CN105116701A - Method of preparing single-side and double-side single-layer single-functional or single-side and double-side single-layer multifunctional printed electronic product by virtue of light induction - Google Patents
Method of preparing single-side and double-side single-layer single-functional or single-side and double-side single-layer multifunctional printed electronic product by virtue of light induction Download PDFInfo
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- CN105116701A CN105116701A CN201510639886.9A CN201510639886A CN105116701A CN 105116701 A CN105116701 A CN 105116701A CN 201510639886 A CN201510639886 A CN 201510639886A CN 105116701 A CN105116701 A CN 105116701A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/65—Apparatus which relate to the handling of copy material
- G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
- G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
- H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
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Abstract
The invention relates to a method of preparing a single-side and double-side single-layer single-functional or single-side and double-side single-layer multifunctional printed electronic product by virtue of light induction, and relates to the technical field of printed electronics, and solves the problem that an existing inkjet printing electronic technology cannot realize the high-efficiency, high-resolution and mass production of electronic circuits. The method comprises the following steps: first selecting a substrate, and designing circuit information on a computer, controlling the radiation of optical beams by virtue of an optical beam controller, enabling the circuit information to be stored into a photosensitive material, forming an electrostatic latent image of the circuit, then covering the photosensitive material with functional ink powder, converting the circuit information into a visible ink powder circuit image, transfer printing the functional ink powder onto the substrate by virtue of hot-pressing sintering or electrostatic adsorption or the combination of the hot-pressing sintering and the electrostatic adsorption, and then roasting the substrate to form a circuit layer. The method is also suitable for printing an integrated circuit.
Description
Technical field
The present invention relates to printed electronics technical field; In particular to a kind of printed electronics technology utilizing photoinduction conduction ink powder to form circuit.
Background technology
In electronic information manufacturing industry, traditional Copper Foil etching technique is widely used because of its technology maturation, but also because of its complicate fabrication process, production process is various, consumption of materials is large, produce the reasons such as a large amount of waste liquids brings great pressure to environment, thus extensively denounced.For overcoming the problems such as traditional Copper Foil etching technique technique is loaded down with trivial details, seriously polluted, meet the demands for development such as flexible circuit of new generation, wearable circuit, ink-jet printed electronic technology is arisen at the historic moment simultaneously.
The basic ideas of ink-jet printed electronic technology, adopt functional ink or ink directly on insulating substrate, to print out electronic circuit.This technology has the outstanding advantages such as operation is simple, cost is low, free from environmental pollution.But, the precision of the live width of the circuit printed low and ink-jet printed time shower nozzle the restriction of problem such as easily to block, the current slower development of this technology, only rests on laboratory level, applies less in large-scale production.
Summary of the invention
The present invention, in order to solve the electronic circuit problem of producing that cannot realize high-level efficiency, high resolving power, scale of existing ink-jet printed electronic technology, proposes and adopts photoinduction to prepare the method for one side, two-sided individual layer list function or one side, the multi-functional printing electronic product of two-sided individual layer.
Adopt photoinduction to prepare the method for single-surface single-layer list function printed electronics product, it comprises the steps:
Step one, selects non-conducting material as substrate;
Step 2, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 3, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 4, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder of N kind with electric charge is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step 5, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;
Step 6, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.
Adopt photoinduction to prepare the method for the multi-functional printed electronics product of two-sided individual layer, it comprises the steps:
Steps A 1, selects non-conducting material as substrate;
Step B1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step C1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step D1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step e 1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; N is positive integer;
Step F 1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step G1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step H1, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step I1, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e 1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with N kind and the functional ink powder of N+1 kind;
Step J1, when substrate being coated with the first ink powder functional to N+1 kind, carries out next step;
Step K 1, the first substrate to the functional ink powder of N+1 kind of covering is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first sintering temperature to the functional material in the functional ink powder of N+1 kind, make a circuit forming surface layer of substrate, obtain and there is the multi-functional printed electronics product of single-surface single-layer;
Step L1, repeat step B1 to step K 1, having the multi-functional printed electronics product of single-surface single-layer, another forms circuit layer on the surface, obtains and has the multi-functional printed electronics product of two-sided individual layer.
