CN105094291B - The method and a kind of electronic equipment of a kind of control electronics - Google Patents
The method and a kind of electronic equipment of a kind of control electronics Download PDFInfo
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- CN105094291B CN105094291B CN201410185167.XA CN201410185167A CN105094291B CN 105094291 B CN105094291 B CN 105094291B CN 201410185167 A CN201410185167 A CN 201410185167A CN 105094291 B CN105094291 B CN 105094291B
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Abstract
The invention discloses a kind of method of control electronics and a kind of electronic equipment, solve on electronic equipment can the largest deformation amplitude of deformation panel be difficult to the technical problem changed.The electronic equipment include can deformation panel, the panel is when by the external force being applied in, the first area of the panel can produce deformation, so that the relative position in the second area of the panel and the 3rd region changes, wherein, the second area is positioned at the region of the side of first area first, and the 3rd region is different with second side positioned at the region of the side of first area second, first side;Methods described includes:Detect the characteristic parameter of the deformed state for characterizing the first area;Judge whether the characteristic parameter meets preparatory condition;When the characteristic parameter meets the preparatory condition, the temperature control unit of the electronic equipment is controlled to adjust the temperature of the first area, to change the largest deformation amplitude of the first area.
Description
Technical field
The present invention relates to electronic technology field, the method and a kind of electronic equipment of more particularly to a kind of control electronics.
Background technology
At present, with the continuous development of electronic technology and material science, many electronic equipments have can deformation panel, make
Electronic equipment form it is more changeable, the occupation mode of electronic equipment is more abundant, and the production and living to people offer convenience.
But present inventor has found that above-mentioned prior art at least has following technical problem:
User apply external force make can deformation panel produce deformation when, can the largest deformation amplitude of deformation panel keep relative
It is stable, it is difficult to allow can deformation panel carry out deformation by a larger margin, or can deformation panel be limited in a less amplitude model
Enclose interior deformation.
The content of the invention
The application provides a kind of method and a kind of electronic equipment of control electronics, for solving to exist in the prior art
Electronic equipment on can the largest deformation amplitude of deformation panel be difficult to the technical problem changed, realizing can deformation by regulation
Temperature at panel, change can deformation panel largest deformation amplitude technique effect.
On the one hand the application provides a kind of method of control electronics, the electronic equipment include can deformation face
Plate, for the panel when by the external force being applied in, the first area of the panel can produce deformation so that the of the panel
The relative position in two regions and the 3rd region changes, wherein, the second area is positioned at the area of the side of first area first
Domain, the 3rd region are different with second side positioned at the region of the side of first area second, first side;It is described
Method includes:Detect the characteristic parameter of the deformed state for characterizing the first area;Judge whether the characteristic parameter is full
Sufficient preparatory condition;When the characteristic parameter meets the preparatory condition, the temperature control unit of the electronic equipment is controlled to adjust
The temperature of the whole first area, to change the largest deformation amplitude of the first area.
Optionally, it is described to judge whether the characteristic parameter meets preparatory condition, including:Whether judge the characteristic parameter
Meet the first preparatory condition;It is described when the characteristic parameter meets the preparatory condition, control the temperature of the electronic equipment
Control unit adjusts the temperature of the first area, to change the largest deformation amplitude of the first area, including:In the spy
When sign parameter meets first preparatory condition, the temperature control unit of the electronic equipment is controlled to enter the first area
Row heating, to increase the largest deformation amplitude of the first area;Or described judge whether the characteristic parameter meets to preset
Condition, including:Judge whether the characteristic parameter meets the second preparatory condition;It is described to meet described preset in the characteristic parameter
During condition, the temperature control unit of the electronic equipment is controlled to adjust the temperature of the first area, to change firstth area
The largest deformation amplitude in domain, including:When the characteristic parameter meets second preparatory condition, the electronic equipment is controlled
Temperature control unit cools down to the first area, to reduce the largest deformation amplitude of the first area.
Optionally, before the characteristic parameter for detecting the deformed state for characterizing the first area, the side
Method also includes:When the panel deforms upon, it is determined that producing the first area of deformation.
Optionally, it is described when the characteristic parameter meets the preparatory condition, control the temperature control of the electronic equipment
Unit processed adjusts the temperature of the first area, including:The temperature control unit is removable temperature control unit, described
When characteristic parameter meets the preparatory condition, control the temperature control unit be moved to the first area correspondence position,
And adjust the temperature of the first area;Or the temperature control unit is temperature control modules array, be arranged on it is described
Position corresponding to panel, when the characteristic parameter meets the preparatory condition preparatory condition, control the temperature control modules
Temperature control modules corresponding with the first area are adjusted to the temperature of the first area in array.
Optionally, the characteristic parameter of the detection first area, including:It is special by the first sensing unit detection first
Parameter is levied, the fisrt feature parameter is used for the deformation amplitude for characterizing the first area;It is described to judge that the characteristic parameter is
It is no to meet preparatory condition, including:Judge the fisrt feature parameter whether in the range of given threshold;Join in the fisrt feature
When number is in the range of the given threshold, the characteristic parameter meets the preparatory condition.
Optionally, the characteristic parameter of the detection first area, including:It is special by the second sensing unit detection second
Parameter is levied, the second feature parameter is used for the deformation direction for characterizing the first area;It is described to judge that the deformed state is
It is no to meet preparatory condition, including:Judge whether the second feature parameter is consistent with default deformation direction;It is special described second
When sign parameter is consistent with the default deformation direction, the characteristic parameter meets the preparatory condition.
Optionally, it is described when the characteristic parameter meets the preparatory condition, control the temperature control of the electronic equipment
Unit processed adjusts the temperature of the first area, including:When the characteristic parameter meets the preparatory condition, the temperature is controlled
When temperature to the characteristic parameter that degree control unit adjusts the first area meets end condition, the end condition and institute
State preparatory condition difference.
Optionally, the electronic equipment also includes temperature sensing unit, it is described meet in the characteristic parameter it is described pre-
If during condition, after the temperature of the temperature control unit adjustment first area for controlling the electronic equipment, methods described is also
Including:The temperature parameter at the fisrt feature position of the electronic equipment is detected by the temperature sensing unit;In the temperature
When parameter is in design temperature threshold range, the temperature control unit is controlled to stop adjusting the temperature of the first area
It is whole.
On the other hand the application provides a kind of electronic equipment, including:Can deformation panel, positioned at the electronic equipment
First surface;Wherein, for the panel when by the external force being applied in, the first area of the panel can produce deformation so that
The relative position in the second area of the panel and the 3rd region changes, wherein, the second area is to be located at firstth area
The region of the side of domain first, the 3rd region are the regions positioned at the side of first area second, first side and described the
Two sides are different;Sensing unit, set on the panel, for detecting the deformation parameter for the deformed state for characterizing the panel;
The deformation parameter includes the characteristic parameter for being used to characterize the deformed state of the first area;Temperature control unit, it is arranged on
On the position corresponding with the panel;Processor, it is connected with the sensing unit and the temperature control unit, for judging
Whether the characteristic parameter meets preparatory condition, and the temperature control is controlled when the characteristic parameter meets the preparatory condition
Unit processed adjusts the temperature of the first area, to change the largest deformation amplitude of the first area.
Optionally, the sensing unit includes the 3rd sensing unit, and the 3rd sensing unit is used to send out in the panel
During raw deformation, it is determined that producing the first area of deformation.
Optionally, the temperature control unit is fixed by a removable attachment means, and the temperature control unit is in institute
It is lower removable to state removable attachment means traction, can be right by the movement of the temperature control unit temperature control unit
Any position of the panel is heated or cooled;The processor is additionally operable to controlling the temperature control unit adjustment institute
Before the temperature for stating first area, the temperature control unit is controlled to be moved to and the first area correspondence position;Or institute
It is temperature control modules array to state temperature control unit, is arranged on position corresponding with the panel;The processor is additionally operable to
Before the temperature for controlling the temperature control unit to adjust the first area, determine in the temperature control modules array with
The temperature control modules of the first area position correspondence are used to the first area be heated or cooled.
Optionally, the sensing unit includes the first sensing unit, sets on the panel, first sensing unit
The fisrt feature parameter of the deformation amplitude for characterizing the first area can be detected, the characteristic parameter includes described first
Characteristic parameter;The processor is specifically used for judging the characteristic parameter whether in the range of given threshold, and in the feature
The temperature control unit is controlled to be adjusted the temperature of the first area when parameter is in the range of the given threshold.
Optionally, the sensing unit includes the second sensing unit, sets on the panel, second sensing unit
The nyctitropic second feature parameter of shape for characterizing the first area can be detected, the characteristic parameter includes described second
Characteristic parameter;The processor is specifically used for judging whether the second feature parameter is consistent with default deformation direction, and
The second feature parameter controls the temperature control unit to the first area when being consistent with the default deformation direction
Temperature be adjusted.
Optionally, the processor is specifically used for when judging that the characteristic parameter meets preparatory condition, described in control
Temperature control unit the temperature of the first area is adjusted to the characteristic parameter meet end condition when, the termination
Condition is different from the preparatory condition.
