CN102244048A - Double-chip simulator and double-chip simulation heat dissipation system - Google Patents
Double-chip simulator and double-chip simulation heat dissipation system Download PDFInfo
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- CN102244048A CN102244048A CN2010101801738A CN201010180173A CN102244048A CN 102244048 A CN102244048 A CN 102244048A CN 2010101801738 A CN2010101801738 A CN 2010101801738A CN 201010180173 A CN201010180173 A CN 201010180173A CN 102244048 A CN102244048 A CN 102244048A
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Abstract
The invention relates to a double-chip simulator and a double-chip simulation heat dissipation system. The double-chip simulator is applicable to simulation of heating situations of two chips. The double-chip simulator comprises a heat conducting block and two heating sources, wherein the heat conducting block has a test surface and a heating surface which are opposite to each other; the two heating sources are contacted with the heating surface respectively; the heat conducting block also comprises a lug boss protruded out of the test surface; the test surface is contacted with a heat dissipation module so as to form the double-chip simulation heat dissipation system; the double-chip simulation heat dissipation system is applicable to simulation of heat dissipation situations of the two chips; the heat dissipation module comprises a heating tube; and the position of the heating tube is adjusted to detect whether the heat dissipation module meets the requirement of the heat dissipation of the two chips.
Description
Technical field
The present invention relates to a kind of heater and cooling system thereof, particularly a kind of twin-core sheet analogue means and cooling system thereof.
Background technology
Because Information technology develops fast, make live the more and more polynary change of information products kind of periphery of people, the function of information products embraces a wide spectrum of ideas especially.In such environment, between information products manufacturer in order to obtain preferable competitive advantage, how to promote and the quality that guarantees product people are required to become important content in the activity of information products manufacturer to meet.In order to promote and to guarantee the quality of product and reach people's demand, be indispensable for the grasp of product quality.Wherein, the manufacturer of information products can be tested the product that is about to dispatch from the factory by the demand condition of product, and then guarantees the product quality that people bought.
In recent years, along with the raising of computer speed and performance, the central processing unit of computer-internal and the heating of other chip and heat dissipating state more and more come into one's own.Wherein, the chip manufacturing chamber of commerce designs the hot test chip that has with the identical heating system of real chip in addition according to the actual heating situation of chip, and this hot test chip is supplied to the assembly plant of computer, formulates the radiating requirements of computer for the assembly plant of computer.Afterwards, the assembly plant of computer passes to the manufacturer of radiating module with the radiating requirements of this computer, with design and the manufacturing of carrying out radiating module.Because, the quantity rareness of these hot test chips, so the manufacturer of radiating module tends to replace hot test chip with the heat block of even heating before shipment, and each radiating module is advanced test.
But there is the framework of new chip in current chip manufacturer, central processing unit (Central ProcessorUnit wherein, CPU) be to be incorporated in the same encapsulation (package) with north bridge (North Bridge), and in running, central processing unit and north bridge can be supported mutually.Yet at the framework of so new chip, the present way of radiating module manufacturer is still with a heater and simulates central processing unit and the north bridge that is incorporated into same encapsulation, and tests.This measure will be different with the actual operation of the central processing unit of computer-internal and north bridge and can't obtain the result of true radiating module running.
Summary of the invention
In view of above problem, the disclosed twin-core sheet of the present invention analogue means is the heating situation that can simulate two chips in the single encapsulation, apace and exactly a radiating module is detected.
The disclosed twin-core sheet of the present invention analogue means is in order to simulate the heating situation of two chips.According to one embodiment of the invention, twin-core sheet analogue means comprises heat-conducting block and two heating sources, and heat-conducting block has the test surfaces respect to one another and the area of heating surface, and two heating sources contact with the area of heating surface respectively, when two heating sources produced heat, test surfaces produced two high-temperature areas.
According to one embodiment of the invention, test surfaces has groove, and groove is between two high-temperature areas.
According to one embodiment of the invention, heat-conducting block has two protuberances, and two protuberance self-tests surfaces is outwards outstanding, and the size of two protuberances measure-alike with two chips respectively, the spacing of two protuberances is identical with the spacing of two chips, and the height of the two protuberances height with two chips respectively is identical.
