CN105136325A - Flexible temperature sensor with self-packaging and preparation method thereof - Google Patents
Flexible temperature sensor with self-packaging and preparation method thereof Download PDFInfo
- Publication number
- CN105136325A CN105136325A CN201510511210.1A CN201510511210A CN105136325A CN 105136325 A CN105136325 A CN 105136325A CN 201510511210 A CN201510511210 A CN 201510511210A CN 105136325 A CN105136325 A CN 105136325A
- Authority
- CN
- China
- Prior art keywords
- board
- flexible base
- metal electrode
- temperature sensor
- graphene layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention discloses a flexible temperature sensor with self-packaging and a preparation method thereof. The temperature sensor comprises a flexible substrate, a lower metal plate electrode, a graphene layer and an upper metal plate electrode, wherein a through hole is formed in the flexible substrate; the graphene layer is arranged in the through hole of the flexible substrate; the upper metal plate electrode is fixedly connected with the upper surface of the flexible substrate; the lower metal plate electrode is fixedly connected with the lower surface of the flexible substrate; the top surface of the graphene layer is connected with the bottom surface of the upper metal plate electrode; and the bottom surface of the graphene layer is connected with the top surface of the lower metal plate electrode. The flexible temperature sensor is high in sensitivity and is provided with flexibility, and is high in biological compatibility.
Description
Technical field
The present invention relates to a kind of temperature sensor, specifically, relate to a kind of flexibility temperature sensor and preparation method thereof had from encapsulation.
Background technology
At present, people have invented various temperature sensor, especially based on the temperature sensor of material temperature-resistance variation characteristic in order to detected temperatures.Wherein, thermal resistance temperature sensor utilizes the resistance value of conductor or semiconductor to vary with temperature and the principle changed carries out a kind of sensor temperature meter of thermometric.Current most of thermal resistance type temperature sensor makes with metal, the most frequently used thermal resistance has platinum resistance thermometer sensor, and copper thermistor, but these sensors adopt non-flexible material to make, can only the temperature of the smooth object of measured surface, bio-compatibility is bad, and needs extra sensor package.
Summary of the invention
technical matters:in view of this, the object of the present invention is to provide a kind of flexibility temperature sensor and preparation method thereof had from encapsulation, this temperature sensor is highly sensitive, has flexibility, and bio-compatibility is good.
technical scheme:for solving the problems of the technologies described above, the technical scheme that the embodiment of the present invention adopts is:
Have the flexibility temperature sensor from encapsulation, this temperature sensor comprises flexible base, board, lower metal electrode board, graphene layer and upper metal electrode board; Be provided with through hole in flexible base, board, graphene layer is arranged in the through hole of flexible base, board; Upper metal electrode board is fixedly connected on the upper surface of flexible base, board, and lower metal electrode board is fixedly connected on the lower surface of flexible base, board, and the end face of graphene layer is connected with the bottom surface of upper metal electrode board, and the bottom surface of graphene layer is connected with the end face of lower metal electrode board.
As preferably, described through hole is positioned at the middle part of flexible base, board.
As preferably, described graphene layer is full of the through hole of flexible base, board, and the upper surface flush of the upper surface of graphene layer and flexible base, board, the lower surface of graphene layer flushes with the lower surface of flexible base, board.
As preferably, described flexible base, board is made up of LCP material.
As preferably, described flexible base, board is made into through hole by laser boring.
As preferably, between the thickness of described flexible base, board is 50 to 100 microns; Between the thickness of lower metal electrode board is 12 to 20 microns; Upper metal electrode board is formed in the upper surface of flexible base, board and graphene layer by magnetron sputtering method.
An above-mentioned preparation method with the flexibility temperature sensor from encapsulation, this preparation method comprises the following steps:
The first step: carry out laser boring to flexible base, board, forms through hole;
Second step: utilize laminating to be bonded with metal forming on flexible base, board one surface, metal forming forms lower metal electrode board;
3rd step: spin coating graphene oxide layer on flexible substrates, graphene oxide layer fills the through hole of full flexible base, board, and simultaneous oxidation graphene layer covers another surface of flexible base, board;
4th step: carry out high-temperature heating, is reduced into graphene film layer by graphene oxide layer;
5th step: scrape off the graphene film layer being positioned at flexible base, board surface, the graphene film layer being arranged in flexible base, board through hole forms graphene layer;
6th step: utilize magnetron sputtering method, sputtering layer of metal is on flexible base, board surface, and metal electrode board in formation, upper metal electrode board is connected with graphene layer, thus makes sensor.
