CN105093629B - A kind of display panel and preparation method thereof, display device - Google Patents
A kind of display panel and preparation method thereof, display device Download PDFInfo
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- CN105093629B CN105093629B CN201510519152.7A CN201510519152A CN105093629B CN 105093629 B CN105093629 B CN 105093629B CN 201510519152 A CN201510519152 A CN 201510519152A CN 105093629 B CN105093629 B CN 105093629B
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- array substrate
- membrane substrates
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
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- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of display panels and preparation method thereof, display device, with to avoid the prior art, when eliminating electrostatic, the bad problem such as flashing, picture greening of generation improves display effect and product yield.The display panel includes the array substrate being oppositely arranged and color membrane substrates, and array substrate includes viewing area and perimeter leads area, and perimeter leads area includes ground connection cabling；Color membrane substrates include the transparency conducting layer of array base palte side, wherein further include the conducting resinl between array substrate and color membrane substrates, orthographic projection of the conducting resinl in array substrate is located at perimeter leads area, and conducting resinl is connect with ground connection cabling；Color membrane substrates further include being arranged in run through the connecting hole of color membrane substrates at least one of array substrate perimeter leads area corresponding region, and transparency conducting layer passes through the connecting hole and conductive glue connection.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of display panel and preparation method thereof, display device.
Background technique
Liquid crystal display panel of thin film transistor (Thin Film Transistor Liquid Crystal Display,
It TFT-LCD) is currently used flat-panel monitor, liquid crystal display panel is with its small size, low power consumption, no radiation, high resolution
The advantages that, it is widely used in modern digital informationization equipment.
In TFT-LCD production process, due to equipment and personnel, electrostatic can not avoid completely.It is general next
It says, plays the role of eliminating electrostatic in color membrane substrates back spatter layer of transparent conductive layer, the prior art is usually in color film base
Back sputtering indium oxide layer tin (Indium Tin Oxide, ITO) conductive layer plays the role of eliminating electrostatic.But arrive mesh
Before until, how the electrostatic on ITO conductive layer is introduced into ground terminal, each producer is not quite similar by the way of, at present most
Common mode be the color membrane substrates back side ITO conductive layer and array substrate ground connection cabling between bridging at apply elargol, reach
To the effect for eliminating electrostatic.
Specifically, as shown in Figure 1, the TFT-LCD display panel of the prior art includes 11 He of array substrate being oppositely arranged
Color membrane substrates 12, and the sealant 13 between array substrate 11 and color membrane substrates 12.Array substrate 11 includes being located at week
The ground connection cabling 14 of side lead district, color membrane substrates 12 include the ITO conductive layer 15 that 11 side of array base palte is arranged in, existing skill
Art has the function that eliminate electrostatic by the elargol 16 for being connected across ITO conductive layer 15 and being grounded between cabling 14.
But this mode for applying elargol conducting has following defects that firstly, since the property of elargol itself limits, very
Situations such as being easy to happen oxidation, corrosion or even falling off, connects so as to cause the transparency conducting layer and array substrate at the color membrane substrates back side
Virtual connection even disconnects between ground cabling, causes the electrostatic at the color membrane substrates back side that can not eliminate, and obvious bad, the shadow such as flashing occurs
Ring display effect and product yield；Secondly as elargol is more liquid, it is easy to penetrate into color membrane substrates and array substrate
Between, connection conducting other parts cause to occur bad, and such as: elargol penetrates between color membrane substrates and array substrate, leads to black square
The transparency conducting layer and array substrate at the battle array connection color membrane substrates back side are grounded cabling, so that black matrix induced potential is uneven, lead
Addressed pixel periphery is shinny, and macro manifestations are the bad of picture greening.
In conclusion when the prior art eliminates display panel electrostatic, it may occur that flashing, picture greening etc. are bad, influence to show
Show effect and product yield.
Summary of the invention
The embodiment of the invention provides a kind of display panels and preparation method thereof, display device, with to avoid the prior art
When eliminating electrostatic, the bad problem such as flashing, picture greening of generation improves display effect and product yield.
