CN105097731B - A kind of minitype radiator of column phyllotaxy arrangement - Google Patents
A kind of minitype radiator of column phyllotaxy arrangement Download PDFInfo
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- CN105097731B CN105097731B CN201510471775.1A CN201510471775A CN105097731B CN 105097731 B CN105097731 B CN 105097731B CN 201510471775 A CN201510471775 A CN 201510471775A CN 105097731 B CN105097731 B CN 105097731B
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- thermal column
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- bottom plate
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Abstract
A kind of minitype radiator of column phyllotaxy arrangement, it is made up of radiating bottom plate, main thermal column and multiple secondary thermal columns, it is characterised in that:Main thermal column is vertically fixed on radiating bottom plate, outer round surface of the lower end of multiple secondary thermal columns respectively with main thermal column is fixedly connected, the theoretical Van Iterson models of phyllotaxy of multiple secondary thermal columns in the arrangement of main thermal column outer round surface meets bioscience, the present invention can increase the area of dissipation of radiator, improve radiating efficiency.
Description
Technical field
The present invention relates to a kind of radiator, and more particularly to a kind of minitype radiator of column phyllotaxy arrangement, this dissipates
Hot device can effectively reduce electronic component surface temperature.
Background technology
With the integrated level of electronic component and the continuous improvement of performance and the continuous reduction of its physical size, electronics member
Device heat flow density is sharply increased, and its surface heat flux is up to~ Magnitude, and have and continue increased trend,
Heat dissipation problem has turned into restricts one of principal element that microelectronic component and equipment performance improve, and has become fluid force at present
Learn one of important research direction with thermal conduction study field.The radiating mode of conventional radiator is all to use aluminum or plate made of copper
Fin radiator and pin column radiator, and the mode of additional fans, dependence be monophasic fluid forced-convection heat transfer side
Method.These are at present it is impossible to meet the needs of electronic component steady operation, in particular with component or electronics
The reduction in internal heat dissipating space, the radiating mode of stock size can not be used, it is necessary to change heat spreader structures to improve electronics
The heat-sinking capability of component.
The content of the invention
The purpose of the present invention, it is to provide a kind of minitype radiator of column phyllotaxy arrangement.
The present invention is based on the theoretical progress of phyllotaxy arrangement in bioscience.The phyllotaxy theory of biology shows, plant
The geometry arrangement of seed of leaf, petal and fruit meet golden section rule, the maximum in region is realized on geometric space
Filling and complementation.The arrangement of the seed of some of biologies can form blade row line spiral clockwise and anticlockwise, between seed
Create into corresponding spiral grooves.This arrangement is applied to as on radiator, by increasing capacitance it is possible to increase the area of dissipation of radiator, thermal column
Between form the flowing that blade row line spiral goove is beneficial to air in the presence of fan, improve radiating efficiency.Therefore, according to the Theoretical Design
The radiating efficiency of micro- radiator can be improved by going out the thermal column arrangement of end face minitype radiator.
The technical scheme of use is:
A kind of minitype radiator of column phyllotaxy arrangement, by radiating bottom plate, main thermal column and multiple secondary thermal column groups
Into, it is characterised in that:Main thermal column is vertically fixed on radiating bottom plate, the lower ends of multiple secondary thermal columns respectively with main thermal column
Outer round surface is fixedly connected, and phyllotaxy of multiple secondary thermal columns in the arrangement of main thermal column outer round surface meets bioscience is theoretical
Van Iterson models, its model is,,,;I.e. in post
Under mark system,nIt is the arrangement ordinal number of time thermal column,FornPolar coordinates of the individual secondary thermal column on the polar coordinates face of cylindrical coordinate
Radius, andIt is a constant value, and the radius of main thermal column;FornPole of the individual secondary thermal column on polar coordinates face is sat
Mark angle;FornIndividual secondary thermal column andnPolar coordinates angle between+1 thermal column on polar coordinates face, and;FornThe position coordinates in individual secondary thermal column z-axis direction in cylindrical coordinate;cIt is the distribution on z-axis direction
Constant, unit mm.
It is above-mentionedcIt is 0.1mm~0.5mm in the distributed constant of Z-direction, and the area of section sum of multiple secondary thermal columns and master
The area ratio of the outer surface of thermal column is 35-65%.
Secondary thermal column cylindrical center line is the normal direction of main thermal column outer round surface, and the diameter d of secondary thermal column is 0.5mm
~3mm, length L are 3d~6d.
The radius R of main thermal column is 3-10mm, and height S is 10~30mm.
When above-mentioned main thermal column is vertically fixed on radiating bottom plate, the center line of the central point of radiating bottom plate and main thermal column
Overlap.
Above-mentioned radiating bottom plate is rectangle, and radiating bottom plate thickness H is 1-3mm.
The present invention minitype radiator, be mainly used in miniature electronic component, semiconductor components and devices and other miniature zero
In the radiation processes of part etc., component surface temperature can be effectively reduced, improves the service life and operating efficiency of component,
Development to electronic component has great significance.
To the explanation of Van Iterson models:
Van Iterson models are describe the seed arrangement that delavay fir seed and pineapple etc. have cylindric parent surface one
Mathematical modeling, i.e.,,,,;Wherein,nIt is under cylindrical coordinate
Seed fruit parent surface arrangement ordinal number,FornPolar coordinates radius of the individual seed under cylindrical coordinate on polar coordinates face,
AndIt is a constant value, and the radius of fruit parent;FornPolar angle of the individual seed on polar coordinates face;
FornIndividual seed andnPolar coordinates angle between+1 seed on polar coordinates face, and, it is golden section
Angle;FornThe position coordinates in individual seed z-axis direction in cylindrical coordinate;cIt is the distributed constant on z-axis direction, generally with mm
For unit.
This arrangement is nature biotechnology evolves the result of selection to adapt to environment, and it makes seed on geometric space
Maximum filling and the complementation of position are realized, and seed arrangement forms the clockwise seed blade row line spiral of family and family
Seed blade row line spiral counterclockwise.
When designing the minitype radiator of column phyllotaxy arrangement, if each thermal column is regarded as a seed,
So secondary thermal column the main thermal column outer round surface of micro- radiator arrangement can according to Van Iterson models description
Arranged, the arrangement model of secondary thermal column is also,,,;
I.e. under post mark system,nIt is the arrangement ordinal number of time thermal column,FornIndividual secondary thermal column is on the polar coordinates face of cylindrical coordinate
Polar coordinates radius, andIt is a constant value, it is also the radius of main thermal column;FornIndividual secondary thermal column is in polar coordinates face
On polar angle;FornIndividual secondary thermal column andnPolar coordinates folder between+1 thermal column on polar coordinates face
Angle, and, also to meet golden section angle;FornThe position in individual secondary thermal column z-axis direction in cylindrical coordinate
Coordinate;cIt is the distributed constant of time thermal column in the z-axis direction, unit mm.So miniature radiating of column phyllotaxy arrangement
The secondary thermal column of device realizes the Golden-Section Law arrangement on the geometric position of the outer round surface of main thermal column, reaches maximum filling
And locations complementary, and time line spiral goove air duct of blade row clockwise and anticlockwise of radiating intercolumniation is formd, in the work of fan
Under, the radiating efficiency of radiator can be improved.
The preparation method of the present invention:
1)Thickness according to the bottom plate 14,14 in Fig. 3 is designed using CAD software by the requirement of radiating object is chosen at
1mm~3mm, and determine its center.14 length and width dimensions by radiating object size by being determined.
2)Center using the center of the bottom plate 14 in Fig. 3 as main thermal column 15, then designs main thermal column, it is determined that main dissipate
The size of plume.The radius R controls of main thermal column are controlled in 10 mm~30mm in 3mm~10mm scopes, height S.
3)The phyllotaxy Structural assignments rule and Van Iterson mathematical modulos of pine nut and pineapple seed in Fig. 1 and Fig. 2
Type, time thermal column 16 is designed in the arrangement position of the main outer round surface of thermal column 15 using CAD software, shows phyllotaxy in figure 3
Arrangement pattern.
4)Design the size of secondary thermal column 14 of phyllotaxy arrangement.Time thermal column is cylindrical as shown in Figure 3, the diameter of cylinderd
Control is in the range of 1mm~3mm, the length of secondary thermal columnLChosen in the range of 3d~6d.
5)By changing the distributed constant in Van Iterson mathematical modelingsc, obtain not having to distributed constantcUnder time dissipate
Plume arrangement form.Pass through controlcThe size of value is so as to cylindrical by the relatively main thermal column 15 of the total area of section of secondary thermal column 16
The rate control of surface area is in the range of 35%~65%.Pass through different distributions constant in Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8cNext time
The distribution situation of thermal column understands that distributed constant c influences time density degree of thermal column arrangement,cThe more big secondary thermal column arrangement of value
It is more sparse.cSpan be 0.1mm~0.5mm.
Brief description of the drawings
Fig. 1 is delavay fir seed and the seed phyllotaxy Structural assignments figure of pineapple.
1 in Fig. 1 is seed, and 2 be seed blade row line spiral counterclockwise, and 3 be seed blade row line spiral clockwise, and 4 be fruit
Real parent.
Fig. 2 is the phyllotaxy Structural assignments Van Iterson mathematical modeling figures of seed on pineapple and pine nut cylinder parent.
5 in Fig. 2 be seed kernel point, and 6 be parent, and 7 be seed point blade row line spiral counterclockwise, and 8 be seed clockwise
Point blade row line spiral, 9 be n-th of seed point, and 10 be (n+1)th seed point, and 11 be the n-th+2 seed points, and 12 be seed clockwise
Blade row line spiral goove between grain point, 13 be the blade row line spiral goove between seed point counterclockwise.
