CN105102347A - 包装弹性压环 - Google Patents

包装弹性压环 Download PDF

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Publication number
CN105102347A
CN105102347A CN201480001459.1A CN201480001459A CN105102347A CN 105102347 A CN105102347 A CN 105102347A CN 201480001459 A CN201480001459 A CN 201480001459A CN 105102347 A CN105102347 A CN 105102347A
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Prior art keywords
container
silicon chip
elastomeric element
pressure ring
elasticity pressure
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CN201480001459.1A
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English (en)
Inventor
刘汝拯
克利夫顿·C·哈格德
詹姆斯·R·托马斯
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/07—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using resilient suspension means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)

Abstract

本发明公开了一种包装弹性压环(20)，包括：一个框架部分(22)，确立了所述包装弹性压环(20)的外边缘；以及多个弹性部件(24)，相对于所述框架部分(22)的表面以斜角(A)伸出所述框架部分(22)。弹性部件(24)配置为当容器关闭时弯向或者移向并接触容器(30)表面。弹性部件(24)的弹性为容器(30)中的包装弹性压环(20)提供了一个固定位置，帮助保持容器中物品如硅片(32)处于想要的状态。

Description

包装弹性压环
技术领域
本发明涉及包装领域，具体涉及包装弹性压环。
背景技术
包装易损物品时，如硅片，必须确保物品在容器中的安全。例如，硅片在容器中发生侧向或轴向移动时会被损坏，侧向移动包括硅片堆中的硅片相对面之间的相对运动(例如硅片间相对滑动)，轴向移动包括硅片堆中的硅片沿轴线运动(例如硅片向前运动或滑离彼此)。每一种运动都可能会损坏硅片的精密性或电路。
各种各样的硅片容器结构已经被研发出来，也有各种各样用容器包装硅片的办法为人们所知，其中一些容器的结构特征用于抵制硅片的非期望运动。
发明内容
根据本发明的一个具体实施例，一个包装弹性压环包括一个配置为占用容器内一定空间的框架，在容器内某些区域框架与容器内物品的边缘相适配，例如硅片。包装弹性压环包括多个伸出框架并与框架表面成斜角的弹性部件，弹性部件配置为当容器关闭时弯曲或移动并接触容器表面，弹性部件的弹性使包装弹性压环在容器中处于一个牢固的位置，帮助保持容器中的物品例如硅片处于一个想要的状态。
以下图中示出了包装弹性压环的一个具体实施例。
附图说明
图1是本发明的一个实施例中包装弹性压环的透视图。
图2是图1实施例中包装弹性压环的俯视图。
图3是包装弹性压环的侧向正视图。
图4是图2中的4-4方向的剖视图。
图5是容纳了多个硅片的容器中包括至少一个包装弹性压环的容器装配示意图。
具体实施方式
如图1-3所示，本发明的一个实施例中，包装弹性压环20包括一个框架部分22，在这个示例中，框架部分22环绕包装弹性压环20的外缘延伸。在这个示例中，外围边缘通常为圆形，框架部分22包括一个环状部分。在这个示例中，当放置包装弹性压环的容器内受到外力时，框架部分22通常很坚固可靠地阻止其压缩。
包装弹性压环20包括多个伸出框架部分22的弹性部件24，在此实施例中，弹性部件24通常向内伸向包装弹性压环20的中心。
由图4可看出，弹性部件24以一个倾斜的角度A伸出框架部分22，在此实施例中，角度A为弹性部件24与框架部分22内表面26的夹角。在此实施例中，框架部分22的内表面26通常与底面28垂直。当在容纳了硅片的容器中放置包装弹性压环时，通常将其定位为底面28与硅片表面平行。
弹性部件24的至少部分可弹性弯曲，使得它们受到外力时，弹性部件24可以响应外力而相对于框架部分22弯曲或移动。弹性部件24可以相对铰链轴弯曲，例如，沿着弹性部件24的长度方向弯曲或者沿弹性部件24与框架部分22之间的界面弯曲。可选地，弹性部件24可以沿其自身在多个位置弯曲或弯折，这取决于施加外力的角度和外力施加到弹性部件24上的部位。
图5示出了一个容器30，包括容器底部30A和容器顶部30B，多个硅片32置于容器30中，各个硅片32之间由分离环36隔开，一个分离环36处于最底部的硅片(如图)和容器底部30A的基面之间。
硅片32和分离环36置于容器底部30A后，有一个额外的轴向(例如图中的顶部到底部方向)空间没有被占用。如果这部分空间被闲置，硅片在容器中会发生轴向的相对运动(例如硅片堆中的至少一部分硅片会上下移动，如图中所示)。在此实施例中，多个包装弹性压环20被放置在容器中，占用未被硅片32和分离环36占用的轴向空间。将包装弹性压环20置于容器中后，容器中没有未被占用的轴向空间，容器底部30A和容器顶部30B被安全固定在一起并且硅片堆在容器中牢固地保持在原来的位置。
多个包装弹性压环20可选择地占用容器中适当的位置，在图中，距离硅片堆最远或者距离容器底部30A的开口端最近的包装弹性压环20被安放好，使得框架部分22处于容器底部30A的边线(如图中38所示)以内。弹性部件24的至少一部分长度从容器底部30A的内部伸出，可以从图5中看到，弹性部件24的一部分伸出了图中38所示的边线。由于容器底部30A和容器顶部30B被牢固地固定在一起，弹性部件24的一部分伸出边线后，与容器顶部30B的内表面40相接触。关闭容器后产生的力使得弹性部件24偏向或弯向容器内部(例如图中所示为向下弯折)。弹性部件24的弹力或弹性使其具有压向所有的框架部分22、容器中的硅片32和分离环36的倾向，从而使得硅片堆在容器中牢固地保持在原来的位置。
在图5所示的实施例中，安置在容器内部的包装弹性压环20的弹性部件24并不偏折或弯曲，因为它们并未与会向它们施加外力从而引起其偏折或者弯曲的某一表面相接触，图5中只有最上面的包装弹性压环20的弹性部件24弯曲了。
框架部分22占用了容器30中一定的轴向空间，弹性部件24具有一个可调节的特征，可以调节包装弹性压环20占用容器30的总空间大小。通常情况下，不可压缩的框架部分22会占用容器内一定的预设空间，此时容器内未被硅片堆占用的整个距离上没有未预料到或不受控制的弹性或弹力。
结合在一起的固体或者通常情况下不可压缩的框架部分22，和易弯曲的或者具有弹性的弹性部件24为容器中的硅片或者其他物品提供了一个更加安全的容纳空间，因为弹性部件24确保容器中存在一种倾向，促使容器中的物品处于一个想要的位置。仅仅在要求弹性部件24偏折或者弯曲，从而获得这样一种倾向时，这种倾向所产生的外力才会显现并受到控制，这个外力加强了容器中的物品的保护，例如硅片。