As preferably, in the described first step: through hole is positioned at the middle part of flexible base, board; Flexible base, board is made up of LCP material.
As preferably, in the 4th described step: described heating-up temperature is lower than the melt temperature of flexible base, board.
beneficial effect:compared with existing temperature sensor, the embodiment of the present invention has following beneficial effect: the flexible distortion of temperature sensor, can be arranged on the body surface detected temperatures of arbitrary shape.In diastrophic situation, temperature sensor still can normally work.The temperature sensor of the present embodiment is with low cost, can be widely used in the fields such as biomedical and wearable device.In addition, utilize Graphene to make the temperature-sensing element (device) of temperature sensor, there is certain flexibility, and can temperature-sensing element (device) be filled in the through hole of LCP substrate very easily in making, and between LCP substrate, there is good adhesion.Graphene layer is filled in the through hole of LCP substrate, instead of is placed on LCP substrate surface.This makes graphene layer not only can well work in through-holes, and LCP substrate also serves the effect of protection to graphene layer, and lower metal electrode board and upper metal electrode board then can be made can to encapsulate graphene layer.
Accompanying drawing explanation
Fig. 1 is the cut-open view of temperature sensor in the embodiment of the present invention;
Fig. 2 is the structural representation of preparation method's first step in the embodiment of the present invention;
Fig. 3 is the structural representation of preparation method's second step in the embodiment of the present invention;
Fig. 4 is the structural representation of preparation method the 3rd step in the embodiment of the present invention;
Fig. 5 is the structural representation of preparation method the 4th step in the embodiment of the present invention;
Fig. 6 is the structural representation of preparation method the 5th step in the embodiment of the present invention;
Fig. 7 is the structural representation of preparation method the 6th step in the embodiment of the present invention.
Have in figure: flexible base, board 1, lower metal electrode board 2, graphene layer 3, upper metal electrode board 4, graphene oxide layer 5, graphene film layer 6.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in detail.
As shown in Figure 1, a kind of flexibility temperature sensor had from encapsulation of the embodiment of the present invention, it is characterized in that, this temperature sensor comprises flexible base, board 1, lower metal electrode board 2, graphene layer 3 and upper metal electrode board 4; Be provided with through hole in flexible base, board 1, graphene layer 3 is arranged in the through hole of flexible base, board 1; Upper metal electrode board 4 is fixedly connected on the upper surface of flexible base, board 1, lower metal electrode board 2 is fixedly connected on the lower surface of flexible base, board 1, and the end face of graphene layer 3 is connected with the bottom surface of upper metal electrode board 4, the bottom surface of graphene layer 3 is connected with the end face of lower metal electrode board 2.
The course of work of the flexibility temperature sensor of said structure is: object under test surface temperature passes to graphene layer 3 by lower metal electrode board 2, the resistance of graphene layer 3 is caused to change, resistance variations is exported by upper metal electrode board 4 and lower metal electrode board 2, finally reaches the object measuring body surface temperature value.Carry out data fitting demarcation according to the prior resistance to body surface temperature and temperature-sensing element (device), obtain resistance temperature relation, then according to the resistance variations of the actual temperature-sensing element (device) recorded, obtain the temperature value of required measurement point.
The temperature sensor of said structure has from encapsulating effect.As temperature-sensing element (device) in temperature sensor
Graphene layer 3, is filled in the through hole of flexible base, board 1, and is covered by lower metal electrode 2 and upper metal electrode 4, so graphene layer 3 is well protected.In addition, other parts of this temperature sensor do not need extra packaging protection.Therefore, the temperature sensor of the present embodiment has and carries encapsulation effect.Meanwhile, this temperature sensor comprises flexible base, board 1, lower metal electrode board 2, graphene layer 3 and upper metal electrode board 4.These parts itself all have certain pliability, thus make this temperature sensor entirety have pliability, can along with testee surface Bending Deformation, as the object of human body skin and some surface irregularities, all flexible deformation be attached to its surface temperature of testee surface measurement.