The disclosed twin-core sheet simulation of the present invention cooling system is in order to simulate the heat dissipating state of two chips.According to one embodiment of the invention, twin-core sheet simulation cooling system comprises twin-core sheet analogue means and radiating module.Twin-core sheet analogue means comprises heat-conducting block and two heating sources, and heat-conducting block has the test surfaces respect to one another and the area of heating surface, and two heating sources contact with the area of heating surface respectively, and radiating module contacts with test surfaces.
According to one embodiment of the invention, radiating module comprises heat pipe.
According to one embodiment of the invention, the two heating source along continuous straight runs that contact with the area of heating surface are arranged, the axial and horizontal direction parallel of heat pipe.
According to one embodiment of the invention, the two heating source along continuous straight runs that contact with the area of heating surface are arranged, heat pipe axially vertical with horizontal direction.
According to one embodiment of the invention, heat-conducting block has two protuberances, two protuberance self-tests surface is outwards outstanding, and the size of two protuberances is measure-alike with two chips respectively, the spacing of two protuberances is identical with the spacing of two chips, the height of the two protuberances height with two chips respectively is identical, and radiating module contacts with two protuberances.
According to one embodiment of the invention, radiating module comprises heat pipe.
According to one embodiment of the invention, two protuberance along continuous straight runs are arranged, the axial and horizontal direction parallel of heat pipe.
According to one embodiment of the invention, two protuberance along continuous straight runs are arranged, heat pipe axially vertical with horizontal direction.
According to the disclosed twin-core sheet of the present invention analogue means, because two above-mentioned heating sources contact with the area of heating surface respectively, therefore when these heating sources are in operating state, test surfaces can produce the high-temperature region of two correspondences, so the present invention can simulate the actual heating situation of two chips that are positioned at single encapsulation.In addition, the present invention can also be disposed at the heat pipe of radiating module on the twin-core sheet analogue means, to simulate the actual performance of this radiating module when being installed in the encapsulation with two chips.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Figure 1A is the cross-sectional view that the twin-core sheet analogue means according to the first embodiment of the present invention is connected with heating controller;
Figure 1B is the plan structure schematic diagram of the twin-core sheet analogue means of Figure 1A;
Fig. 1 C be Figure 1A twin-core sheet analogue means the Temperature Distribution schematic diagram;
Fig. 2 A is the cross-sectional view that the twin-core sheet analogue means according to the second embodiment of the present invention is connected with heating controller;
Fig. 2 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 2 A;
Fig. 3 A is the cross-sectional view that the twin-core sheet analogue means according to the third embodiment of the present invention is connected with heating controller;
Fig. 3 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 3 A;
Fig. 4 A is the cross-sectional view that the twin-core sheet analogue means according to the fourth embodiment of the present invention is connected with heating controller;
Fig. 4 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 4 A;
Fig. 5 A is the cross-sectional view that the twin-core sheet analogue means according to the fifth embodiment of the present invention is connected with heating controller;
Fig. 5 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 5 A;
Fig. 6 A is the cross-sectional view that the twin-core sheet analogue means according to the sixth embodiment of the present invention is connected with heating controller;
Fig. 6 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 6 A;
Fig. 7 A is the cross-sectional view that the twin-core sheet analogue means according to the seventh embodiment of the present invention is connected with heating controller;
Fig. 7 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 7 A;
Fig. 8 A is the cross-sectional view that the twin-core sheet analogue means according to the eighth embodiment of the present invention is connected with heating controller;
Fig. 8 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 8 A;
Fig. 9 A is the cross-sectional view that the twin-core sheet analogue means according to the ninth embodiment of the present invention is connected with heating controller; And
Fig. 9 B is the plan structure schematic diagram of the twin-core sheet analogue means of Fig. 9 A.
