CN105101617A - Flexible circuit board and circuit structure - Google Patents
Flexible circuit board and circuit structure Download PDFInfo
- Publication number
- CN105101617A CN105101617A CN201510440130.1A CN201510440130A CN105101617A CN 105101617 A CN105101617 A CN 105101617A CN 201510440130 A CN201510440130 A CN 201510440130A CN 105101617 A CN105101617 A CN 105101617A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- function element
- substrate
- kink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to a flexible circuit board. The flexible circuit board comprises a substrate and a connection pad, wherein the connection pad is arranged at the end of the substrate, the flexible circuit board also comprises a reinforcement element, and the reinforcement element is arranged at the other end, far away from the connection pad, of the substrate and fixed on the substrate. The invention also provides a circuit structure. In the flexible circuit board and the circuit structure which are provided by the invention, with the arrangement of the reinforcement element, the flexible circuit board and the circuit structure cannot be damaged during drawing and taking actions of the flexible circuit board and the circuit structure.
Description
Technical field
The present invention relates to a kind of flexible circuit board and a kind of circuit structure.
Background technology
The flexible circuit board generally including many electronic components in electronic installation and be electrically connected with those electronic components.Flexible circuit board is generally the mode by grafting, is plugged on electronic component by the golden finger on flexible circuit board.In the assembling process of electronic installation, the operation often can inserted flexible circuit board or choose.But in the process of choosing flexible circuit board, flexible circuit board is easy to because the pressing of finger is destroyed.
Summary of the invention
In view of above content, be necessary to provide a kind of flexible circuit board.
A kind of flexible circuit board.Described flexible circuit board comprises substrate and connection gasket.Described connection gasket is positioned at one end of described substrate.Described flexible circuit board also comprises and is positioned at the stiffener of described substrate away from the other end of described connection gasket.Described stiffener is fixing on the substrate.
Further, described stiffener comprises connecting portion and kink, and described kink is to the lateral buckling away from described substrate.
Further, described connecting portion is in the side of described kink away from described connection gasket, and the end part aligning of described connecting portion and described colloid.
Further, described connecting portion is between described kink and described connection gasket.
Further, described flexible circuit board also comprises colloid, and described stiffener is pasted on the substrate by described colloid.
Further, described connecting portion contacts with described gel phase near the side of described substrate and passes through described colloid and pastes on the substrate.
Further, described kink is no more than 30 to the angle away from described substrate one lateral buckling
o.
Further, the material of described stiffener is selected from polyimides, PETG or steel plate.
There is a need to provide a kind of circuit structure.
A kind of circuit structure, described circuit structure comprises described flexible circuit board.Described circuit structure also comprises function element.Described function element is arranged on one of described flexible circuit board on the surface.
Further, described circuit structure also comprises function element stiffening plate, described function element stiffening plate be arranged on described flexible circuit board away from described function element another on the surface, and the position of described function element stiffening plate is just to described function element.
Further, the edge of described function element stiffening plate surrounding all exceeds the edge of described function element surrounding.
Compared to prior art, flexible circuit board provided by the present invention and circuit structure, owing to being provided with stiffener, can not damage described flexible circuit board and circuit structure when the action of choosing to described flexible circuit board and circuit structure.
Accompanying drawing explanation
The schematic diagram of the circuit structure that Fig. 1 provides for first embodiment of the invention.
Fig. 2 is the end view of circuit structure in Fig. 1.
Fig. 3 is the exploded view of circuit structure in Fig. 1.
Fig. 4 is the partial enlarged drawing in IV region in Fig. 2.
The schematic diagram of the circuit structure that Fig. 5 provides for second embodiment of the invention.
Fig. 6 is the end view of circuit structure in Fig. 5.
Fig. 7 is the exploded view of circuit structure in Fig. 5.
Fig. 8 is the partial enlarged drawing in VIII region in Fig. 6.
Main element symbol description
| Circuit structure | 200、300 |
| Flexible circuit board | 210、310 |
| Function element | 220、320 |
| Function element stiffening plate | 230、330 |
| Substrate | 211、311 |
| Connection gasket | 212、312 |
| Function element district | 213、313 |
| Colloid | 214、314 |
| Stiffener | 215、315 |
| Connecting portion | 2151、3151 |
| Kink | 2152、3152 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The schematic diagram of the circuit structure 200 that Fig. 1 provides for first embodiment of the invention.Fig. 2 is the end view of described circuit structure 200.Fig. 3 is the exploded view of described circuit structure 200.See also Fig. 1-3, the circuit structure 200 that the specific embodiment of the invention provides comprises flexible circuit board 210, function element 220 and function element stiffening plate 230.Described function element 220 is fixed on one of described flexible circuit board 210 on the surface.Described function element stiffening plate 230 be arranged on described flexible circuit board 210 away from described function element 220 another on the surface, and the position of described function element stiffening plate 230 is just to described function element 220.
