate trench making described carrying platform identical along direction moves horizontally, make described detecting unit launch detection signal towards described platform body upper surface simultaneously, and receive the feedback signal reflected by described platform body upper surface; Judge this feedback signal whether in whole moving process all from described elongate trench, if so, then determine there is no position deviation between described carrying platform and described detecting unit.
Preferably, also be provided with along the spaced multiple oval arc-shaped through-hole of its circumference at described platform body upper surface, allow for making described platform body to adjust its position circumferentially, with in described carrying platform moving process, ensure described feedback signal all from described elongate trench; Screw is provided with in each oval arc-shaped through-hole, in order to complete described platform body after the adjustment of its position circumferentially, fixing described carrying platform.
Preferably, also be provided with along its spaced multiple tapped through hole of circumference and the screw with each tapped through hole threaded engagement at described platform body upper surface, by regulating the screw of each tapped through hole and Qi Nei at the relative position axially of described tapped through hole, regulate the levelness of described platform body upper surface.
Preferably, the shape that each boss projects on the upper surface of described platform body comprises triangle, circle, polygon or ellipse.
As another technical scheme, the present invention also provides a kind of wafer thickness checkout gear, it comprises for the carrying platform of bearing wafer, for detecting the detecting unit of the wafer thickness at wafer surface diverse location place and the driving mechanism for driving described carrying platform to move, wherein, described carrying platform have employed above-mentioned carrying platform provided by the invention respectively to the relative position of described carrying platform and described detecting unit, and the relative position of described carrying platform and wafer is calibrated.
The present invention has following beneficial effect:
Carrying platform provided by the invention, it is provided with the multiple boss be intervally arranged along its circumference on the upper surface of platform body, for common support wafer.Owing to being placed in the vertical gap having between wafer on boss upper surface and platform body and can pass through for manipulator, manipulator thus can be utilized automatically to carry out picking and placeing the operation of wafer, thus the full-automation that wafer thickness detects can be realized.
Wafer thickness checkout gear provided by the invention, it, by adopting carrying platform provided by the invention, can utilize manipulator automatically to carry out picking and placeing the operation of wafer, thus can realize the full-automation of wafer thickness detection.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing a kind of wafer thickness checkout gear;
Fig. 2 is the vertical view of existing carrying platform;
The stereogram of the carrying platform that Fig. 3 provides for the embodiment of the present invention;
The vertical view of the carrying platform that Fig. 4 A provides for the embodiment of the present invention;
Fig. 4 B is the cutaway view along A-A line in Fig. 4 A;
Fig. 4 C is the vertical view of carrying platform when bearing wafer in Fig. 4 A;
Fig. 5 A is the schematic diagram positioned manipulator and carrying platform;
Fig. 5 B is the location diagram of manipulator locating piece and carrying platform;
Fig. 5 C is the enlarged drawing in I region in Fig. 5 B; And
The cutaway view of carrying platform when manipulator takes out wafer that Fig. 6 provides for the embodiment of the present invention.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, carrying platform provided by the invention and wafer thickness checkout gear are described in detail.
See also Fig. 3-Fig. 6, the carrying platform that the embodiment of the present invention provides is for the bearing wafer when detecting unit detects wafer thickness, it comprises platform body 21, the multiple boss 22 be intervally arranged along its circumference are provided with at the upper surface of platform body 21, the upper surface of multiple boss 22 is used for common support wafer 30, in the present embodiment, the quantity of boss 22 is four, and four boss 22 are intervally arranged along the circumference of the upper surface of platform body 21, and distribute about the upper surface Central Symmetry of platform body 21; And the shape approximation that each boss 22 projects at the upper surface of platform body 21 is triangle, as shown in Figure 3 and Figure 5.Certainly, in actual applications, the quantity of boss also can be two, more than three or five, and, the shape that each boss projects on the upper surface of platform body can also be other arbitrary shapes of circular, polygon or ellipse etc., as long as boss can stably supporting wafers.