A kind of display panel provided in an embodiment of the present invention, it is described including the array substrate being oppositely arranged and color membrane substrates
Array substrate includes viewing area and perimeter leads area, and the perimeter leads area includes ground connection cabling；The color membrane substrates include back
It further include the conduction between the array substrate and the color membrane substrates to the transparency conducting layer of the array substrate side
Glue, orthographic projection of the conducting resinl in the array substrate are located at the perimeter leads area, the conducting resinl and the ground connection
Cabling connection；
The color membrane substrates further include be arranged in array substrate perimeter leads area corresponding region at least one through institute
The connecting hole of color membrane substrates is stated, the transparency conducting layer passes through the connecting hole and the conductive glue connection.
By display panel provided in an embodiment of the present invention, due to display panel include positioned at array substrate and color membrane substrates it
Between conducting resinl, orthographic projection of the conducting resinl in array substrate be located at perimeter leads area, and conducting resinl is connect with ground connection cabling；Color film
Substrate further include be arranged in array substrate perimeter leads area corresponding region at least one run through color membrane substrates connecting hole, thoroughly
Bright conductive layer passes through the connecting hole and conductive glue connection.The embodiment of the present invention passes through the connecting hole through color membrane substrates, Yi Jixing
Ground connection cabling on the transparency conducting layer and array substrate at the conducting resinl conducting color membrane substrates back side that can be more stable, to reach color
Ilm substrate is backwards to transparency conducting layer ground protection, the effect of elimination accumulation of static electricity.It, can by the setting of connecting hole and conducting resinl
The ground connection cabling on the transparency conducting layer and array substrate at the color membrane substrates back side is connected by applying elargol to avoid the prior art
Mode, so as to avoid the color membrane substrates buildup of static electricity caused by reasons because elargol oxidation, burn into fall off etc., film flicker and
Elargol penetrates into the various undesirable generations such as picture greening caused by black matrix.
Preferably, the color membrane substrates further include the metal being arranged in the connecting hole, the transparency conducting layer passes through
Metal in the connecting hole and the conductive glue connection are set.
Preferably, the color membrane substrates further include the metal being arranged in the connecting hole, and connect with the metal
The color membrane substrates are set backwards to the metal wire of the array substrate side, the transparency conducting layer passes through the metal wire and setting
Metal and the conductive glue connection in the connecting hole, wherein orthographic projection of the metal wire in the array substrate
Positioned at array substrate perimeter leads area.
Preferably, the color membrane substrates further include the metal being arranged in the connecting hole, and connect with the metal
Metal wire of the color membrane substrates towards the array substrate side is set, and the transparency conducting layer passes through the metal wire and setting
Metal and the conductive glue connection in the connecting hole, wherein orthographic projection of the metal wire in the array substrate
Positioned at array substrate perimeter leads area.
Preferably, the color membrane substrates further include the metal being arranged in the connecting hole, and connect with the metal
The color membrane substrates are set backwards to the first metal wire of the array substrate side and the setting connecting with the metal in the coloured silk
For ilm substrate towards the second metal wire of the array substrate side, the transparency conducting layer passes through the gold that is arranged in the connecting hole
Belong to, first metal wire and second metal wire and the conductive glue connection, wherein first metal wire and described the
Orthographic projection of two metal wires in the array substrate is located at array substrate perimeter leads area.
Preferably, the connecting hole is penetration type hole or stepped bore.
Preferably, the connecting hole is penetration type bellmouth or step type conical hole.
The embodiment of the invention also provides a kind of display device, which includes above-mentioned display panel.
The embodiment of the invention also provides a kind of production methods of display panel, including production array substrate and color membrane substrates
Method, the array substrate includes viewing area and perimeter leads area, and perimeter leads area includes ground connection cabling, wherein the side
Method further include:
With array substrate perimeter leads area corresponding region at color membrane substrates on make at least one through the color film
The connecting hole of substrate；
Transparency conducting layer is made backwards to the array substrate side in the color membrane substrates；
Conducting resinl is made between the array substrate and the color membrane substrates, the conducting resinl is in the array substrate
Orthographic projection be located at the perimeter leads area, the conducting resinl is connect with the ground connection cabling, and the transparency conducting layer passes through institute
State connecting hole and the conductive glue connection.
