CN105116700A

CN105116700A - Method of preparing various single-side multilayer single-functional and single-side and double-side multilayer multifunctional printed electronic product by virtue of light induction

Info

Publication number: CN105116700A
Application number: CN201510639856.8A
Authority: CN
Inventors: 林铁松; 何鹏; 刘贵铭
Original assignee: Harbin Institute of Technology
Current assignee: Harbin Institute of Technology
Priority date: 2015-09-30
Filing date: 2015-09-30
Publication date: 2015-12-02

Abstract

The invention relates to a method of preparing various single-side multilayer single-functional and a single-side and double-side multilayer multifunctional printed electronic product by virtue of light induction, and relates to the technical field of printed electronics, and solves the problem that an existing inkjet printing electronic technology cannot realize the high-efficiency mass production of high-resolution electronic circuits. The method comprises the following steps: first selecting a substrate, then completing the design of circuit information or insulation layer information on a computer, controlling the radiation of optical beams by virtue of an optical beam controller, enabling the circuit information or insulation layer information to be stored in a photosensitive material, forming an electrostatic latent image of the circuit or insulation layer information, covering the photosensitive material with functional ink powder, converting the circuit information or insulation layer information into a visible ink powder circuit or insulation layer image, transfer printing the functional ink powder onto the substrate by virtue of hot-pressing sintering or electrostatic adsorption or the combination of the hot-pressing sintering and electrostatic adsorption, and roasting the substrate to form a circuit layer or an insulation layer. The method is also suitable for printing an integrated circuit.

Description

Photoinduction is adopted to prepare the method for multiple single-side multi-layer list function and one side, the multi-functional printed electronics product of double-sided multi-layer

Technical field

The present invention relates to printed electronics technical field; In particular to a kind of printed electronics technology utilizing photoinduction conduction ink powder to form circuit.

Background technology

In electronic information manufacturing industry, traditional Copper Foil etching technique is widely used because of its technology maturation, but also because of its complicate fabrication process, production process is various, consumption of materials is large, produce the reasons such as a large amount of waste liquids brings great pressure to environment, thus extensively denounced.For overcoming the problems such as traditional Copper Foil etching technique technique is loaded down with trivial details, seriously polluted, meet the demands for development such as flexible circuit of new generation, wearable circuit, ink-jet printed electronic technology is arisen at the historic moment simultaneously.

The basic ideas of ink-jet printed electronic technology, adopt functional ink or ink directly on insulating substrate, to print out electronic circuit.This technology has the outstanding advantages such as operation is simple, cost is low, free from environmental pollution.But, the precision of the live width of the circuit printed low and ink-jet printed time shower nozzle the restriction of problem such as easily to block, the current slower development of this technology, only rests on laboratory level, applies less in large-scale production.

Summary of the invention

The present invention, in order to solve the electronic circuit problem of producing that cannot realize high-level efficiency, high resolving power, scale of existing ink-jet printed electronic technology, proposes the method adopting photoinduction to prepare multiple single-side multi-layer list function and one side, the multi-functional printed electronics product of double-sided multi-layer.

Adopt photoinduction to prepare the method for the unifunctional printed electronics product of single-side multi-layer, it comprises the steps:

Step 11, selects non-conducting material as substrate;

Step 21, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 31, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 41, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;

Step 51, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step 61, utilizes Computer-aided manufacturing to complete the design of insulation course, and insulation course information is sent to control device of light beam;

Step 71, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, the information of insulation course to be stored on photosensitive material and to form the electrostatic latent image of insulation course;

Step 81, is coated on photosensitive material by the functional ink powder with insulation characterisitic with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder with insulation characterisitic is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of insulation course is converted into visual ink powder insulation course image, completes the developing process of insulation course;

Step 91, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder insulation course image, be transferred on the substrate being coated with the functional ink powder of N kind in step 51 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, the substrate being now coated with the functional ink powder of N kind is coated with the functional ink powder with insulation characterisitic;

Step 101, by be coated with the functional ink powder of N kind and have insulation characterisitic functional ink powder substrate on be placed in baking oven and toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the functional ink powder of N kind and the sintering temperature with the functional material in the functional ink powder of insulation characterisitic, make a circuit forming surface layer and the insulation course of substrate;

Step 111, repeats step 21 to step 101, obtains and have the unifunctional printed electronics product of single-side multi-layer.