As shown in Figure 5, be placed between the wafer 30 of the upper surface of boss 22 and platform body 21 and have vertical gap, when needs utilize manipulator 31 to take out wafer 30 from boss 22, first, manipulator 31 is moved horizontally in this vertical gap; Then, manipulator 31 rises, and now wafer 30 departs from boss 22, and is carried by manipulator 31, can complete the operation of taking out wafer.The operation of placing the operation of wafer and above-mentioned taking-up wafer is similar, does not repeat them here.
In actual applications, as long as the size in above-mentioned vertical gap ensures to make manipulator 31 pass through.Thus, by multiple boss 22 common support wafer 30, manipulator can be utilized automatically to carry out picking and placeing the operation of wafer, thus the full-automation of wafer thickness detection can be realized.
And, be provided with positioning convex 221 at the upper surface of each boss 22, position in order to the wafer 30 be opposite on the upper surface of multiple boss 22, that is, limit the position of wafer 30 on boss 22.In the present embodiment, the inner surface of each positioning convex 221 (namely, side towards the center of platform body 21) be arc surface, this arc surface tilts relative to the upper surface of boss 22, namely, the radius of each position of radius in the vertical direction of this arc surface from top to bottom reduces gradually, and the radius approximately equal of its least radius and wafer, as shown in Figure 4 B and 4C.In other words, each positioning convex 221 is arranged on the upper surface of boss 22, and be positioned at the periphery of this upper surface for supporting wafers 30 region, and the circular inner edge jointly formed by the inner surface of all positioning convex 221 matches with the periphery wall of the wafer 30 being placed in boss 22 upper surface, thus the wafer 30 realizing being opposite to the upper surface of multiple boss 22 positions.
When utilizing manipulator 31 that wafer 30 is positioned over the upper surface of boss 22, wafer 30 is after disengaging manipulator 31, can be fallen on the upper surface of boss 22 along the arc surface tilted by self gravitation, thus automatically realize the calibration to its position on boss upper surface.Certainly, in actual applications, above-mentioned arc surface also can be mutually vertical with the upper surface of boss, now this arc surface radius should with the radius approximately equal of wafer.
Inner surface due to positioning convex 221 is the arc surface that can match with the periphery wall of wafer 30, in other words, positioning convex 221 is location that the mode contacted by " face and face " or " line and line " realizes to wafer, compared with the mode that this passes through with reference column in prior art " putting and point " contacts, more firmly wafer can be fixed on the assigned address on boss, thus when the movement velocity of carrying platform can be avoided higher, the wafer that may occur is relative to the situation of platform body upper surface slide, and then the accuracy of detection of wafer thickness checkout gear can be improved.
In this enforcement, the upper surface of each boss 22 is provided with slip-proofing device (not shown), in order to adopt friction fixing mode, wafer 30 is fixed on boss 22.Slip-proofing device has higher roughness relative to the upper surface of boss 22, thus can increase the frictional force between wafer 30, and then wafer 30 can be avoided relative to platform body 21 upper surface slide.In actual applications, slip-proofing device can comprise such as cushion rubber or rubber cushion etc. can and wafer between produce the part of larger frictional force.In addition, this slip-proofing device can adopt following manner to be fixed on the upper surface of boss 22, that is: the upper surface of each boss 22 is provided with mounting groove 222, by being fixed on by slip-proofing device in mounting groove 222, realizes fixing this slip-proofing device.Preferably, a part for slip-proofing device can be made to be positioned at mounting groove 222, another part of slip-proofing device is positioned at outside mounting groove 222, namely, a wherein part for slip-proofing device can relative to the upper surface projection of boss 22, thus be more conducive to preventing wafer 30 relative to platform body 21 upper surface slide.Certainly, in actual applications, the mode of the present invention to the structure of slip-proofing device and the upper surface that is fixed on boss has no particular limits, as long as it can play above-mentioned anti-skiddingly to act on.