Optionally, the electronic equipment also includes:Temperature sensing unit, it is connected with the processor, it is described for detecting
The temperature parameter at the fisrt feature position of electronic equipment;The processor is additionally operable in the temperature parameter in design temperature threshold value
In the range of when control the temperature control unit to stop being adjusted the temperature of the first area.
Optionally, the electronic equipment also includes:Heat-transfer device, position corresponding with the panel is arranged on, for inciting somebody to action
Heat at the first area, which is guided to the first position of the electronic equipment, the first position, is located at the electronic equipment
The first surface outside surface;And/or heat-proof device, it is arranged on the panel and the second feature portion on electronic equipment
Between position, for preventing heat caused by the first area from conducting to the second feature position.
Optionally, the electronic equipment also includes:Housing, the panel are fixed by the housing, and the housing can
The corresponding deformation with the panel deformation.
The one or more technical schemes provided in the embodiment of the present application, have at least the following technical effects or advantages:
Electronic equipment can control temperature control unit to come pair in the case where the deformed state of panel meets preparatory condition
The first area that deformation is produced on panel carries out that processing is heated or cooled, and then changes the largest deformation amplitude of first area, enters
And solve present in prior art on electronic equipment can the largest deformation amplitude technology that is difficult to change of deformation panel ask
Topic, realize by regulation can temperature at deformation panel, change can deformation panel largest deformation amplitude technique effect so that
Electronic equipment can according to the actual use situation of user adjust panel can deformation range and deformation difficulty, expanded electronics
The usage scenario of equipment, enrich the mode that user uses electronic equipment.
Brief description of the drawings
Fig. 1 a are the schematic diagram of the deformation of panel 10 when not heated in the embodiment of the present application 1;
Fig. 1 b are the schematic diagram of the deformation of panel 10 when being heated in the embodiment of the present application 1;
Fig. 2 be the embodiment of the present application 1 in panel in one way deformation when side schematic view;
Fig. 3 is the schematic block diagram of the functional module of control electronics in the embodiment of the present application 1;
Fig. 4 is the schematic block diagram of sensing unit 20 in the embodiment of the present application 1;
Fig. 5 a are the side schematic view of a kind of electronic equipment provided in the embodiment of the present application 1;
Fig. 5 b are the front schematic view of a kind of electronic equipment provided in the embodiment of the present application 1;
Fig. 6 is the schematic flow sheet of the method for control electronics in the embodiment of the present application 2;
Fig. 7 is another schematic flow sheet of the method for control electronics in the embodiment of the present application 2.
Embodiment
The application provides a kind of method and a kind of electronic equipment of control electronics, for solving to exist in the prior art
Electronic equipment on can the largest deformation amplitude of deformation panel be difficult to the technical problem changed, realizing can deformation by regulation
Temperature at panel, change can deformation panel largest deformation amplitude technique effect.
Technical scheme in the embodiment of the present application is in order to solve the above technical problems, general thought is as follows:
In certain temperature range, can deformation panel after deformation to largest deformation amplitude, it is difficult to by increase force come
Further increase the deformation amplitude of panel, similarly, after panel-shaped fades to a smaller deformation amplitude, it is difficult to make panel by outer
Under power effect, in the state of maintaining the smaller deformation amplitude, without the deformation of more large deformation amplitude, that is, being difficult to change can shape
Become the largest deformation amplitude of panel.
In the embodiment of the present application, electronic equipment can under certain condition, and the deformation region of counter plate is heated so that shape
Becoming the largest deformation scope increase in region, panel can carry out deformation by a larger margin, or electronic equipment is under certain condition,
The deformation region of counter plate carries out cooling treatment so that the largest deformation amplitude of deformation region reduces, and then prevents deformation region
Carry out deformation by a relatively large margin.Therefore, what electronic equipment can be according to the actual use situation of user adjustment panel 10 can deformation
Scope, the usage scenario of electronic equipment is expanded, enriched the mode that user uses electronic equipment.
Technical scheme is described in detail below by accompanying drawing and specific embodiment, it should be understood that the application
Specific features in embodiment and embodiment are the detailed description to technical scheme, rather than to present techniques
The restriction of scheme, in the case where not conflicting, the technical characteristic in the embodiment of the present application and embodiment can be mutually combined.
Embodiment 1
The application by embodiment 1 provide a kind of electronic equipment, the electronic equipment can be smart mobile phone, tablet personal computer or
Intelligent watch, etc..The electronic equipment comprises at least panel 10, sensing unit 20, temperature control unit 30 and processor 40.
Refer to shown in Fig. 1 a, panel 10 for can deformation panel, positioned at the first surface of electronic equipment, first surface can
Think the arbitrary surfaces of electronic equipment, panel 10 there can be the display panel of display function or without display
The panel of function.For panel 10 when by the external force being applied in, the first area 101 of panel 10 can produce deformation so that panel
The relative position in 10 region 103 of second area 102 and the 3rd changes, wherein, second area 102 is to be located at first area 101
The region of first side, the 3rd region 103 are different with the second side positioned at the region of the side of first area 101 second, the first side.
Specifically, first area 101 is the deformation region of panel 10, as shown in Figure 1a, applies inside directed force F in the
When on two regions 102 and the 3rd region 103, first area 101 will be produced perpendicular to the inside Bending Deformation of panel 10.Actual feelings
Deformation is produced in condition or by way of shown in Fig. 2, active force is acted directly on first area 101, first area
101 deformation drives the change of second area 102 and the relative position of the 3rd region 103.In the embodiment of the present application, in the firstth area
When domain 101 produces deformation, the region 103 of second area 102 and the 3rd can produce corresponding deformation, can not also produce deformation.
As shown in figure 3, sensing unit 20 is set on the faceplate 10, for detecting the deformation for the deformed state for characterizing panel 10
Parameter;Deformation parameter includes the characteristic parameter for being used to characterize the deformed state of first area 101.Specifically, sensing unit 20
It can be arranged on the stress surface of panel 10, can also be arranged on the face relative with stress surface of panel 10, sensing unit 20
Two parts can also be included, be separately positioned on stress surface and the face relative with stress surface.
Temperature control unit 30 is arranged on the position corresponding with panel 10, is added for the correspondence position of counter plate 10
Heat treatment or cooling treatment.
Processor 40, it is connected with sensing unit 20 and temperature control unit 30, processor 40 can be an integrated chip,
It can be a single-chip microcomputer.Whether processor 40 meets preparatory condition for judging characteristic parameter, and meets to preset in characteristic parameter
During condition control temperature control unit 30 to be heated to first area 101 or cooling treatment, first is adjusted with this
The temperature in region 101, after the temperature of first area 101 changes, the ductility of first area 101 can change, first area 101
The largest deformation amplitude that can reach during deformation produces change, while can also change the deformation complexity of first area 101.
Specifically, processor 40 can control temperature control unit 30 when characteristic parameter meets the first preparatory condition
First area 101 is heated so that the ductility enhancing of first area 101, not only cause the maximum shape of first area 101
Time-varying amplitude increases, and can also make deformation amplitude of the first area 101 under the effect of unit external force bigger, the reduction of deformation difficulty.
In addition, processor 40 also can be when characteristic parameter meets the second preparatory condition, control temperature control unit 30 is right
First area 101 carries out cooling treatment, and then reduces the largest deformation amplitude of first area 101 so that prolongs first area 101
Malleability weakens, and not only causes the largest deformation amplitude of first area 101 to reduce, can also make the masterpiece outside unit of first area 101
Deformation amplitude under is smaller, the increase of deformation difficulty, is easy to make panel 10 maintain under a smaller deformation amplitude state, without
The easily deformation with external force progress by a larger margin.
Under normal temperature, during the deformation of first area 101 to a certain threshold value, deformation amplitude is difficult to continue to increase, if applied by force
Bigger active force, by cause panel 10 can deformation structure destroy, cause panel breaking or can not recover to non-deformation
State, this threshold value are the largest deformation amplitude under normal temperature.
In the embodiment of the present application, can by the radius of curvature of deformation position come the deformation amplitude of Metric Transformation position,
The current deformation amplitude in one region can be characterized with the inverse of the minimum profile curvature radius in first area, i.e.,:L=a/
Rmin, wherein L is deformation amplitude, and a is constant, RminFor the minimum value of first area incurvature radius.Minimum profile curvature radius RminMore
Small, the deformation amplitude L of first area is bigger.
As shown in Figure 1a, when not heated to first area 101, when on the region 103 of second area 102 and the 3rd
Apply a pair of active forces, panel 10 is curved inwardly the R of deformation, now first area 101minFor R1;As shown in Figure 1 b, right
After first area 101 is heated, the application side in the same position of second area 102 and the same position in the 3rd region 103
To with a pair of active forces of size identical, the now R of first area 101min' it is R2, R2Less than R1, that is, apply identical active force
When, before heating, the deformation amplitude increase of first area 101 after heating.In addition, R might as well be set1When not heating as most
Small curvature radius threshold, the minimum profile curvature radius threshold value of first area 101 is less than or equal to R after heating2, necessarily more than R1, i.e.,
The minimum profile curvature radius threshold value of first area 101 reduces after heating, the increase of largest deformation amplitude.