Adopt photoinduction to prepare the method for the multi-functional printed electronics product of double-sided multi-layer, it comprises the steps:

Step Z1, selects non-conducting material as substrate;

Step Z2, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step Z3, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step Z4, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step Z5, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step Z6, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step Z7, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step Z8, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step Z9, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step Z5 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, the substrate being now coated with the functional ink powder of N kind is coated with the functional ink powder of N+1 kind;

Step Z10, until substrate is coated with the first to carry out next step again to the functional ink powder of N+1 kind;

Step Z11, utilizes Computer-aided manufacturing to complete the design of insulation course, and insulation course information is sent to control device of light beam;

Step Z12, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, insulation course information to be stored on photosensitive material and to form the electrostatic latent image of insulation course;

Step Z13, is coated on photosensitive material by the functional ink powder with insulation characterisitic with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder with insulation characterisitic is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder insulation course image, completes the developing process of insulation course;

Step Z14, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder circuit image, be transferred in step Z10 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines and be coated with the first on the substrate of the functional ink powder of N+1 kind, be now coated with the first to the substrate of the functional ink powder of N+1 kind, cover the functional ink powder with insulation characterisitic;

Step Z15, repeats step Z2 to step Z14, completes multidevelopment process, obtain the substrate of the functional ink powder being coated with the functional ink powder of N+1 kind and have insulation characterisitic;

Step Z16, the substrate of functional ink powder being coated with the functional ink powder of N+1 kind and having an insulation characterisitic is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the functional ink powder of N+1 kind and the sintering temperature with the functional material in the functional ink powder of insulation characterisitic, make the substrate of the functional ink powder being coated with the functional ink powder of N+1 kind and there is insulation characterisitic forms multilayer circuit layer and insulation course, obtain and there is the multi-functional printed electronics product of single-side multi-layer;

Step Z17, repeats step Z2 to step Z16, the another side with the unifunctional printed electronics product of single-side multi-layer forms circuit layer and insulation course, obtain and have the unifunctional printed electronics product of double-sided multi-layer.

Beneficial effect: the method for printed electronics product of the present invention compares traditional Copper Foil lithographic technique, and concise production process, cost are low; And energy consumption is low, without waste liquid, waste material is few, can realize environmental protection High-efficient Production.Meanwhile, under laboratory or small serial production condition, can generate individual layer and multilayer circuit board fast, circuit not easily produces defect simultaneously, and cost is low, reaction is fast, equipment investment is little.

The method of printed electronics product of the present invention, compared with existing ink-jet printed electronic technology, avoids the susceptible to plugging problem of ink-jet printed electronic technology shower nozzle from principle, and uses light beam and on-mechanical graphing, drastically increases production efficiency.Meanwhile, the limiting resolution of this technology, also higher than existing ink-jet printed electronic technology, compares existing ink-jet printed electronic technology, and the limiting resolution of printed electronics method of the present invention improves more than 30%.

The present invention is also applicable to electronic information manufacturing technology, increases the fields such as material manufacturing technology, printed circuit board technology, electronic label technology, flat display technology and flexible wearable electronic technology.

Accompanying drawing explanation

Fig. 1 is the process flow diagram that the method for the unifunctional printed electronics product of single-side multi-layer is prepared in employing photoinduction in embodiment one.

Embodiment

Embodiment one, reference Fig. 1 illustrate present embodiment, and the method for the unifunctional printed electronics product of single-side multi-layer is prepared in the employing photoinduction described in present embodiment, and it comprises the steps:

Step 11, selects non-conducting material as substrate;

In present embodiment, the present invention utilizes the elective irradiation of light beam on photosensitive material, is stored on photosensitive material by circuit information.Completing circuit design on computers, is sent to control device of light beam by circuit information.Control device of light beam controls light beam elective irradiation on photosensitive material, and photosensitive material light Partial charge changes, and is stored in by circuit information on photosensitive material, forms the electrostatic latent image of circuit.With the functional ink powder of electric charge, be optionally adsorbed on the light part of photosensitive material or non-light part, by the electrostatic latent image of circuit on photosensitive material, be converted into visual ink powder circuit image.By hot pressed sintering or Electrostatic Absorption, ink powder is transferred on substrate.Through overbaking or illumination, form circuit layer.This technology can realize environmental protection, efficient, high resolving power, scale electronic circuit produce, can be used for the fields such as printed circuit board, electronic tag, flat-panel monitor and flexible wearable electronics.