Wherein, Reference numeral
100,200,300 twin-core sheet analogue means
102,202,302 heat-conducting blocks
104,204,304 heating sources
106,206,306 heating sources
108,208,308 test surfaces
109 storage tanks
110,210,310 areas of heating surface
1111,1112 high-temperature areas
112,214,316 heat pipes
113,213,315 heating controllers
212 grooves
114,216,318 radiating blocks
116,218,320 radiating modules
312,314 protuberances
400,500,600 twin-core sheets simulation cooling system
700,800,900 twin-core sheets simulation cooling system
A, C, E direction
B, D, F are axial
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and operation principle are done concrete description:
The twin-core sheet analogue means of the disclosed embodiment of the present invention is applicable to that simulation has the heating situation of the encapsulation of two chips.For example, twin-core sheet analogue means can be in order to central processing unit (the Central Processor Unit that is configured in same encapsulating carrier plate on the simulation framework plate, CPU), but be not in order to limit the present invention with the heating situation of north bridge (North Bridge).
Please refer to Figure 1A and Figure 1B, it is respectively to be the section of the foundation first embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet analogue means 100 comprises heat-conducting block 102, heating source 104 and heating source 106.Heat-conducting block 102 has the test surfaces 108 respect to one another and the area of heating surface 110, and heating source 104 can directly contact with the area of heating surface 110 respectively with heating source 106, but not as limit.For example, heating source 104 also can contact with the area of heating surface 110 respectively by welding manner with heating source 106.In addition, heating source 104 also can be configured in via heat-conducting cream on the area of heating surface 110 with heating source 106.When heating source 104 produced heat with heating source 106, test surfaces 108 was to produce high-temperature area 1111 and high-temperature area 1112, shown in Fig. 1 C.Above-mentioned high-temperature area 1111 is meant in two peak values of the Temperature Distribution of test surfaces 108 that with high-temperature area 1112 it is configured in the central processing unit of same encapsulating carrier plate and the heating situation on north bridge surface in order to simulation respectively.Wherein, heat-conducting block 102 can be but is not limited to copper billet, and heat-conducting block 102 can be but be not limited to have the heat-conducting block of storage tank 109, and wherein, the bottom surface of storage tank 109 is the area of heating surface 110.
In the present embodiment, heating source 104 is connected at least one heating controller 113 respectively with heating source 106, heating controller 113 is controlled the unlatching of heating source 104 and heating source 106 discriminably or is closed, and also adjusts the power output of heating source 104 and heating source 106 discriminably.Wherein, the power output of heating source 104 and heating source 106 can be identical, also can be different, and to simulate the actual heating situation of central processing unit and north bridge on the single encapsulating carrier plate.
Below will the function mode of twin-core sheet analogue means 100 be described.For example, heating source 104 is in order to the simulation central processing unit, and heating source 106 is in order to be modeled as north bridge.So when the power output of heating source 104 was bigger than the power output of heating source 106, twin-core sheet analogue means 100 can be simulated when the load of the central processing unit situation during greater than the load of north bridge.
In the present embodiment, be configured in the central processing unit and the heating situation of north bridge on motherboard of same encapsulating carrier plate with simulation by heat-conducting block 102, heating source 104 and heating source 106, but owing to having one between central processing unit that in fact places same encapsulating carrier plate and the north bridge at interval, for more near actual state, in the foundation second embodiment of the present invention, can also make the test surfaces of heat-conducting block have groove, wherein this groove is between between two heating sources, and detailed description please refer to the second following embodiment.
Please refer to Fig. 2 A and Fig. 2 B, it is respectively according to the section of the second embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet analogue means 200 comprises heat-conducting block 202, heating source 204 and heating source 206.Heat-conducting block 202 has the test surfaces 208 respect to one another and the area of heating surface 210, test surfaces 208 has groove 212, when heating source 204 produces heat with heating source 206, test surfaces 208 produces two high-temperature areas (similar Fig. 1 C), groove 212 is between two high-temperature areas, and heating source 204 contacts with the area of heating surface 210 respectively with heating source 206.
