CN105116009B - One kind heating analogue means and heat pipe heat radiation device for detecting performance - Google Patents
One kind heating analogue means and heat pipe heat radiation device for detecting performance Download PDFInfo
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- CN105116009B CN105116009B CN201510489998.0A CN201510489998A CN105116009B CN 105116009 B CN105116009 B CN 105116009B CN 201510489998 A CN201510489998 A CN 201510489998A CN 105116009 B CN105116009 B CN 105116009B
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Abstract
The invention provides one kind heating analogue means and heat pipe heat radiation device for detecting performance, the heating analogue means to include：Central processing unit, for controlling the operating voltage of linear power supply, and the temperature value gathered according to first Temperature sampler and second temperature collector controls the adjustment of the operating voltage of linear power supply；Linear power supply, the operating voltage control parameter for being sent according to central processing unit is operated voltage adjustment, and heater element is powered；Heater element, generated heat for the operating voltage according to linear power supply；First Temperature sampler, central processing unit is sent to for gathering environment temperature, and by environment temperature；Second temperature collector, central processing unit is sent to for gathering the surface temperature of heater element, and by the surface temperature of heater element.The present invention can be preferably to IC chip heating simulate, and by simulate heating realize heat pipe heat dispersion digital quantization, the detection for realizing heat pipe more rapidly and efficiently.
Description
Technical field
The present invention relates to communication equipment technical field of measurement and test, more particularly to a kind of heating analogue means and heat pipe heat radiation performance
Detection means.
Background technology
With the densification of integrated circuit, complicate development, caused heat is also therewith at work for its electronic component
Increase severely, raise component temperature, the normal work of component is had an impact.Therefore, it is necessary to heat abstractor is installed to ensure
The heating element such as central processing unit or other high temperature chips normal work at a proper temperature.But how to ensure to install
Heat abstractor disclosure satisfy that the cooling requirements of component or chip need just realize by repeatedly testing.At present in industry
The test majority of heating and the radiating of the big IC chip of the caloric values such as FPGA is realized by the way of software emulation, passes through heat
Simulation software simulates IC caloric value size.Moreover, commercially the control to temperature and collection are all using integration
Temperature acquisition equipment, realizing for steady temperature be less desirable.
Existing heat abstractor improves heat-sinking capability using hot pipe technique.But heat pipe is in manufacture and transportation
Collision be all easy to produce the difficult slight crack seen of naked eyes, cause the vacuum in cavity to decline and substantially reduce its capacity of heat transmission,
And these slight cracks are difficult to be detected with visual inspection method, thus can only opposite heat tube one by one heat dispersion detected so that it is determined that
Whether it is qualified.And the method for testing of in general heat pipe for thermal conductivity performance, it is the one end for using hand-held heat pipe, its other end is immersed into heat
In water, judge whether the heat conductivility of heat pipe can meet to want with the temperature sensation of hand opposite heat tube handheld terminal after a period of time
Ask, this method of testing is less efficient, and it is mainly judged by the subjective sensation of people in addition, without quantizating index, inspection
It is very inaccurate to survey result.
The method of testing of FPGA radiatings is realized by computer simulation emulation mostly in the prior art, but actual FPGA works
Heat dissipation problem is also with indoor temperature and related to heat pipe contact face smoothness etc. practical factor, so passing through computer simulation
The method for emulating FPGA work and radiating is difficult really to reflect the real work situation of heat-pipe radiating apparatus in RRU.And
And the firm power of thermal source, steady temperature adjusting method in industry have various ways, for example with temperature controller, but testing efficiency
It is excessively poorly efficient, be not suitable for the production of batch.
The content of the invention
In view of the above problems, it is proposed that the present invention so as to provide one kind overcome above mentioned problem or at least in part solve or
Person slows down the heating analogue means and heat pipe heat radiation device for detecting performance of above mentioned problem, with realize heat pipe heat radiation performance it is quick,
Efficient detection.