In step 91, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder insulation course image, on the substrate be transferred to by Electrostatic Absorption technology, this place, what insulation characterisitic was formed after referring to baking is insulation course, does not affect its chargeding performance, can adopt Electrostatic Absorption technology.

In present embodiment, by first covering a kind of functional ink powder, then covering the functional ink powder with insulation characterisitic, then toasting once, making substrate to be formed circuit layer and insulation course.Repeat to fire circuit layer and insulation course, thus formation has the unifunctional printed electronics product of single-side multi-layer.Wherein circuit layer is toasted by the functional ink powder of N kind with electric charge and forms, and N is the positive integer from 1.Insulation course is toasted by the functional ink powder with insulation characterisitic and forms.This embodiment adopts and repeatedly toasts, and can improve the reliability of product.

Embodiment two, prepare the method for the unifunctional printed electronics product of double-sided multi-layer based on embodiment one, it comprises the steps:

Step 1-1, selects non-conducting material as substrate;

Step 2-1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step 3-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step 4-1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;

Step 5-1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step 6-1, utilizes Computer-aided manufacturing to complete the design of insulation course, and insulation course information is sent to control device of light beam;

Step 7-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, the information of insulation course to be stored on photosensitive material and to form the electrostatic latent image of insulation course;

Step 8-1, is coated on photosensitive material by the functional ink powder with insulation characterisitic with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder with insulation characterisitic is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of insulation course is converted into visual ink powder insulation course image, completes the developing process of insulation course;

Step 9-1, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder insulation course image, be transferred on the substrate being coated with the functional ink powder of N kind in step 5-1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, the substrate being now coated with the functional ink powder of N kind is coated with the functional ink powder with insulation characterisitic;

Step 10-1, by be coated with the functional ink powder of N kind and have insulation characterisitic functional ink powder substrate on be placed in baking oven and toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the functional ink powder of N kind and the sintering temperature with the functional material in the functional ink powder of insulation characterisitic, make a circuit forming surface layer and the insulation course of substrate;

Step 11-1, repeats step 21 to step 101, obtains and have the unifunctional printed electronics product of single-side multi-layer;

Step 12-1, repeats step 2-1 to step 11-1, the another side with the unifunctional printed electronics product of single-side multi-layer forms circuit layer and insulation course, obtain and have the unifunctional printed electronics product of double-sided multi-layer.

Present embodiment is on the basis of the unifunctional printed electronics product of single-side multi-layer of embodiment one acquisition, form circuit layer and insulation course, thus acquisition has the unifunctional printed electronics product of double-sided multi-layer at its another side.

The method of the unifunctional printed electronics product of single-side multi-layer is prepared in employing photoinduction described in embodiment three, present embodiment, and it comprises the steps:

Steps A, selects non-conducting material as substrate;

Step B, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step C, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step D, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;

Step e, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step F, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain the substrate with circuit layer;

Step G, utilizes Computer-aided manufacturing to complete the design of insulation course, and insulation course information is sent to control device of light beam;

Step H, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, the information of insulation course to be stored on photosensitive material and to form the electrostatic latent image of insulation course;

Step I, is coated on photosensitive material by the functional ink powder with insulation characterisitic with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder with insulation characterisitic is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder insulation course image, completes the developing process of insulation course;

Step J, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder insulation course image, being transferred to by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines has on the substrate of circuit layer in step F, and the substrate now with circuit layer is coated with the functional ink powder with insulation characterisitic;

Step K, by cover there is the functional ink powder of insulation characterisitic the substrate with circuit layer on be placed in baking oven and toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material had in the functional ink powder of insulation characterisitic, the surface making the substrate with circuit layer have a circuit layer forms insulation course;

Step L, repeats step B to step K, obtains and have the unifunctional printed electronics product of single-side multi-layer.