Claims (1)

1.一种包装弹性压环，包括：
一个框架部分，确立了所述包装弹性压环的外边缘，
多个弹性部件，相对于所述框架的表面倾斜伸出所述框架。
CN201480001459.1A 2013-03-26 2014-03-26 包装弹性压环 Pending CN105102347A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361805254P 2013-03-26 2013-03-26
US61/805,254 2013-03-26
PCT/CN2014/074136 WO2014154146A1 (en) 2013-03-26 2014-03-26 Packaging insert

Publications (1)

Publication Number Publication Date
CN105102347A true CN105102347A (zh) 2015-11-25

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US (1) US20160049319A1 (zh)
EP (1) EP2978682A1 (zh)
JP (1) JP2016515765A (zh)
KR (1) KR20150136477A (zh)
CN (1) CN105102347A (zh)
SG (1) SG11201507837PA (zh)
TW (1) TW201509767A (zh)
WO (2) WO2014154146A1 (zh)

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
JP6545601B2 (ja) * 2015-10-23 2019-07-17 アキレス株式会社 セパレータ
US11672360B2 (en) * 2019-02-27 2023-06-13 Inducomp Corporation Ball display case

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US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
CN1639031A (zh) * 2002-01-08 2005-07-13 布赖恩·克利弗 减震设备和方法
WO2005112106A1 (ja) * 2004-05-19 2005-11-24 Nippon Mining & Metals Co., Ltd. ウェハ保管容器
CN1704321A (zh) * 2004-06-03 2005-12-07 康维有限公司 集成电路晶片包装系统和方法
EP1206399B1 (en) * 1999-07-23 2010-03-17 Ray G. Brooks Protective system for integrated circuit (ic) wafers

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US5366079A (en) * 1993-08-19 1994-11-22 Taiwan Semiconductor Manufacturing Company Integrated circuit wafer and retainer element combination
US7425362B2 (en) * 2002-09-06 2008-09-16 E.Pak International, Inc. Plastic packaging cushion
US8393471B2 (en) * 2008-04-18 2013-03-12 Texas Instruments Incorporated Packing insert for disc-shaped objects
US20100224517A1 (en) * 2009-03-03 2010-09-09 Haggard Clifton C Disk separator device
US9653331B2 (en) * 2011-02-16 2017-05-16 Texchem Advanced Products Incorporated Sdn. Bhd. Single and dual stage wafer cushion

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
EP1206399B1 (en) * 1999-07-23 2010-03-17 Ray G. Brooks Protective system for integrated circuit (ic) wafers
CN1639031A (zh) * 2002-01-08 2005-07-13 布赖恩·克利弗 减震设备和方法
WO2005112106A1 (ja) * 2004-05-19 2005-11-24 Nippon Mining & Metals Co., Ltd. ウェハ保管容器
CN1704321A (zh) * 2004-06-03 2005-12-07 康维有限公司 集成电路晶片包装系统和方法

Also Published As

Publication number Publication date
EP2978682A1 (en) 2016-02-03
WO2014154146A1 (en) 2014-10-02
WO2014160774A1 (en) 2014-10-02
US20160049319A1 (en) 2016-02-18
JP2016515765A (ja) 2016-05-30
TW201509767A (zh) 2015-03-16
SG11201507837PA (en) 2015-10-29
KR20150136477A (ko) 2015-12-07

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