According to an aspect of the invention, there is provided a kind of heating analogue means, the device includes central processing unit, linear
Power supply, heater element, the first Temperature sampler and second temperature collector；
Central processing unit, for controlling the operating voltage of the linear power supply, and according to first Temperature sampler and
The temperature value of second temperature collector collection controls the adjustment of the operating voltage of the linear power supply；
Linear power supply, the operating voltage control parameter for being sent according to the central processing unit are operated voltage tune
It is whole, and the heater element is powered；
Heater element, for being generated heat according to the operating voltage of the linear power supply；
First Temperature sampler, the central processing unit is sent to for gathering environment temperature, and by the environment temperature；
Second temperature collector, for gathering the surface temperature of heater element, and by the surface temperature of the heater element
It is sent to the central processing unit.
Optionally, the linear power supply is linear programmable power supply, and the operating voltage of the linear programmable power supply is 24V-
32V。
Optionally, described device also includes switching switch, the switching switch be connected to the central processing unit with it is linear
Between power supply, for receiving the operating voltage control parameter of the central processing unit transmission, and controlled according to the operating voltage
Parameter switches over to the operating voltage of the linear power supply.
Optionally, first Temperature sampler is room temperature collector, the environment temperature that the room temperature collector will collect
Degree is sent to the central processing unit by CDMA/GPRS wireless networks.
According to another aspect of the present invention, there is provided a kind of heat pipe heat radiation device for detecting performance, the device include temperature
Detection means and any of the above-described heating analogue means；
The heating analogue means, heat pipe side to be measured is placed in, the heat pipe to be measured is added for simulating IC chip
Heat；Temperature-detecting device, for detecting the temperature value of the heat pipe to be measured in real time, the heating analogue means is according to the temperature
The temperature value of the heat pipe to be measured of detection means detection determines the rate of heat dissipation of heat pipe to be measured.
Optionally, the heat pipe to be measured is the heat pipe installed in cabinet inside.
Optionally, the central processing unit in the heating analogue means receives the described of temperature-detecting device detection and treated
The temperature value of calorimetric pipe, and dissipating for the heat pipe to be measured is calculated according to the temperature value of the heat pipe to be measured received at different moments
Heating rate.
Optionally, the central processing unit arbitrarily detects described to be measured twice with specific reference to the temperature-detecting device
The ratio of the difference of the temperature value of heat pipe and the time interval of detection time twice, obtains the rate of heat dissipation of the heat pipe to be measured,
Formula is：
Wherein, h is rate of heat dissipation, C1For the first collecting temperature value, C2For the second collecting temperature value, t is the time gathered twice
Interval.
Optionally, the central processing unit in the heating analogue means is additionally operable to control the line in the heating analogue means
The cut-out of property power supply.
Beneficial effects of the present invention are：
Heating analogue means and heat pipe heat radiation device for detecting performance provided by the invention, are controlled using CPU with linear power supply
The power of heating block processed is heated its opposite heat tube to simulate the operational heat amount of IC chip, by reading heat pipe in real time
Heat dispersal situations dissolve the heat dispersion of heat pipe so as to digital quantity, realize the detection of the heat dispersion of heat pipe more rapidly and efficiently,
And heat pipe heat radiation performance can also be subjected to digital quantization so that the production of heat pipe heat radiation performance detection.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, and in order to allow above and other objects of the present invention, feature and advantage can
Become apparent, below especially exemplified by the embodiment of the present invention.
Brief description of the drawings
By reading the detailed description of hereafter preferred embodiment, it is various other the advantages of and benefit it is common for this area
Technical staff will be clear understanding.Accompanying drawing is only used for showing the purpose of preferred embodiment, and is not considered as to the present invention
Limitation.And in whole accompanying drawing, identical part is denoted by the same reference numerals.In the accompanying drawings：
Fig. 1 is a kind of structural representation of analogue means that generates heat provided in an embodiment of the present invention；
Fig. 2 is a kind of structural representation of heat pipe heat radiation device for detecting performance provided in an embodiment of the present invention.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
Those skilled in the art of the present technique are appreciated that unless expressly stated, singulative " one " used herein, " one
It is individual ", " described " and "the" may also comprise plural form.It is to be further understood that what is used in the specification of the present invention arranges
Diction " comprising " refer to the feature, integer, step, operation, element and/or component be present, but it is not excluded that in the presence of or addition
One or more other features, integer, step, operation, element, component and/or their groups.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein (including technology art
Language and scientific terminology), there is the general understanding identical meaning with the those of ordinary skill in art of the present invention.Should also
Understand, those terms defined in such as general dictionary, it should be understood that have with the context of prior art
The consistent meaning of meaning, and unless by specific definitions, otherwise will not be explained with the implication of idealization or overly formal.
