CN105112714A - High-conductivity copper alloy material - Google Patents
High-conductivity copper alloy material Download PDFInfo
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- CN105112714A CN105112714A CN201510567014.6A CN201510567014A CN105112714A CN 105112714 A CN105112714 A CN 105112714A CN 201510567014 A CN201510567014 A CN 201510567014A CN 105112714 A CN105112714 A CN 105112714A
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Abstract
The invention relates to a high-conductivity copper alloy material which mainly comprises copper, silver, lithium, tellurium and lanthanide rare earth metal, wherein copper is a main element. The copper alloy material is a substitute for a traditional silver-copper alloy, improves the conventional high-conductivity copper alloy, and reduces the production cost while ensuring the product performance.
Description
Technical field
The invention belongs to copper alloy field, refer to a kind of high conductivity Cu alloy material especially.
Background technology
More than 58% of annual copper output is for electrical material field in the world, has 80% industrial silver to be for electrical field every year at China's argent.That is copper and these two kinds of metal industry fields of silver are mainly based on electrical material, but China is silver lacks country, and from the price of world market silver far above copper.And have very near similar performance with regard to these two kinds of metals in the physicals in electrical material field, particularly for index conductivity copper most important in electrician is silver 94%, conductivity is positioned at the 2nd of all metals.
How the approximation of two kinds of metals in electrical material field carrys out alternative silver for some electronic parts with the copper that price is lower, is that this area scientific research personnel is making great efforts problem always.Although more existing electrical material useful copper carrys out alternative silver, thisly substituting just simple substituting, is what to sacrifice the performance of electric product be cost.Disclose a kind of patent of high electric material of copper, tellurium rare earth without containing silver afterwards from China patent CN03135189 after, because the electric conductivity in the technical scheme of this patent exceedes the electric conductivity of the yellow gold of existing use, completely close to the electric conductivity of silver, and enrich due to the rare earth resources of China, existing silver gradually replace by this technology.
But in recent years along with country is to the protection of rare earth and restriction, the price of rare earth has risen too fast, the particularly important how improvements over the prior art just show.And in field of metallurgy, all know that the minor alteration of certain material just may have influence on the performance of product, even if the roughly formula range of this to be also us know this kind of material but the product produced really cannot reach the major cause of the performance of original product.
Summary of the invention
The object of the invention is to improve existing copper alloy technology, to realize, ensureing that the specific conductivity of Cu alloy material can substitute outside silver, reducing the production cost of material.
The present invention is achieved by the following technical solutions:
A kind of High-conduction copper alloy material, its composition is by weight percentage: silver-colored 0.03-0.05%, lithium 0.01-0.03%, tellurium 0.05%-1.2%, and lanthanide rare metal 0.03%-0.08%, all the other are copper.
Its composition is silver 0.031%, 0.016% by weight percentage, and lanthanide rare metal 0.08%, tellurium 0.52%, all the other are copper.
The invention has the beneficial effects as follows:
It is high that the Cu alloy material produced by the technical program has electric conductivity, and performance is good, and relative production cost is low, and its product performance can substitute silver completely, and this copper alloy can augmented performance and radiating effect in semiconductor applications.
Embodiment
Below the present invention is described in detail by specific embodiment.
In the present invention, the refining process for copper alloy requires not strict, and the refining mode of prior art all can be produced, and technique threshold is low.
The control of raw-material quality and each group component is the most important thing is in the technical program, the performance of small change to final copper alloy all has a significant impact, identical with the technical scheme of China patent CN03135189 at other process aspect, uniquely within the scope of stage casing 900-700 DEG C of cooling after aluminium alloy casting, control cooling rate, maintain 20-25 DEG C of constant temperature cooling, be beneficial to the compacted of each element in copper alloy and turn use into, realize the arrangement of each first cellulose crystal.
The copper alloy produced by this technology is compared with other Kufil, its specific conductivity exceeds more than 8%, thermal conductivity exceeds more than 15%, tensile strength exceeds more than 5%, cutting ability is better than other Kufil, electrical erosion resistance can be good, can not produce silver-colored cadmium steam polluting environment, crystal grain queueing discipline under electron microscope because of arcing.
Specific embodiment and performance are shown in Table 1.
High-conduction copper alloy material (table 1)
Note: be above 900-700 DEG C with 22 DEG C/h of cycle annealings after take off data.
Claims (2)
1. a High-conduction copper alloy material, is characterized in that: its composition is by weight percentage: silver-colored 0.03-0.05%, lithium 0.01-0.03%, tellurium 0.05%-1.2%, and lanthanide rare metal 0.03%-0.08%, all the other are copper.
2. a kind of High-conduction copper alloy material according to claim 1, is characterized in that: its composition is silver 0.031%, 0.016% by weight percentage, and lanthanide rare metal 0.08%, tellurium 0.52%, all the other are copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510567014.6A CN105112714A (en) | 2015-09-08 | 2015-09-08 | High-conductivity copper alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510567014.6A CN105112714A (en) | 2015-09-08 | 2015-09-08 | High-conductivity copper alloy material |
Publications (1)
| Publication Number | Publication Date |
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| CN105112714A true CN105112714A (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510567014.6A Pending CN105112714A (en) | 2015-09-08 | 2015-09-08 | High-conductivity copper alloy material |
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| CN (1) | CN105112714A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1544672A (en) * | 2003-11-11 | 2004-11-10 | 成都精作科技发展有限公司 | Copper alloy material having high heat conductivity |
| CN101171349A (en) * | 2005-06-08 | 2008-04-30 | 株式会社神户制钢所 | Copper alloy, copper alloy plate, and process for producing the same |
| CN102383002A (en) * | 2011-10-26 | 2012-03-21 | 云南新铜人实业有限公司 | Copper-based alloy for cable shielding |
| CN102851528A (en) * | 2012-09-10 | 2013-01-02 | 任静儿 | High-conductivity copper alloy |
| CN103824833A (en) * | 2012-11-16 | 2014-05-28 | 吕传盛 | Copper alloy wire used for packaging of semiconductor |
-
2015
- 2015-09-08 CN CN201510567014.6A patent/CN105112714A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1544672A (en) * | 2003-11-11 | 2004-11-10 | 成都精作科技发展有限公司 | Copper alloy material having high heat conductivity |
| CN101171349A (en) * | 2005-06-08 | 2008-04-30 | 株式会社神户制钢所 | Copper alloy, copper alloy plate, and process for producing the same |
| CN102383002A (en) * | 2011-10-26 | 2012-03-21 | 云南新铜人实业有限公司 | Copper-based alloy for cable shielding |
| CN102851528A (en) * | 2012-09-10 | 2013-01-02 | 任静儿 | High-conductivity copper alloy |
| CN103824833A (en) * | 2012-11-16 | 2014-05-28 | 吕传盛 | Copper alloy wire used for packaging of semiconductor |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151202 |