In the present embodiment, the center of platform body 21 upper surface is provided with centre bore 213, as shown in Figure 4 A, for installation manipulator locating piece (not shown).This manipulator locating piece is used for positioning the relative position between manipulator and carrying platform.The mode that manipulator utilizes this manipulator locating piece to position is specifically as follows: as shown in figures 5a-5c, the lower surface of manipulator locating piece 42 is provided with a projection 421, when manipulator locating piece 42 is placed on the upper surface of platform body 21, this projection 421 is positioned at centre bore 213, and the two tolerance fit.Preferably, protruding 421 can adopt the arc-shaped profile that precision is higher, so as with centre bore 213 accurate match.
When manipulator locating piece 42 is placed on the upper surface of platform body 21, and make protruding 421 be positioned at centre bore 213 after, manipulator 31 is moved near carrying platform, then the teaching operation of manipulator 31 is carried out, with gradually by bonded to each other for the cylindrical sidewalls of the semicircular structure and manipulator locating piece 42 that are positioned at manipulator 31 center, when the two is bonded to each other, the position of manipulator 31 relative to carrying platform can be determined, then position current for manipulator 31 recorded and be kept in teach box, thus completing the positioning action of manipulator 31.In addition, before carrying out technique, need manipulator locating piece 42 is taken off on carrying platform and preserves.
As shown in Figure 4 B, in the present embodiment, also be provided with dowel hole 216 at the center of platform body 21 lower surface, platform body 21 and rotating shaft 33 realize the location to platform body 21 and rotating shaft 33 by the alignment pin 32 be arranged in dowel hole 216, as shown in Figure 6.In actual applications, the alignment tolerance between dowel hole and alignment pin can be designed tightlier, to improve positioning precision.
In the present embodiment, also be provided with along spaced four elongate trench 214 of its circumference at platform body 21 upper surface, every bar elongate trench 214 center line in the longitudinal direction extends along the radial direction of platform body 21 upper surface, and adjacent two elongate trench 214 is mutually vertical, as illustrated in figures 4 a and 4b.And every bar elongate trench 214 has default linearity, and between adjacent two elongate trench 214, there is preset vertical degree.
Before needs utilize detecting unit detection wafer thickness, usually need to calibrate the relative position between carrying platform and detecting unit, that is, carrying platform and detecting unit are respectively at radial direction and the relative position circumferentially of carrying platform, to improve accuracy of detection.The concrete mode of calibration is, that is: the length direction of wherein two elongate trench 214 making carrying platform identical along direction moves horizontally, make detecting unit launch detection signal towards platform body 21 upper surface simultaneously, and receive the feedback signal reflected by platform body 21 upper surface; Judge this feedback signal whether in whole moving process all from elongate trench 214, if so, then determine there is no position deviation between carrying platform and detecting unit; If not, then need the relative position readjusted between carrying platform and detecting unit, to eliminate this position deviation.
Preferably, first carrying platform is made to move horizontally along the length direction of two elongate trench 214 of the left and right sides, center being positioned at platform body 21 upper surface in Fig. 4 A, then make carrying platform half-twist, then carrying platform is moved horizontally along the length direction of two elongate trench 214 of the upper and lower both sides, center being positioned at platform body 21 upper surface in Fig. 4 A.If carrying platform does not all have position deviation in the radial direction at orthogonal two, namely, in the whole process that carrying platform moves horizontally along above-mentioned both direction, the feedback signal reflected by platform body 21 upper surface all from elongate trench 214, then can judge carrying platform and detecting unit straight line registration in vertical direction.In actual applications, the width of every bar elongate trench and length can set according to the requirement of detecting unit and accuracy of detection.