In the temperature sensor of said structure, lower metal electrode board 2 and upper metal electrode board 4 can exchange use.In the temperature sensor of the present embodiment, lower metal electrode board 2 is identical with the effect that upper metal electrode board 4 plays.Metal is the good conductor of heat.From lower metal electrode board 2 and upper metal electrode board 4, environment temperature can well be passed to graphene layer 3 to temperature by any one.Graphene layer 3 resistance variations, is exported by lower metal electrode board 2 and upper metal electrode board 4, and lower metal electrode board 2 is identical with the effect that upper metal electrode board 4 plays, and the following metal electrode board 2 of institute and upper metal electrode board 4 can exchange use.In addition, graphene layer 3 is filled in the through hole of flexible base, board 1, instead of is arranged on the surface of flexible base, board 1.While this makes graphene layer 3 work in through-holes, flexible base, board 1 also serves the effect of protection to graphene layer 3, does not need to encapsulate graphene layer 3 more in addition.
Preferably, described through hole is positioned at the middle part of flexible base, board 1.
Preferably, described graphene layer 3 is full of the through hole of flexible base, board 1, and the upper surface flush of the upper surface of graphene layer 3 and flexible base, board 1, the lower surface of graphene layer 3 flushes with the lower surface of flexible base, board 1.Such setting can make graphene layer 3 well link together with lower metal electrode 2 and upper metal electrode 4.
Preferably, described flexible base, board 1 is made up of LCP material.Polymeric liquid crystal copolymer (being called for short LCP in literary composition) is the polymer substance that a kind of mobility that be made up of rigid molecule chain, existing liquid under certain physical condition has again the physical property anisotropy (this state is called liquid crystal state) of crystal.LCP has the advantage of many uniquenesses, such as loss is little, cost is low, frequency of utilization scope is large, intensity is high, lightweight, thermotolerance and anti-flammability is strong, linear expansion coefficient is little, corrosion resistance and radiation resistance forming temperature that is good, CP film low, there is the excellent moulding processability of flexible and foldability, can be used for various band arc and the bending goods waiting complicated shape.Through hole on flexible base, board 1 is made by laser boring.
Preferably, between the thickness of described flexible base, board 1 is 50 to 100 microns; Between the thickness of lower metal electrode board 2 is 12 to 20 microns; Upper metal electrode board 4 is formed in the upper surface of flexible base, board 1 and graphene layer 3 by magnetron sputtering method.The thickness of flexible base, board 1 is greater than the thickness of lower metal electrode board 2 and the thickness of upper metal electrode board 4.This just makes temperature sensor have good flexibility, otherwise the pliability of sensor is not good.
An above-mentioned preparation method with the flexibility temperature sensor from encapsulation, this preparation method comprises the following steps:
The first step: carry out laser boring to flexible base, board 1, forms through hole;
Second step: utilize laminating to be bonded with metal forming on flexible base, board 1 one surface, metal forming forms lower metal electrode board 2;
3rd step: spin coating graphene oxide layer 5 on a flexible substrate 1, graphene oxide layer 5 fills the through hole of full flexible base, board 1, and simultaneous oxidation graphene layer 5 covers another surface of flexible base, board 1;
4th step: carry out high-temperature heating, is reduced into graphene film layer 6 by graphene oxide layer 5;
5th step: scrape off the graphene film layer 6 being positioned at flexible base, board 1 surface, the graphene film layer 6 being arranged in flexible base, board 1 through hole forms graphene layer 3;
6th step: utilize magnetron sputtering method, sputtering layer of metal is on flexible base, board 1 surface, and metal electrode board 4 in formation, upper metal electrode board 4 is connected with graphene layer 3, thus makes sensor.
As preferably, in the described first step: through hole is positioned at the middle part of flexible base, board 1; Flexible base, board 1 is made up of LCP material.In the 4th described step: described heating-up temperature is lower than the melt temperature of flexible base, board 1.