It is consistent with principle during heating for situation that cooling treatment is carried out to first area 101, that is, the after cooling down
The largest deformation amplitude in one region 101 reduces, and the lower deformation quantity of unit effect reduces, the increase of deformation difficulty, the embodiment of the present application
No longer illustrate.
To sum up, in the embodiment of the present application above-mentioned technical proposal, electronic equipment can meet pre- in the deformed state of panel 10
If in the case of condition, control temperature control unit 30 come on counter plate 10 produce deformation first area 101 heated or
Cooling treatment, and then change the largest deformation amplitude of first area 101, and then solve electronic equipment present in prior art
On can the largest deformation amplitude of deformation panel 10 be difficult to the technical problem changed, realizing can be at deformation panel 10 by regulation
Temperature, change can deformation panel 10 largest deformation amplitude technique effect so that electronic equipment can be according to the reality of user
Service condition adjustment panel 10 can deformation range and deformation difficulty, expanded the usage scenario of electronic equipment, enriched use
Family uses the mode of electronic equipment.
Further, each device of electronic equipment internal can make following one or more processing:First, the body by internal each device
Product reduces, or large volume of device is arranged to the device of multiple small volumes by rotary connecting device connection;Second,
The electrical connection between device is realized by flexible PCB;Third, device in itself by can shape-changing material form, itself can deformation;Its
Four, surplus space is left around device, is easy to the position of device to change;Fifth, device is arranged on electronic equipment internal
The position not deformed upon.By that with upper type, can enable electronic equipment internal device including processor 40
Deformation with panel 10 is adapted, and then lifts the safety of electronic equipment internal device, increases panel 10 in actual conditions
Can deformation amplitude.
Further, in the embodiment of the present application, the first area 101 for producing deformation can be the one or more on panel 10
FX, or any one region on panel 10.Wherein, when first area 101 is can be with multiple FX
One or more of, and first area 101 can be panel 10 on arbitrary region when, the 3rd sensing unit can be passed through
203 determine the particular location of first area 101.
Specifically, Fig. 4 is refer to, sensing unit 20 includes the 3rd sensing unit 203, and the 3rd sensing unit 203 is used for
When panel 10 deforms upon, it is determined that producing the first area 101 of deformation.It is in multiple FX in first area 101
When one or more, the 3rd sensing unit 203 is correspondingly arranged at these FX, and when first area 101 is panel
On 10 during arbitrary region, the 3rd sensing unit 203 is correspondingly arranged at the position for the deformed state for being able to detect that whole panel 10
On.
In the embodiment of the present application, the 3rd sensing unit 203 can determine first area 101 using various ways, under
Face is enumerated two of which and introduced, and certainly, in specific implementation process, is not limited to following two situations.
(1) the 3rd sensing unit 203 is the strain gauge resistance sensor of flexible element, and the flexible member can be electricity
Foil gauge is hindered, resistance strain gage is fitted on panel 10 (or specific several fixed deformation regions), wherein, resistance strain gage
With the deformation of first area 101 with width deformation, change in resistance during resistance strain gage deformation, and then make it possible to according to the 3rd sensing
The electrical parameter numerical value that unit 203 detects determines the particular location of first area 101 deformed upon.
(2) 3rd sensor 203 is surface acoustic wave sensor, and surface acoustic wave sensor is with piezoelectric substrate (such as quartz substrate)
For pressure vibration film, the pressure vibration film with width can produce deformation with first area 101, the piezoelectric substrate after deformation due to
The changes in distribution of stress/strain, cause surface acoustic wave thereon spread speed change, by using using SAW device as
The resonator mode of member is fed back, its frequency output signal is that good linear relationship is presented with stress, is changed according to stress
Position can determine that produce deformation first area 101.
In specific implementation process, above-mentioned resistance strain gage and piezoelectric substrate can be a continuous laminated structure, also may be used
Think the array of multiple discrete laminated structure compositions, by the array, the detection range of 3rd sensor 203 can be with coverage rate
On plate 10 all can deformation region.
Further, the first area 101 for producing deformation for one or more FX on panel 10 when, temperature control
Unit 30 processed is arranged on these FX, and when first area 101 can be any one region on panel 10,
Temperature control unit 30 can carry out temperature control in any one position on counter plate 10.
In the embodiment of the present application, temperature control unit 30 can realize any one position on counter plate 10 using various ways
Carry out temperature control is put, three kinds therein is set forth below and is introduced, certainly, in specific implementation process, is not limited to following three
Kind situation.
First, temperature control unit 30 is fixed by a removable attachment means, temperature control unit 30 connects removable
Connection device traction is lower removable, and by the movement of temperature control unit 30, temperature control unit 30 is capable of any of counter plate 10
Position is heated or cooled.
In this case, processor 40 be additionally operable to control temperature control unit 30 adjust first area 101 temperature it
Before, control temperature control unit 30 is moved to and the correspondence position of first area 101;
Second, temperature control unit 30 is temperature control modules array, it is arranged on and 10 corresponding position of panel, the temperature
The temperature regulating range of control module array can be on cover plate 10 any position.In this case, processor 40 is also used
In before control temperature control unit 30 adjusts the temperature of first area 101, with first in temperature control module array
The temperature control modules of the position correspondence of region 101 are used to first area 101 be heated or cooled.
Third, temperature control unit 30 adjusts the temperature of first area 101 by way of irradiation, including electromagnetic irradiation,
The modes such as laser irradiation, infrared radiation.
In this case, processor 40 is additionally operable to adjust the temperature of the first area 101 in control temperature control unit 30
Before degree, the irradiation direction of temperature control unit 30 is adjusted so that irradiation energy face first caused by temperature control unit 30
Region 101.
Further, temperature control unit 30 includes heating unit and/or cooling unit, i.e. temperature control unit 30 can be with
Heating unit is only included, cooling unit can also be only included or include the two simultaneously.In temperature control unit 30 simultaneously
Comprising heating unit and during cooling unit, heating unit and refrigeration unit can integrate, and form a hardware,
It can be the separate hardware of two separation.
Specifically, heating unit can be electricity heater, such as be heated by electrical components heating power;
It can also be irradiated heat device, such as carry out irradiated heat with laser or electromagnetic wave;It can also be chemical heater, pass through control
Heat-producing chemical reaction is carried out to heat.
And cooling unit can be devaporizer, absorbed by the evaporation of the lower boiling cooling agent such as freon a large amount of
Heat, reduce first area 101 temperature;Can also be chemical cooler, by control endothermic chemical reaction carry out come pair
Reduce the temperature of first area 101;Can also be fluid cooler, by the cryogen wherein injected to first area 101
Cooled down.
Further, Fig. 4 is continued referring to, sensing unit 20 includes the first sensing unit 201, sets on the faceplate 10, the
One sensing unit 201 can detect the fisrt feature parameter of the deformation amplitude for characterizing first area 101, and characteristic parameter includes
Fisrt feature parameter.Processor 40 is specifically used for judging characteristic parameter whether in the range of given threshold, and exists in characteristic parameter
Temperature control unit 30 is controlled to be adjusted the temperature of first area 101 when in the range of given threshold.
Specifically, fisrt feature parameter is corresponding with the deformation amplitude of first area 101, therefore in fisrt feature parameter
When in the range of given threshold, the deformation amplitude of first area 101 can be realized in first area within setting range
101 deformation adjust the temperature of first area 101 by temperature control unit 30 to when setting deformation amplitude.
Processor 40 is specifically used for judging characteristic parameter whether in the range of the first given threshold, and in characteristic parameter the
Temperature control unit 30 is controlled to heat first area 101 when in the range of one given threshold;Or join for judging characteristic
Number controls temperature control unit whether in the range of the second given threshold when characteristic parameter is in the range of the second given threshold
30 pairs of first areas 101 cool down.
In actual conditions, first area 101 can be heated or cooling treatment when panel 10 produces deformation,
Now the first given threshold scope and the second given threshold scope be corresponding to deformation amplitude from zero to more than zero when (can set
For the smaller setting value more than zero) fisrt feature parameter values scope.
During alternatively, it is also possible near the deformation of first area 101 to (under normal temperature) largest deformation amplitude, just to first area
101 are heated, so that first area 101 can carry out deformation of the deformation amplitude more than the largest deformation amplitude under normal temperature, this
When the corresponding deformation amplitude range with closing on (under normal temperature) largest deformation amplitude of the first given threshold scope;Or in the firstth area
During the deformation of domain 101 to certain setting deformation amplitude range, in order to keep current shape time-varying amplitude, the further expansion of deformation amplitude is avoided
Greatly, cooling treatment is carried out to first area 101, now, the second given threshold scope corresponds to the setting deformation amplitude range
Fisrt feature parameter values scope.
Furthermore, may shadow if continuing deformation by a larger margin in the deformation of panel 10 to certain deformation amplitude
Electrical connection between the safety or damage device of other devices of sound electronic equipment internal, therefore, is detecting first area 101
During deformation to certain preboarding time-varying amplitude, cooling treatment can be carried out to it by temperature control unit 30, make its largest deformation width
Degree reduces, and caused deformation quantity also reduces under unit active force, and preventing it from entering guild influences electrically to connect between internal components and device
The significantly deformation of the security connect, ensure the safety and normal work of electronic equipment.