In the present embodiment, heating source 204 is connected at least one heating controller 213 respectively with heating source 206, heating controller 213 is controlled the unlatching of heating source 204 and heating source 206 discriminably or is closed, and also adjusts the power output of heating source 204 and heating source 206 discriminably.Wherein, the power output of heating source 204 and heating source 206 can be identical, also can be different, simulating the heating situation of central processing unit and north bridge on the actual same encapsulating carrier plate, just give unnecessary details no longer in this more.
In the present embodiment, by the heat-conducting block 202 with groove 212 and heating source 204 and heating source 206 to simulate the heating situation of central processing unit and north bridge on the same encapsulating carrier plate, owing in fact place the central processing unit on the motherboard different with twin-core sheet analogue means 200 with the size (size of north bridge is bigger than the size of central processing unit) and the relativeness of north bridge, for more near actual state, again according in the third embodiment of the present invention, outwards outstanding two protuberances of the test surfaces of heat-conducting block, the size of two protuberances and relativeness are identical with the size and the relativeness that place central processing unit on the same encapsulating carrier plate and north bridge respectively.
Please refer to Fig. 3 A and Fig. 3 B, it is respectively according to the section of the third embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet analogue means 300 comprises heat-conducting block 302, heating source 304 and heating source 306.Heat-conducting block 302 has protuberance 312 and protuberance 314, protuberance 312 is outwards outstanding with protuberance 314 self-test surfaces 308, and the size of protuberance 312 and protuberance 314 respectively with same encapsulating carrier plate on central processing unit and north bridge measure-alike, the spacing of central processing unit and north bridge is identical on the spacing of protuberance 312 and protuberance 314 and the same encapsulating carrier plate, the height of protuberance 312 and protuberance 314 respectively with same encapsulating carrier plate on the height of central processing unit and north bridge identical.
In the present embodiment, heating source 304 is connected at least one heating controller 315 respectively with heating source 306, heating controller 315 is controlled the unlatching of heating source 304 and heating source 306 discriminably or is closed, and also adjusts the power output of heating source 304 and heating source 306 discriminably.Wherein, the power output of heating source 304 and heating source 306 can be identical, also can be different, simulating the heating situation of central processing unit and north bridge on the actual same encapsulating carrier plate, just give unnecessary details no longer in this more.
In the present embodiment, by having protuberance 312 heat-conducting block 302, heating source 304 and heating source 306 to simulate the heating situation of central processing unit and north bridge on the same encapsulating carrier plate with protuberance 314, since the size of protuberance 312 and protuberance 314 and situation relatively respectively with place central processing unit and north bridge on the same encapsulating carrier plate identical, twin-core sheet analogue means 300 is than the approaching actual heating situation that places central processing unit and north bridge on the same encapsulating carrier plate.
According to above-mentioned first embodiment to the, three embodiment, twin-core sheet analogue means can be by changing heat-conducting block with the heating situation near actual central processing unit and north bridge.In more detail, when the size of central processing unit and north bridge on the same encapsulating carrier plate of the approaching more reality of the test surfaces of heat-conducting block and relativeness, twin-core sheet analogue means is the central processing unit on the same encapsulating carrier plate of approaching more reality and the heating situation of north bridge just.
Based on above-mentioned twin-core sheet analogue means, the present invention can also be formulated in a radiating module twin-core sheet analogue means to constitute a pair of chip simulation cooling system, and to test the performance of radiating module fast and exactly, wherein radiating module comprises heat pipe.
Please refer to Fig. 4 A and Fig. 4 B, it is respectively according to the section of the fourth embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet simulation cooling system 400 comprises twin-core sheet analogue means 100 and radiating module 116.Wherein, radiating module 116 comprises heat pipe 112 and radiating block 114.Heat pipe 112 can contact (being heat pipe 112 indirect contact test surfaces 108) via radiating block 114 with test surfaces 108, in addition, heat pipe 112 also can directly contact with test surfaces 108, but present embodiment is not in order to limit the present invention.