Preferably, the method using laser boring makes the connecting hole.
Preferably, described before the color membrane substrates make transparency conducting layer backwards to the array substrate side, the side
Method further includes that metal, the first metal wire and the second metal wire, the production metal, the first metal are made on the color membrane substrates
Line and the second metal wire specifically include:
There are the two sides of the color membrane substrates of the connecting hole to distinguish deposited metal film in production, is formed and be located at the connecting hole
Interior metal；
Metallic film to the color membrane substrates backwards to the array substrate side forms the first metal wire using patterning processes；
The second metal wire is formed using patterning processes to the metallic film of the color membrane substrates towards the array substrate side；
Wherein, the orthographic projection of first metal wire and second metal wire in the array substrate is located at array substrate periphery and draws
Line area.
Detailed description of the invention
Fig. 1 is the cross section structure schematic diagram of prior art display panel；
Fig. 2 is a kind of cross section structure schematic diagram of display panel provided in an embodiment of the present invention；
Fig. 3 is a kind of planar structure schematic diagram of display panel provided in an embodiment of the present invention；
Fig. 4 is the cross section structure schematic diagram for the display panel that the embodiment of the present invention one provides；
Fig. 5 is the cross section structure schematic diagram of display panel provided by Embodiment 2 of the present invention；
Fig. 6 is the cross section structure schematic diagram for the display panel that the embodiment of the present invention three provides；
Fig. 7 is the cross section structure schematic diagram for the display panel that the embodiment of the present invention four provides；
Fig. 8 (a) and Fig. 8 (b) is the structural schematic diagram of connecting hole provided in an embodiment of the present invention；
Fig. 9 is a kind of production method flow chart of display panel provided in an embodiment of the present invention；
Figure 10 be it is provided in an embodiment of the present invention production connecting hole in metal, the first metal wire and the second metal wire system
Make method flow diagram；
Figure 11 is the cross section structure schematic diagram provided in an embodiment of the present invention that connecting hole is made by the way of laser opening；
Figure 12-Figure 16 is respectively metal, the first metal wire and second in production connecting hole provided in an embodiment of the present invention
The cross section structure schematic diagram of different phase when metal wire.
Specific embodiment
The embodiment of the invention provides a kind of display panels and preparation method thereof, display device, with to avoid the prior art
When eliminating electrostatic, the bad problem such as flashing, picture greening of generation improves display effect and product yield.
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into
It is described in detail to one step, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall within the protection scope of the present invention.
Each thicknesses of layers and area size, shape do not react the actual proportions of each film layer in attached drawing, and purpose is only illustrated to say
Bright the content of present invention.
The display panel of specific embodiment of the invention offer is provided with reference to the accompanying drawing.
As shown in Fig. 2, the specific embodiment of the invention provides a kind of display panel, including the array substrate 11 being oppositely arranged
With color membrane substrates 12, array substrate includes viewing area (not shown) and perimeter leads area (not shown), perimeter leads
Area includes ground connection cabling 14；Color membrane substrates 12 include the transparency conducting layer 21 of 11 side of array base palte, and Fig. 2 also shows this hair
Sealant 13 of the bright specific embodiment between array substrate 11 and color membrane substrates 12；
Display panel in the specific embodiment of the invention further includes leading between array substrate 11 and color membrane substrates 12
Electric glue 22, orthographic projection of the conducting resinl 22 in array substrate 11 are located at the perimeter leads area of array substrate 11, conducting resinl 22 with connect
Ground cabling 14 connects；
Color membrane substrates 12 further include be arranged in 11 perimeter leads area corresponding region of array substrate at least one through coloured silk
The connecting hole 23 of ilm substrate 12, Fig. 2 illustrate only two connecting holes for running through color membrane substrates 12 in the specific embodiment of the invention, thoroughly
Bright conductive layer 21 is connect by connecting hole 23 with conducting resinl 22.