Fig. 1 is a kind of structural representation of analogue means that generates heat provided in an embodiment of the present invention, as shown in figure 1, the device
Including central processing unit 110, linear power supply 120, heater element 130, the first Temperature sampler 140 and second temperature collector
150；
Described central processing unit 110, for controlling the operating voltage of the linear power supply, and according to first temperature
Collector and the temperature value of second temperature collector collection control the adjustment of the operating voltage of the linear power supply；
Described linear power supply 120, the operating voltage control parameter for being sent according to the central processing unit carry out work
Make voltage adjustment, and the heater element is powered；
Described heater element 130, for being generated heat according to the operating voltage of the linear power supply；
The first described Temperature sampler 140, for gathering environment temperature, and by the environment temperature be sent to it is described in
Central processor；
Described second temperature collector 150, for gathering the surface temperature of heater element, and by the heater element
Surface temperature is sent to the central processing unit.
In the embodiment of the present invention, the control of heating analogue means, this dress are realized by the linear voltage regulation to heater element
By being sampled to the real time temperature of heater element in putting, and sample temperature is fed back into central processor CPU, CPU passes through internal
The operating voltage of preset algorithm Linear Control linear power supply, further realizes the control of heating element generating heat power, makes its heating
Temperature is maintained on steady state value, so as to reach the effect of steady temperature, simulates IC chip, such as FPGA real work effect
Fruit.
Further, the heating analogue means that the embodiment of the present invention proposes also includes switching switch, and the switching switch connects
It is connected between the central processing unit and linear power supply, ginseng is controlled for receiving the operating voltage that the central processing unit is sent
Number, and the operating voltage of the linear power supply is switched over according to the operating voltage control parameter.
Described heating analogue means realizes the process of simulation heating by three phases, specific as follows：
First stage, high-power quick heating adapted to the demand of batch production quick detection, and second stage is turned down power and reached
More accurately analog chip heating temp；Phase III continuous power heats, true according to heat emulation data approximation product work
Truth condition simulates the heat pipe course of work.Automatic lifting controller is completed system with reference to three stepwise heating modes and realized.
In the embodiment of the present invention, the linear power supply is linear programmable power supply, the operating voltage of the linear programmable power supply
For 24V-32V.CPU controls linear power supply to be worked between 24V~32V by switching switch, so as to control the work(of heating block
Rate from 115W to 180W between work, while gather room temperature and heating block temperature feedback and pass through series of algorithms to CPU, CPU
The power of control heating block reaches constant 150 degree of temperature, to keep heating block constant constant at 150 degree, it would be desirable to
Once being monitored every 1S kinds, monitoring value is two Temperature samplers configured on device, distinguishes device outside external cavity,
Heating block outer surface.To gather 2 temperature values：Indoor temperature C1, heating deblocking temperature C2, the voltage-controlled coefficient of conversion h of temperaturev/1℃, pass through
The cutting edge aligned voltage-controlled value V of below equation conversion：
V=(150 DEG C of-C2-C1)*hv/1℃
Further, first Temperature sampler is room temperature collector, the environment that the room temperature collector will collect
Temperature is sent to the central processing unit by CDMA/GPRS wireless networks.Added in detection process of the present invention according to interior
The step of environment temperature is modified, the temperature that CPU gathers according to room temperature collector, and using the temperature as temperature variation curve
A reference value, missed for the environment that is introduced during subsequent correction simulation heating and digital quantization heat pipe heat radiation ability
Difference.
In order to realize the heating simulation to IC chips such as FPGA and the quantization of the heat pipe heat radiation performance of measured workpiece, this hair
Bright embodiment provides a kind of heat pipe heat radiation device for detecting performance, as shown in Fig. 2 the heat pipe heat radiation device for detecting performance includes
Temperature-detecting device 200 and any of the above-described heating analogue means 100；
The heating analogue means 100, is placed in heat pipe side to be measured, and the heat pipe to be measured is carried out for simulating IC chip
Heating；Temperature-detecting device 200, for detecting the temperature value of the heat pipe to be measured, the heating basis of analogue means 100 in real time
The temperature value for the heat pipe to be measured that the temperature-detecting device 200 detects determines the rate of heat dissipation of heat pipe to be measured.