Similar with the 3rd sensing unit 203 in the embodiment of the present application, the first sensing unit 201 can use various ways
To realize detection fisrt feature parameter, two of which is set forth below and is introduced, certainly, in specific implementation process, is not limited to
Following two situations.
First, the first sensing unit 201 is the strain gauge resistance sensor of flexible element, the flexible member can be
Resistance strain gage, resistance strain gage are fitted on panel 10 (or specific several fixed deformation regions), wherein, resistance-strain
Piece is with the deformation of first area 101 and with width deformation, and change in resistance during resistance strain gage deformation, fisrt feature parameter is strain-type
The electrical parameter that electric resistance sensor detects.
Because with the deformation amplitude of first area 101 difference, the fisrt feature parameter detected is different, therefore, based on one
Fixed mathematical modeling, the shape of first area 101 can be determined according to the fisrt feature parameter that the first sensing unit 201 detects
Time-varying amplitude.
Second, first sensor 201 is surface acoustic wave sensor, surface acoustic wave sensor is with piezoelectric substrate (such as quartzy base
Piece) it is pressure vibration film, the pressure vibration film can be as first area 101 be with width generation deformation, the piezoelectric substrate after deformation
Due to the changes in distribution of stress/strain, surface acoustic wave is caused to change in spread speed thereon, by using with surface acoustic wave device
Part is the resonator mode of feedback member, and its frequency output signal is that good linear relationship is presented with the active force applied, with
The size of active force and the deformation amplitude of first area 101 added by this detection.
Further, Fig. 4 is continued referring to, sensing unit 20 includes the second sensing unit 202, sets on the faceplate 10, the
Two sensing units 202 can detect the nyctitropic second feature parameter of shape for characterizing first area 101, and characteristic parameter includes
Second feature parameter;Processor 40 is specifically used for judging whether second feature parameter is consistent with default deformation direction, and the
Temperature control unit 30 is controlled to adjust the temperature of first area 101 when two characteristic parameters are consistent with default deformation direction
It is whole.
Specifically, when processor 40 can carry out setting the deformation on deformation direction in first area 101, to the firstth area
Domain 101 carries out that processing is heated or cooled.
That is, processor 40 is specifically used for judging whether second feature parameter is consistent with the first default deformation direction, and
Control temperature control unit 30 adds to first area 101 when second feature parameter is consistent with the first default deformation direction
Heat, and then enable first area 101 to carry out deformation by a larger margin in the deformation direction, deformation difficulty also can be smaller;
Or
For judging whether second feature parameter is consistent with the second default deformation direction, and in second feature parameter and the
Control temperature control unit 30 cools down to first area 101 when two default deformation directions are consistent, and then causes the firstth area
Largest deformation amplitude of the domain 101 on the deformation direction diminishes, and deformation difficulty can also become big so that panel 10 is difficult in the shape
Change direction upper carry out deformation.
In actual conditions, the first default deformation direction can be the outwardly direction of vertical panel 10, and second presets deformation side
To for the inward direction of vertical panel 10, panel 10 is set easily to be bent outwardly deformation, it is difficult to which curve inwardly deformation;Can also phase
Instead, the first default deformation direction can be the inward direction of vertical panel 10, the second default deformation direction for vertical panel 10 to
Outer direction, panel 10 is set to be easy to the deformation that curves inwardly, it is difficult to be bent outwardly deformation.That is, electronic equipment may be only specific
Just need it to be carried out processing is heated or cooled when producing deformation on direction, and specific deformation direction is with being heated or cooled processing
Corresponding relation, in the embodiment of the present application not limit.Several examples with above-mentioned technical proposal are set forth below, certainly,
It is not limited in actual applications following several.
Example 1, when the deformation direction of first area 101 is that vertical panel is outside, temperature control unit 30 is to first area
101 are heated.So processing has following beneficial effect, first, when the vertical panel of first area 101 is bent outwardly deformation, it is curved
Panel 10 after song will surround temperature control unit 30, heat caused by temperature control unit 30 is wrapped in, can not only carry
The higher position efficiency of heating surface, additionally it is possible to such as CPU other devices of thermal damage electronic equipment internal caused by avoiding.
Second, when the deformation direction of first area 101 is that vertical panel is outside, electronic equipment is in use state (such as more
When panel 10 is display panel, panel more than 10 is in dispaly state when first area is bent outwardly), in this condition to the firstth area
Domain is heated, and is matched with the actual demand of user.
It is to it when vertical panel is outside in the deformation direction of first area 101 third, when panel 10 is display panel
Heating can increase the visual range of display panel.When panel 10 produces the outside bending deformation of vertical panel 10, second area 102
Had angle with the 3rd region 103, then show content that is identical or differing on the region 103 of second area 102 and the 3rd,
And then the user positioned at electronic equipment different azimuth is enabled to see that electronics is set by the region 103 of second area 102 or the 3rd
Standby display content, equivalent to the visual range for extending display panel.In order to widen the visual range of display panel as far as possible,
When detecting display panel outward bending deformation, first area 101 can be heated, increase its largest deformation width
Degree, reduce its deformation difficulty so that angle further reduces between the region 103 of second area 102 and the 3rd, display panel can
Become much larger depending on scope.
Example 2, when the deformation direction of first area 101 is that vertical panel is inside, temperature control unit 30 is to first area
101 carry out cooling treatment.Continue to use the example that said panel 10 is display panel, when the display width of display panel is smaller, production
It is not enough to form the ring curtain display screen around user after raw inside deformation, in this case, display panel carries out perpendicularly inward
During deformation, because the display content in the region 103 of second area 102 and the 3rd is not in a display surface, user needs conversion to regard
Angle can switch the display content on viewing second area 102 and the 3rd region 103, and the appreciation effect of user can drop on the contrary
It is low.Therefore, in this case, cooling treatment can be carried out to first area 101, avoids display panel because inwardly carrying out significantly
Deformation and cause visual effect to decline, and then improve user usage experience.
Example 3, when the deformation direction of first area 101 is that vertical panel is inside, temperature control unit 30 is to first area
101 are heated.Because electronic equipment has certain thickness on panel 10 to the housing direction relative with panel 10,
Therefore, when 101 outside deformation of first area, because the thickness of the internal components positioned at panel dorsal part and housing limits, first
The reality in region can deformation amplitude be possibly less than largest deformation amplitude under normal temperature, therefore, in this case need not be to
Heated in one region 101, it is not necessary to further increase largest deformation amplitude;On the contrary, when the deformation direction of first area 101 is
When vertical panel is inside, due to not limited by the internal components of panel dorsal part and the thickness of housing, the reality of first area can shape
Time-varying amplitude can reach the largest deformation amplitude under normal temperature, it is possible that needing further to increase largest deformation amplitude, it is necessary to right
Heated first area 101.
Example 4, the component of electronic equipment internal have the knot that can carry out deformation by a relatively large margin in one direction
Structure, and deformation more by a small margin can only be carried out in the opposite direction.For example, the circuit board first face of electronic equipment is provided with largely
Contact (or pin), and contact is not provided with the second face opposite with the first face, circuit board can be around one or more rotating shafts
Rotate, so, when panel 10 bends deformation, circuit board can be corresponded to and bent, still, because the first face is provided with substantial amounts of touch
Point, circuit board carry out perpendicular to second face out bending when, bending amplitude can not be too big, otherwise will cause connecing between contact
Touch, be damaged circuit board.
It might as well assume that the surface orientation that the second face is exposed outside with panel 10 is consistent, i.e. when panel 10 is carried out perpendicular to face
During the inside bending deformation of plate, circuit board is carried out perpendicular to the second inward-facing deformation, in this case, in order to increase panel 10
Outside largest deformation amplitude, first area 101 can be heated, and when panel 10 carry out it is outside perpendicular to panel 10
Deformation when, circuit board carry out perpendicular to the second deformation faced out, in order to avoid contact, do not make first area 101
Largest deformation amplitude increases, and first area 101 is not heated, it might even be possible to carries out cooling treatment to first area 101, enters
And reduce the largest deformation amplitude of first area 101, increase the deformation difficulty of first area 101, ensure the safety of circuit board.
In the embodiment of the present application, the second sensing unit 202 can detect second feature parameter using various ways, below
Enumerate two of which to be introduced, certainly, in specific implementation process, be not limited to following two situations.
First, the first sensing unit 201 is the strain gauge resistance sensor of flexible element, the flexible member can be
Such as semiconductor, piezoelectric have the resistance strain gage that anisotropic material is formed, and the resistance strain gage is fitted in panel
On 10 (or specific several fixed deformation regions), wherein, resistance strain gage with the deformation of first area 101 and with width deformation,
Change in resistance during resistance strain gage deformation, and because resistance strain gage constituent material has anisotropy, therefore, when deformation direction
When different, the electrical parameter detected is also just different, therefore, first area can be determined by the change for analyzing electrical parameter
101 deformation direction.
Second, descend both sides that one ply strain piece is respectively set on the faceplate 10, by analyzing the stress in two layers of foil gauge up and down
Attribute difference, it may be determined that go out deformation direction.Stress is compression in lower floor's foil gauge is detected, stress in the foil gauge of upper strata
For tensile stress when, determine that panel 10 is bent outwardly deformation;And stress is tensile stress in lower floor's foil gauge is detected, upper ply strain
When stress is compression in piece, determine that panel 10 curves inwardly deformation.
