CN105120634A - High-conductivity radiator - Google Patents
High-conductivity radiator Download PDFInfo
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- CN105120634A CN105120634A CN201510559606.3A CN201510559606A CN105120634A CN 105120634 A CN105120634 A CN 105120634A CN 201510559606 A CN201510559606 A CN 201510559606A CN 105120634 A CN105120634 A CN 105120634A
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Abstract
The invention relates to a radiator, in particular, a high-conductivity radiator. The high-conductivity radiator comprises a plurality of radiating units; the radiating unit includes flexible graphite sheets, thermal conductive connection fasteners and thermal conductive plastic supports, wherein a plurality of flexible graphite sheets and thermal conductive connection fasteners are adopted, the thermal conductive connection fasteners are installed between the flexible graphite sheets, and the flexible graphite sheets are installed on the thermal conductive plastic supports. According to the high-conductivity radiator of the invention, the flexible graphite sheets, the thermal conductive connection fasteners and the thermal conductive plastic are used in combination, and therefore, material cost can be greatly decreased, and thermal conduction and heat dissipation effects can be improved, and defects of electric leakage of graphite as well as large weight and serious pollution of copper and aluminum materials can be eliminated; the heat dissipation effects and safety factors of high-altitude application fields can greatly improved; and the problem of high possibility of being plugged of a water tank air conditioning radiator which is caused by difficulty in washing which is further caused by excessively high density of aluminum materials can be completely solved. The high-conductivity radiator has an electric leakage-prevention function and a waterproof function. The high-conductivity radiator is a revolutionarily novel radiator.
Description
Technical field
The present invention relates to a kind of radiator, be specifically related to a kind of high conduction heat radiator.
Background technology
At present, the mode of domestic heat conduction and heat radiation mode main still dispel the heat with materials such as copper, aluminium alloy, heat-conducting plastic potteries heat conduction and air-cooled forced heat radiation, or use graphite material heat radiation.But pure graphite material is too expensive unsuitable shaping, and application structure is difficult, there will be the problems such as conduction electric leakage for electronic product.Use cheap flexible graphite platelet to be faced with shaping heat radiation difficult, limitation is used for heat-conducting pad, is difficult to form powerful radiator.
Albronze heat radiation is mainly by dispelling the heat with air circulation, and source material is expensive and heat transfer efficiency is not very high, and very large to the pollution of environment heavy metal, energy waste is large, is used in electronic product and easily leaks electricity, and heavier, and high-altitude uses easily to drop and hurts sb.'s feelings.
Although heat-conducting plastic or common plastics are anticreep in electronic radiation application, radiating efficiency is extremely low, and cost is also lower.Pottery can anticreep and heat conductivility better, but the high firing ceramics of density quality must be used can to reach this effect.Shortcoming is unsuitable shaping, and cost is high.Graphite heat conducting radiating effect also exceeds 3-6 doubly than copper aluminium, is best heat radiation Heat Conduction Material, but is used in electric equipment products and easily leaks electricity dangerous, use high purity graphite material to be difficult to again shaping, and cost is also high.Flexible graphite platelet is cheaply cheap, but is difficult to do powerful radiator structure, and reason is flexible graphite platelet pliability extreme difference, very easily damages fractureing or shaking disconnected.
Summary of the invention
The technical problem to be solved in the present invention is the deficiency how overcoming prior art existence, aims to provide a kind of high conduction heat radiator.
Technical solution of the present invention is: a kind of high conduction heat radiator, comprise several heat-sink units, described heat-sink unit comprises flexible graphite platelet, heat conduction connects securing member and heat-conducting plastic supports composition, described flexible graphite platelet, heat conduction connection securing member have several, described heat conduction connects securing member and is arranged between described flexible graphite platelet, and described flexible graphite platelet is arranged on heat-conducting plastic and supports.
Further, the present invention also comprises solenoid coil, and described solenoid coil connects securing member through described flexible graphite platelet and heat conduction, and described solenoid coil is screwed.Described solenoid coil can replace by lead screw.
Further, heat-conducting plastic of the present invention is supported for two, lays respectively at the both sides of flexible graphite platelet, and described heat-conducting plastic is provided with groove in supporting, card and at groove about described flexible graphite platelet.