Please continue the B with reference to Fig. 4, in the present embodiment, the heating source 104 that contacts with the area of heating surface 110 is arranged along direction A with heating source 106, and the axial B of heat pipe 112 is vertical with direction A.Wherein, the caliber of heat pipe 112 is greater than the spacing of heating source 104 with heating source 106, and radiating block 114 needs contact high-temperature area 1111 and high-temperature area 1112.Above-mentioned heating source 104 places same plane with heating source 106 along the side that is arranged as heating source 104 of direction A and a side of heating source 106, and direction A is and above-mentioned parallel plane direction that the axial B of heat pipe 112 is the direction that heat pipe 112 extends.
In the present embodiment, heating source 104 can be modeled as central processing unit, and heating source 106 can be modeled as north bridge, but present embodiment is not in order to limit the present invention.Because when actual test twin-core sheet is simulated cooling system 400, the power output of heating source 104 and heating source 106 can be respectively greater than thermal design power (the Thermal Design Power of central processing unit and north bridge, TDP), so when high-temperature area that the position of the configuration of heat pipe 112 deflection is produced in order to the heating source 104 of simulation central processing unit, radiating module 116 has preferable radiating effect.
In the present embodiment, the axial B of heat pipe 112 is vertical with horizontal direction A, but present embodiment is not in order to limit the present invention.For example, the axial B of heat pipe 112 also can be parallel with direction A.
Please refer to Fig. 5 A and Fig. 5 B, it is respectively according to the section of the fifth embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet simulation cooling system 500 comprises twin-core sheet analogue means 100 and radiating module 116.Radiating module 116 comprises heat pipe 112 and radiating block 114, and heat pipe 112 can contact with test surfaces 108 via radiating block 114.
In the present embodiment, the heating source 104 that contacts with the area of heating surface 110 is arranged along direction A with heating source 106, and the axial B of heat pipe 112 is parallel with direction A.Wherein, radiating block 114 needs contact high-temperature area 1111 and high-temperature area 1112.
The 4th above-mentioned embodiment and the 5th embodiment, twin-core sheet analogue means 100 is simulated the central processing unit on the same encapsulating carrier plate and the heating situation of north bridge by heat-conducting block 102 and heating source 104 and heating source 106, but in fact between central processing unit on the same encapsulating carrier plate and north bridge, have one at interval, can make twin-core sheet cooling system near actual state by heat-conducting block with groove.
Please refer to Fig. 6 A and Fig. 6 B, it is respectively according to the section of the sixth embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet simulation cooling system 600 comprises twin-core sheet analogue means 200 and radiating module 218.Radiating module 218 comprises heat pipe 214 and radiating block 216, and heat pipe 214 can contact with test surfaces 208 via radiating block 216.
Please continue the B with reference to Fig. 6, in the present embodiment, the heating source 204 that contacts with the area of heating surface 110 is arranged along direction C with heating source 206, and the axial D of heat pipe 214 is vertical with direction C.Wherein, the caliber of heat pipe 214 is greater than the spacing of heating source 204 with heating source 206, and radiating block 216 need contact two high-temperature areas (similar Fig. 1 C), and radiating block 216 can completely cover groove 212.Above-mentioned heating source 204 places same plane with heating source 206 along the side that is arranged as heating source 204 of direction C and a side of heating source 206, and direction C is and above-mentioned parallel plane direction that the axial D of heat pipe 214 is the direction that heat pipe 214 extends.
In the present embodiment, heating source 204 can be modeled as central processing unit, and heating source 206 can be modeled as north bridge, but present embodiment is not in order to limit the present invention.Carry out the test of twin-core sheet simulation cooling system 600, in the time of can finding high-temperature area that the position deflection heating source 204 of the configuration of heat pipe 214 produced, radiating module 218 has preferable radiating effect.
In the present embodiment, the axial D of heat pipe 214 is vertical with direction C, but present embodiment is not in order to restriction the present invention.For example, the axial D of heat pipe 214 also can be parallel with direction C.
Please refer to Fig. 7 A and Fig. 7 B, it is respectively according to the section of the seventh embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet simulation cooling system 700 comprises twin-core sheet analogue means 200 and radiating module 218.Radiating module 218 comprises heat pipe 214 and radiating block 216, and heat pipe 214 can contact with test surfaces 208 via radiating block 216.
