CN105095548A - Parameterization unit for improving matching property of device - Google Patents
Parameterization unit for improving matching property of device Download PDFInfo
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- CN105095548A CN105095548A CN201410216634.0A CN201410216634A CN105095548A CN 105095548 A CN105095548 A CN 105095548A CN 201410216634 A CN201410216634 A CN 201410216634A CN 105095548 A CN105095548 A CN 105095548A
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Abstract
The invention provides a small-size matching transistor parameterization module unit and aims at improving the efficiency of layout design and the stability of a layout. The parameterized small-size matching transistor module unit is composed of two transistors in a fixed matching connection relation to each other. The module unit is capable of adjusting the size of the transistor, adjusting the gate area of the transistor any time, optimizing the matching accuracy according to the actual layout allowed area and improving the compactness of the layout.
Description
Technical field
The present invention relates to integrated circuit fields, particularly relate to analogue layout rear end.
Background technology
Integrated circuit (IC) design comprises Front-end Design and two stages are designed in rear end, and Front-end Design is responsible for logic realization, typically uses the speech like sound of verilog/VHDL, carries out the description of behavioral scaling.Rear end design refers to that gate level netlist Front-end Design produced carries out placement-and-routing by EDA design tool and carries out physical verification and the final process produced for the GDS file manufactured, and its main responsibility has: chip makes physical structure analysis, logic analysis, set up rear end design cycle, laying out pattern's wiring, layout editing, domain physical verification, get in touch with wafer factory and submit production data to.So-called GDS file, being a kind of patterned file, is a kind of form of integrated circuit diagram.
Along with the increase increasingly of mixed-signal designs complicacy, development technology design tool bag (PDK, ProcessDesignKit) to set up checking reference flowchart for the market risk reducing expensive design repeatedly brought be very important.In general, wafer factory can according to the design component of the requirement customization PDK of technology, and each technique can have the PDK of a set of correspondence.
PDK is analog/mixed signal IC circuit design and the complete process file set that provides, is the data platform connecting IC design and IC manufacture technics.The content of PDK comprises:
Device model (DeviceModel): the realistic model file provided by Foundry;
Symbol and view (Symbols & View): for the symbol of principle diagram design, parameterized design cell all have passed the checking of SPICE emulation;
Component description form (CDF, ComponentDescriptionFormat) and Callback function: the property description file of device, defines the various view format etc. of type of device, device name, device parameters and parameter call relation function collection Callback, device model, device;
Parameterized units (Pcell, ParameterizedCell): it is by the SKILL language compilation of Cadence, the domain of its correspondence have passed DRC (DRC, designrulecheck) and domain and circuit diagram (LVS) verify, facilitate designer to carry out domain (SchematicDrivenLayout) design cycle of schematic diagram driving;
Technological document (TechnologyFile): for the technical papers of layout design and checking, comprises the mapping relations definition of the design data layer of GDSII and process layer, the attribute definition of design data layer, Photographing On-line rule, electric rule, display color defines and graphical format definition etc.;
Physical verification rule (PVRule) file: comprise layout verification file DRC/LVS/RC and extract, supports Diva, Dracula, Assura etc. of Cadence.
What the parameter wherein in parameterized units (Pcell) referred to is exactly CDF parameter, and their combination can realize all functions of customization, is the core of PDK.In fact, the storehouse of PDK just refers to the intersection of all parameterized units.Specifically, parameterized units has following effect:
(1) can accelerate the data inserting domain, what avoid unit repeats establishment;
(2) save the space of physical disk, similar portion can be connected to identical resource;
(3) avoid because multiple version of same unit will be safeguarded and the mistake that occurs;
(4) achieve the editting function of level, do not need the design in order to change domain and remove modification layer level structure.
In a word, if having the PDK of the optimization sets such as parameterized units structure, symbol and the rule through verifying, the work of IC designer just can free and become high-quality and be rich in efficiency from the task of loaded down with trivial details fallibility.
In traditional territory unit storehouse, only there is mos transistor elementary cell, layout drawing personnel are when drawing coupling MOS transistor, first call the mos transistor of two band parameters, and then according to circuit simulation the mos transistor size parameter that confirms out, optimum configurations is carried out to the territory unit of each mos transistor, then carry out connecting and layout according to the principle of coupling, in later stage modify process, if mos transistor size changes to some extent, then change operation very loaded down with trivial details, and easily make a mistake in careless.
Summary of the invention
The invention provides small size matching transistor parameterized module unit, to improve the efficiency of drawing domain, improve the stability of domain.
Small size matching transistor parameterized module unit provided by the invention, is made up of the transistor of two fixing coupling annexations.Described modular unit provides and controls transistor gate length and grid width two parameters, and two parameters described in amendment, can adjust the size of transistor, and corresponding adjustment will be made automatically in inside, still keeps coupling annexation.