The embodiment of the present invention adopts organic flexible material LCP as the Intermediate substrate of temperature sensor, utilize graphene layer 3 as temperature-sensing element (device), when temperature passes to graphene layer 3 from lower metal electrode board 2 or upper metal electrode board 4, there is corresponding change in the resistance of graphene layer 3, then from lower metal electrode board 2 and upper metal electrode board 4, resistance variations is exported, reach the object measuring body surface temperature value.
More than show and describe ultimate principle of the present invention, principal character and advantage.Those skilled in the art should understand; the present invention is not by the restriction of above-mentioned specific embodiment; description in above-mentioned specific embodiment and instructions is just in order to further illustrate principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The scope of protection of present invention is defined by claims and equivalent thereof.
Claims (9)
1. have the flexibility temperature sensor from encapsulation, it is characterized in that, this temperature sensor comprises flexible base, board (1), lower metal electrode board (2), graphene layer (3) and upper metal electrode board (4); Flexible base, board is provided with through hole in (1), and graphene layer (3) is arranged in the through hole of flexible base, board (1); Upper metal electrode board (4) is fixedly connected on the upper surface of flexible base, board (1), lower metal electrode board (2) is fixedly connected on the lower surface of flexible base, board (1), and the end face of graphene layer (3) is connected with the bottom surface of upper metal electrode board (4), the bottom surface of graphene layer (3) is connected with the end face of lower metal electrode board (2).
2., according to the flexibility temperature sensor had from encapsulation according to claim 1, it is characterized in that, described through hole is positioned at the middle part of flexible base, board (1).
3. according to the flexibility temperature sensor had from encapsulation according to claim 1, it is characterized in that, described graphene layer (3) is full of the through hole of flexible base, board (1), and the upper surface flush of the upper surface of graphene layer (3) and flexible base, board (1), the lower surface of graphene layer (3) flushes with the lower surface of flexible base, board (1).
4., according to the flexibility temperature sensor had from encapsulation according to claim 1, it is characterized in that, described flexible base, board (1) is made up of LCP material.
5., according to the flexibility temperature sensor had from encapsulation according to claim 1, it is characterized in that, described flexible base, board (1) is made into through hole by laser boring.
6. according to the flexibility temperature sensor had from encapsulation according to claim 1, it is characterized in that, between the thickness of described flexible base, board (1) is 50 to 100 microns; Between the thickness of lower metal electrode board (2) is 12 to 20 microns; Upper metal electrode board (4) is formed in the upper surface of flexible base, board (1) and graphene layer (3) by magnetron sputtering method.
7. the preparation method had from the flexibility temperature sensor encapsulated according to claim 1, it is characterized in that, this preparation method comprises the following steps:
The first step: carry out laser boring to flexible base, board (1), forms through hole;
Second step: utilize laminating to be bonded with metal forming on flexible base, board (1) surface, metal forming forms lower metal electrode board (2);
3rd step: at the upper spin coating graphene oxide layer (5) of flexible base, board (1), graphene oxide layer (5) fills the through hole of full flexible base, board (1), and simultaneous oxidation graphene layer (5) covers another surface of flexible base, board (1);
4th step: carry out high-temperature heating, is reduced into graphene film layer (6) by graphene oxide layer (5);
5th step: scrape off the graphene film layer (6) being positioned at flexible base, board (1) surface, the graphene film layer (6) being arranged in flexible base, board (1) through hole forms graphene layer (3);
6th step: utilize magnetron sputtering method, sputtering layer of metal is on flexible base, board (1) surface, metal electrode board (4) in formation, upper metal electrode board (4) is connected with graphene layer (3), thus makes sensor.
8., according to the preparation method had from the flexibility temperature sensor encapsulated according to claim 7, it is characterized in that, in the described first step: through hole is positioned at the middle part of flexible base, board (1); Flexible base, board (1) is made up of LCP material.
