CN105097731B - A kind of minitype radiator of column phyllotaxy arrangement - Google Patents

A kind of minitype radiator of column phyllotaxy arrangement Download PDF

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Publication number
CN105097731B
CN105097731B CN201510471775.1A CN201510471775A CN105097731B CN 105097731 B CN105097731 B CN 105097731B CN 201510471775 A CN201510471775 A CN 201510471775A CN 105097731 B CN105097731 B CN 105097731B
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China
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thermal column
column
main
bottom plate
arrangement
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CN201510471775.1A
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CN105097731A (en
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吕玉山
王军
舒启林
胡玉珩
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Shenyang Ligong University
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Shenyang Ligong University
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Abstract

A kind of minitype radiator of column phyllotaxy arrangement, it is made up of radiating bottom plate, main thermal column and multiple secondary thermal columns, it is characterised in that:Main thermal column is vertically fixed on radiating bottom plate, outer round surface of the lower end of multiple secondary thermal columns respectively with main thermal column is fixedly connected, the theoretical Van Iterson models of phyllotaxy of multiple secondary thermal columns in the arrangement of main thermal column outer round surface meets bioscience, the present invention can increase the area of dissipation of radiator, improve radiating efficiency.

Description

A kind of minitype radiator of column phyllotaxy arrangement
Technical field
The present invention relates to a kind of radiator, and more particularly to a kind of minitype radiator of column phyllotaxy arrangement, this dissipates Hot device can effectively reduce electronic component surface temperature.
Background technology
With the integrated level of electronic component and the continuous improvement of performance and the continuous reduction of its physical size, electronics member Device heat flow density is sharply increased, and its surface heat flux is up to~ Magnitude, and have and continue increased trend, Heat dissipation problem has turned into restricts one of principal element that microelectronic component and equipment performance improve, and has become fluid force at present Learn one of important research direction with thermal conduction study field.The radiating mode of conventional radiator is all to use aluminum or plate made of copper Fin radiator and pin column radiator, and the mode of additional fans, dependence be monophasic fluid forced-convection heat transfer side Method.These are at present it is impossible to meet the needs of electronic component steady operation, in particular with component or electronics The reduction in internal heat dissipating space, the radiating mode of stock size can not be used, it is necessary to change heat spreader structures to improve electronics The heat-sinking capability of component.
The content of the invention
The purpose of the present invention, it is to provide a kind of minitype radiator of column phyllotaxy arrangement.
The present invention is based on the theoretical progress of phyllotaxy arrangement in bioscience.The phyllotaxy theory of biology shows, plant The geometry arrangement of seed of leaf, petal and fruit meet golden section rule, the maximum in region is realized on geometric space Filling and complementation.The arrangement of the seed of some of biologies can form blade row line spiral clockwise and anticlockwise, between seed Create into corresponding spiral grooves.This arrangement is applied to as on radiator, by increasing capacitance it is possible to increase the area of dissipation of radiator, thermal column Between form the flowing that blade row line spiral goove is beneficial to air in the presence of fan, improve radiating efficiency.Therefore, according to the Theoretical Design The radiating efficiency of micro- radiator can be improved by going out the thermal column arrangement of end face minitype radiator.
The technical scheme of use is:
A kind of minitype radiator of column phyllotaxy arrangement, by radiating bottom plate, main thermal column and multiple secondary thermal column groups Into, it is characterised in that:Main thermal column is vertically fixed on radiating bottom plate, the lower ends of multiple secondary thermal columns respectively with main thermal column Outer round surface is fixedly connected, and phyllotaxy of multiple secondary thermal columns in the arrangement of main thermal column outer round surface meets bioscience is theoretical Van Iterson models, its model is,,,;I.e. in post Under mark system,nIt is the arrangement ordinal number of time thermal column,FornPolar coordinates of the individual secondary thermal column on the polar coordinates face of cylindrical coordinate Radius, andIt is a constant value, and the radius of main thermal column;FornPole of the individual secondary thermal column on polar coordinates face is sat Mark angle;FornIndividual secondary thermal column andnPolar coordinates angle between+1 thermal column on polar coordinates face, andFornThe position coordinates in individual secondary thermal column z-axis direction in cylindrical coordinate;cIt is the distribution on z-axis direction Constant, unit mm.
It is above-mentionedcIt is 0.1mm~0.5mm in the distributed constant of Z-direction, and the area of section sum of multiple secondary thermal columns and master The area ratio of the outer surface of thermal column is 35-65%.
Secondary thermal column cylindrical center line is the normal direction of main thermal column outer round surface, and the diameter d of secondary thermal column is 0.5mm ~3mm, length L are 3d~6d.
The radius R of main thermal column is 3-10mm, and height S is 10~30mm.
When above-mentioned main thermal column is vertically fixed on radiating bottom plate, the center line of the central point of radiating bottom plate and main thermal column Overlap.
Above-mentioned radiating bottom plate is rectangle, and radiating bottom plate thickness H is 1-3mm.
The present invention minitype radiator, be mainly used in miniature electronic component, semiconductor components and devices and other miniature zero In the radiation processes of part etc., component surface temperature can be effectively reduced, improves the service life and operating efficiency of component, Development to electronic component has great significance.
To the explanation of Van Iterson models:
Van Iterson models are describe the seed arrangement that delavay fir seed and pineapple etc. have cylindric parent surface one Mathematical modeling, i.e.,,,,;Wherein,nIt is under cylindrical coordinate Seed fruit parent surface arrangement ordinal number,FornPolar coordinates radius of the individual seed under cylindrical coordinate on polar coordinates face, AndIt is a constant value, and the radius of fruit parent;FornPolar angle of the individual seed on polar coordinates face; FornIndividual seed andnPolar coordinates angle between+1 seed on polar coordinates face, and, it is golden section Angle;FornThe position coordinates in individual seed z-axis direction in cylindrical coordinate;cIt is the distributed constant on z-axis direction, generally with mm For unit.