In present embodiment, by covering once functional ink powder, baking once, cover the functional ink powder once with insulation characterisitic again, toast mode once again, make substrate to be formed circuit layer and insulation course, repeat abovementioned steps, make to repeat to fire circuit layer and insulation course, thus formation has the unifunctional printed electronics product of multilayer.Wherein circuit layer is toasted by the functional ink powder of N kind with electric charge and forms.Insulation course is toasted by the functional ink powder with insulation characterisitic and forms.This embodiment adopts and repeatedly toasts, and can arrange different baking temperatures, often kind of functional ink powder is toasted all at a proper temperature, can improve the reliability of product for different functional ink powders.

Embodiment four, prepare the method for the unifunctional printed electronics product of double-sided multi-layer based on embodiment three, it comprises the steps:

Steps A in embodiment three is to step L;

Step L-1, repeats step B to step L, the another side with the unifunctional printed electronics product of single-side multi-layer forms circuit layer and insulation course, obtain and have the unifunctional printed electronics product of double-sided multi-layer.

The method of the unifunctional printed electronics product of single-side multi-layer is prepared in employing photoinduction described in embodiment five, present embodiment, and it comprises the steps:

Step a, selects non-conducting material as substrate;

Steps d, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step f, utilizes Computer-aided manufacturing to complete the design of insulation course, and insulation course information is sent to control device of light beam;

Step g, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, the information of insulation course to be stored on photosensitive material and to form the electrostatic latent image of insulation course;

Step h, is coated on photosensitive material by the functional ink powder with insulation characterisitic with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder with insulation characterisitic is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder insulation course image, completes developing process;

Step I, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with the functional ink powder of N kind and there is the functional ink powder of insulation characterisitic;

Step j, repeats step b to step I;

Step k, the substrate being coated with the functional ink powder of multilayer N kind and multilayer and having the functional ink powder of insulation characterisitic is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the functional ink powder of N kind and the sintering temperature with the functional material in the functional ink powder of insulation characterisitic, circuit layer and insulation course on the surface making substrate, obtain and have the unifunctional printed electronics product of single-side multi-layer.

In present embodiment, by first covering the functional ink powder of same and the functional ink powder with insulation characterisitic, and after repeating the functional ink powder placed the functional ink powder of same and there is insulation characterisitic, the mode of unified baking again, make substrate to be formed multilayer circuit layer and multilayer dielectric layer, thus formation has the unifunctional printed electronics product of single-side multi-layer.Wherein circuit layer is toasted by the first the functional ink powder with electric charge and forms.Insulation course is toasted by the functional ink powder with insulation characterisitic and forms.This embodiment adopts unified baking, can simplify operation, enhance productivity.

In present embodiment, by covering a same ink powder, then covering the ink powder of primary insulation characteristic, repeating abovementioned steps, then the mode of unified baking, make substrate to be formed circuit layer and insulation course, obtain and there is the unifunctional printed electronics product of single-side multi-layer.

Embodiment six, prepare the method for the unifunctional printed electronics product of double-sided multi-layer based on embodiment five,

Step a in embodiment five is to step k;

Step l, repeats step b to step k, the another side with the unifunctional printed electronics product of single-side multi-layer forms circuit layer and insulation course, obtain and have the unifunctional printed electronics product of double-sided multi-layer.

The method of the multi-functional printed electronics product of single-side multi-layer is prepared in employing photoinduction described in embodiment seven, present embodiment, and the method comprises the steps:

Step X1, selects non-conducting material as substrate;

Step X2, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step X3, control device of light beam controls light beam and is optionally radiated on photosensitive material, photosensitive material light part and non-light

Part current potential is different, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step X4, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;

Step X5, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step X6, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step X7, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step X8, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is coated with and is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step X9, photosensitive material will be formed the functional ink powder of N+1 of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step X5 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with the functional ink powder of N kind and the functional ink powder of N+1 kind;

Step X10, carries out next step when substrate being coated with the first ink powder functional to N+1 kind;

Step X11, utilizes Computer-aided manufacturing to complete the design of insulation course, and insulation course information is sent to control device of light beam;

Step X12, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, insulation course information to be stored on photosensitive material and to form the electrostatic latent image of insulation course;

Step X13, is coated on photosensitive material by the functional ink powder with insulation characterisitic with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder with insulation characterisitic is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder insulation course image, completes the developing process of insulation course;

Step X14, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder insulation course image, be transferred to by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines and be coated with the first on the substrate of the functional ink powder of N+1 kind in step X10, now substrate is coated with the first to the functional ink powder of N+1 kind and the functional ink powder with insulation characterisitic;

Step X15, be placed in baking oven to the functional ink powder of N+1 kind and the substrate of functional ink powder with insulation characterisitic toast being coated with the first, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first to the functional ink powder of N+1 kind and the sintering temperature with the functional material in the functional ink powder of insulation characterisitic, make to be coated with the first to the functional ink powder of N+1 kind and the circuit forming surface layer of substrate of functional ink powder and the insulation course with insulation characterisitic;

Step X16, repeats step X2 to step X15, obtains and have the multi-functional printed electronics product of single-side multi-layer.

In present embodiment, by cover the first to the functional ink powder of N+1 kind and a kind of there is the functional ink powder of insulation characterisitic after, the mode of unified baking, makes substrate to be formed circuit layer and insulation course, repeat to cover and fire, realize printing the printed electronics product with multi-layer multi.Circuit layer is formed to the functional ink powder baking of N+1 kind by the first; Insulation course is toasted by the functional ink powder with insulation characterisitic and forms.

Embodiment eight, prepare the method for the multi-functional printed electronics product of double-sided multi-layer based on embodiment seven, the method comprises the steps:

Step X1 in embodiment seven is to step X16;

Step X17, repeats step X2 to step X16, forms circuit layer and insulation course on the surface at another of the multi-functional printed electronics product of single-side multi-layer, obtain and have the multi-functional printed electronics product of double-sided multi-layer.

The method of the multi-functional printed electronics product of single-side multi-layer is prepared in employing photoinduction described in embodiment nine, present embodiment, and it comprises the steps:

Step Y1, selects non-conducting material as substrate;

Step Y2, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step Y3, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step Y4, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step Y5, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;

Step Y6, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain the substrate with single sided circuits layer;

Step Y7, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;

Step Y8, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

Step Y9, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

Step Y10, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate with single sided circuits layer in step Y6 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, the substrate now with single sided circuits layer is coated with the functional ink powder of N+1 kind;

Step Y11, the substrate with single sided circuits layer of the functional ink powder of covering N+1 kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N+1 kind, make the one side with circuit layer of the substrate with single sided circuits layer again form circuit layer, obtain and there is the multi-functional substrate of one side;

Step Y12, utilizes Computer-aided manufacturing to complete the design of insulation course, and insulation course information is sent to control device of light beam;

Step Y13, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, insulation course information to be stored on photosensitive material and to form the electrostatic latent image of insulation course;

Step Y14, is coated on photosensitive material by the functional ink powder with insulation characterisitic with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder with insulation characterisitic is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder insulation course image, completes the developing process of insulation course;

Step Y15, photosensitive material will be formed the functional ink powder with insulation characterisitic of visual ink powder circuit image, being transferred to having on the multi-functional substrate of one side in step Y11 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now there is the multi-functional substrate of one side with the one side of circuit layer covering the functional ink powder with insulation characterisitic;

Step Y16, be placed in baking oven toast covering the multi-functional substrate of one side that has with the functional ink powder of insulation characterisitic, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material had in the functional ink powder of insulation characterisitic, make to have on the multi-functional substrate of one side and form insulation course with the one side of circuit layer;

Step Y17, repeats step Y2 to step Y16, obtains the printed electronics product with multi-layer multi.

In present embodiment, by covering a kind of functional ink powder, baking once, cover another kind of functional ink powder again, then toast mode once, then cover the functional ink powder with insulation characterisitic, toast mode once again, make substrate to be formed multi-functional circuit layer and insulation course, repeat to fire circuit layer and insulation course, thus formation has the multi-functional printed electronics product of single-side multi-layer.

In present embodiment, multi-functional by the decision of employing several functions ink powder, the functional ink powder of N kind determines the multi-functional of this printed electronics product.

Embodiment ten, prepare the method for the multi-functional printed electronics product of double-sided multi-layer based on embodiment nine, it comprises the steps:

Step Y1 in embodiment eight is to step Y17;

Step Y18, repeats step Y2 to step Y17, forms circuit layer and insulation course on the surface at another of the multi-functional printed electronics product of single-side multi-layer, obtain and have the multi-functional printed electronics product of double-sided multi-layer.