Further, the bottom of flexible graphite platelet of the present invention can be provided with fastening balance plate, and described fastening balance plate is arranged in groove.
Further, heat-sink unit of the present invention is at least one.
Further, heat conduction of the present invention connects securing member and can be high purity graphite pad or copper backing or aluminium backing.
Further, the present invention also comprises the application of a kind of high conduction heat radiator on light fixture.
Further, the present invention also comprises the application of a kind of high conduction heat radiator at automobile radiating water tank.
Further, the present invention also comprises the application of a kind of high conduction heat radiator at radiator heat collector.
Further, the present invention also comprises the application of a kind of high conduction heat radiator on electronics.
Further, heat-sink unit of the present invention comprises flexible graphite platelet, heat conduction connects securing member and heat-conducting plastic supports composition, described flexible graphite platelet has several, described heat conduction connects securing member and heat-conducting plastic support is positioned at the described flexible graphite platelet left and right sides, described heat conduction connects securing member and heat-conducting plastic support is equipped with groove, and described flexible graphite platelet is arranged on heat-conducting plastic support and heat conduction connects on the groove of securing member.
The present invention use heat conduction connect securing member, flexible graphite and heat-conducting plastic combine, greatly reduce material cost, improve heat conduction and heat radiation effect, and compensate for graphite electric leakage and copper aluminium material weight too heavy/pollute weight defect.The present invention has taken into full account the defect of existing radiator; By by the cheapness of flexible graphite, high heat conduction, thermal diffusivity and sealing property; Simultaneously obtain a kind of high conduction heat radiator by the unsuitable conductivity of high purity graphite high-termal conductivity, heat radiation plastics and high strength.Present invention greatly enhances radiating effect, reduce product weight by flexible graphite and the combination of heat radiation plastics, improve the coefficient of safety of high-altitude site of deployment, also there is function that is anticreep, waterproof, greatly reduce use cost.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described.
Fig. 1 is the overall structure schematic diagram of the embodiment of the present invention;
Fig. 2 is embodiment of the present invention application schematic diagram;
Fig. 3 is the another kind of embodiment schematic diagram of the present invention;
Fig. 4 is the third embodiment schematic diagram of the present invention;
Fig. 5 is the present invention's the 4th kind of embodiment schematic diagram;
Embodiment
Referring to accompanying drawing, describe a kind of high conduction heat radiator of the present invention in detail.
As shown in Figure 1, a kind of high conduction heat radiator, comprises several heat-sink units A, and described heat-sink unit A is one.
Described heat-sink unit A comprises flexible graphite platelet, the heat-conducting plastic of high purity graphite pad and outside supports composition, described heat-sink unit A is from top to bottom followed successively by the first flexible graphite platelet 1, first high purity graphite pad 2, second high purity graphite pad 3 and the second flexible graphite platelet 4, described first flexible graphite platelet 1, first high purity graphite pad 2, second high purity graphite pad 3 and the second flexible graphite platelet 4 are gone here and there together by screw 5, described solenoid coil 5 is fastening by bolt 51, ensures firmly solid.Above-mentioned heat-conducting plastic supports available common plastics and replaces.
It is two that described heat-conducting plastic supports 6, lay respectively at the both sides of described first flexible graphite platelet 1 and the second flexible graphite platelet 4, described heat-conducting plastic supports in 6 and is provided with groove 61, described first flexible graphite platelet 1 and the second flexible graphite platelet about 4 block and at groove 61, prevent dropping of flexible graphite platelet.The top of described first flexible graphite platelet 1 and the second flexible graphite platelet 4 be equipped with fastening balance plate 11, described fastening balance plate 11 is also arranged in groove 61 simultaneously.The present invention uses heat-conducting plastic support 6 to carry out reinforcing heat radiation protection with solenoid coil 5 and fastening balance plate 11 to flexible graphite platelet; compensate for flexible graphite platelet and do the frangible flimsy defect of radiating element; the heat radiation heat transfer efficiency solving all kinds of heat sink material radiator is low, dangerous, non-watertight dust-proof, cost is high, heavy metal pollution, frangible flexibility graphite flake radiator structure
Between described first high purity graphite pad 3 and the second high purity graphite pad 4, the 3rd flexible graphite platelet 7 is installed, increases radiating effect.