Beneficial effect: printed electronics method of the present invention compares traditional Copper Foil lithographic technique, and concise production process, cost are low; And energy consumption is low, without waste liquid, waste material is few, can realize environmental protection High-efficient Production.Meanwhile, under laboratory or small serial production condition, can generate individual layer and multilayer circuit board fast, circuit not easily produces defect simultaneously, and cost is low, reaction is fast, equipment investment is little.
Printed electronics method of the present invention, compared with existing ink-jet printed electronic technology, avoids the susceptible to plugging problem of ink-jet printed electronic technology shower nozzle from principle, and uses light beam and on-mechanical graphing, drastically increases production efficiency.Meanwhile, the limiting resolution of this technology, also higher than existing ink-jet printed electronic technology, compares existing ink-jet printed electronic technology, and the limiting resolution of printed electronics method of the present invention improves more than 30%.
The present invention is also applicable to electronic information manufacturing technology, increases the fields such as material manufacturing technology, printed circuit board technology, electronic label technology, flat display technology and flexible wearable electronic technology.
Accompanying drawing explanation
Fig. 1 is the process flow diagram adopting photoinduction to prepare the method for single-surface single-layer list function printed electronics product.
Embodiment
Embodiment one, reference Fig. 1 illustrate present embodiment, and the preparation method of the photoinduced printed electronics product of the employing described in present embodiment, it comprises the steps:
Step one, selects non-conducting material as substrate;
Step 2, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 3, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 4, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder of N kind with electric charge is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step 5, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;
Step 6, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.
In present embodiment, the present invention utilizes the elective irradiation of light beam on photosensitive material, is stored on photosensitive material by circuit information.Completing circuit design on computers, is sent to control device of light beam by circuit information.Control device of light beam controls light beam elective irradiation on photosensitive material, and photosensitive material light Partial charge changes, and is stored in by circuit information on photosensitive material, forms the electrostatic latent image of circuit.With the functional ink powder of electric charge, be optionally adsorbed on the light part of photosensitive material or non-light part, by the electrostatic latent image of circuit on photosensitive material, be converted into visual ink powder circuit image.Combined by hot pressed sintering or Electrostatic Absorption or the two, functional ink powder is transferred on substrate.Through overbaking or illumination, form circuit layer.This technology can realize environmental protection, efficient, high resolving power, scale electronic circuit produce, can be used for the fields such as printed circuit board, electronic tag, flat-panel monitor and flexible wearable electronics.
The inventive method, solve existing ink-jet printed electronic technology cannot realize high-level efficiency, high resolving power, scale electronic circuit produce problem.
Embodiment two, present embodiment prepare further illustrating of the method for single-surface single-layer list function printed electronics product to the employing photoinduction described in embodiment one, in present embodiment, step 6 is replaced by following method:
The substrate being coated with the functional ink powder of N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the softening temperature of organic polymer in the functional ink powder of N kind or denaturation temperature, remove the organic substance organic polymer in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.
Embodiment three, present embodiment prepare further illustrating of the method for single-surface single-layer list function printed electronics product to the employing photoinduction described in embodiment one, in present embodiment, step 6 is replaced by following method:
Irradiate under the substrate being coated with the functional ink powder of N kind is placed in light, make the organic material decomposition in the functional ink powder of N kind, remove the organic substance in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.
The method of two-sided individual layer list function printed electronics product is prepared in employing photoinduction described in embodiment four, present embodiment, and it comprises the steps:
Step one by one, selects non-conducting material as substrate;
Step 2 one, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 3 one, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 4 one, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder of N kind with electric charge is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step May Day, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, be transferred on substrate by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with the functional ink powder of N kind;
Step 6 one, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer;
Step July 1st, repeat step 2 one to step 6 one, form circuit layer on the surface at another with the unifunctional printed electronics product of single-surface single-layer, obtain and there is the unifunctional printed electronics product of two-sided individual layer.
In present embodiment, the basis of step 2 one to step 6 one is repeated, form circuit layer at the another side of substrate, make the two sides of substrate all form circuit layer, obtain and there is the unifunctional printed electronics product of two-sided individual layer.
The method of the multi-functional printed electronics product of single-surface single-layer is prepared in employing photoinduction described in embodiment five, present embodiment, and it comprises the steps:
Steps A, selects non-conducting material as substrate;
Step B, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step C, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step D, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step e, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; N is positive integer;
Step F, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step G, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step H, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step I, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with N kind and the functional ink powder of N+1 kind;
Step J, when substrate being coated with the first ink powder functional to N+1 kind, carries out next step;
Step K, the first substrate to the functional ink powder of N+1 kind of covering is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first sintering temperature to the functional material in the functional ink powder of N+1 kind, make a circuit forming surface layer of substrate, obtain and there is the multi-functional printed electronics product of single-surface single-layer.
In present embodiment, by first covering function ink powder, then the mode of unified baking, make substrate surface forms circuit layer.This embodiment adopts unified baking, can simplify operation, enhance productivity.
The method of the multi-functional printed electronics product of two-sided individual layer is prepared in employing photoinduction described in embodiment six, present embodiment, and it comprises the steps:
Steps A 1, selects non-conducting material as substrate;
Step B1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step C1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step D1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step e 1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; N is positive integer;
Step F 1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step G1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step H1, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step I1, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e 1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with N kind and the functional ink powder of N+1 kind;
Step J1, when substrate being coated with the first ink powder functional to N+1 kind, carries out next step;
Step K 1, the first substrate to the functional ink powder of N+1 kind of covering is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first sintering temperature to the functional material in the functional ink powder of N+1 kind, make a circuit forming surface layer of substrate, obtain and there is the multi-functional printed electronics product of single-surface single-layer;
Step L1, repeat step B1 to step K 1, having the multi-functional printed electronics product of single-surface single-layer, another forms circuit layer on the surface, obtains and has the multi-functional printed electronics product of two-sided individual layer.
In present embodiment, on the basis of preparing the multi-functional printed electronics product of single-surface single-layer, form circuit layer at the another side with the multi-functional printed electronics product of single-surface single-layer, formed and there is the multi-functional printed electronics product of two-sided individual layer.
The method of the multi-functional printed electronics product of single-surface single-layer is prepared in employing photoinduction described in embodiment seven, present embodiment, and it comprises the steps:
Step 11, selects non-conducting material as substrate;
Step 21, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 31, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 41, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step 51, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;
Step 61, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, makes a circuit forming surface layer of substrate;
Step 71, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 81, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 91, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step 101, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, is transferred on the substrate of a circuit forming surface layer in step 61 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; The substrate of a now circuit forming surface layer is coated with the functional ink powder of N+1 kind;
Step 111, the substrate of a circuit forming surface layer of the functional ink powder of covering N+1 kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N+1 kind, make the substrate of a circuit forming surface layer forms circuit layer again;
Step 121, repeats step 21 to step 111, obtains and have the multi-functional printed electronics product of single-surface single-layer.
In present embodiment, by covering an ink powder, baking once, then covers an ink powder, then toasts mode once, makes substrate surface forms circuit layer.This embodiment adopts and repeatedly toasts, and can arrange different baking temperatures, often kind of functional ink powder is toasted all at a proper temperature for different functional ink powders, can improve the reliability of product simultaneously.
The method of the multi-functional printed electronics product of two-sided individual layer is prepared in employing photoinduction described in embodiment eight, present embodiment, and it comprises the steps:
Step 11-1, selects non-conducting material as substrate;
Step 21-1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 31-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 41-1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step 51-1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;
Step 61-1, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, makes a circuit forming surface layer of substrate;
Step 71-1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 81-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 91-1, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step 10-1, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, is transferred on the substrate of a circuit forming surface layer in step 61-1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; The substrate of a now circuit forming surface layer is coated with the functional ink powder of N+1 kind;
Step 11-1, the substrate of a circuit forming surface layer of the functional ink powder of covering N+1 kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N+1 kind, make the substrate of a circuit forming surface layer forms circuit layer again;
Step 12-1, repeats step 21-1 to step 11-1, obtains and have the multi-functional printed electronics product of single-surface single-layer;
Step 13-1, repeats step 21-1 to step 12-1, forms circuit layer on the surface, obtain the multi-functional printed electronics product of two-sided individual layer at another with the multi-functional printed electronics product of single-surface single-layer.