Fig. 3 is the structural representation of the minitype radiator of the present invention.
14 in Fig. 3 be the radiating bottom plate of minitype radiator, and 15 be main thermal column, and 16 be time thermal column.
Fig. 4 is the first distributed constantcTo secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 5 be second of distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 6 be the third distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 7 be the 4th kind of distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Fig. 8 be the 5th kind of distributed constant c to secondary thermal column the arrangement state of main thermal column outer round surface influence figure.
Embodiment
A kind of minitype radiator of column phyllotaxy arrangement, dissipated by radiating bottom plate 14, main thermal column 15 and multiple times
Plume 16 is formed, it is characterised in that:
Main thermal column 15 is vertically fixed on square, and on a height of 3mm radiating bottom plate 14, the axis of main thermal column 15 is with dissipating
The central point of hot bottom plate 14 overlaps.The lower end of multiple secondary thermal columns 16 is fixed with the outer round surface 17 of main thermal column 15 respectively to be connected
Connect, and multiple secondary thermal columns 16 are laid in the main outer round surface of thermal column 15 by Van Iterson models, its model is,,,.I.e. under post mark system,nIt is the arrangement ordinal number of time thermal column,FornPolar coordinates radius of the individual secondary thermal column on the polar coordinates face of cylindrical coordinate, andIt is a constant value, and main thermal column
Radius;FornPolar angle of the individual secondary thermal column on polar coordinates face;FornIndividual secondary thermal column andn+ 1 time scattered
Polar coordinates angle between plume on polar coordinates face, and;FornIndividual secondary thermal column z in cylindrical coordinate
The position coordinates of direction of principal axis;cIt is the distributed constant on z-axis direction, unit mm.
It is above-mentionedcIt is 0.225mm in Z-direction distributed constant, and the area of section sum of multiple secondary thermal columns and main thermal column
Outer surface area ratio be 50%.The radius of main thermal column 15 is 10mm, and high S is 30mm.The diameter of secondary thermal column 16dFor
3mm, length L are 9mm.
Claims (1)
1. a kind of minitype radiator of column phyllotaxy arrangement, it is made up of radiating bottom plate, main thermal column and multiple secondary thermal columns,
It is characterized in that:Main thermal column is vertically fixed on radiating bottom plate, and the lower end of multiple secondary thermal columns is outer with main thermal column respectively
Circular surfaces are fixedly connected, phyllotaxy theory of multiple secondary thermal columns in the arrangement of main thermal column outer round surface meets bioscience
VanIterson models, its model are,,,;I.e. in post mark system
Under,nIt is the arrangement ordinal number of time thermal column,FornPolar coordinates radius of the individual secondary thermal column on the polar coordinates face of cylindrical coordinate,
AndIt is a constant value, and the radius of main thermal column;FornPolar angle of the individual secondary thermal column on polar coordinates face;FornIndividual secondary thermal column andnPolar coordinates angle between+1 thermal column on polar coordinates face, and;FornThe position coordinates in individual secondary thermal column z-axis direction in cylindrical coordinate;cIt is the distributed constant on z-axis direction, unit is
Mm,
DescribedcIt is 0.1mm~0.5mm in the distributed constant of Z-direction, and the area of section sum of multiple secondary thermal columns dissipates with main
The area ratio of the outer surface of plume is 35~65%, and described secondary thermal column cylindrical center line is main thermal column outer round surface
Normal direction, the diameter d of secondary thermal column are 0.5mm~3mm, and length L is 3d~6d, the radius R of described main thermal column for 3~
10mm, height S are 10~30mm, when described main thermal column is vertically fixed on radiating bottom plate, the central point of radiating bottom plate with
The center line of main thermal column overlaps, and described radiating bottom plate is rectangle, and radiating bottom plate thickness H is 1mm~3mm.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201116716Y (en) * | 2007-07-31 | 2008-09-17 | 广州市雅江光电设备有限公司 | LED lamp bead with separated radiator |
CN202008995U (en) * | 2010-11-19 | 2011-10-12 | 武汉热诺金属科技有限公司 | Upright-array type water-cooled radiator |
CN102954111A (en) * | 2012-06-13 | 2013-03-06 | 沈阳理工大学 | Surface structure of radial sliding bearing with lubricating oil points in phyllotaxy arrangement |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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SG2013047410A (en) * | 2013-06-19 | 2015-01-29 | Lai Huat Goi | An apparatus for generating nanobubbles |
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2015
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201116716Y (en) * | 2007-07-31 | 2008-09-17 | 广州市雅江光电设备有限公司 | LED lamp bead with separated radiator |
CN202008995U (en) * | 2010-11-19 | 2011-10-12 | 武汉热诺金属科技有限公司 | Upright-array type water-cooled radiator |
CN102954111A (en) * | 2012-06-13 | 2013-03-06 | 沈阳理工大学 | Surface structure of radial sliding bearing with lubricating oil points in phyllotaxy arrangement |
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