CN105132691B - A kind of method that metallic copper is extracted from waste printed circuit board - Google Patents
A kind of method that metallic copper is extracted from waste printed circuit board Download PDFInfo
- Publication number
- CN105132691B CN105132691B CN201510610773.6A CN201510610773A CN105132691B CN 105132691 B CN105132691 B CN 105132691B CN 201510610773 A CN201510610773 A CN 201510610773A CN 105132691 B CN105132691 B CN 105132691B
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- negative electrode
- printed circuit
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 40
- 239000010949 copper Substances 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000002699 waste material Substances 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000010936 titanium Substances 0.000 claims abstract description 10
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 10
- 239000003792 electrolyte Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 238000005336 cracking Methods 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 238000004458 analytical method Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- 239000005864 Sulphur Substances 0.000 claims description 4
- 238000000197 pyrolysis Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000001757 thermogravimetry curve Methods 0.000 claims description 3
- 230000015556 catabolic process Effects 0.000 claims description 2
- 238000004587 chromatography analysis Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000006731 degradation reaction Methods 0.000 claims description 2
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 238000002411 thermogravimetry Methods 0.000 claims description 2
- 238000010792 warming Methods 0.000 claims description 2
- 238000007707 calorimetry Methods 0.000 claims 1
- 238000013211 curve analysis Methods 0.000 claims 1
- 238000004817 gas chromatography Methods 0.000 claims 1
- 238000005868 electrolysis reaction Methods 0.000 abstract description 8
- 239000003365 glass fiber Substances 0.000 abstract description 4
- 238000009776 industrial production Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 16
- 239000002253 acid Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000002386 leaching Methods 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 244000005700 microbiome Species 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000011953 bioanalysis Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002240 furans Chemical class 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000007885 magnetic separation Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001698 pyrogenic effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Processing Of Solid Wastes (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
The present invention relates to a kind of method that metallic copper is extracted from waste printed circuit board, it comprises the following steps：（a）The superficial layer of waste printed circuit board is separated from its substrate；（b）Be negative electrode using the superficial layer as anode, titanium plate, copper-bath be electrolyte, connect dc source after formed open circuit electrolytic cell；（c）The spacing of regulation anode and negative electrode is 2 ~ 12cm, direct current power source voltage is 1 ~ 5V, the temperature of copper-bath is 25 ~ 50 DEG C, connects circuit and is electrolysed 0.5 ~ 5h, collects the copper obtained on negative electrode.Be negative electrode using superficial layer as anode, titanium plate, copper-bath be that electrolyte forms electrolytic cell, and accurately control electrolytic parameter, high-purity volume copper can be obtained on negative electrode, can be directly used for industrial production；And the copper-bath used can recycle, secondary pollution will not be caused to environment, because waste and old circuit board need not be crushed, not only simplify electrolysis process, the property of nonmetallic materials such as glass fibre is not damaged.
Description
Technical field
The invention belongs to material recovery field, is related to a kind of method for extracting metallic copper, and in particular to a kind of from waste and old print
The method that metallic copper is extracted in brush wiring board.
Background technology
Printed substrate（Printed circuit Bonds, PCBs）It is the base by resin and glass fiber material preparation
Copper rivet and copper foil and electronic component on plate, substrate etc. are formed.Printed substrate be widely used in information, communication,
The fields such as electronics, military affairs, space flight.With the continuous development of scientific technology and every field demand printed substrate continuous expansion
Greatly, the quantity of caused waste printed circuit board also sharp increase.A variety of in one side waste printed circuit board poisonous have
Evil material has to pass through recycling；Heavy metal element in another aspect waste printed circuit board substrate has high money again
Source recycles value, is a kind of potential secondary resource.Therefore, rationally effective recovery waste printed circuit board to economical and
Environmental protection suffers from important meaning.
At present, the technology for extracting metal from old circuit board both at home and abroad is mainly four kinds, i.e. mechanical treatment technology, Re Chu
Reason technology, hydrometallurgical technology and biotechnology.
Mechanical treatment technology mainly using physical method, realizes waste printed circuit board metal and non-gold by broken first
The dissociation of category, then metal and the difference of nonmetallic property contained by, are carried out these materials using different sorting methods
Separation.The mechanical treatment technology of discarded circuit board has：Disassemble, crush, pneumatic separating, magnetic separation, screening, vortex sorting, electric separation etc..