The method of the multi-functional printed electronics product of single-side multi-layer is prepared in employing photoinduction described in embodiment 11, present embodiment, and it comprises the steps:

Step Z1, selects non-conducting material as substrate;

Step Z16, the substrate of functional ink powder being coated with the functional ink powder of N+1 kind and having an insulation characterisitic is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the functional ink powder of N+1 kind and the sintering temperature with the functional material in the functional ink powder of insulation characterisitic, make the substrate of the functional ink powder being coated with the functional ink powder of N+1 kind and there is insulation characterisitic forms multilayer circuit layer and insulation course, obtain and there is the multi-functional printed electronics product of single-side multi-layer.

In present embodiment, by first covering the functional ink powder of N kind, then cover the functional ink powder of N+1 kind, cover the functional ink powder with insulation characterisitic again, repeat abovementioned steps again, and then the mode of unified baking, obtain and there is the multi-functional printed electronics product of single-side multi-layer.

In present embodiment, after now ink powder being covered, more unified baking.

Embodiment 12, prepare the method for the multi-functional printed electronics product of double-sided multi-layer based on embodiment ten, it comprises the steps:

Step Z1 in embodiment 11 is to step Z16;

Further illustrating of embodiment 13, present embodiment ten pairs of embodiments one to ten two, in present embodiment, described light beam is a kind of, two or more combination in X ray, gamma-rays, laser, LED light, visible ray, ultraviolet or infrared ray.

Utilize the functional ink powder with electric charge, will the circuit information on photosensitive material be stored in, and by transfer printing, transfer on substrate.

The functional ink powder used, refer to the organism including functional material, functional material wherein comprises conductive material, capacitance material, resistance material, inductive material, insulating material, superconductor, semiconductor material, dielectric substance, magnetic material, photoelectric material, thermoelectric material, thermo-sensitive material, absorbing material or electronic package material.The functional ink powder of N+1 kind that the functional ink powder used comprises with electric charge is coated with functional ink powder.

Described substrate be the substrate that a kind of, two or more the potpourri in macromolecule, glass, pottery or biomaterial is made, and this substrate is rigidity or flexibility.

After described photosensitive material refers to that light is irradiated, the material that chargeding performance or electric conductivity change.

Printed electronics product comprises printed circuit board, electronic tag (RFID), chip, printing transistor, Organic Light Emitting Diode (OLED), flat-panel monitor, flexible electronic, wearable electronic and solar-energy photo-voltaic cell.

The circuit layer of each design and insulation course can be identical, also can be different.

Embodiment 14, present embodiment prepare further illustrating of the method for the multi-functional printed electronics product of single-side multi-layer to the employing photoinduction described in embodiment 11, in present embodiment,

Step Z16 is replaced by following method:

The substrate of functional ink powder being coated with the functional ink powder of N+1 kind and having an insulation characterisitic is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the functional ink powder of N+1 kind and there is insulation characterisitic functional ink powder in the softening temperature of organic polymer or denaturation temperature, organic substance organic polymer in the functional ink powder of removing N+1 kind, make the substrate of the functional ink powder being coated with the functional ink powder of N+1 kind and there is insulation characterisitic forms multilayer circuit layer and insulation course, acquisition has the multi-functional printed electronics product of single-side multi-layer.

Embodiment 15, present embodiment prepare further illustrating of the method for the multi-functional printed electronics product of single-side multi-layer to the employing photoinduction described in embodiment 11, in present embodiment,

Step Z16 is replaced by following method:

By be coated with the functional ink powder of N+1 kind and have insulation characterisitic functional ink powder substrate light under irradiate, make the functional ink powder of N+1 kind and there is the organic material decomposition in the functional ink powder of insulation characterisitic, removing N+1 kind functional ink powder and have insulation characterisitic functional ink powder base in organic substance, make a surface of substrate form multilayer circuit layer and insulation course, obtain and there is the multi-functional printed electronics product of single-side multi-layer.