In the present embodiment, the heating source 204 that contacts with the area of heating surface 110 is arranged along direction C with heating source 206, and the axial D of heat pipe 214 is parallel with direction C.Wherein, radiating block 216 needs contact two high-temperature areas (similar Fig. 1 C), and radiating block 216 can completely cover groove 212.
The 6th above-mentioned embodiment and the 7th embodiment, the spacing of simulating central processing unit and north bridge on the same encapsulating carrier plate by the width of groove 212 is with the heating situation near twin-core sheet on the actual same encapsulating carrier plate, but in fact place the central processing unit on the same encapsulating carrier plate different with the north bridge size, so with outwards outstanding two protuberances of the test surfaces of heat-conducting block, the size of two protuberances and relative situation respectively with place central processing unit and north bridge on the same encapsulating carrier plate identical.
Please refer to Fig. 8 A and Fig. 8 B, it is respectively according to the section of the eighth embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet simulation cooling system 800 comprises twin-core sheet analogue means 300 and radiating module 320.Radiating module 320 comprises heat pipe 316 and radiating block 318, and heat pipe 316 can contact with test surfaces 308 via radiating block 318, protuberance 312, protuberance 314.
Please continue the B with reference to Fig. 8, in the present embodiment, the heating source 304 that contacts with the area of heating surface 310 is arranged along direction E with heating source 306, and the axial F of heat pipe 316 is vertical with direction E.Wherein, the caliber of heat pipe 316 is greater than the spacing of protuberance 312 with protuberance 314, and radiating block 318 needs contact protuberance 312 and protuberance 314.Above-mentioned heating source 304 places same plane with heating source 306 along the side that is arranged as heating source 304 of direction E and a side of heating source 306, and direction E is and above-mentioned parallel plane direction that the axial F of heat pipe 316 is the direction that heat pipe 316 extends.
In the present embodiment, protuberance 312 can be modeled as central processing unit, and protuberance 314 can be modeled as north bridge, but present embodiment is not in order to limit the present invention.Carry out the test of twin-core sheet simulation cooling system 800, in the time of can finding the allocation position deflection protuberance 312 of heat pipe 316, radiating module 320 has preferable radiating effect.
In the present embodiment, the axial F of heat pipe 316 is vertical with direction E, but present embodiment is not in order to limit the present invention.For example, the axial F of heat pipe 316 also can be parallel with direction E.
Please refer to Fig. 9 A and Fig. 9 B, it is respectively according to the section of the ninth embodiment of the present invention and plan structure schematic diagram.In the present embodiment, twin-core sheet simulation cooling system 900 comprises twin-core sheet analogue means 300 and radiating module 320.Radiating module 320 comprises heat pipe 316 and radiating block 318, and heat pipe 316 can contact with test surfaces 308 via radiating block 318, protuberance 312, protuberance 314.
In the present embodiment, the heating source 304 that contacts with the area of heating surface 310 is arranged along direction E with heating source 306, and the axial F of heat pipe 316 is parallel with direction E.Wherein, radiating block 318 needs contact protuberance 312 and protuberance 314.
In the above embodiments, heating source can be ceramic heating flake or heating rod, but not as limit.
According to the disclosed twin-core sheet of the present invention analogue means, because two above-mentioned heating sources contact with the area of heating surface respectively, therefore when these heating sources are in operating state, test surfaces can produce the high-temperature region of two correspondences, so the present invention can simulate the actual heating situation of two chips that are positioned at single encapsulation.In addition, the present invention more can be disposed at the heat pipe of radiating module on the twin-core sheet analogue means, to simulate the actual performance of this radiating module when being installed in the encapsulation with two chips.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (9)
1. a twin-core sheet analogue means in order to simulate the heating situation of two chips, is characterized in that, this twin-core sheet analogue means comprises:
One heat-conducting block, this heat-conducting block have a test surfaces respect to one another and an area of heating surface; And
Two heating sources, those heating sources contact with this area of heating surface respectively, and when those heating sources produced heat, this test surfaces produced two high-temperature areas.