The method can preferably separate to metal with nonmetallic realization, and its flow is simple, to environment without destruction, but will be to useless during sorting
Old printed substrate substrate is crushed, and the purity of gained each component is not high after sorting, it is impossible to is directly recycled by industry.
Hydrometallurgical technology is that waste and old circuit board is handled with the acid of strong oxidizing property, then purifies the gold in leachate
Belong to ion, metal is reclaimed using replacing or being electrolysed handling process.The shortcomings that this method is that the strong oxidizers such as the nitric acid used can be
NO is discharged in processing procedureX, environment is polluted, and a large amount of waste liquids are generated, easily cause secondary pollution.In addition, with nitric acid, sulphur
When the strong acid such as acid are to leach the metal in substrate, on the one hand substrate nonmetallic materials can occur to aoxidize and be destroyed；On the other hand
The molecular structure that the metal ion of dissolving can also destroy nonmetallic materials on substrate makes the reduction of nonmetallic materials performance.
Heat treatment technics is that old circuit board is placed in high-temperature smelting pot to burn, and removes the inorganic components such as resin, Zhi Houzai
Utilize the noble metal in pyrogenic process and electrolysis recovery lime-ash.Disadvantage of this method is that：It can produce in burning process and largely also have
The smog of the noxious materials such as bioxin, furans and Polychlorinated biphenyls, secondary pollution and personal safety hidden danger be present.
Biotechnology is a kind of technology for carrying out specific absorption or cooperation to special metal ion using microorganism.This side
Method technique is simple, running cost is low, easy to operate, but the cultivation fee of microorganism is longer with larger and process cycle.At present, bioanalysis
Correlative study still in laboratory stage.
Hydrometallurgical technology and heat treatment technics grow up on the basis of metalliferous mineral smelting, technology more into
Ripe, cost is relatively low, and recovery metal purity is higher.Relative to heat treatment technics, hydrometallurgical technology needs to consume a large amount of chemistry examinations
The leaching of row metal is entered in agent, but technique is simply ripe, does not produce a large amount of toxic and harmful gas, and energy resource consumption is less, appropriate behaviour
Make that the pollution to environment can be greatly reduced.For hydrometallurgical technology, the key problem in technology for extracting copper is the leaching aspect of copper
And purity problem of copper of extraction etc..At present, the technology of conventional wet underwater welding copper is relatively cumbersome, is directed not only to the leaching of complexity
The configuration of copper system solution, can also be in extraction copper such as the selection and consumption of complexing agent, strong oxidizer, extractant, strippant
During produce a large amount of toxic and harmful gas pollution environment.
The content of the invention
One kind is provided the invention aims to overcome the deficiencies in the prior art gold is extracted from waste printed circuit board
Belong to the method for copper.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：One kind extracts metal from waste printed circuit board
The method of copper, it comprises the following steps：
（a）The superficial layer of waste printed circuit board is separated from its substrate；
（b）Be negative electrode using the superficial layer as anode, titanium plate, copper-bath be electrolyte, connect dc source after shape
Into the electrolytic cell of open circuit；
（c）The spacing of regulation anode and negative electrode is 2 ~ 12cm, direct current power source voltage is 1 ~ 5V, the temperature of copper-bath is
25 ~ 50 DEG C, connect circuit and be electrolysed 0.5 ~ 5h, collect the copper obtained on negative electrode.
Optimally, the concentration of the copper-bath is 0.1 ~ 1mol/L.
Optimally, the copper-bath is obtained by the copper and sulfuric acid reaction obtained on negative electrode.
Because above-mentioned technical proposal is used, the present invention has following advantages compared with prior art：The present invention is from waste and old print
The method that metallic copper is extracted in brush wiring board using superficial layer as anode, titanium plate is negative electrode, copper-bath is that electrolyte forms electricity
Xie Chi, and electrolytic parameter is accurately controlled, high-purity volume copper can be obtained on negative electrode, can be directly used for industrial production；And make
Copper-bath can recycle, and will not cause secondary pollution to environment, because waste and old circuit board need not be crushed,
Not only simplify electrolysis process, the property of nonmetallic materials such as glass fibre is not damaged, expanded significantly secondly
Secondary utilization scope.