The embodiment of the present invention is by will propose that different heat amount is applied in heating analogue means position in another embodiment of the present invention
It is added on heat pipe to be measured, the heating power of the IC chips such as FPGA is simulated in this way, wherein the heater element can
To be realized using electrical heating block.
Further, the heat pipe to be measured is the heat pipe installed in cabinet inside, for such as cabinet inside such as RRU cabinets heat
The heat dispersion of pipe makes quick analysis, and then evaluates the quality of case radiation ability.Itd is proposed in the embodiment of the present invention
Heat pipe heat radiation device for detecting performance, heat pipe heat radiation performance is realized by the fall off rate of heat pipe temperature after pyrotoxin contact heat pipe
Digital quantization function..
Further, the central processing unit in the heating analogue means receives the described of the temperature-detecting device detection
The temperature value of heat pipe to be measured, and the heat pipe to be measured is calculated according to the temperature value of the heat pipe to be measured received at different moments
Rate of heat dissipation.
Further, the central processing unit arbitrarily detected twice with specific reference to the temperature-detecting device described in treat
The ratio of the difference of the temperature value of calorimetric pipe and the time interval of detection time twice, obtains the radiating of the heat pipe to be measured
Rate, formula are：
Wherein, h is rate of heat dissipation, C1For the first collecting temperature value, C2For the second collecting temperature value, t is the time gathered twice
Interval.
The embodiment of the present invention,
Temperature-detecting device is laid on the lower chamber pipe of our heat pipes in cabinet, using CPU to temperature-detecting device
The heat pipe temperature collected obtains in real time, and according to the temperature value obtained in good time, the time declined by temperature judges RRU heat pipes
Heat-sinking capability, it is expected rate of heat dissipation h1℃/S, said below by taking the heat-sinking capability that tested RRU cavitys requirement reaches as an example
It is bright：
Desired rate of heat dissipation is：h1=5 DEG C/s, we implement the heat pipe temperature of collection, at interval of 15S collecting temperatures C1,
C2, obtain actual rate of heat dissipation:
Work as h2>h1It can determine that the radiating love ability of heat conducting pipe meets the requirements.
Further, the central processing unit in the heating analogue means is additionally operable to control in the heating analogue means
The cut-out of linear power supply.In production process, heat pipe heat radiation device for detecting performance, to being added in the consideration in terms of safety test
Heartbeat detection mechanism, when in detection process be used for detect control and presentation of information top level computer without response or it is artificial because
After element causes communication restricting the number to be interrupted, CPU can automatically cut off linear power supply power supply according to the result of heartbeat detection, ensure the peace of production
Entirely.
Through the above description of the embodiments, those skilled in the art can be understood that the present invention can lead to
Hardware realization is crossed, the mode of necessary general hardware platform can also be added by software to realize.Based on such understanding, this hair
Bright technical scheme can be embodied in the form of software product, and the software product can be stored in a non-volatile memories
In medium (can be CD-ROM, USB flash disk, mobile hard disk etc.), including some instructions are causing a computer equipment (can be
Personal computer, server, or network equipment etc.) perform method described in each embodiment of the present invention.
It will be appreciated by those skilled in the art that accompanying drawing is the schematic diagram of a preferred embodiment, module or stream in accompanying drawing
Journey is not necessarily implemented necessary to the present invention.
It will be appreciated by those skilled in the art that the module in device in embodiment can describe be divided according to embodiment
It is distributed in the device of embodiment, respective change can also be carried out and be disposed other than in one or more devices of the present embodiment.On
The module for stating embodiment can be merged into a module, can also be further split into multiple submodule.
Disclosed above is only several specific embodiments of the present invention, and still, the present invention is not limited to this, any ability
What the technical staff in domain can think change should all fall into protection scope of the present invention.