Further, in the embodiment of the present application, deformation amplitude and two, deformation direction factor can be combined to judge whether pair
First area 101 carries out temperature adjustment.That is, when second feature parameter is consistent with default deformation direction, fisrt feature is judged
Whether parameter is only consistent and fisrt feature parameter in the range of given threshold in second feature parameter with default deformation direction
When in the range of given threshold, characteristic parameter just meets preparatory condition.
In actual implementation process, fisrt feature parameter can also be first judged whether in the range of given threshold, it is special first
In the case that sign parameter meets condition, then judge whether second feature parameter is consistent with default deformation direction.The application is implemented
In example, the sequencing of two judgment steps is not construed as limiting.
Further, processor 40 is specifically used for when judging that characteristic parameter meets preparatory condition, controls temperature control list
The temperature of first 30 pairs of first areas 101 be adjusted to characteristic parameter meet end condition when, end condition with preparatory condition not
Together.
Specifically, when characteristic parameter meets preparatory condition, thermostat unit 30 enters trip temperature to first area 101
Regulation, due to the first area 101 after temperature adjustment and environment (including air, the device being connected, second area, the 3rd region)
With certain temperature difference, if temperature adjustment is not carried out persistently, first area 101 will with environment carry out heat conduction after,
Slowly recover the temperature to temperature adjustment so that the largest deformation amplitude of first area 101 recovers the number to temperature adjustment
Value, this needs the use demand for changing largest deformation amplitude inconsistent with user., should in order to avoid the appearance of such case
When characteristic parameter is satisfied with and sets condition, the temperature of first area 101 is carried out by thermostat unit to continue regulation, and then
The direction that ensureing the largest deformation amplitude of first area 101 can be consistent to the use demand of user persistently changes, or maintains
In the number range being consistent with user's use demand.
And when characteristic parameter meets end condition, electronic equipment will be such that thermostat unit stops to first area 101
Carry out temperature adjustment.
In specific implementation process, end condition can be that deformation amplitude reaches the 3rd setting amplitude range, such as when the firstth area
The deformation of domain 101 to one by a relatively large margin when, it is contemplated that ensure the electrical connection of panel 10, and other devices closed on panel 10
Security, should not further increase the deformation range of first area 101, avoid causing brokenly electrical connection and adjacent devices
It is bad, it should now stop heating.
Adjusted in addition, the change that end condition can also be the deformation amplitude for detecting first area 101 is converted into temperature
Save opposite trend, such as detected in heating the deformation amplitude of first area 101 reduce (or be decreased to a certain threshold value with
Under), now show that user has no longer made panel 10 carry out deformation by a larger margin, can now stop heating.
Furthermore when end condition can also be that deformation direction changes, as said panel 10 is display panel
In example, when the deformation direction for detecting first area 101 is that vertical panel is outside, in order to widen the visual model of display panel
Enclose, first area 101 is heated, and when the deformation direction of first area 101 is inside for vertical panel, stop heating,
The visual effect caused by the inside deformation of panel is avoided to reduce.The embodiment of the present application is no longer illustrated one by one.
Further, Fig. 3 is continued referring to, electronic equipment also includes temperature sensing unit 50, is connected with processor 40, is used for
Detect the temperature parameter at the fisrt feature position of electronic equipment;Processor 40 is additionally operable in temperature parameter in design temperature threshold value model
Temperature control unit 30 is controlled to stop being adjusted the temperature of first area 101 when enclosing interior.
Specifically, temperature control unit 30 is controlled to stop adding when temperature parameter is more than or equal to the first design temperature threshold value
Heat, avoid fisrt feature spot temperature too high;Or when temperature parameter is less than or equal to the second design temperature threshold value, control temperature
Control unit 30 stops cooling down first area 101, avoids fisrt feature spot temperature too low.
In actual conditions, fisrt feature position can include first area 101, and/or such as CPU positions in electronic equipment
Put, core position, the position of hard disk position equitemperature Sensitive Apparatus, and/or user holding area.Wherein, first area 101 is
The position maximum with environment temperature difference of electronic equipment, and the temperature at temperature sensor position to the safety of electronic equipment and
Performance impact is very big, and the temperature of user holding area will also influence the usage experience of user, therefore, appointing in said temperature
When one or more of anticipating exceeds corresponding threshold range, will all influence user's normal use electronic equipment, should stop immediately into
One step carries out temperature adjustment to first area, avoids the temperature of electronic equipment internal excessively extreme, influences the safety of electronic equipment
And performance.
In specific implementation process, above-mentioned user holding area can be the fixed position on electronic equipment, the position by
In the gripping sense for improving user in design, it is usually the case that, user can grip electronic equipment by the position;Separately
Outside, user holding area can also be that user is the position that electronic equipment is gripped during user's actual use, and electronic equipment can lead to
Cross related transducer equipment (such as pressure sensor, infrared sensor) and determine its particular location, then pass through TEMP list again
Member 50 monitors the temperature at the position.
Further, electronic equipment also includes heat abstractor, is connected with processor 40, for dispersing the heat of electronic equipment internal
Amount;Processor 40 is additionally operable to adjust the operating power of heat abstractor according to temperature parameter dynamic, wherein, operating power is with temperature
Parameter increases and increased, and then while being heated to first area 101, avoids the temperature in other regions too high, influences
The performance and safety of electronic equipment.
In addition, adjusting the power of heat abstractor according to temperature dynamic, energy can be saved in the case where ensureing effectively radiating
Amount, heat abstractor can also be allowed to produce vibration when radiating and be kept low, avoid causing damage to vibration sensitive element.
Further, electronic equipment also includes power control module, and the power control module can be integrated on processor 40,
It can also be independent entity module.On the one hand, power control module can control temperature control unit 30 adjusting the firstth area
The mode of operation during temperature in domain 101, the lower power consumption of the temperature control unit 30 made.Specifically, first is needed in user
When the largest deformation amplitude in region maintains certain fixed value, it is only necessary to by the temperature control of first area in corresponding fixed temperature
Value.It might as well assume that the fixed temperature value is more than environment temperature, temperature control unit 30 need to add to first area 101
Heat, if maintaining heating always, not only the temperature of first area 101 is likely to be greater than the fixed temperature value, and can cause need not
The energy waste wanted, the extra power consumption for increasing electronic equipment.
In the embodiment of the present application, power control module can control temperature control unit 30 to enter in the ranks first area 101
Every heating so that the temperature of first area 101 maintains the fixed temperature value.Due to that need not heat always, electronic equipment
Power consumption will be reduced.And the mode of the interval of temperature control unit 30 heating comprises at least following two modes:First, set one
The sensor of the temperature of first area 101 is detected, power control unit will be less than the fixed temperature value in the temperature of first area 101
Temperature control unit 30 is controlled to heat first area 101 when (or being sized less than the fixed temperature value), and the
The temperature in one region 101 controls temperature control unit when being more than fixed temperature value (or being sized more than the fixed temperature value)
30 stop heating.Second, power control unit is according to the parameter structure such as pyroconductivity of the fixed temperature value, environment temperature and air
The mathematical modeling that computer heating control is carried out to first area 101 is built, makes the strategy of the interval of temperature control unit 30 heating, and then
So that the strategy execution that temperature control unit 30 calculates according to simulation heats.Wherein, the acquisition of environment temperature can lead to
The detection of setting temperature sensor is crossed to obtain, can also the excessively related application program inquiry acquisition of clearance.
On the other hand, power control module can be also used for heating first area 101 in temperature control unit 30
Or during cooling, the partial function module on closing electronic equipment, power consumption is reduced, extends the cruising time of electronic equipment.These quilts
The functional module of closing can be navigation module, locating module, data communication module, WiFi module.Except closing above-mentioned function
Beyond module, screen intensity or temporary close screen can also be reduced, reduce volume or temporarily Jing Yin, etc..
Further, electronic equipment also includes heat-transfer device, can be good by heat conductivilitys such as heat conductive silica gel material, graphenes
Material be made, be arranged on 10 corresponding position of panel, for the heat at first area 101 to be guided to electronic equipment
First position, first position are located at the surface outside the first surface of electronic equipment, first position be to electronic equipment performance and
Safety effects are smaller or do not influence, and do not interfere with the position using electronic equipment of user, should not such as be arranged at display
Face, grip position, CPU equitemperature sensing elements position.
Further, electronic equipment also includes the second heat-transfer device, and one end of second heat-transfer device is arranged on electronic equipment
Heating element on, at CPU, the other end is divided into two branch roads, and tie point is arranged on foregoing first position, the second branch road
First area is arranged on, is controlled between two branch roads by electronic valve.When needing to heat first area, the electronic valve
Door closes tie point, turns on the second branch road, and producing heat by heating element carries out independent or auxiliary to first area 101
Heating;And when that need not heat, tie point is turned on, closes the second branch road, and then can not only be reduced at heater members
Temperature, additionally it is possible to produce heat using heater members and heated to first area 101, saved the energy, reduced power consumption.
Further, electronic equipment can also include heat-proof device, can be good by heat-proof qualities such as glass fibre, aerogel blankets
Good material is formed, and is arranged between the second feature position on panel 10 and electronic equipment, for preventing first area 101 from producing
Heat conduct to second feature position, it is sensitive that second feature position includes user holding area, display area, CPU equitemperatures
Position, etc., and then avoid influenceing performance, the safety of electronic equipment, and the usage experience of user.
Further, electronic equipment also includes housing, and panel 10 is fixed by housing, housing can with the deformation of panel 10 and
Corresponding deformation.Optionally, housing includes the back housing parallel with panel 10 and the side housing adjacent with panel 10 so that
Flat board or class plate morphology is integrally presented in electronic equipment.
Housing realize can the mode of deformation include:Shell itself by can shape-changing material form, or housing can around one
Or multiple axis rotate, and housing is rotated about axis and can correspond to the realization of the rotary connecting devices such as rotating shaft by setting.Due to housing
Deformation can be corresponded to the deformation of panel 10, panel can adapt to by aforementioned processing mode electronic equipment internal device in addition
10 deformation, by cause electronic equipment by apply external force when integrally present can deformation characteristic, widened electronic equipment
Occupation mode and usage scenario, lift the aesthetics of the outward appearance of electronic equipment, but also electronic equipment is being received external force effect
When buffering amplitude it is bigger, improve the impaired ability of the external force resistance of electronic equipment.
In addition, in actual conditions, when panel 10 produces deformation, possible housing itself is unable to deformation, but can between housing
Rotated by rotary connecting device, and then the form for causing electronic equipment overall changes with the deformation of panel 10.With Fig. 5 a and
Exemplified by notebook computer shown in Fig. 5 b, notebook computer includes the body 200 of the first noumenon 100 and second, the first noumenon 100 with
Second body 200 is connected by the first rotary connecting device 300.The second area 102 of panel 10 is arranged on the first noumenon 100
On, the 3rd region 103 is arranged on the second body 200, and first area 101 is located in the first noumenon 100 and the phase of the second body 200
Neighbouring region.First housing 110 relative with panel 10 of the first noumenon 100 it is relative with panel 10 with the second body 200
Two housings 210 can be can not deformation housing, the two phase separation, first area 101 produce rotate deformation when, first
Body 100 is connected tumbler 300 around first with the second body 200 and rotated, and the first housing 110 and the second housing 210 also will be therewith
Rotate so that notebook computer configuration with first area deformation and deformation, notebook computer overall appearance are perfect harmony.
When it is implemented, panel 10 can be display surface, or for can deformation touch surface, or for can deformation joint face, etc..
So, when panel 10 rotates around the axis between base and display position, two on the opposing face of panel 10
Individual housing can be by axis of rotation, and then changes the configuration of electronic equipment, and when panel 10 is display panel,
The viewing area of notebook can be divided into two regions that relative position can change, and conveniently different user be shown simultaneously identical
Or different display contents, enrich the display mode of notebook computer.
Further, in the embodiment of the present application, while there may be multiple deformation regions, electronic equipment can be only to wherein shape
The maximum deformation region of time-varying amplitude carries out temperature adjustment, can also carry out temperature adjustment to each deformation region.
Further, in the embodiment of the present application, when also producing corresponding deformation in the region 103 of second area 102 and the 3rd, processing
Device 40 can determine the point of contact of deformation curved surface, and then determine near the point of contact by analyzing the deformation changes in amplitude at each position
Setting range inner region is first area 101, or first determines the rate of change of each position deformation amplitude, it is then determined that deformation amplitude
First area 101 is in the region of the setting range of rate of change larger (setting more than rate of change).
Embodiment 2
Corresponding with the electronic equipment that embodiment 1 provides, the embodiment of the present application 2 provides a kind of side of control electronics
Method, the electronic equipment can be smart mobile phone, tablet personal computer, intelligent watch, etc..The electronic equipment include can deformation panel
10, for panel 10 when by the external force being applied in, the first area 101 of panel 10 can produce deformation so that the second of panel 10
The relative position in the region 103 of region 102 and the 3rd changes, wherein, second area 102 is to be located at the side of first area 101 first
Region, the 3rd region 103 are different with the second side positioned at the region of the side of first area 101 second, the first side;
Fig. 6 is refer to, this method comprises the following steps:
Step 101:Detect the characteristic parameter of the deformed state for characterizing first area 101;
Step 102:Whether judging characteristic parameter meets preparatory condition;
Step 103:When characteristic parameter meets preparatory condition, the adjustment of temperature control unit 30 first of control electronics
The temperature in region 101, to change the largest deformation amplitude of first area 101.
In the embodiment of the present application above-mentioned technical proposal, electronic equipment can meet preparatory condition in the deformed state of panel 10
In the case of, the first area 101 that control temperature control unit 30 carrys out on counter plate 10 to produce deformation carries out that place is heated or cooled
Reason, and then change the largest deformation amplitude of first area 101, so solve present in prior art on electronic equipment can
The largest deformation amplitude of deformation panel 10 is difficult to the technical problem changed, realize by regulation can temperature at deformation panel 10,
Change can deformation panel 10 largest deformation amplitude technique effect so that electronic equipment can be according to the actual use feelings of user
Condition adjustment panel 10 can deformation range and deformation difficulty, expanded the usage scenario of electronic equipment, enrich user use
The mode of electronic equipment.
Further, step 102:Whether judging characteristic parameter meets preparatory condition, including:
Whether judging characteristic parameter meets the first preparatory condition;
Step 103:When characteristic parameter meets preparatory condition, the adjustment of temperature control unit 30 first of control electronics
The temperature in region 101, to change the largest deformation amplitude of first area 101, including:
When characteristic parameter meets the first preparatory condition, the temperature control unit 30 of control electronics is to first area
101 heat, to increase the largest deformation amplitude of first area 101;
Or
Step 102:Whether judging characteristic parameter meets preparatory condition, including:
Whether judging characteristic parameter meets the second preparatory condition;
Step 103:When characteristic parameter meets preparatory condition, the adjustment of temperature control unit 30 first of control electronics
The temperature in region 101, to change the largest deformation amplitude of first area 101, including:
When characteristic parameter meets the second preparatory condition, the temperature control unit 30 of control electronics is to first area
101 cool down, to reduce the largest deformation amplitude of first area 101.
Further, Fig. 7 is refer to, in step 101:Detect the feature ginseng of the deformed state for characterizing first area 101
Before number, this method also includes:
Step 104:When panel 10 deforms upon, it is determined that producing the first area 101 of deformation.
And then first area 101 on the faceplate 10 it is unfixed when, determine the particular location of first area 101.
Further, step 103:When characteristic parameter meets preparatory condition, the temperature control unit 30 of control electronics
The temperature of first area 101 is adjusted, including:
Temperature control unit 30 is removable temperature control unit 30, when characteristic parameter meets preparatory condition, control temperature
Degree control unit 30 be moved to the correspondence position of first area 101, and adjust the temperature of first area 101;Or
Temperature control unit 30 is temperature control modules array, be arranged on 10 corresponding position of panel, in characteristic parameter
When meeting preparatory condition preparatory condition, control temperature control modules array in 101 corresponding temperature control modules of first area
The temperature of first area 101 is adjusted.
And then temperature control unit 30 is realized to first area 101 when the position of first area 101 is not fixed
Carry out temperature adjustment.
Further, step 101:The characteristic parameter of first area 101 is detected, including:
Fisrt feature parameter is detected by the first sensing unit 201, fisrt feature parameter is used to characterize first area 101
Deformation amplitude;
Step 102:Whether judging characteristic parameter meets preparatory condition, including:
Judge fisrt feature parameter whether in the range of given threshold;In fisrt feature parameter in the range of given threshold
When, characteristic parameter meets preparatory condition.
And then realize according to the deformation amplitude of first area 101 to determine whether to carry out temperature adjustment to first area 101.
Further, step 101:The characteristic parameter of first area 101 is detected, including:
Second feature parameter is detected by the second sensing unit 202, second feature parameter is used to characterize first area 101
Deformation direction;
Step 102:Judge whether deformed state meets preparatory condition, including:
Judge whether second feature parameter is consistent with default deformation direction;In second feature parameter and default deformation direction
When being consistent, characteristic parameter meets preparatory condition.
And then realize according to the deformation direction of first area 101 to determine whether to carry out temperature adjustment to first area 101.
Further, step 104:When characteristic parameter meets preparatory condition, the temperature control unit 30 of control electronics
The temperature of first area 101 is adjusted, including:
When characteristic parameter meets preparatory condition, control temperature control unit 30 adjusts the temperature of first area 101 to spy
When sign parameter meets end condition, end condition is different from preparatory condition.
And then under end condition intelligently stop that the temperature of first area 101 is adjusted, ensure the peace of electronic equipment
Quan Xing, and improve the Experience Degree of user.
Further, Fig. 7 is continued referring to, electronic equipment also includes temperature sensing unit 50, step 103:Join in feature
When number meets preparatory condition, after the temperature of the adjustment of temperature control unit 30 first area 101 of control electronics, method is also
Including:
Step 105:The temperature parameter at the fisrt feature position of electronic equipment is detected by temperature sensing unit 50;
Step 106:When temperature parameter is in design temperature threshold range, control temperature control unit 30 stops to first
The temperature in region 101 is adjusted.
And then performance, the safety of extreme temperature influence electronic equipment are avoided, and the usage experience of user.
By the method that the embodiment of the present application 2 is introduced is the method for controlling the electronic equipment in embodiment 1, pass through
To the detailed description of electronic equipment in previous embodiment 1, those skilled in the art are clear that in the present embodiment 2 and controlled
The specific implementation process of the method for electronic equipment, thus it is succinct for specification, it will not be described in detail herein.
The one or more technical schemes provided in the embodiment of the present application, have at least the following technical effects or advantages:
Electronic equipment can control temperature control unit 30 in the case where the deformed state of panel 10 meets preparatory condition
The first area 101 for carrying out on counter plate 10 to produce deformation carries out that processing is heated or cooled, and then changes the maximum of first area 101
Deformation amplitude, so solve present in prior art on electronic equipment can the largest deformation amplitude of deformation panel 10 be difficult to
The technical problem of change, realize by regulation can temperature at deformation panel 10, change can deformation panel 10 largest deformation width
The technique effect of degree so that what electronic equipment can be according to the actual use situation of user adjustment panel 10 can deformation range and shape
Become difficulty, expanded the usage scenario of electronic equipment, enrich the mode that user uses electronic equipment.
It should be understood by those skilled in the art that, embodiments herein can be provided as method, system or computer program
Product.Therefore, the application can use the reality in terms of complete hardware embodiment, complete software embodiment or combination software and hardware
Apply the form of example.Moreover, the application can use the computer for wherein including computer usable program code in one or more
The computer program production that usable storage medium is implemented on (including but is not limited to magnetic disk storage, CD-ROM, optical memory etc.)
The form of product.
The application is with reference to the flow according to the method for the embodiment of the present application, equipment (system) and computer program product
Figure and/or block diagram describe.It should be understood that can be by every first-class in computer program instructions implementation process figure and/or block diagram
Journey and/or the flow in square frame and flow chart and/or block diagram and/or the combination of square frame.These computer programs can be provided
Instruct the processors 40 of all-purpose computer, special-purpose computer, Embedded Processor or other programmable data processing devices with
Produce a machine so that the instruction performed by computer or the processor of other programmable data processing devices 40 produces use
In the dress for realizing the function of being specified in one flow of flow chart or multiple flows and/or one square frame of block diagram or multiple square frames
Put.
These computer program instructions, which may be alternatively stored in, can guide computer or other programmable data processing devices with spy
Determine in the computer-readable memory that mode works so that the instruction being stored in the computer-readable memory, which produces, to be included referring to
Make the manufacture of device, the command device realize in one flow of flow chart or multiple flows and/or one square frame of block diagram or
The function of being specified in multiple square frames.
These computer program instructions can be also loaded into computer or other programmable data processing devices so that counted
Series of operation steps is performed on calculation machine or other programmable devices to produce computer implemented processing, so as in computer or
The instruction performed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in individual square frame or multiple square frames.
Specifically, computer program instructions can be stored in corresponding to the information processing method in the embodiment of the present application
In the storage mediums such as CD, hard disk, USB flash disk, when computer program instructions quilt corresponding with information processing method in storage medium
When one electronic equipment reads or is performed, comprise the following steps:
Detect the characteristic parameter of the deformed state for characterizing the first area;
Judge whether the characteristic parameter meets preparatory condition;
When the characteristic parameter meets the preparatory condition, the temperature control unit of the electronic equipment is controlled to adjust institute
The temperature of first area is stated, to change the largest deformation amplitude of the first area.
Optionally, stored in storage medium and step:Judge whether the characteristic parameter meets preparatory condition, it is corresponding
Computer instruction specifically comprises the following steps during specific be performed:Judge whether the characteristic parameter meets that first is pre-
If condition;
Stored in storage medium and step:Judge whether the characteristic parameter meets preparatory condition, corresponding computer
Instruction specifically comprises the following steps during specific be performed:When the characteristic parameter meets the preparatory condition, control
The temperature control unit of the electronic equipment adjusts the temperature of the first area, to change the largest deformation of the first area
Amplitude, corresponding computer instruction specifically comprise the following steps during specific be performed:Meet institute in the characteristic parameter
When stating the first preparatory condition, temperature control unit the heating to the first area of the electronic equipment is controlled, to increase
The largest deformation amplitude of the big first area;Or
Stored in storage medium and step:Judge whether the characteristic parameter meets preparatory condition, corresponding computer
Instruction specifically comprises the following steps during specific be performed:Judge whether the characteristic parameter meets the second preparatory condition;
Stored in storage medium and step:Judge whether the characteristic parameter meets preparatory condition, corresponding computer
Instruction specifically comprises the following steps during specific be performed:When the characteristic parameter meets the preparatory condition, control
The temperature control unit of the electronic equipment adjusts the temperature of the first area, to change the largest deformation of the first area
Amplitude, corresponding computer instruction specifically comprise the following steps during specific be performed:Meet institute in the characteristic parameter
When stating the second preparatory condition, temperature control unit the cooling down to the first area of the electronic equipment is controlled, to subtract
The largest deformation amplitude of the small first area.
Optionally, other computer instruction is also stored with storage medium, these computer instructions with step:Inspection
The characteristic parameter of the deformed state for characterizing the first area is surveyed, corresponding computer instruction is performed before being performed,
Comprise the following steps when executed:When the panel deforms upon, it is determined that producing the first area of deformation.
Optionally, stored in storage medium and step:When the characteristic parameter meets the preparatory condition, institute is controlled
The temperature control unit for stating electronic equipment adjusts the temperature of the first area, and corresponding computer instruction was performed specifically
Cheng Zhong, specifically comprise the following steps:
The temperature control unit is removable temperature control unit, meets the preparatory condition in the characteristic parameter
When, control the temperature control unit be moved to the first area correspondence position, and adjust the temperature of the first area;
Or
The temperature control unit is temperature control modules array, position corresponding with the panel is arranged on, described
When characteristic parameter meets the preparatory condition preparatory condition, control in the temperature control modules array with the first area pair
The temperature control modules answered are adjusted to the temperature of the first area.
Optionally, stored in storage medium and step:Detect the characteristic parameter of the first area, corresponding computer
Instruction specifically comprises the following steps during specific be performed:Fisrt feature parameter is detected by the first sensing unit, it is described
Fisrt feature parameter is used for the deformation amplitude for characterizing the first area;
Stored in storage medium and step:Judge whether the characteristic parameter meets preparatory condition, corresponding computer
Instruction specifically comprises the following steps during specific be performed:Judge the fisrt feature parameter whether in given threshold model
In enclosing;When the fisrt feature parameter is in the range of the given threshold, the characteristic parameter meets the preparatory condition.
Optionally, stored in storage medium and step:Detect the characteristic parameter of the first area, corresponding computer
Instruction specifically comprises the following steps during specific be performed:Second feature parameter is detected by the second sensing unit, it is described
Second feature parameter is used for the deformation direction for characterizing the first area;
Stored in storage medium and step:Judge whether the characteristic parameter meets preparatory condition, corresponding computer
Instruction specifically comprises the following steps during specific be performed:Judge the second feature parameter whether with default deformation side
To being consistent;When the second feature parameter is consistent with the default deformation direction, the characteristic parameter meets described pre-
If condition.
Optionally, stored in storage medium and step:When the characteristic parameter meets the preparatory condition, institute is controlled
The temperature control unit for stating electronic equipment adjusts the temperature of the first area, and corresponding computer instruction was performed specifically
Cheng Zhong, specifically comprise the following steps:When the characteristic parameter meets the preparatory condition, the temperature control unit is controlled to adjust
When the temperature of the whole first area to the characteristic parameter meets end condition, the end condition and the preparatory condition are not
Together.
Optionally, the electronic equipment also includes temperature sensing unit, and other calculating is also stored with storage medium
Machine instruct, these computer instructions with step:When the characteristic parameter meets the preparatory condition, the electronics is controlled to set
Standby temperature control unit adjusts the temperature of the first area, and corresponding computer instruction is performed after being performed, in quilt
Comprise the following steps during execution:
The temperature parameter at the fisrt feature position of the electronic equipment is detected by the temperature sensing unit;
When the temperature parameter is in design temperature threshold range, the temperature control unit is controlled to stop to described the
The temperature in one region is adjusted.
Although having been described for the preferred embodiment of the application, those skilled in the art once know basic creation
Property concept, then can make other change and modification to these embodiments.So appended claims be intended to be construed to include it is excellent
Select embodiment and fall into having altered and changing for the application scope.
Obviously, those skilled in the art can carry out the essence of various changes and modification without departing from the application to the application
God and scope.So, if these modifications and variations of the application belong to the scope of the application claim and its equivalent technologies
Within, then the application is also intended to comprising including these changes and modification.
Claims (17)
1. a kind of method of control electronics, the electronic equipment include can deformation panel, the panel is by being applied
During the external force added, the first area of the panel can produce deformation so that the phase in the second area of the panel and the 3rd region
Position is changed, wherein, the second area is that the 3rd region is to be located at positioned at the region of the side of first area first
The region of the side of first area second, first side and second side are different;Methods described includes:
Detect the characteristic parameter of the deformed state for characterizing the first area;
Judge whether the characteristic parameter meets preparatory condition;
When the characteristic parameter meets the preparatory condition, the temperature control unit of the electronic equipment is controlled to adjust described the
The temperature in one region, to change the largest deformation amplitude of the first area.
2. the method as described in claim 1, it is characterised in that:
It is described to judge whether the characteristic parameter meets preparatory condition, including:Judge whether the characteristic parameter meets that first is pre-
If condition;
It is described when the characteristic parameter meets the preparatory condition, control the electronic equipment temperature control unit adjust institute
The temperature of first area is stated, to change the largest deformation amplitude of the first area, including:Described in meeting in the characteristic parameter
During the first preparatory condition, the temperature control unit of the electronic equipment is controlled to heat the first area, to increase
State the largest deformation amplitude of first area;
Or
It is described to judge whether the characteristic parameter meets preparatory condition, including:Judge whether the characteristic parameter meets that second is pre-
If condition;
It is described when the characteristic parameter meets the preparatory condition, control the electronic equipment temperature control unit adjust institute
The temperature of first area is stated, to change the largest deformation amplitude of the first area, including:Described in meeting in the characteristic parameter
During the second preparatory condition, the temperature control unit of the electronic equipment is controlled to cool down the first area, to reduce
State the largest deformation amplitude of first area.
3. method as claimed in claim 2, it is characterised in that in the deformation shape detected for characterizing the first area
Before the characteristic parameter of state, methods described also includes:
When the panel deforms upon, it is determined that producing the first area of deformation.
4. method as claimed in claim 3, it is characterised in that it is described when the characteristic parameter meets the preparatory condition,
The temperature control unit of the electronic equipment is controlled to adjust the temperature of the first area, including:
The temperature control unit is removable temperature control unit, when the characteristic parameter meets the preparatory condition, control
Make the temperature control unit be moved to the first area correspondence position, and adjust the temperature of the first area;Or
The temperature control unit is temperature control modules array, position corresponding with the panel is arranged on, in the feature
When parameter meets the preparatory condition, temperature control corresponding with the first area in the temperature control modules array is controlled
Module is adjusted to the temperature of the first area.
5. the method as described in claim 1, it is characterised in that the characteristic parameter of the detection first area, including:
Fisrt feature parameter is detected by the first sensing unit, the fisrt feature parameter is used for the shape for characterizing the first area
Time-varying amplitude;
It is described to judge whether the characteristic parameter meets preparatory condition, including:
Judge the fisrt feature parameter whether in the range of given threshold;In the fisrt feature parameter in the given threshold
In the range of when, the characteristic parameter meets the preparatory condition.
6. the method as described in claim 1, it is characterised in that the characteristic parameter of the detection first area, including:
Second feature parameter is detected by the second sensing unit, the second feature parameter is used for the shape for characterizing the first area
Change direction;
It is described to judge whether the characteristic parameter meets preparatory condition, including:
Judge whether the second feature parameter is consistent with default deformation direction;Preset in the second feature parameter with described
When deformation direction is consistent, the characteristic parameter meets the preparatory condition.
7. the method as described in claim 1, it is characterised in that it is described when the characteristic parameter meets the preparatory condition,
The temperature control unit of the electronic equipment is controlled to adjust the temperature of the first area, including:
When the characteristic parameter meets the preparatory condition, the temperature control unit is controlled to adjust the temperature of the first area
When degree to the characteristic parameter meets end condition, the end condition is different from the preparatory condition.
8. the method as described in claim 1, it is characterised in that the electronic equipment also includes temperature sensing unit, described
When characteristic parameter meets the preparatory condition, the temperature control unit of the electronic equipment is controlled to adjust the temperature of the first area
After degree, methods described also includes:
The temperature parameter at the fisrt feature position of the electronic equipment is detected by the temperature sensing unit;Join in the temperature
When number is in design temperature threshold range, the temperature control unit is controlled to stop adjusting the temperature of the first area
It is whole.
9. a kind of electronic equipment, including:
Can deformation panel, positioned at the first surface of the electronic equipment;Wherein, the panel is by the external force being applied in
When, the first area of the panel can produce deformation so that the relative position in the second area of the panel and the 3rd region changes
Become, wherein, the second area is positioned at the region of the side of first area first, and the 3rd region is to be located at described first
The region of area second side, first side and second side are different;
Sensing unit, set on the panel, for detecting the deformation parameter for the deformed state for characterizing the panel;The shape
Variable element includes the characteristic parameter for being used to characterize the deformed state of the first area;
Temperature control unit, it is arranged on the position corresponding with the panel;
Processor, it is connected with the sensing unit and the temperature control unit, for judging whether the characteristic parameter meets
Preparatory condition, and control the temperature control unit to adjust firstth area when the characteristic parameter meets the preparatory condition
The temperature in domain, to change the largest deformation amplitude of the first area.
10. electronic equipment as claimed in claim 9, it is characterised in that the sensing unit includes the 3rd sensing unit, described
3rd sensing unit is used for when the panel deforms upon, it is determined that producing the first area of deformation.
11. electronic equipment as claimed in claim 10, it is characterised in that:
The temperature control unit is fixed by a removable attachment means, and the temperature control unit is in the removable connection
Device traction is lower removable, and the panel can be appointed by the movement of the temperature control unit temperature control unit
One position is heated or cooled;
The processor is additionally operable to before the temperature for controlling the temperature control unit to adjust the first area, described in control
Temperature control unit is moved to and the first area correspondence position;
Or
The temperature control unit is temperature control modules array, is arranged on position corresponding with the panel;The processor
It is additionally operable to before the temperature for controlling the temperature control unit to adjust the first area, determines the temperature control modules battle array
It is used to the first area be heated or cooled with the temperature control modules of the first area position correspondence in row.
12. electronic equipment as claimed in claim 9, it is characterised in that the sensing unit includes the first sensing unit, sets
On the panel, first sensing unit can detect the fisrt feature of the deformation amplitude for characterizing the first area
Parameter, the characteristic parameter include the fisrt feature parameter;
The processor is specifically used for judging the fisrt feature parameter whether in the range of given threshold, and special described first
The temperature control unit is controlled to be adjusted the temperature of the first area when levying parameter in the range of the given threshold.
13. electronic equipment as claimed in claim 9, it is characterised in that the sensing unit includes the second sensing unit, sets
On the panel, second sensing unit can detect the nyctitropic second feature of shape for characterizing the first area
Parameter, the characteristic parameter include the second feature parameter;
The processor is specifically used for judging whether the second feature parameter is consistent with default deformation direction, and described the
Two characteristic parameters control temperature of the temperature control unit to the first area when being consistent with the default deformation direction
It is adjusted.
14. electronic equipment as claimed in claim 9, it is characterised in that the processor is specifically used for judging the spy
When sign parameter meets preparatory condition, the temperature control unit is controlled to be adjusted to the temperature of the first area to the spy
When sign parameter meets end condition, the end condition is different from the preparatory condition.
15. electronic equipment as claimed in claim 9, it is characterised in that the electronic equipment also includes:Temperature sensing unit,
It is connected with the processor, the temperature parameter at the fisrt feature position for detecting the electronic equipment;The processor is also used
Stop in controlling the temperature control unit when the temperature parameter is in design temperature threshold range to the first area
Temperature be adjusted.
16. the electronic equipment as described in any claim in claim 9-15, it is characterised in that the electronic equipment also wraps
Include:
Heat-transfer device, position corresponding with the panel is arranged on, for the heat at the first area to be guided to described
The first position of electronic equipment, the first position are located at the surface outside the first surface of the electronic equipment;And/or
Heat-proof device, it is arranged between the second feature position on the panel and electronic equipment, for preventing firstth area
Heat caused by domain is conducted to the second feature position.
17. the electronic equipment as described in any claim in claim 9-15, it is characterised in that the electronic equipment also wraps
Include:
Housing, the panel are fixed by the housing, and the housing being capable of the corresponding deformation with the panel deformation.
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CN108401403B (en) * | 2016-03-28 | 2021-07-16 | 联想(北京)有限公司 | Electronic equipment and heat dissipation method thereof |
CN108319187A (en) * | 2018-01-02 | 2018-07-24 | 厦门盈趣科技股份有限公司 | The anti-loaded detection device of printer heat-sensitive paper based on foil gauge and method |
CN110850910B (en) * | 2018-08-20 | 2021-07-20 | 浙江宇视科技有限公司 | Heating control method and device and electronic equipment |
CN109799876B (en) * | 2018-12-29 | 2020-11-20 | 联想(北京)有限公司 | Terminal device and method of controlling the same |
CN110007834A (en) * | 2019-03-25 | 2019-07-12 | 联想(北京)有限公司 | Control method and electronic equipment |
CN115191011A (en) * | 2020-12-28 | 2022-10-14 | 昆山国显光电有限公司 | Flexible display panel and display device |
CN114488861B (en) * | 2022-01-24 | 2024-08-20 | 杭州老板电器股份有限公司 | Cooking parameter adjustment method and device and electronic equipment |
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CN101296431A (en) * | 2007-04-28 | 2008-10-29 | 北京三星通信技术研究有限公司 | Appearance control device and method, portable terminal for using the same |
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