Embodiment
The method that the present invention extracts metallic copper from waste printed circuit board, it comprises the following steps：（a）By waste and old printing
The superficial layer of wiring board separates from its substrate；（b）Be negative electrode using the superficial layer as anode, titanium plate, copper-bath be electricity
Liquid is solved, breaking electrolytic cell is formed after connecting dc source；（c）The spacing for adjusting anode and negative electrode is 2 ~ 12cm, dc source
Voltage is 1 ~ 5V, the temperature of copper-bath is 25 ~ 50 DEG C, connects circuit and is electrolysed 0.5 ~ 5h, collects the copper obtained on negative electrode i.e.
Can.Be negative electrode using superficial layer as anode, titanium plate, copper-bath be that electrolyte forms electrolytic cell, and accurately control electrolytic parameter,
High-purity volume copper can be obtained on negative electrode, can be directly used for industrial production；And the copper-bath used can be circulated and made
With will not cause secondary pollution to environment, because waste and old circuit board need not be crushed, not only simplify electrolysis process, also make
The property of nonmetallic materials such as glass fibre is not damaged, and has expanded its secondary utilization scope significantly.Copper-bath
Concentration is preferably 0.1 ~ 1mol/L, and copper-bath is obtained by the copper and sulfuric acid reaction obtained on negative electrode, can so save sulphur
The dosage of sour copper, it is cost-effective, reduce the destruction to environment.
Step（a）In, it is by the specific method that the superficial layer of waste printed circuit board separates from its substrate：（S1）Take useless
Abandon wiring board and carry out differential scanning calorimetry respectively（DSC）And thermogravimetric analysis（TGA）Test analyzes curve corresponding to obtaining, it is determined that
Cracking temperature region；It should be noted that cracking temperature region needs to carry out comprehensive analysis according to DSC curve and TGA curves, it is first
Component or the temperature range of material fast degradation in discarded circuit board are determined first with TGA curves, then according on DSC curve
First main peak and second main peak determine cracking temperature region（Cracking temperature region is to second at first main peak peak value
Main peak initially forms temperature range corresponding to place, preferably 300 ~ 450 DEG C）；（S2）Tube furnace is warming up to the cracking temperature
Any temperature in region, is continuously passed through inert gas（Inert gas flow can be adjusted according to actual process, as long as really
It is not oxidized to protect discarded circuit board）, sample is then pushed away into boat feeding effectively heating warm area and carries out insulation 10 ~ 60 minutes, directly
Warpage occurs to metal level；（S3）Collection vessel is connected in the tube furnace exit, takes the gas discharged in pyrolytic process to enter
Promoting the circulation of qi analysis of hplc, recovery scheme is determined according to gas chromatographic analysis result, recycled（Caused by pyrolytic process
Pyrolysis gas and pyrolysis oil can be recovered, and carry out secondary use to make the energy or raw material, utilized with reaching the maximum of resource
Change）；（S4）After the discarded circuit board cooling after pyrolysis, glass fabric and metal level are peeled off；The surface so obtained
Layer has higher quality, is advantageous to improve the yield of metallic copper.
The present invention is further described below in conjunction with embodiment.
Embodiment 1
The present embodiment provides a kind of method that metallic copper is extracted from waste printed circuit board, and it comprises the following steps：
（a）The superficial layer of waste printed circuit board is separated from its substrate；
（b）Be negative electrode using the superficial layer as anode, titanium plate, 0.1mol/L copper-baths be electrolyte, connect direct current
The electrolytic cell of open circuit is formed after power supply；
（c）The spacing of regulation anode and negative electrode is 12cm, the temperature of direct current power source voltage 1V, copper-bath is 50
DEG C, circuit electrolysis 5h is connected, collects the copper obtained on negative electrode；Because electrolysis time is longer, treat that copper-bath concentration becomes
After dilute, the copper that power taking solution obtains is added in sulfuric acid, is thermally formed copper-bath, is added in thinning previous solu, makes its dense
Degree keeps being about 0.1mol/L.