Fig. 3 is the planar structure schematic diagram for the display panel that the specific embodiment of the invention provides, and shows array base in figure
The grounded metal line 141 of integrated circuit (IC) and the bridging ITO line 142 of grounded metal line 141 are accessed on plate 11, the present invention is specific
Ground connection cabling 14 of the embodiment by grounded metal line 141 and bridging ITO line 142 as array substrate perimeter leads area.
Preferably, the material of the transparency conducting layer 21 in the specific embodiment of the invention is tin indium oxide (Indium Tin
Oxide, ITO) monofilm, or be the monofilm of indium zinc oxide (IZO), or be the composite membrane of tin indium oxide and indium zinc oxide,
The specific embodiment of the invention does not limit the specific material of transparency conducting layer 21.
Preferably, the conducting resinl 22 in the specific embodiment of the invention is the sealant with conducting particles, is being embodied
When, which can be conductive gold spacer, and conducting resinl 22 is in nonconducting sealant material identical with 13 material of sealant
It is formed after conductive gold spacer is added in material, certainly, in practical applications, conducting resinl 22 can also can be played using other types of
Conductive and connection function conducting resinl, the specific embodiment of the invention do not limit the specific material of conducting resinl 22.
The specific embodiment of the invention is led by setting through the more stable conducting resinl of the connecting hole and performance of color membrane substrates
Ground connection cabling on the transparency conducting layer and array substrate at the logical color membrane substrates back side, to reach color membrane substrates backwards to electrically conducting transparent
Layer ground protection, the effect for eliminating accumulation of static electricity.By the setting of connecting hole and conducting resinl, can pass through to avoid the prior art
Apply elargol connection the color membrane substrates back side transparency conducting layer and array substrate on ground connection cabling mode, so as to avoid because
Color membrane substrates buildup of static electricity caused by the reasons such as elargol aoxidizes, burn into falls off, film flicker and elargol penetrate into caused by black matrix
The various undesirable generations such as picture greening.
Due to the monofilm that the material of the transparency conducting layer in the specific embodiment of the invention is ITO or IZO, or for ITO and
The composite membrane of IZO, therefore the resistance of the transparency conducting layer in the specific embodiment of the invention is larger, transparency conducting layer and array substrate
On ground connection cabling connect conducting when, the resistance of entire conductive line road is also larger, can be in electrically conducting transparent in actual design
The lower metal wire of partial ohmic is designed to reduce entire conductive line in the conductive line road of layer and the ground connection cabling in array substrate
The resistance of road, to enable transparency conducting layer preferably to connect with the ground connection cabling in array substrate, so as to more
The good accumulation of static electricity eliminated on color membrane substrates.
The specific embodiment of the invention reduces the ground connection cabling on transparency conducting layer and array substrate by following four mode
Connection resistance.
Embodiment one:
As shown in figure 4, the color membrane substrates 12 in the specific embodiment of the invention further include the metal 40 being arranged in connecting hole,
Transparency conducting layer 21 passes through the metal 40 being arranged in connecting hole and connect with conducting resinl 22.Metal 40 in the specific embodiment of the invention
Material can be aluminium (Al), molybdenum (Mo) etc., the specific embodiment of the invention does not make specific limit to the material of metal 40.
Since the resistance of metal 40 is smaller, when transparency conducting layer 21 is connect by metal 40 with conducting resinl 22, connection electricity
Resistance can reduce, and transparency conducting layer 21 preferably be connect with the ground connection cabling 14 in array substrate 11, so as to more
The good accumulation of static electricity eliminated on color membrane substrates.
Embodiment two:
As shown in figure 5, the color membrane substrates 12 in the specific embodiment of the invention further include the metal 40 being arranged in connecting hole,
And the metal wire 50 that 12 array base palte of color membrane substrates, 11 side is arranged in connecting with the metal 40, transparency conducting layer 21 are logical
The metal 40 crossing the metal wire 50 and being arranged in connecting hole is connect with conducting resinl 22, wherein metal wire 50 is in array substrate 11
On orthographic projection be located at array substrate perimeter leads area.The material of metal wire 50 can be aluminium in the specific embodiment of the invention
(Al), molybdenum (Mo) etc., the specific embodiment of the invention do not make specific restriction, in the specific implementation, the present invention to the material of metal wire
Metal 40 is identical with the material of metal wire 50 in specific embodiment.