In present embodiment, form circuit layer on the surface at another with the multi-functional printed electronics product of single-surface single-layer, obtain the multi-functional printed electronics product of two-sided individual layer.
Further illustrating of embodiment nine, present embodiment nine pairs of embodiments one to eight, in present embodiment, described light beam is a kind of, two or more combination in X ray and gamma-rays, laser, LED light, visible ray, ultraviolet or infrared ray.
Utilize the functional ink powder with electric charge, will the circuit information on photosensitive material be stored in, and by transfer printing, transfer on substrate.Functional ink powder with electric charge is that the first is to the functional ink powder of N+1 kind.
Functional ink powder, refer to the organism including functional material, functional material wherein comprises conductive material, capacitance material, resistance material, inductive material, insulating material, superconductor, semiconductor material, dielectric substance, magnetic material, photoelectric material, thermoelectric material, thermo-sensitive material, absorbing material or electronic package material.The first all belongs to this type of to the functional ink powder of N+1 kind.
Described substrate be the substrate that a kind of, two or more the potpourri in macromolecule, glass, pottery or biomaterial is made, and this substrate is rigidity or flexibility.
After described photosensitive material refers to that light is irradiated, the material that chargeding performance or electric conductivity change.
Printed electronics product comprises printed circuit board, electronic tag (RFID), chip, printing transistor, Organic Light Emitting Diode (OLED), flat-panel monitor, flexible electronic, wearable electronic and solar-energy photo-voltaic cell.
The circuit layer of each design and insulation course can be identical, also can be different.
Embodiment ten, present embodiment are an embodiment, the according to the embodiment of the present invention content of to nine, and now propose an embodiment, step is as follows:
The first step, selects polyethylene terephthalate flexible material to be substrate;
Second step, utilizes computer-aided manufacturing (CAM) technology, in the design of computing machine completing circuit, and circuit information is sent to control device of light beam;
3rd step, control device of light beam controls light beam, and be optionally radiated on organic light-guide material, organic light-guide material light part is different from non-light part current potential, and circuit information is stored on photosensitive material, forms the electrostatic latent image of circuit;
4th step, by the conduction ink powder (including the polystyrene of nano-Ag particles) with electric charge, is coated on organic light-guide material; On organic light-guide material, diverse location current potential is different, and the conduction ink powder with electric charge optionally can be adsorbed on the light part of organic light-guide material, thus the electrostatic latent image of circuit on photosensitive material is converted into visual ink powder circuit image, completes developing process;
5th step, organic light-guide material will be formed the conduction ink powder with electric charge of circuit image, hot pressed sintering 10-30s under the condition of 1-5MPa, 200-250 DEG C, and make the conduction ink powder with electric charge be transferred on PET substrate;
6th step, the substrate covering conduction ink powder is placed in baking oven and toasts, baking temperature is 150-200 DEG C, time 0.5-1h, forms conductive circuit layer;
7th step, control device of light beam controls light beam, is radiated on whole organic light-guide material;
8th step, by the insulation ink powder (polystyrene) with electric charge, is coated on organic light-guide material; The whole light of organic light-guide material, is adsorbed on the surface of whole organic light-guide material by the insulation ink powder with electric charge;
9th step, by the insulation ink powder on organic light-guide material, hot pressed sintering 10-30s under the condition of 1-5MPa, 200-250 DEG C, makes ink powder be transferred on PET substrate;
Tenth step, the substrate covering insulation ink powder is placed in baking oven and toasts, baking temperature is 150-200 DEG C, time 0.5-1h, forms insulation course;
11 step, repeats second step to the tenth step, can obtain layer flexible electronic circuit.
Above-described embodiment is only preferred embodiment of the present invention, not limits the scope of the invention according to this, therefore: all various equivalence changes done according to principle of the present invention etc., all should be encompassed within protection scope of the present invention.
Claims (9)
1. adopt photoinduction to prepare the method for single-surface single-layer list function printed electronics product, it is characterized in that, it comprises the steps:
Step one, selects non-conducting material as substrate;
Step 2, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 3, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 4, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder of N kind with electric charge is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step 5, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;
Step 6, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.
2. the method for single-surface single-layer list function printed electronics product is prepared in employing photoinduction according to claim 1, and it is characterized in that, step 6 is replaced by following method:
The substrate being coated with the functional ink powder of N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the softening temperature of organic polymer in the functional ink powder of N kind or denaturation temperature, remove the organic substance organic polymer in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.
3. the method for single-surface single-layer list function printed electronics product is prepared in employing photoinduction according to claim 1, and it is characterized in that, step 6 is replaced by following method:
Irradiate under the substrate being coated with the functional ink powder of N kind is placed in light, make the organic material decomposition in the functional ink powder of N kind, remove the organic substance in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer.
4. adopt photoinduction to prepare the method for two-sided individual layer list function printed electronics product, it is characterized in that, it comprises the steps:
Step one by one, selects non-conducting material as substrate;
Step 2 one, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 3 one, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 4 one, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, the functional ink powder of N kind with electric charge is optionally adsorbed on the light part of photosensitive material or non-light part, now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process; N is positive integer;
Step May Day, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, be transferred on substrate by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with the functional ink powder of N kind;
Step 6 one, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, make a circuit forming surface layer of substrate, obtain and there is the unifunctional printed electronics product of single-surface single-layer;
Step July 1st, repeat step 2 one to step 6 one, form circuit layer on the surface at another with the unifunctional printed electronics product of single-surface single-layer, obtain and there is the unifunctional printed electronics product of two-sided individual layer.
5. adopt photoinduction to prepare the method for the multi-functional printed electronics product of single-surface single-layer, it is characterized in that, it comprises the steps:
Steps A, selects non-conducting material as substrate;
Step B, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step C, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step D, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step e, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; N is positive integer;
Step F, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step G, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step H, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step I, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with N kind and the functional ink powder of N+1 kind;
Step J, when substrate being coated with the first ink powder functional to N+1 kind, carries out next step;
Step K, the first substrate to the functional ink powder of N+1 kind of covering is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first sintering temperature to the functional material in the functional ink powder of N+1 kind, make a circuit forming surface layer of substrate, obtain and there is the multi-functional printed electronics product of single-surface single-layer.
6. adopt photoinduction to prepare the method for the multi-functional printed electronics product of two-sided individual layer, it is characterized in that, it comprises the steps:
Steps A 1, selects non-conducting material as substrate;
Step B1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step C1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step D1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step e 1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; N is positive integer;
Step F 1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step G1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step H1, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step I1, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, be transferred on the substrate being coated with the functional ink powder of N kind in step e 1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines, now substrate be coated with N kind and the functional ink powder of N+1 kind;
Step J1, when substrate being coated with the first ink powder functional to N+1 kind, carries out next step;
Step K 1, the first substrate to the functional ink powder of N+1 kind of covering is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the first sintering temperature to the functional material in the functional ink powder of N+1 kind, make a circuit forming surface layer of substrate, obtain and there is the multi-functional printed electronics product of single-surface single-layer;
Step L1, repeat step B1 to step K 1, having the multi-functional printed electronics product of single-surface single-layer, another forms circuit layer on the surface, obtains and has the multi-functional printed electronics product of two-sided individual layer.