Embodiment 2
The present embodiment provides a kind of method that metallic copper is extracted from waste printed circuit board, and it comprises the following steps：
（a）The superficial layer of waste printed circuit board is separated from its substrate；
（b）Be negative electrode using the superficial layer as anode, titanium plate, 1mol/L copper-baths be electrolyte, connect direct current
The electrolytic cell of open circuit is formed behind source；
（c）The spacing of regulation anode and negative electrode is 2cm, the temperature of direct current power source voltage 5V, copper-bath is 25 DEG C,
Circuit electrolysis 0.5h is connected, collects the copper obtained on negative electrode.
Embodiment 3
The present embodiment provides a kind of method that metallic copper is extracted from waste printed circuit board, and it comprises the following steps：
（a）The superficial layer of waste printed circuit board is separated from its substrate；
（b）Be negative electrode using the superficial layer as anode, titanium plate, 0.5mol/L copper-baths be electrolyte, connect direct current
The electrolytic cell of open circuit is formed after power supply；
（c）The spacing of regulation anode and negative electrode is 5cm, the temperature of direct current power source voltage 3V, copper-bath is 30 DEG C,
Circuit electrolysis 2h is connected, collects the copper obtained on negative electrode.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is made, it should all be included within the scope of the present invention.
Claims (3)
- A kind of 1. method that metallic copper is extracted from waste printed circuit board, it is characterised in that it comprises the following steps：（a）The superficial layer of waste printed circuit board is separated from its substrate；（b）Be negative electrode using the superficial layer as anode, titanium plate, copper-bath be electrolyte, connect formed after dc source it is disconnected The electrolytic cell on road；（c）The spacing of regulation anode and negative electrode is 2 ~ 12cm, direct current power source voltage is 1 ~ 5V, the temperature of copper-bath be 25 ~ 50 DEG C, connect circuit and be electrolysed 0.5 ~ 5h, collect the copper obtained on negative electrode；Step（a）In, the superficial layer of waste printed circuit board is separated from its substrate and comprised the following steps：（S1）Take discarded circuit board carry out differential scanning calorimetry respectively and thermogravimetric analysis test to obtain corresponding to analysis curve, really Determine cracking temperature region：Comprehensive analysis is carried out according to differential calorimetry curve and thermal gravimetric analysis curve, first with the heat Weight analysis curve determines component or the temperature range of material fast degradation in discarded circuit board, then according to the differential scanning amount It is defined as the cracking temperature section to second main peak place of initially forming at first main peak peak value on heating curve；（S2）Tube furnace is warming up to any temperature in the cracking temperature region, is continuously passed through inert gas, then will examination Sample pushes away boat feeding effectively heating warm area and carries out insulation 10 ~ 60 minutes, until warpage occurs for metal level；（S3）Collection vessel is connected in the tube furnace exit, takes the gas discharged in pyrolytic process to carry out gas-chromatography point Analysis, determines recovery scheme according to gas chromatographic analysis result, is recycled；（S4）After the discarded circuit board cooling after pyrolysis, glass fabric and metal level are peeled off.
- 2. the method according to claim 1 that metallic copper is extracted from waste printed circuit board, it is characterised in that：The sulphur The concentration of sour copper solution is 0.1 ~ 1mol/L.