The heat that the present invention is sent by heater members starts to start heat radiation area along flexible graphite platelet through fastening balance plate 11 on the first flexible graphite platelet 1, and fastening balance plate 11 has carried out reinforcing heat radiation protection to flexible graphite platelet.Then the conduction of the first high purity graphite pad 2 is passed through to the 3rd flexible graphite platelet 7,3rd flexible graphite platelet 7 conducts to the second high purity graphite pad 3, second high purity graphite pad 3 conducts to the second flexible graphite platelet 4, strengthen its area of dissipation step by step, the rest may be inferred level is more, area can improve radiating effect and heat transfer efficiency more greatly more.
Heat-conducting plastic supports 6 and protect flexible graphite platelet while its heat radiation of help, protects it should not be shatter or fracture, and solenoid coil 5 and screw 51 are mainly used in reinforcing and reinforcement, high purity graphite and the flexible graphite platelet tight heat conductivility between heater members.
As shown in Figure 2, a kind of high conduction heat radiator is in the application of LED high-power bulb lamp.
Heat-sink unit A is arranged on and expands between light shield 8 and socket upper cover 9, greatly reduce the heat of LED, extend the useful life of LED high-power bulb lamp.
As shown in Figure 3, for another embodiment of the present invention, heat-sink unit A comprises flexible graphite platelet A1, heat conduction connects securing member A3 and heat-conducting plastic supports A2 composition, heat-conducting plastic supports the right side that A2 is positioned at described flexible graphite platelet A1, described heat-conducting plastic supports in A2 and is provided with groove A21, card and in groove A21 on the right side of described flexible graphite platelet A1.Described heat conduction connects the left side that securing member A3 is positioned at described flexible graphite platelet A1, and described heat conduction connects securing member A3 and is provided with groove A31, the left side card of described flexible graphite platelet A1 and in groove A31.Described solenoid coil A4 connects groove A31 and the flexible graphite platelet A1 of securing member A3 through described heat conduction, and flexible graphite platelet A1 is fixed together the most at last, and by clamp nut A41.The opposite side of hot link securing member A3 can be directly installed on heater element side.Above-mentioned heat-conducting plastic supports A2 and can replace with common plastics.
As shown in Figure 4, for the third embodiment of the present invention, heat-sink unit A comprises flexible graphite platelet a, heat conduction connects securing member b and heat-conducting plastic supports c composition, heat-conducting plastic is supported with two, heat-conducting plastic supports the left and right sides that c is positioned at described flexible graphite platelet a, described heat-conducting plastic supports in c and is provided with groove c1, described flexible graphite platelet a left and right sides card and in groove c1.Described heat conduction connects securing member b and comprises high purity graphite pad b1 and copper frame connection securing member b2.Above-mentioned heat-conducting plastic supports c and can replace with common plastics.
As shown in Figure 4, high purity graphite pad b1 is three, passes perpendicularly through flexible graphite platelet a respectively, and copper frame connects securing member b2 and linked together by three high purity graphite pad b1, and design is unique, creative high, has great innovation.
As shown in Figure 5; for inventing the 4th kind of embodiment; the present embodiment is arranged in the support overcoat d of the tetragonal body of front opening; it is two that heat-conducting plastic supports e; lay respectively at the top and bottom supporting overcoat d; heat-conducting plastic supports the groove e1 that e is provided with certain intervals; flexible graphite platelet f is arranged in laterally zygomorphic groove e1; the two sides of flexible graphite platelet f is equipped with fastening balanced protection layer h; fastening balanced protection layer h is equivalent to the fastening balance plate 11 in embodiment 1; play effect that is fixing, that support and protect, its heat dispersion increases greatly.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to embodiment illustrated herein, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a high conduction heat radiator, comprise several heat-sink units, it is characterized in that: described heat-sink unit comprises flexible graphite platelet, heat conduction connects securing member and heat-conducting plastic supports composition, described flexible graphite platelet, heat conduction connection securing member have several, described heat conduction connects securing member and is arranged between described flexible graphite platelet, and described flexible graphite platelet is arranged on heat-conducting plastic and supports.