7. adopt photoinduction to prepare the method for the multi-functional printed electronics product of single-surface single-layer, it is characterized in that, it comprises the steps:
Step 11, selects non-conducting material as substrate;
Step 21, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 31, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 41, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step 51, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;
Step 61, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, makes a circuit forming surface layer of substrate;
Step 71, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 81, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 91, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step 101, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, is transferred on the substrate of a circuit forming surface layer in step 61 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; The substrate of a now circuit forming surface layer is coated with the functional ink powder of N+1 kind;
Step 111, the substrate of a circuit forming surface layer of the functional ink powder of covering N+1 kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N+1 kind, make the substrate of a circuit forming surface layer forms circuit layer again;
Step 121, repeats step 21 to step 111, obtains and have the multi-functional printed electronics product of single-surface single-layer.
8. adopt photoinduction to prepare the method for the multi-functional printed electronics product of two-sided individual layer, it is characterized in that, it comprises the steps:
Step 11-1, selects non-conducting material as substrate;
Step 21-1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 31-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 41-1, is coated on photosensitive material by the functional ink powder of N kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step 51-1, photosensitive material will be formed the functional ink powder of N kind of visual ink powder circuit image, is transferred on substrate, now substrate is coated with the functional ink powder of N kind by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines;
Step 61-1, the substrate of the functional ink powder of covering N kind is placed in baking oven toast, baking temperature lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N kind, makes a circuit forming surface layer of substrate;
Step 71-1, utilizes the design of Computer-aided manufacturing completing circuit, and circuit information is sent to control device of light beam;
Step 81-1, control device of light beam controls light beam and is optionally radiated on photosensitive material, and photosensitive material light part is different from non-light part current potential, and now, circuit information to be stored on photosensitive material and to form the electrostatic latent image of circuit;
Step 91-1, is coated on photosensitive material by the functional ink powder of N+1 kind with electric charge; On photosensitive material, diverse location current potential is different, and the functional ink powder of N+1 kind is optionally adsorbed on the light part of photosensitive material or non-light part, and now, on photosensitive material, the electrostatic latent image of circuit is converted into visual ink powder circuit image, completes developing process;
Step 10-1, photosensitive material will be formed the functional ink powder of N+1 kind of visual ink powder circuit image, is transferred on the substrate of a circuit forming surface layer in step 61-1 by Electrostatic Absorption technology or hot pressing and sintering technique or technology that the two combines; The substrate of a now circuit forming surface layer is coated with the functional ink powder of N+1 kind;
Step 11-1, the substrate of a circuit forming surface layer of the functional ink powder of covering N+1 kind is placed in baking oven toast, baking temperature is lower than the softening temperature of substrate or denaturation temperature, and higher than the sintering temperature of the functional material in the functional ink powder of N+1 kind, make the substrate of a circuit forming surface layer forms circuit layer again;
Step 12-1, repeats step 21-1 to step 11-1, obtains and have the multi-functional printed electronics product of single-surface single-layer;
Step 13-1, repeats step 21-1 to step 12-1, forms circuit layer on the surface, obtain the multi-functional printed electronics product of two-sided individual layer at another with the multi-functional printed electronics product of single-surface single-layer.
9. the method for the multi-functional printed electronics product of two-sided individual layer is prepared in employing photoinduction according to claim 8, it is characterized in that,
Described light beam is a kind of, two or more combination in X ray, gamma-rays, laser, LED light, visible ray, ultraviolet or infrared ray;
The described functional ink powder of N+1 kind with electric charge is coated with functional ink powder, wherein include the organism of functional material, functional material wherein comprises conductive material, capacitance material, resistance material, inductive material, insulating material, superconductor, semiconductor material, dielectric substance, magnetic material, photoelectric material, thermoelectric material, thermo-sensitive material, absorbing material or electronic package material;
Described substrate is the substrate that a kind of, two or more potpourri in macromolecule, glass, pottery or biomaterial are made, and this substrate is rigidity or flexibility;
After described photosensitive material refers to that light is irradiated, the material that chargeding performance or electric conductivity change.
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Cited By (1)
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| CN106926461A (en) * | 2017-04-27 | 2017-07-07 | 重庆英泰帝克科技有限公司 | A kind of aseptic printing production lines of medical 3D |
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