2. twin-core sheet analogue means according to claim 1 is characterized in that this test surfaces has a groove, and this groove is between those high-temperature areas.
3. twin-core sheet analogue means according to claim 1, it is characterized in that, this heat-conducting block has two protuberances, those protuberances are outwards outstanding from this test surfaces, and the size of those protuberances is measure-alike with those chips respectively, the spacing of those protuberances is identical with the spacing of those chips, and the height of those protuberances height with those chips respectively is identical.
4. a twin-core sheet simulation cooling system in order to simulate the heat dissipating state of two chips, is characterized in that, this twin-core sheet simulation cooling system comprises:
A pair of chip analogue means comprises a heat-conducting block and two heating sources, and this heat-conducting block has a test surfaces respect to one another and an area of heating surface, and those heating sources contact with this area of heating surface respectively; And
One radiating module, this radiating module contacts with this test surfaces.
5. twin-core sheet according to claim 4 simulation cooling system is characterized in that this radiating module comprises a heat pipe, and those heating sources that contacts with this area of heating surface are arranged along a direction, this heat pipe axial parallel with this direction.
6. twin-core sheet according to claim 4 simulation cooling system is characterized in that those heating sources that contacts with this area of heating surface are arranged along a direction, this heat pipe axial vertical with this direction.
7. twin-core sheet simulation cooling system according to claim 4, it is characterized in that, this heat-conducting block has two protuberances, those protuberances are outwards outstanding from this test surfaces, and the size of those protuberances is measure-alike with those chips respectively, the spacing of those protuberances is identical with the spacing of those chips, and the height of those protuberances height with those chips respectively is identical, and this radiating module contacts with those protuberances.
8. twin-core sheet according to claim 7 simulation cooling system is characterized in that this radiating module comprises a heat pipe, and those protuberances are arranged along a direction, this heat pipe axial parallel with this direction.
9. twin-core sheet according to claim 7 simulation cooling system is characterized in that this radiating module comprises a heat pipe, and those protuberances are arranged along a direction, this heat pipe axial vertical with this direction.
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| CN201010180173.8A CN102244048B (en) | 2010-05-14 | 2010-05-14 | Double-chip simulator and double-chip simulation heat dissipation system |
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| CN201010180173.8A CN102244048B (en) | 2010-05-14 | 2010-05-14 | Double-chip simulator and double-chip simulation heat dissipation system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105116009A (en) * | 2015-08-11 | 2015-12-02 | 上海原动力通信科技有限公司 | Heating simulation device and heat pipe heat dispersion detection device |
| CN113484363A (en) * | 2021-06-29 | 2021-10-08 | 重庆长安新能源汽车科技有限公司 | Test device and method for simulating internal heating of controller |
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| CN1790689A (en) * | 2004-11-05 | 2006-06-21 | 国际商业机器公司 | Method and apparatus for thermal characterization under non-uniform heat load |
| CN101198242A (en) * | 2006-12-06 | 2008-06-11 | 英业达股份有限公司 | Double-heat source radiating module |
| CN101203122A (en) * | 2006-12-14 | 2008-06-18 | 英业达股份有限公司 | Dual heat source radiating module |
| CN201207245Y (en) * | 2008-04-30 | 2009-03-11 | 英业达股份有限公司 | Memory like heat source apparatus |
| CN201218816Y (en) * | 2008-06-04 | 2009-04-08 | 英业达股份有限公司 | Heat source apparatus similar to chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105116009A (en) * | 2015-08-11 | 2015-12-02 | 上海原动力通信科技有限公司 | Heating simulation device and heat pipe heat dispersion detection device |
| CN105116009B (en) * | 2015-08-11 | 2017-12-08 | 上海原动力通信科技有限公司 | One kind heating analogue means and heat pipe heat radiation device for detecting performance |
| CN113484363A (en) * | 2021-06-29 | 2021-10-08 | 重庆长安新能源汽车科技有限公司 | Test device and method for simulating internal heating of controller |
| CN113484363B (en) * | 2021-06-29 | 2023-05-23 | 重庆长安新能源汽车科技有限公司 | Test device and method for simulating internal heating of controller |
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