2. the high conduction heat radiator of one according to claim 1, is characterized in that: also comprise solenoid coil, and described solenoid coil connects securing member through described flexible graphite platelet and heat conduction, and described solenoid coil is screwed.
3. the high conduction heat radiator of one according to claim 2, is characterized in that: described solenoid coil can replace by lead screw.
4. the high conduction heat radiator of one according to claim 1 and 2, is characterized in that: described heat-conducting plastic is supported for two, lays respectively at the both sides of flexible graphite platelet, and described heat-conducting plastic is provided with groove in supporting, card and at groove about described flexible graphite platelet.
5. the high conduction heat radiator of the one according to claim 1 or 4, is characterized in that: the two sides of described flexible graphite platelet can be provided with fastening balance plate, and described fastening balance plate is arranged in groove.
6. the high conduction heat radiator of one according to claim 1 and 2, is characterized in that: described heat-sink unit is at least one.
7. according to the high conduction heat radiator of the one described in claim 1 to 6, it is characterized in that: described heat conduction connects securing member and can be high purity graphite pad or copper backing or aluminium backing.
8. a high conduction heat radiator, comprise several heat-sink units, it is characterized in that: described heat-sink unit comprises flexible graphite platelet, heat conduction connects securing member and heat-conducting plastic supports composition, described flexible graphite platelet has several, described heat conduction connects securing member and heat-conducting plastic support is positioned at the described flexible graphite platelet left and right sides, described heat conduction connects securing member and heat-conducting plastic support is equipped with groove, and described flexible graphite platelet is arranged on heat-conducting plastic support and heat conduction connects on the groove of securing member.
9. the application of a kind of high conduction heat radiator according to claim 1 on light fixture.
10. the application of a kind of high conduction heat radiator according to claim 1 on electronics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510559606.3A CN105120634B (en) | 2015-09-06 | 2015-09-06 | A kind of high conduction heat radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510559606.3A CN105120634B (en) | 2015-09-06 | 2015-09-06 | A kind of high conduction heat radiator |
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| CN105120634A true CN105120634A (en) | 2015-12-02 |
| CN105120634B CN105120634B (en) | 2017-11-14 |
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| CN204948599U (en) * | 2015-09-06 | 2016-01-06 | 张永锋 | A kind of high conduction heat radiator |
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2015
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Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10126081A (en) * | 1996-10-17 | 1998-05-15 | Matsushita Electric Ind Co Ltd | Heat insulating device |
| JP2000091453A (en) * | 1998-09-10 | 2000-03-31 | Ishino Corporation:Kk | Heat-radiating sheet material, manufacture thereof and radiator using the same |
| CN101060974A (en) * | 2004-09-17 | 2007-10-24 | 先进能源科技公司 | Sandwiched finstock |
| CN101326406A (en) * | 2005-09-06 | 2008-12-17 | 格拉弗技术国际控股有限公司 | Flexible graphite flooring heat spreader |
| CN101427095A (en) * | 2006-01-06 | 2009-05-06 | 格拉弗技术国际控股有限公司 | Microchannel heat sink manufactured from graphite materials |
| CN201115224Y (en) * | 2007-05-23 | 2008-09-10 | 新高功能医用电子有限公司 | Heat radiation connector module |
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| CN103592796A (en) * | 2012-08-17 | 2014-02-19 | 华宏新技股份有限公司 | Anisotropic heat dissipation in a backlight unit |
| CN203482563U (en) * | 2013-08-27 | 2014-03-12 | 孙伟峰 | Heat dissipation apparatus for electronic consumer goods |
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| CN105120634B (en) | 2017-11-14 |
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Effective date of registration: 20190430 Address after: 322000 1016, 10th Building, Building B, No. 10, Gaoxin Road, Fujiang Street, Yiwu City, Jinhua City, Zhejiang Province (self-declaration) Patentee after: Yiwu Weituo Environmental Protection Technology Co., Ltd. Address before: 261000 No. 141 Zhangjia Xiaozhuang Village, Xinxing Town, Zhucheng City, Weifang City, Shandong Province Patentee before: Zhang Yongfeng |
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