Embodiment 16, present embodiment are an embodiment, the according to the embodiment of the present invention content of to ten four, and now propose an embodiment, step is as follows:

The first step, selects polyethylene terephthalate flexible material to be substrate;

Second step, utilizes computer-aided manufacturing (CAM) technology, in the design of computing machine completing circuit, and circuit information is sent to control device of light beam;

3rd step, control device of light beam controls light beam, and be optionally radiated on organic light-guide material, organic light-guide material light part is different from non-light part current potential, and circuit information is stored on photosensitive material, forms the electrostatic latent image of circuit;

4th step, by the conduction ink powder (including the polystyrene of nano-Ag particles) with electric charge, is coated on organic light-guide material; On organic light-guide material, diverse location current potential is different, and the conduction ink powder with electric charge optionally can be adsorbed on the light part of organic light-guide material, thus the electrostatic latent image of circuit on photosensitive material is converted into visual ink powder circuit image, completes developing process;

5th step, organic light-guide material will be formed the conduction ink powder with electric charge of circuit image, hot pressed sintering 10-30s under the condition of 1-5MPa, 200-250 DEG C, and make the conduction ink powder with electric charge be transferred on PET substrate;

6th step, the substrate covering conduction ink powder is placed in baking oven and toasts, baking temperature is 150-200 DEG C, time 0.5-1h, forms conductive circuit layer;

7th step, control device of light beam controls light beam, is radiated on whole organic light-guide material;

8th step, by the insulation ink powder (polystyrene) with electric charge, is coated on organic light-guide material; The whole light of organic light-guide material, is adsorbed on the surface of whole organic light-guide material by the insulation ink powder with electric charge;

9th step, by the insulation ink powder on organic light-guide material, hot pressed sintering 10-30s under the condition of 1-5MPa, 200-250 DEG C, makes ink powder be transferred on PET substrate;

Tenth step, the substrate covering insulation ink powder is placed in baking oven and toasts, baking temperature is 150-200 DEG C, time 0.5-1h, forms insulation course;

11 step, repeats second step to the tenth step, can obtain layer flexible electronic circuit.

Above-described embodiment is only preferred embodiment of the present invention, not limits the scope of the invention according to this, therefore: all various equivalence changes done according to principle of the present invention etc., all should be encompassed within protection scope of the present invention.

Claims

1. adopt photoinduction to prepare the method for the unifunctional printed electronics product of single-side multi-layer, it is characterized in that, it comprises the steps:

Step 11, selects non-conducting material as substrate;

2. adopt photoinduction to prepare the method for the unifunctional printed electronics product of single-side multi-layer, it is characterized in that, it comprises the steps:

Steps A, selects non-conducting material as substrate;

Step D, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;

3. adopt photoinduction to prepare the method for the unifunctional printed electronics product of single-side multi-layer, it is characterized in that, it comprises the steps:

Step a, selects non-conducting material as substrate;

Step j, repeats step b to step I;

4. adopt photoinduction to prepare the method for the multi-functional printed electronics product of single-side multi-layer, it is characterized in that, it comprises the steps:

Step X1, selects non-conducting material as substrate;

Step X3, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;

5. adopt photoinduction to prepare the method for the multi-functional printed electronics product of single-side multi-layer, it is characterized in that, it comprises the steps:

Step Y1, selects non-conducting material as substrate;

6. adopt photoinduction to prepare the method for the multi-functional printed electronics product of single-side multi-layer, it is characterized in that, it comprises the steps:

Step Z1, selects non-conducting material as substrate;

7. the method for the multi-functional printed electronics product of single-side multi-layer is prepared in employing photoinduction according to claim 6, it is characterized in that,

Described light beam is a kind of, two or more combination in X ray, gamma-rays, laser, LED light, visible ray, ultraviolet or infrared ray;

The described functional ink powder of N+1 kind with electric charge is coated with functional ink powder, wherein include the organism of functional material, functional material wherein comprises conductive material, capacitance material, resistance material, inductive material, insulating material, superconductor, semiconductor material, dielectric substance, magnetic material, photoelectric material, thermoelectric material, thermo-sensitive material, absorbing material or electronic package material;

Described substrate is the substrate that a kind of, two or more potpourri in macromolecule, glass, pottery or biomaterial are made, and this substrate is rigidity or flexibility;

8. the method for the multi-functional printed electronics product of single-side multi-layer is prepared in employing photoinduction according to claim 7, it is characterized in that,

Step Z16 is replaced by following method:

9. the method for the multi-functional printed electronics product of single-side multi-layer is prepared in employing photoinduction according to claim 7, it is characterized in that,

Step Z16 is replaced by following method:

10. adopt photoinduction to prepare the method for the multi-functional printed electronics product of double-sided multi-layer, it is characterized in that, it comprises the steps:

Step Z1, selects non-conducting material as substrate;