Optionally, in described modular unit, draw six metal line, connect for modular unit external circuit.
Optionally, the grid area of described transistor can be adjusted at any time, allow area according to actual domain, Optimized Matching degree of accuracy.
Optionally, described modular unit adopts common centroid domain structure completely.
Optionally, described transistor the right and left adds equidistant setoff grid, avoids the mismatch caused because polysilicon etch rate is inconsistent.
Optionally, in described modular unit, the gate electrode of setoff pipe is connected with backgate, contributes to ensureing that the electrology characteristic of transistor does not affect by the pseudo-raceway groove formed below setoff pipe.
Optionally, with metal, multiple gate electrode is connected with each other without polysilicon in described modular unit, prevents adjacent domain from there is polysilicon graphics and causing etch rate to change.
Optionally, described modular unit correctly processes the position of contact hole on polygate electrodes.
Optionally, described modular unit possesses close to symmetrical metal connecting line layout.
Optionally, the source/drain eliminating setoff pipe is injected, and reduces modular unit area.
Optionally, consider the ability to bear of electric current, provide parameter d elta_sd to adjust source-drain area width, improve domain compactedness.
Accompanying drawing explanation
Fig. 1 is the small size matching transistor parameterized module cellular construction schematic diagram considering compactedness and matching performance in the preferred embodiment of the present invention.
Embodiment
The increase of gate area contributes to reducing local irregularities's impact, improves coupling degree of accuracy.And because the elongated impact reducing channel-length modulation of raceway groove, so long channel MOSFET mates more accurate than short-channel transistor.This domain modular unit that there is parameter, can change with parameter, can when ensureing that breadth length ratio is certain, adjust its grid area at any time, according to chip area at any time by grid rea adjusting to most suitable size, make to obtain best matching effect in a practical situation.
The mismatch caused by gradient can be reduced by the distance reduced between matching transistor barycenter.Common centroid laying out pattern is tightr, is more not easy the impact being subject to nonlinear gradient.Fig. 1 is the preferred embodiment of the invention, and wherein MOS domain barycenter is aimed at and compact in design completely.The active grid region of MOS transistor adopts long narrow rectangular in form, is divided into several sections, thus can construct a compact array.Described module is interlocked rightly, and these are interdigital, and the barycenter of coupling device is aimed at the central point of array axis of symmetry.
The etch rate of polysilicon is always not consistent.The perforate of polysilicon is larger, and etch rate is faster, because etching ion more freely can enter sidewall and the bottom of large opening, therefore when little perforate has just been carved, and the marginal existence over etching to a certain degree of large opening.This effect makes the grid length of Silicon-gate MOS transistor change.Must reach medium or the transistor of precision current coupling should use setoff grid to guarantee even etching, otherwise 1% or larger current mismatch may be caused.Add setoff grid in described module, and ensure that the distance served as a contrast or foil between grid and actual gate equals the distance between actual gate, avoid the mismatch caused because polysilicon etch rate is inconsistent.
The gate electrode of setoff pipe is connected with backgate by described modular unit, contributes to ensureing that the electrology characteristic of transistor does not affect by the pseudo-raceway groove formed below setoff pipe.Some deviser is connected setoff pipe with contiguous gate electrode, but does like this and can make end electric capacity and leakage current increase, so do not adopt this method.
Many devisers are connected with each other multiple gate electrode with a polysilicon, form finger gate structure.Beyond doubt very easily, but there is polysilicon graphics due to adjacent domain in this, therefore this way may make etch rate change.In order to reach optimum matching effect, described modular unit uses metal to connect simple rectangle polysilicon strip.With metal, multiple gate electrode is connected with each other without polysilicon, prevents adjacent domain from there is polysilicon graphics and causing etch rate to change.
Contact hole position on MOS transistor active gate can cause significant threshold voltage mismatch.For this effect, a kind of possible explanation is owing to there is metal above active gate.Contacting the another kind of mechanism brought out is contact local silication.If the polysilicon gate formed in technique is enough thin, some silicide just may penetrate polysilicon gate completely.The silicide that oxide interface place occurs greatly can change the work function of gate electrode near contact hole, and makes total threshold voltage mismatch.If stress form changes in crystallite dimension, impurity, then may produce by contacting the mismatch of bringing out.The correct position processing contact hole on polygate electrodes in described module, ensure the top making contact thick field oxide layer, now it obviously cannot change the character of transistor.
Designer Craftman's Long-Time Service reducing annealing is with the threshold voltage of stable MOS transistor.In annealing process, hydrogen can infiltrate interlayer oxide.Some hydrogen atom finally can arrive oxide layer-silicon interface place, and is combined with dangling bonds.This reaction has neutralized the positive fixed charge that dangling bonds are introduced.Due to incomplete hydrogenation, the difference of coupling MOS transistor metal connecting line domain can introduce large mismatch between originally identical device.Described module adopts close to symmetrical metal connecting line layout, alleviates the mismatch that incomplete hydrogenation is introduced.