This arrangement is nature biotechnology evolves the result of selection to adapt to environment, and it makes seed on geometric space Maximum filling and the complementation of position are realized, and seed arrangement forms the clockwise seed blade row line spiral of family and family Seed blade row line spiral counterclockwise.
When designing the minitype radiator of column phyllotaxy arrangement, if each thermal column is regarded as a seed, So secondary thermal column the main thermal column outer round surface of micro- radiator arrangement can according to Van Iterson models description Arranged, the arrangement model of secondary thermal column is also,,,; I.e. under post mark system,nIt is the arrangement ordinal number of time thermal column,FornIndividual secondary thermal column is on the polar coordinates face of cylindrical coordinate Polar coordinates radius, andIt is a constant value, it is also the radius of main thermal column;FornIndividual secondary thermal column is in polar coordinates face On polar angle;FornIndividual secondary thermal column andnPolar coordinates folder between+1 thermal column on polar coordinates face Angle, and, also to meet golden section angle;FornThe position in individual secondary thermal column z-axis direction in cylindrical coordinate Coordinate;cIt is the distributed constant of time thermal column in the z-axis direction, unit mm.So miniature radiating of column phyllotaxy arrangement The secondary thermal column of device realizes the Golden-Section Law arrangement on the geometric position of the outer round surface of main thermal column, reaches maximum filling And locations complementary, and time line spiral goove air duct of blade row clockwise and anticlockwise of radiating intercolumniation is formd, in the work of fan Under, the radiating efficiency of radiator can be improved.
The preparation method of the present invention:
1)Thickness according to the bottom plate 14,14 in Fig. 3 is designed using CAD software by the requirement of radiating object is chosen at 1mm~3mm, and determine its center.14 length and width dimensions by radiating object size by being determined.
2)Center using the center of the bottom plate 14 in Fig. 3 as main thermal column 15, then designs main thermal column, it is determined that main dissipate The size of plume.The radius R controls of main thermal column are controlled in 10 mm~30mm in 3mm~10mm scopes, height S.
3)The phyllotaxy Structural assignments rule and Van Iterson mathematical modulos of pine nut and pineapple seed in Fig. 1 and Fig. 2 Type, time thermal column 16 is designed in the arrangement position of the main outer round surface of thermal column 15 using CAD software, shows phyllotaxy in figure 3 Arrangement pattern.
4)Design the size of secondary thermal column 14 of phyllotaxy arrangement.Time thermal column is cylindrical as shown in Figure 3, the diameter of cylinderd Control is in the range of 1mm~3mm, the length of secondary thermal columnLChosen in the range of 3d~6d.
5)By changing the distributed constant in Van Iterson mathematical modelingsc, obtain not having to distributed constantcUnder time dissipate Plume arrangement form.Pass through controlcThe size of value is so as to cylindrical by the relatively main thermal column 15 of the total area of section of secondary thermal column 16 The rate control of surface area is in the range of 35%~65%.Pass through different distributions constant in Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8cNext time The distribution situation of thermal column understands that distributed constant c influences time density degree of thermal column arrangement,cThe more big secondary thermal column arrangement of value It is more sparse.cSpan be 0.1mm~0.5mm.
Brief description of the drawings
Fig. 1 is delavay fir seed and the seed phyllotaxy Structural assignments figure of pineapple.
1 in Fig. 1 is seed, and 2 be seed blade row line spiral counterclockwise, and 3 be seed blade row line spiral clockwise, and 4 be fruit Real parent.
Fig. 2 is the phyllotaxy Structural assignments Van Iterson mathematical modeling figures of seed on pineapple and pine nut cylinder parent.
5 in Fig. 2 be seed kernel point, and 6 be parent, and 7 be seed point blade row line spiral counterclockwise, and 8 be seed clockwise Point blade row line spiral, 9 be n-th of seed point, and 10 be (n+1)th seed point, and 11 be the n-th+2 seed points, and 12 be seed clockwise Blade row line spiral goove between grain point, 13 be the blade row line spiral goove between seed point counterclockwise.
Fig. 3 is the structural representation of the minitype radiator of the present invention.
14 in Fig. 3 be the radiating bottom plate of minitype radiator, and 15 be main thermal column, and 16 be time thermal column.
Fig. 4 is the first distributed constantcTo secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 5 be second of distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 6 be the third distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 7 be the 4th kind of distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 8 be the 5th kind of distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Embodiment
A kind of minitype radiator of column phyllotaxy arrangement, dissipated by radiating bottom plate 14, main thermal column 15 and multiple times Plume 16 is formed, it is characterised in that:
Main thermal column 15 is vertically fixed on square, and on a height of 3mm radiating bottom plate 14, the axis of main thermal column 15 is with dissipating The central point of hot bottom plate 14 overlaps.The lower end of multiple secondary thermal columns 16 is fixed with the outer round surface 17 of main thermal column 15 respectively to be connected Connect, and multiple secondary thermal columns 16 are laid in the main outer round surface of thermal column 15 by Van Iterson models, its model is,,,.I.e. under post mark system,nIt is the arrangement ordinal number of time thermal column,FornPolar coordinates radius of the individual secondary thermal column on the polar coordinates face of cylindrical coordinate, andIt is a constant value, and main thermal column Radius;FornPolar angle of the individual secondary thermal column on polar coordinates face;FornIndividual secondary thermal column andn+ 1 time scattered Polar coordinates angle between plume on polar coordinates face, andFornIndividual secondary thermal column z in cylindrical coordinate The position coordinates of direction of principal axis;cIt is the distributed constant on z-axis direction, unit mm.
It is above-mentionedcIt is 0.225mm in Z-direction distributed constant, and the area of section sum of multiple secondary thermal columns and main thermal column Outer surface area ratio be 50%.The radius of main thermal column 15 is 10mm, and high S is 30mm.The diameter of secondary thermal column 16dFor 3mm, length L are 9mm.