In the present embodiment, described function element 220 comprises the electronic components such as integrated circuit, driver, internal memory, capacitor.Described function element stiffening plate 230, for supporting described function element 220, prevents described function element 220 be bent and damage.The material of described function element stiffening plate 230 is selected from polyimides (Polyimide, PI), PETG (PolyethyleneTerephthalate, PET), steel plate etc. can to the passive material of described function element 220.In the present embodiment, the edge of described function element stiffening plate 230 surrounding all exceeds the edge of described function element 220 surrounding, even if therefore function element 220 contraposition has deviation, described function element stiffening plate 230 still can be played a supporting role to described function element 220.
Described flexible circuit board 210 comprises substrate 211, connection gasket 212, function element district 213, colloid 214 and stiffener 215.Described connection gasket 212, colloid 214 and stiffener 215 are arranged on described substrate 211.In the present embodiment, described connection gasket 212 is positioned at one end of flexible circuit board 210.Described colloid 214 is positioned at the other end of described flexible circuit board 210 away from described connection gasket 212 with stiffener 215.Described stiffener 215 is pasted onto on described substrate 211 by described colloid 214.Described function element district 213 is positioned at the roughly middle position of described flexible circuit board 210.Described function element 220 described function element district 213 corresponding to described function element stiffening plate 230 is arranged.
In the present embodiment, the material of described substrate 211 is selected from glass fibre, polyimides etc.In the present embodiment, described connection gasket 212 is for being formed in the golden finger on described substrate 211.Described connection gasket 212 is for carrying out exchanges data by described function element 220 and an external circuit, such as, described connection gasket 212 is inserted the slot of an external circuit, make mutual conduction between described connection gasket 212 and the slot of this external circuit, and then realize the exchanges data of described function element 220 and this external circuit.In the present embodiment, described connection gasket 212 is electrically connected by wire with described function element 220.Described wire can be that open ground is formed in the surface of described substrate 211 or is snugly formed in described substrate 211.In the present embodiment, described wire is hidden in described substrate 211.Particularly, described substrate 211 can be made up of the base material of bilayer, described wire clamp is held between the base material of described bilayer, and is electrically connected by offering via on the substrate and described connection gasket 212 and function element 220 in the position corresponding with described connection gasket 212 and function element 220.In the present embodiment, described colloid 214 be selected from thermosetting cement.Be appreciated that in other embodiments, described colloid 214 also can be selected from the colloid of light solidity glue or other kind.The material of described stiffener 215 is selected from polyimides (Polyimide, PI), PETG (PolyethyleneTerephthalate, PET), steel plate etc.According to the demand of different designs, the material of described stiffener 215 can be identical or different with the material of described function element stiffening plate 230.
Fig. 4 is the partial enlarged drawing in IV region in Fig. 2.See also Fig. 4, described stiffener 215 comprises connecting portion 2151 and kink 2152.Described connecting portion 2151 contacts with described colloid 214 near the side of described substrate 211, and is pasted onto on described substrate 211 by described colloid 214.Described kink 2152 from the position that described kink 2152 is connected with described connecting portion 2151 to the lateral buckling away from described substrate 211, thus forms a tilting structure.In the present embodiment, described kink 2152 is no more than 30 to the angle θ away from described substrate 211 1 lateral buckling
o.In the present embodiment, described connecting portion 2151 is positioned at the side of described kink 2152 away from described connection gasket 212, and the end part aligning of described connecting portion 2151, described colloid 214 and described substrate 211.
During use, the action that the kink 2152 of the hand-holdable described stiffener 215 of operator is chosen to described flexible circuit board 210, extracts described connection gasket 212 from the slot of an external circuit.Thus, the kink 2152 of the hand-held described stiffener 215 of operator firmly, can not damage described flexible circuit board 210.Simultaneously, because described kink 2152 is to the lateral buckling away from described substrate 211, the finger of operator can insert in the gap between described kink 2152 and substrate 211 easily, points jointly firmly pinch described kink 2152 with another, more convenient to operate.
The schematic diagram of the circuit structure 300 that Fig. 5 provides for second embodiment of the invention.Fig. 6 is the end view of described circuit structure 300.Fig. 7 is the exploded view of described circuit structure 300.See also Fig. 5-7, the circuit structure 300 that second embodiment of the invention provides comprises flexible circuit board 310, function element 320 and function element stiffening plate 330.Described function element 320 is fixed on one of described flexible circuit board 310 on the surface.Described function element stiffening plate 330 be arranged on described flexible circuit board 310 away from described function element 320 another on the surface, and the position of described function element stiffening plate 330 is just to described function element 320.
In the present embodiment, described function element 320 comprises the electronic components such as integrated circuit, driver, internal memory, capacitor.Described function element stiffening plate 330, for supporting described function element 320, prevents described function element 320 be bent and damage.The material of described function element stiffening plate 330 is selected from polyimides (Polyimide, PI), PETG (PolyethyleneTerephthalate, PET), steel plate etc. can to the passive material of described function element 320.In the present embodiment, the edge of described function element stiffening plate 330 surrounding all exceeds the edge of described function element 320 surrounding, even if therefore function element 320 contraposition has deviation, described function element stiffening plate 330 still can be played a supporting role to described function element 320.
Described flexible circuit board 310 comprises substrate 311, connection gasket 312, function element district 313, colloid 314 and stiffener 315.Described connection gasket 312, colloid 314 and stiffener 315 are arranged on described substrate 311.In the present embodiment, described connection gasket 312 is positioned at one end of flexible circuit board 310.Described colloid 314 is positioned at the other end of described flexible circuit board 310 away from described connection gasket 312 with stiffener 315.Described stiffener 315 is pasted onto on described substrate 311 by described colloid 314.Described function element district 313 is positioned at the roughly middle position of described flexible circuit board 310.Described function element 320 described function element district 313 corresponding to described function element stiffening plate 330 is arranged.
In the present embodiment, the material of described substrate 311 is selected from glass fibre, polyimides etc.In the present embodiment, described connection gasket 312 is for being formed in the golden finger on described substrate 311.Described connection gasket 312 is for carrying out exchanges data by described function element 320 and an external circuit, such as, described connection gasket 312 is inserted the slot of an external circuit, make mutual conduction between described connection gasket 312 and the slot of this external circuit, and then realize the exchanges data of described function element 320 and this external circuit.In the present embodiment, described connection gasket 312 is electrically connected by wire with described function element 320.Described wire can be that open ground is formed in the surface of described substrate 311 or is snugly formed in described substrate 311.In the present embodiment, described wire is hidden in described substrate 311.Particularly, described substrate 311 can be made up of the base material of bilayer, described wire clamp is held between the base material of described bilayer, and is electrically connected by offering via on the substrate and described connection gasket 312 and function element 320 in the position corresponding with described connection gasket 312 and function element 320.In the present embodiment, described colloid 314 be selected from thermosetting cement.Be appreciated that in other embodiments, described colloid 314 also can be selected from the colloid of light solidity glue or other kind.The material of described stiffener 315 is selected from polyimides (Polyimide, PI), PETG (PolyethyleneTerephthalate, PET), steel plate etc.According to the demand of different designs, the material of described stiffener 315 can be identical or different with the material of described function element stiffening plate 330.
Fig. 8 is the partial enlarged drawing in VIII region in Fig. 6.See also Fig. 8, described stiffener 315 comprises connecting portion 3151 and kink 3152.Described connecting portion 3151 contacts with described colloid 314 near the side of described substrate 311, and is pasted onto on described substrate 311 by described colloid 314.Described kink 3152 from the position that described kink 3152 is connected with described connecting portion 3151 to the lateral buckling away from described substrate 311, thus forms a tilting structure.In the present embodiment, described kink 3152 is no more than 30 to the angle θ away from described substrate 311 1 lateral buckling
o.In the present embodiment, described connecting portion 3151 is between described kink 3152 and described connection gasket 312.
During use, the action that the kink 3152 of the hand-holdable described stiffener 315 of operator is chosen to described flexible circuit board 310, extracts described connection gasket 312 from the slot of an external circuit.Thus, the kink 3152 of the hand-held described stiffener 315 of operator firmly, can not damage described flexible circuit board 310.Simultaneously, because described kink 3152 is to the lateral buckling away from described substrate 311, the finger of operator can insert in the gap between described kink 3152 and substrate 311 easily, points jointly firmly pinch described kink 3152 with another, more convenient to operate.
Above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not depart from the spirit and scope of technical solution of the present invention.
Claims (11)
1. a flexible circuit board, described flexible circuit board comprises substrate and connection gasket, described connection gasket is positioned at one end of described substrate, it is characterized in that, described flexible circuit board also comprises and is positioned at the stiffener of described substrate away from the other end of described connection gasket, and described stiffener is fixing on the substrate.