9., according to the preparation method had from the flexibility temperature sensor encapsulated according to claim 7, it is characterized in that, in the 4th described step: described heating-up temperature is lower than the melt temperature of flexible base, board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510511210.1A CN105136325B (en) | 2015-08-19 | 2015-08-19 | It is a kind of from encapsulation temperature sensor and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510511210.1A CN105136325B (en) | 2015-08-19 | 2015-08-19 | It is a kind of from encapsulation temperature sensor and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105136325A true CN105136325A (en) | 2015-12-09 |
| CN105136325B CN105136325B (en) | 2017-09-15 |
Family
ID=54721758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510511210.1A Active CN105136325B (en) | 2015-08-19 | 2015-08-19 | It is a kind of from encapsulation temperature sensor and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105136325B (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105571738A (en) * | 2015-12-21 | 2016-05-11 | 清华大学 | Water temperature sensing device adopting woven net-shaped structure |
| CN105841836A (en) * | 2016-03-18 | 2016-08-10 | 南京邮电大学 | Novel transient temperature sensor |
| CN107655398A (en) * | 2017-09-13 | 2018-02-02 | 中国科学院深圳先进技术研究院 | A kind of stretchable flexible strain transducer of high sensitivity and preparation method thereof |
| CN108801489A (en) * | 2018-06-22 | 2018-11-13 | 苏州大学 | temperature sensor and preparation method thereof |
| CN108801535A (en) * | 2018-05-29 | 2018-11-13 | 浙江大学 | A kind of sheet-like flexible piezoresistance sensor from packaging method |
| CN109115366A (en) * | 2018-07-23 | 2019-01-01 | 放生（重庆）科技有限公司 | A kind of preparation method of ear temperature detector and ear temperature detector is prepared |
| CN110487438A (en) * | 2019-08-22 | 2019-11-22 | 中南大学 | A kind of flexibility temperature sensor of sandwich-like and preparation method thereof |
| CN110702248A (en) * | 2019-09-17 | 2020-01-17 | 江苏大学 | Thermoelectric sensor based on graphene material and preparation method thereof |
| CN113091939A (en) * | 2021-03-29 | 2021-07-09 | 哈尔滨工业大学 | Preparation method of high-sensitivity temperature sensor based on graphene/barium strontium titanate heterojunction |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103148952A (en) * | 2013-03-12 | 2013-06-12 | 上海第二工业大学 | Surface temperature test circuit based on graphene nanobelt and test method |
| CN103630254A (en) * | 2013-11-18 | 2014-03-12 | 西安电子科技大学 | Graphene temperature sensor and preparing process thereof |
| US20140103298A1 (en) * | 2012-10-15 | 2014-04-17 | The Trustees Of The Stevens Institute Of Technolog | Graphene-based films in sensor applications |
| CN104374486A (en) * | 2014-11-13 | 2015-02-25 | 中国科学院重庆绿色智能技术研究院 | Flexible temperature sensor based on graphene nanometer wall and preparing method thereof |
| CN104390720A (en) * | 2014-12-03 | 2015-03-04 | 东南大学 | Graphene oxide based capacitive temperature sensor and production method thereof |
-
2015
- 2015-08-19 CN CN201510511210.1A patent/CN105136325B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140103298A1 (en) * | 2012-10-15 | 2014-04-17 | The Trustees Of The Stevens Institute Of Technolog | Graphene-based films in sensor applications |
| CN103148952A (en) * | 2013-03-12 | 2013-06-12 | 上海第二工业大学 | Surface temperature test circuit based on graphene nanobelt and test method |
| CN103630254A (en) * | 2013-11-18 | 2014-03-12 | 西安电子科技大学 | Graphene temperature sensor and preparing process thereof |
| CN104374486A (en) * | 2014-11-13 | 2015-02-25 | 中国科学院重庆绿色智能技术研究院 | Flexible temperature sensor based on graphene nanometer wall and preparing method thereof |
| CN104390720A (en) * | 2014-12-03 | 2015-03-04 | 东南大学 | Graphene oxide based capacitive temperature sensor and production method thereof |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105571738A (en) * | 2015-12-21 | 2016-05-11 | 清华大学 | Water temperature sensing device adopting woven net-shaped structure |
| CN105841836B (en) * | 2016-03-18 | 2019-12-27 | 南京邮电大学 | Novel transient temperature sensor |