Described modular unit provides and controls transistor gate length and grid width two parameters, and two parameters described in amendment, can adjust the size of transistor, and corresponding adjustment will be made automatically in inside, still keeps coupling annexation.In described modular unit, draw six metal line, connect for modular unit external circuit.
Because setoff pipe is not transistor truly, so their outward flange does not also need source/drain region, the source/drain served as a contrast or foil above pipe therefore can be stopped to inject.As long as the figure of groove extends beyond the several micron of setoff gate electrode inward flange to guarantee that the edge serving as a contrast or foil pipe is on thin oxide layer, would not introduce obvious mismatch.The source/drain that described modular unit eliminates setoff pipe is injected, and reduces modular unit area.
Oxide layer film thickness depends on temperature and the component of oxidizing atmosphere.Although modern oxidation furnace can both very accurately control, the temperature in boiler tube and gaseous component still have slight change.Thick oxide layer demonstrates concentric rainbow shape colour circle usually, and this shows to there is radial oxide layer gradient.Gate oxide is too thin and do not have interference light, but also has radial oxidated layer thickness gradient.Have closely similar oxidated layer thickness at a distance of nearer external member, but indication layer apart from each other is in very big difference, these difference directly affects the coupling of threshold voltage.So coupling device will put together as far as possible compactly.Described unit module fully takes into account the contradiction between mos transistor chip area and matching module performance, provides parameter d elta_sd, the area change of delta_sd state modulator source/drain region.The area of source/drain region becomes large, can increase the number of source/drain region contact hole, thus increase the ability to bear of electric current.The area of source/drain region diminishes, and domain can be made compacter.
Claims (10)
1. a small size matching transistor parameterized module unit, be made up of the transistor of two fixing coupling annexations, it is characterized in that, described modular unit provides and controls transistor gate length and grid width two parameters, two parameters described in amendment, can adjust the size of transistor, corresponding adjustment will be made automatically in inside, still keeps coupling annexation.
2. modular unit as claimed in claim 1, is characterized in that, draw six metal line in described modular unit, connect for modular unit external circuit.
3. modular unit as claimed in claim 1, is characterized in that, can adjust the grid area of described transistor at any time, allows area, Optimized Matching degree of accuracy according to actual domain.
4. modular unit as claimed in claim 1, it is characterized in that, described modular unit adopts common centroid domain structure completely.
5. modular unit as claimed in claim 1, it is characterized in that, described transistor the right and left adds equidistant setoff grid, avoids the mismatch caused because polysilicon etch rate is inconsistent.
6. modular unit as claimed in claim 1, is characterized in that, is connected by the gate electrode of setoff pipe in described modular unit with backgate, contributes to ensureing that the electrology characteristic of transistor does not affect by the pseudo-raceway groove formed below setoff pipe.
7. modular unit as claimed in claim 1, is characterized in that, with metal, multiple gate electrode is connected with each other, prevents adjacent domain from there is polysilicon graphics and causing etch rate to change in described modular unit without polysilicon.
8. modular unit as claimed in claim 1, it is characterized in that, described modular unit correctly processes the position of contact hole on polygate electrodes.
9. modular unit as claimed in claim 1, is characterized in that, described modular unit possesses close to symmetrical metal connecting line layout.
10. modular unit as claimed in claim 1, is characterized in that, the source/drain eliminating setoff pipe is injected, and reduces modular unit area.
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| CN201410216634.0A CN105095548A (en) | 2014-05-22 | 2014-05-22 | Parameterization unit for improving matching property of device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105095549A (en) * | 2014-05-22 | 2015-11-25 | 上海北京大学微电子研究院 | Parameterized cell for improving matching property of device |
| CN105095550A (en) * | 2014-05-22 | 2015-11-25 | 上海北京大学微电子研究院 | Parameterization unit for improving device matching features |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102142435A (en) * | 2010-12-23 | 2011-08-03 | 上海北京大学微电子研究院 | Parameterized module cell of transistors |
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- 2014-05-22 CN CN201410216634.0A patent/CN105095548A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102142435A (en) * | 2010-12-23 | 2011-08-03 | 上海北京大学微电子研究院 | Parameterized module cell of transistors |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105095549A (en) * | 2014-05-22 | 2015-11-25 | 上海北京大学微电子研究院 | Parameterized cell for improving matching property of device |
| CN105095550A (en) * | 2014-05-22 | 2015-11-25 | 上海北京大学微电子研究院 | Parameterization unit for improving device matching features |
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