Claims (1)

1. a kind of minitype radiator of column phyllotaxy arrangement, it is made up of radiating bottom plate, main thermal column and multiple secondary thermal columns, It is characterized in that:Main thermal column is vertically fixed on radiating bottom plate, and the lower end of multiple secondary thermal columns is outer with main thermal column respectively Circular surfaces are fixedly connected, phyllotaxy theory of multiple secondary thermal columns in the arrangement of main thermal column outer round surface meets bioscience VanIterson models, its model are,,,;I.e. in post mark system Under,nIt is the arrangement ordinal number of time thermal column,FornPolar coordinates radius of the individual secondary thermal column on the polar coordinates face of cylindrical coordinate, AndIt is a constant value, and the radius of main thermal column;FornPolar angle of the individual secondary thermal column on polar coordinates face;FornIndividual secondary thermal column andnPolar coordinates angle between+1 thermal column on polar coordinates face, andFornThe position coordinates in individual secondary thermal column z-axis direction in cylindrical coordinate;cIt is the distributed constant on z-axis direction, unit is Mm,
DescribedcIt is 0.1mm~0.5mm in the distributed constant of Z-direction, and the area of section sum of multiple secondary thermal columns dissipates with main The area ratio of the outer surface of plume is 35~65%, and described secondary thermal column cylindrical center line is main thermal column outer round surface Normal direction, the diameter d of secondary thermal column are 0.5mm~3mm, and length L is 3d~6d, the radius R of described main thermal column for 3~ 10mm, height S are 10~30mm, when described main thermal column is vertically fixed on radiating bottom plate, the central point of radiating bottom plate with The center line of main thermal column overlaps, and described radiating bottom plate is rectangle, and radiating bottom plate thickness H is 1mm~3mm.
CN201510471775.1A 2015-08-05 2015-08-05 A kind of minitype radiator of column phyllotaxy arrangement Expired - Fee Related CN105097731B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201116716Y (en) * 2007-07-31 2008-09-17 广州市雅江光电设备有限公司 LED lamp bead with separated radiator
CN202008995U (en) * 2010-11-19 2011-10-12 武汉热诺金属科技有限公司 Upright-array type water-cooled radiator
CN102954111A (en) * 2012-06-13 2013-03-06 沈阳理工大学 Surface structure of radial sliding bearing with lubricating oil points in phyllotaxy arrangement

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG2013047410A (en) * 2013-06-19 2015-01-29 Lai Huat Goi An apparatus for generating nanobubbles

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201116716Y (en) * 2007-07-31 2008-09-17 广州市雅江光电设备有限公司 LED lamp bead with separated radiator
CN202008995U (en) * 2010-11-19 2011-10-12 武汉热诺金属科技有限公司 Upright-array type water-cooled radiator
CN102954111A (en) * 2012-06-13 2013-03-06 沈阳理工大学 Surface structure of radial sliding bearing with lubricating oil points in phyllotaxy arrangement

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