| CN105841836A (en) * | 2016-03-18 | 2016-08-10 | 南京邮电大学 | Novel transient temperature sensor |
| CN107655398A (en) * | 2017-09-13 | 2018-02-02 | 中国科学院深圳先进技术研究院 | A kind of stretchable flexible strain transducer of high sensitivity and preparation method thereof |
| CN107655398B (en) * | 2017-09-13 | 2020-06-19 | 中国科学院深圳先进技术研究院 | High-sensitivity stretchable flexible strain sensor and preparation method thereof |
| CN108801535A (en) * | 2018-05-29 | 2018-11-13 | 浙江大学 | A kind of sheet-like flexible piezoresistance sensor from packaging method |
| CN108801535B (en) * | 2018-05-29 | 2020-11-13 | 浙江大学 | Self-packaging method of sheet-shaped flexible piezoresistive sensor |
| CN108801489A (en) * | 2018-06-22 | 2018-11-13 | 苏州大学 | temperature sensor and preparation method thereof |
| CN109115366A (en) * | 2018-07-23 | 2019-01-01 | 放生（重庆）科技有限公司 | A kind of preparation method of ear temperature detector and ear temperature detector is prepared |
| CN110487438A (en) * | 2019-08-22 | 2019-11-22 | 中南大学 | A kind of flexibility temperature sensor of sandwich-like and preparation method thereof |
| CN110487438B (en) * | 2019-08-22 | 2021-05-18 | 中南大学 | Preparation method of sandwich-shaped flexible temperature sensor |
| CN110702248A (en) * | 2019-09-17 | 2020-01-17 | 江苏大学 | Thermoelectric sensor based on graphene material and preparation method thereof |
| CN110702248B (en) * | 2019-09-17 | 2020-12-18 | 江苏大学 | Thermoelectric sensor based on graphene material and preparation method thereof |
| CN113091939A (en) * | 2021-03-29 | 2021-07-09 | 哈尔滨工业大学 | Preparation method of high-sensitivity temperature sensor based on graphene/barium strontium titanate heterojunction |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105136325B (en) | 2017-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105136325A (en) | Flexible temperature sensor with self-packaging and preparation method thereof | |
| CN105136326B (en) | A kind of temperature sensor and preparation method thereof | |
| Huang et al. | High-resolution flexible temperature sensor based graphite-filled polyethylene oxide and polyvinylidene fluoride composites for body temperature monitoring | |
| JP6802597B2 (en) | Fiber temperature detection-based flexible electronic skin and its manufacturing method | |
| CN105136873B (en) | A kind of integrated sensor and preparation method thereof | |
| CN105092118A (en) | Flexible piezoresistive pressure sensor with high sensitivity, and preparing method thereof | |
| CN105092117A (en) | Piezoresistive pressure sensor and preparation method thereof | |
| JP2015111162A (en) | Manufacturing method of temperature sensor structure | |
| JP2012517012A5 (en) | ||
| Petropoulos et al. | Flexible PCB-MEMS flow sensor | |
| CN105067016B (en) | Integrated Temperature Humidity Sensor and preparation method thereof | |
| US4186368A (en) | Wide range, quick response temperature probe sensor | |
| Wu et al. | Polysilicon-based flexible temperature sensor for brain monitoring with high spatial resolution | |
| JP2004264297A (en) | Electronic thermometer | |
| CN110501086B (en) | Flexible temperature sensor and preparation method thereof | |
| Zhan et al. | Flexible multi-positional microsensors for cryoablation temperature monitoring | |
| CN109282910A (en) | Double redundancy temperature-sensing element (device) | |
| Zhang et al. | Liquid‐Metal‐Based Stretchable Dual‐Parameter Sensor for Simultaneous Detection of Deformation and Temperature | |
| CN207236780U (en) | A kind of medicinal blood flow rate detection bracelet | |
| CN206990126U (en) | A kind of quick human body temperature measurement structure | |
| CN201536040U (en) | Film insulation platinum resistor | |
| CN206905927U (en) | A kind of high-precision integrated form thermosensitive circuit that can be responded rapidly to | |
| CN112013984A (en) | Wearable flexible temperature sensor and preparation method thereof | |
| CN207503741U (en) | PTC ceramics thermistor | |
| CN207280625U (en) | A kind of electronic cigarette temperature sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |