CN105111960A - Tape with signal wire - Google Patents
Tape with signal wire Download PDFInfo
- Publication number
- CN105111960A CN105111960A CN201510610093.4A CN201510610093A CN105111960A CN 105111960 A CN105111960 A CN 105111960A CN 201510610093 A CN201510610093 A CN 201510610093A CN 105111960 A CN105111960 A CN 105111960A
- Authority
- CN
- China
- Prior art keywords
- circuit
- colloid
- tape
- circuit substrate
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Adhesive Tapes (AREA)
Abstract
The invention discloses a tape with a signal wire. The tape comprises a protective substrate, a circuit substrate, a laser etching circuit and a colloid, wherein the protective substrate is PVC; the thickness of the protective substrate is 1 mm or above; the circuit substrate is transparent resin; the laser etching circuit is arranged on the surface of the circuit substrate and embedded in the colloid; the colloid is acrylic glue. Through adoption of the technical scheme, a weak-current circuit is formed in the tape provided by the invention through laser etching, so as to provide an auxiliary or standby signal transmission medium for electronic equipment; the tape has the favorable characteristics of being light and thin, and can be stuck onto the surfaces of various objects, so that wire arranging is facilitated.
Description
Technical field
The present invention relates to adhesive tape and manufacture field, particularly relate to a kind of adhesive tape with signal cable.
Background technology
Along with improving constantly of laser technology, the application of laser-induced thermal etching circuit is more and more extensive.Normal tape is a kind of good Signal transmissions carrier, and possess frivolous feature, the two is not yet carried out functional integration by prior art, and technology still belongs to blank.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of adhesive tape with signal cable, in adhesive tape, form light current circuit by laser-induced thermal etching, for electronics provides signal transmission medium auxiliary or for subsequent use, possess good frivolous feature, Pasting, at various body surface, facilitates winding displacement.
For solving the problems of the technologies described above; the technical scheme that the present invention adopts is: provide a kind of adhesive tape with signal cable; comprise protection base material, circuit substrate, laser-induced thermal etching circuit and colloid; described protection base material is PVC; the thickness at least 1 millimeter of described protection base material; described circuit substrate is transparent resin, and described laser-induced thermal etching circuit is arranged at circuit substrate surface and is embedded in colloid, and described colloid is acrylic glue.
In a preferred embodiment of the present invention, described laser-induced thermal etching circuit is provided with 8 strands and is arranged parallel to each other.
In a preferred embodiment of the present invention, in described circuit substrate, include thermo-stabilizer and fire retardant.
The invention has the beneficial effects as follows: the invention provides a kind of adhesive tape with signal cable, in adhesive tape, form light current circuit by laser-induced thermal etching, for electronics provides signal transmission medium auxiliary or for subsequent use, possess good frivolous feature, Pasting, at various body surface, facilitates winding displacement.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structure iron of a preferred embodiment of a kind of adhesive tape with signal cable of the present invention.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
As shown in Figure 1, the embodiment of the present invention comprises:
A kind of adhesive tape with signal cable; comprise protection base material 1, circuit substrate 2, laser-induced thermal etching circuit 3 and colloid 4; described protection base material 1 is PVC; the thickness at least 1 millimeter of described protection base material 1; described circuit substrate 2 is transparent resin; described laser-induced thermal etching circuit 3 is arranged at circuit substrate 2 surface and is embedded in colloid 4, and described colloid 4 is acrylic glue.
Wherein, described laser-induced thermal etching circuit 3 is provided with 8 strands and is arranged parallel to each other.By the way, laser-induced thermal etching circuit 3 is made to possess multi-channel data transmission function.
Further, thermo-stabilizer and fire retardant is included in described circuit substrate 2.By the way, high temperature deformation and burning is avoided.
In sum, the invention provides a kind of adhesive tape with signal cable, in adhesive tape, form light current circuit by laser-induced thermal etching, for electronics provides signal transmission medium auxiliary or for subsequent use, possess good frivolous feature, Pasting, at various body surface, facilitates winding displacement.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. the adhesive tape with signal cable; it is characterized in that; comprise protection base material, circuit substrate, laser-induced thermal etching circuit and colloid; described protection base material is PVC; the thickness at least 1 millimeter of described protection base material; described circuit substrate is transparent resin, and described laser-induced thermal etching circuit is arranged at circuit substrate surface and is embedded in colloid, and described colloid is acrylic glue.
2. the adhesive tape with signal cable according to claim 1, is characterized in that, described laser-induced thermal etching circuit is provided with 8 strands and is arranged parallel to each other.
3. the adhesive tape with signal cable according to claim 1, is characterized in that, includes thermo-stabilizer and fire retardant in described circuit substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510610093.4A CN105111960A (en) | 2015-09-23 | 2015-09-23 | Tape with signal wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510610093.4A CN105111960A (en) | 2015-09-23 | 2015-09-23 | Tape with signal wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105111960A true CN105111960A (en) | 2015-12-02 |
Family
ID=54660082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510610093.4A Pending CN105111960A (en) | 2015-09-23 | 2015-09-23 | Tape with signal wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105111960A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914246A (en) * | 2004-02-25 | 2007-02-14 | 株式会社钟化 | Thermosetting resin composition and use thereof |
-
2015
- 2015-09-23 CN CN201510610093.4A patent/CN105111960A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1914246A (en) * | 2004-02-25 | 2007-02-14 | 株式会社钟化 | Thermosetting resin composition and use thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151202 |
|
| RJ01 | Rejection of invention patent application after publication |