- 3. the method according to claim 1 that metallic copper is extracted from waste printed circuit board, it is characterised in that：The sulphur Sour copper solution is obtained by the copper and sulfuric acid reaction obtained on negative electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510610773.6A CN105132691B (en) | 2015-09-23 | 2015-09-23 | A kind of method that metallic copper is extracted from waste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510610773.6A CN105132691B (en) | 2015-09-23 | 2015-09-23 | A kind of method that metallic copper is extracted from waste printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105132691A CN105132691A (en) | 2015-12-09 |
| CN105132691B true CN105132691B (en) | 2018-02-13 |
Family
ID=54718255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510610773.6A Active CN105132691B (en) | 2015-09-23 | 2015-09-23 | A kind of method that metallic copper is extracted from waste printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105132691B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106676577B (en) * | 2017-02-06 | 2019-03-22 | 中国科学院过程工程研究所 | A method of recycling copper from waste and old circuit board |
| CN112439521B (en) * | 2020-11-02 | 2022-08-16 | 安徽瀚中菲欧新材料有限公司 | Copper recovery device of waste circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103388160A (en) * | 2013-07-19 | 2013-11-13 | 北京科技大学 | Method for preparation of ultrafine copper powder by waste circuit board copper dissolution-electrodeposition combined method |
-
2015
- 2015-09-23 CN CN201510610773.6A patent/CN105132691B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103388160A (en) * | 2013-07-19 | 2013-11-13 | 北京科技大学 | Method for preparation of ultrafine copper powder by waste circuit board copper dissolution-electrodeposition combined method |
Non-Patent Citations (2)
| Title |
|---|
| 悬浮电解法回收废旧电子印刷线路板中的铜;王哲 等;《环境工程学报》;20100131;第4卷(第1期);195-198 * |
| 电化学方法回收废旧电路板制备高强高纯铜箔;邓姝皓 等;《稀有金属》;20150814;1.1节和表1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105132691A (en) | 2015-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Zhang et al. | Recent advances in pretreating technology for recycling valuable metals from spent lithium-ion batteries | |
| He et al. | A critical review of current technologies for the liberation of electrode materials from foils in the recycling process of spent lithium-ion batteries | |
| Qiu et al. | Recovering full metallic resources from waste printed circuit boards: A refined review | |
| Li et al. | Overview of the recycling technology for copper-containing cables | |
| Sohaili et al. | A review on printed circuit board recycling technology | |
| CN104028530B (en) | The processing method of waste and old circuit board | |
| CN107653378A (en) | The recovery method of valuable metal in a kind of waste and old nickel cobalt manganese lithium ion battery | |
| CN100480184C (en) | Selective volatilization recovery process for waste zinc-manganese battery | |
| JP2013544964A (en) | The present application is an application number 201010506134.2 filed with the Chinese Patent Office on October 12, 2010, entitled “Method and facility for recovering precious metal from precious metal electronic waste”. The priority of the Chinese patent application "" is hereby incorporated by reference in its entirety. | |
| CN104889140B (en) | A kind of processing method of waste printed circuit board | |
| CN106941198A (en) | A kind of method that utilization thermal cracking reclaims lithium ion battery discarded object | |
| CN104328281A (en) | Method for efficient separation and recycling of precious metals in waste circuit board | |
| Meng et al. | Separation of metals from metal-rich particles of crushed waste printed circuit boards by low-pressure filtration | |
| CN107083484A (en) | A kind of method that metal is reclaimed from waste lithium cell | |
| CN106048231A (en) | Method for recovering tantalum, silver, nickel and iron from waste tantalum capacitor | |
| CN105132691B (en) | A kind of method that metallic copper is extracted from waste printed circuit board | |
| US20220267879A1 (en) | Method for whole component microwave fast digestion and precious metal extraction from ionic liquid of waste circuit board | |
| Mitrasinovic et al. | Recovery of Cu and valuable metals from E-waste using thermal plasma treatment | |
| CN104388987A (en) | Method for preparing copper powder from metal powder of waste printed circuit boards by means of electrolysis | |
| CN105969992A (en) | Method for recycling fine tin from waste circuit board | |
| CN108963370A (en) | Waste lithium cell handles recovery method | |
| CN107475538A (en) | The method for reclaiming valuable metal in waste and old cobalt acid lithium battery positive electrode with citric acid and sodium thiosulfate | |
| JP4819032B2 (en) | Processing equipment for copper etching waste liquid containing hydrogen peroxide | |
| Vieceli et al. | Recycling of lithium-ion batteries: Effect of hydrogen peroxide and a dosing method on the leaching of LCO, NMC oxides, and industrial black mass | |
| CN105714333A (en) | Method for recycling soldering tin from waste circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231128 Address after: Building 8, No. 1 and No. 2, No. 999 Haifeng North Road, Cidong Binhai District, Longshan Town, Cixi City, Ningbo City, Zhejiang Province, 315100 Patentee after: NINGBO HENGCHUANG ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Patentee after: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Patentee after: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES Address before: 315311, No.1 and No.2, Building 8, No. 999 Haifeng North Road, Cidong Binhai District, Longshan Town, Cixi City, Ningbo City, Zhejiang Province Patentee before: NINGBO HENGCHUANG ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Patentee before: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. |