Claims (9)
1. one kind heating analogue means, it is characterised in that adopted including central processing unit, linear power supply, heater element, the first temperature
Storage and second temperature collector；
Central processing unit, for controlling the operating voltage of the linear power supply, and according to first Temperature sampler and second
The temperature value of Temperature sampler collection controls the adjustment of the operating voltage of the linear power supply；
Linear power supply, the operating voltage control parameter for being sent according to the central processing unit are operated voltage adjustment, and
The heater element is powered；
Heater element, for being generated heat according to the operating voltage of the linear power supply；
First Temperature sampler, the central processing unit is sent to for gathering environment temperature, and by the environment temperature；
Second temperature collector, sent for gathering the surface temperature of heater element, and by the surface temperature of the heater element
To the central processing unit.
2. heating analogue means according to claim 1, it is characterised in that the linear power supply is linear programmable power supply,
The operating voltage of the linear programmable power supply is 24V-32V.
3. heating analogue means according to claim 1, it is characterised in that described device also includes switching switch, described
Switching switch is connected between the central processing unit and linear power supply, the work electricity sent for receiving the central processing unit
Control parameter is pressed, and the operating voltage of the linear power supply is switched over according to the operating voltage control parameter.
4. heating analogue means according to claim 1, it is characterised in that first Temperature sampler gathers for room temperature
The environment temperature collected is sent to the central processing unit by device, the room temperature collector by CDMA/GPRS wireless networks.
5. a kind of heat pipe heat radiation device for detecting performance, it is characterised in that described device includes temperature-detecting device and such as right
It is required that any one of 1-4 heating analogue means；
The heating analogue means, heat pipe side to be measured is placed in, the heat pipe to be measured is heated for simulating IC chip；Temperature
Detection means is spent, for detecting the temperature value of the heat pipe to be measured in real time, the heating analogue means is according to the temperature detection
The temperature value of the heat pipe to be measured of device detection determines the rate of heat dissipation of heat pipe to be measured.
6. device according to claim 5, it is characterised in that the heat pipe to be measured is the heat pipe installed in cabinet inside.
7. device according to claim 5, it is characterised in that the central processing unit in the heating analogue means receives institute
The temperature value of the heat pipe to be measured of temperature-detecting device detection is stated, and according to the heat pipe to be measured received at different moments
Temperature value calculates the rate of heat dissipation of the heat pipe to be measured.
8. device according to claim 7, it is characterised in that the central processing unit fills with specific reference to the temperature detection
The ratio of the difference of the temperature value of any heat pipe to be measured detected twice and the time interval of detection time twice is put,
The rate of heat dissipation of the heat pipe to be measured is obtained, formula is：
<mrow>
<mi>h</mi>
<mo>=</mo>
<mfrac>
<mrow>
<msub>
<mi>C</mi>
<mn>1</mn>
</msub>
<mo>-</mo>
<msub>
<mi>C</mi>
<mn>2</mn>
</msub>
</mrow>
<mi>t</mi>
</mfrac>
</mrow>
Wherein, h is rate of heat dissipation, C1For the first collecting temperature value, C2For the second collecting temperature value, t is between the time gathered twice
Every.
9. device according to claim 5, it is characterised in that the central processing unit in the heating analogue means is additionally operable to
Control the cut-out of the linear power supply in the heating analogue means.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN109188237B (en) * | 2018-06-12 | 2021-07-27 | 中车大连电力牵引研发中心有限公司 | Circuit board heat dissipation simulation assembly |