2. flexible circuit board as claimed in claim 1, it is characterized in that, described stiffener comprises connecting portion and kink, and described kink is to the lateral buckling away from described substrate.
3. flexible circuit board as claimed in claim 2, is characterized in that, described connecting portion is in the side of described kink away from described connection gasket, and the end part aligning of described connecting portion and described colloid.
4. flexible circuit board as claimed in claim 2, it is characterized in that, described connecting portion is between described kink and described connection gasket.
5. flexible circuit board as claimed in claim 2, it is characterized in that, described flexible circuit board also comprises colloid, and described stiffener is pasted on the substrate by described colloid.
6. flexible circuit board as claimed in claim 5, it is characterized in that, described connecting portion contacts with described gel phase near the side of described substrate and passes through described colloid to be pasted on the substrate.
7. flexible circuit board as claimed in claim 2, it is characterized in that, described kink is no more than 30 to the angle away from described substrate one lateral buckling
o.
8. flexible circuit board as claimed in claim 1, it is characterized in that, the material of described stiffener is selected from polyimides, PETG or steel plate.
9. a circuit structure, described circuit structure comprises the flexible circuit board as described in claim 1-8 any one, and described circuit structure also comprises function element, and described function element is arranged on one of described flexible circuit board on the surface.
10. circuit structure as claimed in claim 9, it is characterized in that, described circuit structure also comprises function element stiffening plate, described function element stiffening plate be arranged on described flexible circuit board away from described function element another on the surface, and the position of described function element stiffening plate is just to described function element.
11. circuit structures as claimed in claim 10, is characterized in that, the edge of described function element stiffening plate surrounding all exceeds the edge of described function element surrounding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510440130.1A CN105101617A (en) | 2015-07-24 | 2015-07-24 | Flexible circuit board and circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510440130.1A CN105101617A (en) | 2015-07-24 | 2015-07-24 | Flexible circuit board and circuit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101617A true CN105101617A (en) | 2015-11-25 |
Family
ID=54580826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510440130.1A Pending CN105101617A (en) | 2015-07-24 | 2015-07-24 | Flexible circuit board and circuit structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101617A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454738A (en) * | 2017-09-06 | 2017-12-08 | 广东欧珀移动通信有限公司 | A kind of electronic equipment and its flexible circuit board assembly |
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| CN1582085A (en) * | 2003-08-14 | 2005-02-16 | 友达光电股份有限公司 | Positioning reinforcing board, soft circuit film havng same and its connector module |
| JP2011109082A (en) * | 2009-10-22 | 2011-06-02 | Nippon Steel Chem Co Ltd | Flexible double-sided copper-clad laminate, flexible circuit board, and multilayered circuit board |
| CN102445773A (en) * | 2010-10-08 | 2012-05-09 | 瀚宇彩晶股份有限公司 | Combination of backlight source and drive circuit board thereof and liquid crystal display |
| CN102480832A (en) * | 2010-11-30 | 2012-05-30 | 比亚迪股份有限公司 | Flexible printed circuit (FPC) |
| CN203104954U (en) * | 2013-03-19 | 2013-07-31 | 常州宇宙星电子制造有限公司 | Reinforced flexible circuit board |
| CN103929578A (en) * | 2014-04-25 | 2014-07-16 | 昆山凯尔光电科技有限公司 | Camera module |
-
2015
- 2015-07-24 CN CN201510440130.1A patent/CN105101617A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1582085A (en) * | 2003-08-14 | 2005-02-16 | 友达光电股份有限公司 | Positioning reinforcing board, soft circuit film havng same and its connector module |
| JP2011109082A (en) * | 2009-10-22 | 2011-06-02 | Nippon Steel Chem Co Ltd | Flexible double-sided copper-clad laminate, flexible circuit board, and multilayered circuit board |
| CN102445773A (en) * | 2010-10-08 | 2012-05-09 | 瀚宇彩晶股份有限公司 | Combination of backlight source and drive circuit board thereof and liquid crystal display |
| CN102480832A (en) * | 2010-11-30 | 2012-05-30 | 比亚迪股份有限公司 | Flexible printed circuit (FPC) |
| CN203104954U (en) * | 2013-03-19 | 2013-07-31 | 常州宇宙星电子制造有限公司 | Reinforced flexible circuit board |
| CN103929578A (en) * | 2014-04-25 | 2014-07-16 | 昆山凯尔光电科技有限公司 | Camera module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454738A (en) * | 2017-09-06 | 2017-12-08 | 广东欧珀移动通信有限公司 | A kind of electronic equipment and its flexible circuit board assembly |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151125 |
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| WD01 | Invention patent application deemed withdrawn after publication |