CN105132737A - Copper alloy with high electrical conductivity - Google Patents
Copper alloy with high electrical conductivity Download PDFInfo
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- CN105132737A CN105132737A CN201510566972.1A CN201510566972A CN105132737A CN 105132737 A CN105132737 A CN 105132737A CN 201510566972 A CN201510566972 A CN 201510566972A CN 105132737 A CN105132737 A CN 105132737A
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- electrical conductivity
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Abstract
The invention relates to a copper alloy with high electrical conductivity. The copper alloy mainly comprises copper, scandium, tellurium and lanthanum-series rare earth metal, wherein the main element is copper. The alloy material is a substitute of a conventional sliver-copper alloy; the current high-conductivity copper alloy is improved; and the production cost is reduced while the product performance is guaranteed.
Description
Technical field
The invention belongs to copper alloy field, refer to a kind of high conductivity copper alloy especially.
Background technology
More than 58% of annual copper output is for electrical material field in the world, has 80% industrial silver to be for electrical field every year at China's argent.That is copper and these two kinds of metal industry fields of silver are mainly based on electrical material, but China is silver lacks country, and from the price of world market silver far above copper.And have very near similar performance with regard to these two kinds of metals in the physicals in electrical material field, particularly for index conductivity copper most important in electrician is silver 94%, conductivity is positioned at the 2nd of all metals.
How the approximation of two kinds of metals in electrical material field carrys out alternative silver for some electronic parts with the copper that price is lower, is that this area scientific research personnel is making great efforts problem always.Although more existing electrical material useful copper carrys out alternative silver, thisly substituting just simple substituting, is what to sacrifice the performance of electric product be cost.Disclose a kind of patent of high electric material of copper, tellurium rare earth without containing silver afterwards from China patent CN03135189 after, because the electric conductivity in the technical scheme of this patent exceedes the electric conductivity of the yellow gold of existing use, completely close to the electric conductivity of silver, and enrich due to the rare earth resources of China, existing silver gradually replace by this technology.
But in recent years along with country is to the protection of rare earth and restriction, the price of rare earth has risen too fast, the particularly important how improvements over the prior art just show.And in field of metallurgy, all know that the minor alteration of certain material just may have influence on the performance of product, even if the roughly formula range of this to be also us know this kind of material but the product produced really cannot reach the major cause of the performance of original product.
Summary of the invention
The object of the invention is to improve existing copper alloy technology, to realize, ensureing that the specific conductivity of Cu alloy material can substitute outside silver, reducing the production cost of material.
The present invention is achieved by the following technical solutions:
A kind of high conductivity copper alloy, its composition is by weight percentage, and aluminium 0.4-0.8%, scandium 0.01-0.0-3%, tellurium 0.05%-1.2%, lanthanide rare metal 0.03%-0.05%, surplus is copper.
It is further preferred that its composition is by weight percentage: aluminium 0.42%, scandium 0.03%, lanthanide rare metal 0.05%, tellurium 0.55%, surplus is copper.
The invention has the beneficial effects as follows:
It is high that the Cu alloy material produced by the technical program has specific conductivity, and performance is good, and relative production cost is low, and its product performance can substitute silver completely, and this copper alloy can augmented performance and radiating effect in semiconductor applications.
Embodiment
Below the present invention is described in detail by specific embodiment.
In the present invention, the refining process for copper alloy requires not strict, and the refining mode of prior art all can be produced, and technique threshold is low.
The control of raw-material quality and each group component is the most important thing is in the technical program, the performance of small change to final copper alloy all has a significant impact, identical with the technical scheme of China patent CN03135189 at other process aspect, uniquely within the scope of stage casing 900-700 DEG C of cooling after aluminium alloy casting, control cooling rate, maintain 20-25 DEG C of constant temperature cooling, be beneficial to the compacted of each element in copper alloy and turn use into, realize the arrangement of each first cellulose crystal.
Compare with Kufil with the copper alloy that this technology is produced, its specific conductivity exceeds more than 8%, thermal conductivity exceeds more than 15%, tensile strength exceeds more than 5%, cutting ability is better than Kufil, electrical erosion resistance can be good, can not produce silver-colored cadmium steam polluting environment, crystal grain queueing discipline under electron microscope because of arcing.
Specific embodiment and performance are shown in Table 1.
High conductivity copper alloy (table 1)
Note: be above 900-700 DEG C with 22 DEG C/h of cycle annealings after take off data.
Claims (2)
1. a high conductivity copper alloy, is characterized in that: its composition is by weight percentage: aluminium 0.4-0.8%, scandium 0.01-0.0-3%, tellurium 0.05%-1.2%, and lanthanide rare metal 0.03%-0.05%, surplus is copper.
2. a kind of high conductivity copper alloy according to claim 1, is characterized in that: its composition is by weight percentage: aluminium 0.42%, scandium 0.03%, lanthanide rare metal 0.05%, and tellurium 0.55%, surplus is copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566972.1A CN105132737A (en) | 2015-09-08 | 2015-09-08 | Copper alloy with high electrical conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566972.1A CN105132737A (en) | 2015-09-08 | 2015-09-08 | Copper alloy with high electrical conductivity |
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| CN105132737A true CN105132737A (en) | 2015-12-09 |
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| CN201510566972.1A Pending CN105132737A (en) | 2015-09-08 | 2015-09-08 | Copper alloy with high electrical conductivity |
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| CN (1) | CN105132737A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106167859A (en) * | 2016-08-22 | 2016-11-30 | 吴雅萍 | A kind of high conductivity copper alloy |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102864326A (en) * | 2012-09-10 | 2013-01-09 | 顾建 | High-conduction copper alloy material |
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2015
- 2015-09-08 CN CN201510566972.1A patent/CN105132737A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102864326A (en) * | 2012-09-10 | 2013-01-09 | 顾建 | High-conduction copper alloy material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106167859A (en) * | 2016-08-22 | 2016-11-30 | 吴雅萍 | A kind of high conductivity copper alloy |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151209 |