Preferably, before being fixedly connected with rotating shaft by carrying platform, adjustment carrying platform is in its position circumferentially, namely, slightly rotate carrying platform, to ensure above-mentioned feedback signal further all from elongate trench 214, thus make there is no position deviation between carrying platform and detecting unit.Adjustment carrying platform is specifically as follows in the mode of its position circumferentially, that is: being also provided with along spaced four the oval arc-shaped through-holes 211 of its circumference at platform body 21 upper surface, allowing for making platform body 21 to adjust its position circumferentially.In addition, in each oval arc-shaped through-hole 211, screw (not shown) is provided with, in order to complete platform body 21 after the adjustment of its position circumferentially, fixing carrying platform (being fixed together with rotating shaft).
Certainly, in actual applications, the quantity of oval arc-shaped through-hole also can be two, more than three or five, and each oval arc-shaped through-hole can free setting as the case may be in the length circumferentially of platform body upper surface.
Preferably, platform body 21 upper surface is also provided with a slotted hole 215, and above carrying platform, and be positioned at circumference place, slotted hole 215 place one transducer is set, for launching detection signal towards platform body 21 upper surface, and receive the feedback signal reflected by platform body 21 upper surface, thus can realize detecting the anglec of rotation of carrying platform, that is, carrying platform is detected in its position circumferentially, to realize the location to carrying platform more accurately.
In the present embodiment, platform body 21 upper surface is still provided with along its spaced multiple tapped through hole 212 of circumference and with the screw of each tapped through hole 212 threaded engagement (such as, jackscrew) (not shown), by regulating the relative position axially of screw at tapped through hole 212 of each tapped through hole 212 and Qi Nei, regulate the levelness of platform body 21 upper surface.Easy understand, when regulating the levelness of platform body 21 upper surface, the thickness of platform body 21 should be run through in the lower end of part or all of screw, and stretches out from the lower surface of platform body 21, and withstands the end face of rotating shaft 33.Screw stretches out the part of the lower surface of platform body 21 can compensating platform body 21 upper surface angle of inclination with respect to the horizontal plane, thus platform body 21 upper surface can be made to be tending towards level.
It should be noted that, in actual applications, the horizontal rectilinear motion of carrying platform and rotary motion can be, but not limited to adopt driving mechanism of the prior art to realize, the 26S Proteasome Structure and Function of this driving mechanism see background technology and Fig. 1,2.
In sum, the carrying platform that the embodiment of the present invention provides, it is provided with the multiple boss be intervally arranged along its circumference on the upper surface of platform body, for common support wafer.Owing to being placed in the vertical gap having between wafer on boss upper surface and platform body and can pass through for manipulator, manipulator thus can be utilized automatically to carry out picking and placeing the operation of wafer, thus the full-automation that wafer thickness detects can be realized.
As another technical scheme, the embodiment of the present invention also provides a kind of wafer thickness checkout gear, and it comprises for the carrying platform of bearing wafer, for detecting the detecting unit of the wafer thickness at wafer surface diverse location place and the driving mechanism for driving carrying platform to move.Wherein, carrying platform have employed the above-mentioned carrying platform that the embodiment of the present invention provides, and in order to respectively to the relative position of this carrying platform and detecting unit, and the relative position of carrying platform and wafer is calibrated.
The wafer thickness checkout gear that the embodiment of the present invention provides, its above-mentioned carrying platform provided by adopting the embodiment of the present invention, can utilize manipulator automatically to carry out picking and placeing the operation of wafer, thus can realize the full-automation of wafer thickness detection.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a carrying platform, for the bearing wafer when detecting unit detects wafer thickness, it is characterized in that, described carrying platform comprises platform body, be provided with the multiple boss be intervally arranged along its circumference at the upper surface of described platform body, the upper surface of described multiple boss is used for common support wafer; Further,
Be provided with positioning convex at the upper surface of each boss, the wafer in order to the upper surface being opposite to described multiple boss positions.
2. carrying platform according to claim 1, is characterized in that, described in each, the inner surface of positioning convex is arc surface, and
Described arc surface is mutually vertical with the upper surface of described boss, and the radius of described arc surface is equal with the radius of described wafer; Or described arc surface tilts relative to the upper surface of described boss, and the radius of described each position of arc surface in the vertical direction from top to bottom reduces gradually, and the least radius of described arc surface is equal with the radius of described wafer.
3. carrying platform according to claim 1, is characterized in that, the upper surface of each described boss is provided with slip-proofing device, is fixed on described boss by described wafer in order to adopt the fixing mode of friction.
4. carrying platform according to claim 3, is characterized in that, described slip-proofing device comprises cushion rubber or rubber cushion.
5. carrying platform according to claim 1, is characterized in that, is provided with centre bore, for installation manipulator locating piece at the center of described platform body upper surface;
Described manipulator locating piece is used for positioning the relative position between described manipulator and described carrying platform.
6. carrying platform according to claim 1, it is characterized in that, also be provided with along spaced four elongate trench of its circumference at described platform body upper surface, every bar elongate trench center line in the longitudinal direction extends along the radial direction of described platform body upper surface, and adjacent two elongate trench are mutually vertical; Every bar elongate trench has default linearity, and has preset vertical degree between adjacent two elongate trench;
The length direction of wherein two elongate trench making described carrying platform identical along direction moves horizontally, make described detecting unit launch detection signal towards described platform body upper surface simultaneously, and receive the feedback signal reflected by described platform body upper surface; Judge this feedback signal whether in whole moving process all from described elongate trench, if so, then determine there is no position deviation between described carrying platform and described detecting unit.
7. carrying platform according to claim 6, it is characterized in that, also be provided with along the spaced multiple oval arc-shaped through-hole of its circumference at described platform body upper surface, allow for making described platform body to adjust its position circumferentially, with in described carrying platform moving process, ensure described feedback signal all from described elongate trench;
Screw is provided with in each oval arc-shaped through-hole, in order to complete described platform body after the adjustment of its position circumferentially, fixing described carrying platform.
8. carrying platform according to claim 1, it is characterized in that, also be provided with along its spaced multiple tapped through hole of circumference and the screw with each tapped through hole threaded engagement at described platform body upper surface, by regulating the screw of each tapped through hole and Qi Nei at the relative position axially of described tapped through hole, regulate the levelness of described platform body upper surface.
9. carrying platform according to claim 1, is characterized in that, the shape that each boss projects on the upper surface of described platform body comprises triangle, circle, polygon or ellipse.
10. a wafer thickness checkout gear, it comprises for the carrying platform of bearing wafer, for detecting the detecting unit of the wafer thickness at wafer surface diverse location place and the driving mechanism for driving described carrying platform to move, it is characterized in that, described carrying platform adopts carrying platform described in claim 1-9 any one respectively to the relative position of described carrying platform and described detecting unit, and the relative position of described carrying platform and wafer is calibrated.
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| CN201410234654.0A CN105140168A (en) | 2014-05-29 | 2014-05-29 | Carrying platform and wafer thickness detecting device |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106767258A (en) * | 2016-12-30 | 2017-05-31 | 无锡凯涵科技有限公司 | A kind of wheel justifies jitter detection apparatus |
| CN106994644A (en) * | 2015-12-18 | 2017-08-01 | 胜高股份有限公司 | The thickness distribution measurement system and method for semiconductor wafer, grinding system and Ginding process, thickness allowance balance assay method |
| CN108039334A (en) * | 2017-12-22 | 2018-05-15 | 中国科学院上海硅酸盐研究所 | Micron order thickness wafer plummer |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004025379A (en) * | 2002-06-26 | 2004-01-29 | Daisho Seiki Kk | Device for measuring angle of grinding wheel of groove cutting machine for compressor cylinder |
| CN1620596A (en) * | 2002-01-22 | 2005-05-25 | 瑞尼斯豪公司 | Re-orientatable sample holder |
| CN102446802A (en) * | 2011-12-15 | 2012-05-09 | 清华大学 | Wafer platform |
| CN103612202A (en) * | 2013-11-19 | 2014-03-05 | 中国科学院光电技术研究所 | Workpiece clamp positioning device in ion beam polishing equipment |
| CN203527677U (en) * | 2013-11-06 | 2014-04-09 | 英利能源（中国）有限公司 | Bonding location work table |
-
2014
- 2014-05-29 CN CN201410234654.0A patent/CN105140168A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1620596A (en) * | 2002-01-22 | 2005-05-25 | 瑞尼斯豪公司 | Re-orientatable sample holder |
| JP2004025379A (en) * | 2002-06-26 | 2004-01-29 | Daisho Seiki Kk | Device for measuring angle of grinding wheel of groove cutting machine for compressor cylinder |
| CN102446802A (en) * | 2011-12-15 | 2012-05-09 | 清华大学 | Wafer platform |
| CN203527677U (en) * | 2013-11-06 | 2014-04-09 | 英利能源（中国）有限公司 | Bonding location work table |
| CN103612202A (en) * | 2013-11-19 | 2014-03-05 | 中国科学院光电技术研究所 | Workpiece clamp positioning device in ion beam polishing equipment |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106994644A (en) * | 2015-12-18 | 2017-08-01 | 胜高股份有限公司 | The thickness distribution measurement system and method for semiconductor wafer, grinding system and Ginding process, thickness allowance balance assay method |
| CN106767258A (en) * | 2016-12-30 | 2017-05-31 | 无锡凯涵科技有限公司 | A kind of wheel justifies jitter detection apparatus |
| CN108724200A (en) * | 2017-04-14 | 2018-11-02 | 北京北方华创微电子装备有限公司 | Arm-and-hand system and semiconductor processing equipment |
| CN108039334A (en) * | 2017-12-22 | 2018-05-15 | 中国科学院上海硅酸盐研究所 | Micron order thickness wafer plummer |
| CN108039334B (en) * | 2017-12-22 | 2020-05-19 | 中国科学院上海硅酸盐研究所 | Micron-sized thickness wafer bearing table |
| CN109059712A (en) * | 2018-08-21 | 2018-12-21 | 宁波江丰电子材料股份有限公司 | The detection method and cubing of wafer carrier |
| CN109059712B (en) * | 2018-08-21 | 2020-08-04 | 宁波江丰电子材料股份有限公司 | Wafer carrier detection method and detection tool |
| CN111748778A (en) * | 2019-03-29 | 2020-10-09 | 宁波江丰电子材料股份有限公司 | Automatic positioning equipment for ultra-pure aluminum sputtering target material |
| CN111968925A (en) * | 2019-05-20 | 2020-11-20 | 北京北方华创微电子装备有限公司 | Workpiece state monitoring device and method and semiconductor equipment |
| CN111968925B (en) * | 2019-05-20 | 2024-05-17 | 北京北方华创微电子装备有限公司 | Workpiece state monitoring device and method and semiconductor equipment |
| CN113130373A (en) * | 2020-01-16 | 2021-07-16 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
| CN113130373B (en) * | 2020-01-16 | 2024-05-14 | 沈阳新松机器人自动化股份有限公司 | Multi-layer wafer supporting mechanism for vacuum |
| CN113764330A (en) * | 2020-06-03 | 2021-12-07 | 中芯北方集成电路制造(北京)有限公司 | Wafer clamping device |
| WO2022057790A1 (en) * | 2020-09-15 | 2022-03-24 | 无锡华瑛微电子技术有限公司 | Semiconductor edge processing apparatus and method |
| CN113188501A (en) * | 2021-06-30 | 2021-07-30 | 江苏振宁半导体研究院有限公司 | Detection device for detecting thickness of semiconductor wafer |
| CN115781623A (en) * | 2022-12-15 | 2023-03-14 | 西安奕斯伟材料科技有限公司 | Storage device |
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