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| CN110673015B (en) * | 2019-09-28 | 2021-09-03 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Test method for simulating heating power and surface temperature of chip |
| CN112105225B (en) * | 2020-09-08 | 2022-04-22 | 苏州浪潮智能科技有限公司 | Heat dissipation control method, device and equipment |
| CN112268924A (en) * | 2020-10-19 | 2021-01-26 | 郑州轻冶科技股份有限公司 | Detection method and detection system for heat pipe exchanger |
| CN115064044A (en) * | 2022-08-05 | 2022-09-16 | 南昌三瑞智能科技有限公司 | Motor heating simulation and control assembly and experimental method |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201218919Y (en) * | 2008-06-24 | 2009-04-08 | 中控科技集团有限公司 | Temperature control system of loom edge hot-melting apparatus |
| CN102244048A (en) * | 2010-05-14 | 2011-11-16 | 英业达股份有限公司 | Double-chip simulator and double-chip simulation heat dissipation system |
| CN202075250U (en) * | 2011-04-27 | 2011-12-14 | 绍兴文理学院 | Thermal testing device comprising external control power supply, data acquisition unit and heater |
| CN202126420U (en) * | 2011-06-10 | 2012-01-25 | 金安国纪科技（珠海）有限公司 | Heat resistance detecting component for PCB (Printed circuit board) |
| CN102495100A (en) * | 2011-11-15 | 2012-06-13 | 上海卫星工程研究所 | Test device for testing operating life of heat pipe |
| CN102621177A (en) * | 2011-01-26 | 2012-08-01 | 鸿富锦精密工业（深圳）有限公司 | Heat tube testing machine, and heat tube testing system using the same |
| CN105122968B (en) * | 2008-06-27 | 2013-01-02 | 上海卫星工程研究所 | Vacuum environment lower member measuring system for thermal deformation and measuring method thereof |
| CN104006983A (en) * | 2014-06-05 | 2014-08-27 | 柳州职业技术学院 | Intelligent test system for heat resistance of CPU radiator and test method of intelligent test system |
| CN203824950U (en) * | 2014-04-09 | 2014-09-10 | 普罗旺斯科技（深圳）有限公司 | Cooling tester |
| CN104374798A (en) * | 2014-10-31 | 2015-02-25 | 上海卫星工程研究所 | System and method for testing equivalent emissivity of electrically controlled heat shield |
| CN104677934A (en) * | 2015-03-11 | 2015-06-03 | 工业和信息化部邮电工业标准化研究所 | Heat transfer coefficient testing system and method for cabinet body |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4468135A (en) * | 1983-02-01 | 1984-08-28 | Kraft, Inc. | Retort pouch thermal simulator and method of optimizing heat transfer in retort conditions |
| US6942018B2 (en) * | 2001-09-28 | 2005-09-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electroosmotic microchannel cooling system |
| CN102243110A (en) * | 2011-04-20 | 2011-11-16 | 株洲时代散热技术有限公司 | Method and device for testing thermal resistance of radiator of electric power semiconductor element |
| JP2013181761A (en) * | 2012-02-29 | 2013-09-12 | Toppan Printing Co Ltd | Method and device for evaluating flux activity for solder joint |
-
2015
- 2015-08-11 CN CN201510489998.0A patent/CN105116009B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201218919Y (en) * | 2008-06-24 | 2009-04-08 | 中控科技集团有限公司 | Temperature control system of loom edge hot-melting apparatus |
| CN105122968B (en) * | 2008-06-27 | 2013-01-02 | 上海卫星工程研究所 | Vacuum environment lower member measuring system for thermal deformation and measuring method thereof |
| CN102244048A (en) * | 2010-05-14 | 2011-11-16 | 英业达股份有限公司 | Double-chip simulator and double-chip simulation heat dissipation system |
| CN102621177A (en) * | 2011-01-26 | 2012-08-01 | 鸿富锦精密工业（深圳）有限公司 | Heat tube testing machine, and heat tube testing system using the same |
| CN202075250U (en) * | 2011-04-27 | 2011-12-14 | 绍兴文理学院 | Thermal testing device comprising external control power supply, data acquisition unit and heater |
| CN202126420U (en) * | 2011-06-10 | 2012-01-25 | 金安国纪科技（珠海）有限公司 | Heat resistance detecting component for PCB (Printed circuit board) |
| CN102495100A (en) * | 2011-11-15 | 2012-06-13 | 上海卫星工程研究所 | Test device for testing operating life of heat pipe |
| CN203824950U (en) * | 2014-04-09 | 2014-09-10 | 普罗旺斯科技（深圳）有限公司 | Cooling tester |
| CN104006983A (en) * | 2014-06-05 | 2014-08-27 | 柳州职业技术学院 | Intelligent test system for heat resistance of CPU radiator and test method of intelligent test system |
| CN104374798A (en) * | 2014-10-31 | 2015-02-25 | 上海卫星工程研究所 | System and method for testing equivalent emissivity of electrically controlled heat shield |
| CN104677934A (en) * | 2015-03-11 | 2015-06-03 | 工业和信息化部邮电工业标准化研究所 | Heat transfer coefficient testing system and method for cabinet body |
Non-Patent Citations (1)
| Title |
|---|
| 多芯片平板热管散热器性能的实验研究;韩晓星等;《制冷学报》;20121231;第33卷(第6期) * |
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