Compared with embodiment one, the metal 40 in the specific embodiment of the invention one is provided only on the specific embodiment of the invention two
In connecting hole, transparency conducting layer 21 and the contact area of metal 40 are smaller, are similar to point contact, and contact resistance is relatively large；And
In the specific embodiment of the invention two other than metal 40 is set in connecting hole, it is also provided with metal wire 50, at this time electrically conducting transparent
Layer 21 is contacted with metal wire 50, from the figure, it can be seen that transparency conducting layer 21 with the contact of metal wire 50 is face contact at this time, is connect
Contacting surface product is larger, and contact resistance is relatively small.
Therefore, the specific embodiment of the invention two connects when transparency conducting layer 21 passes through metal 40 and metal wire 50 with conducting resinl 22
When connecing, connection resistance is lower, and at this moment transparency conducting layer 21 can preferably be connect with the ground connection cabling 14 in array substrate 11, from
And it can preferably eliminate the accumulation of static electricity on color membrane substrates.
Embodiment three:
As shown in fig. 6, the color membrane substrates 12 in the specific embodiment of the invention further include the metal 40 being arranged in connecting hole,
And what is connect with the metal 40 is arranged in metal wire 60 of the color membrane substrates 12 towards 11 side of array substrate, transparency conducting layer 21 is logical
The metal 40 crossing the metal wire 60 and being arranged in connecting hole is connect with conducting resinl 22, wherein metal wire 60 is in array substrate 11
On orthographic projection be located at array substrate perimeter leads area.The material of metal wire 60 can be aluminium in the specific embodiment of the invention
(Al), molybdenum (Mo) etc., the specific embodiment of the invention do not make specific restriction, in the specific implementation, this hair to the material of the metal wire
The material of the material of metal wire 60 and metal 40 and metal wire 50 is identical in bright specific embodiment.
The specific embodiment of the invention three is similar with embodiment two, when golden towards the setting of 11 side of array substrate in color membrane substrates 12
After belonging to line 60, compared with the specific embodiment of the invention one and embodiment two, conducting resinl 22 and gold in the specific embodiment of the invention three
The contact area for belonging to line 60 is bigger than conducting resinl 22 and the contact area of metal 40, then corresponding contact resistance is smaller.
Therefore, the specific embodiment of the invention three connects when transparency conducting layer 21 passes through metal 40 and metal wire 60 with conducting resinl 22
When connecing, connection resistance is lower, and at this moment transparency conducting layer 21 can preferably be connect with the ground connection cabling 14 in array substrate 11, from
And it can preferably eliminate the accumulation of static electricity on color membrane substrates.
Example IV:
As shown in fig. 7, the color membrane substrates 12 in the specific embodiment of the invention further include the metal 40 being arranged in connecting hole,
And the first metal wire 71 that 12 array base palte of color membrane substrates, 11 side is set for being connect with the metal 40 and with the metal
Second metal wire 72 of the color membrane substrates 12 towards 11 side of array substrate is arranged in 40 connections, and transparency conducting layer 21 is existed by setting
Metal 40, the first metal wire 71 and the second metal wire 72 in connecting hole are connect with conducting resinl 22, wherein 71 He of the first metal wire
Orthographic projection of second metal wire 72 in array substrate 11 is located at array substrate perimeter leads area.
The specific embodiment of the invention four is compared with embodiment one, embodiment two and embodiment three, transparency conducting layer 21 and
The contact area of one metal wire 71 is larger, and conducting resinl 22 and the contact area of the second metal wire 72 are larger, and therefore, the present invention is specific
Example IV when transparency conducting layer 21 by metal 40, the first metal wire 71 and the second metal wire 72 connect with conducting resinl 22 when,
Connection resistance is lower, and at this moment transparency conducting layer 21 can preferably be connect with the ground connection cabling 14 in array substrate 11, so as to
Enough accumulation of static electricity preferably eliminated on color membrane substrates.
Preferably, the connecting hole 23 in the specific embodiment of the invention one, embodiment two, embodiment three and example IV is to pass through
Formula hole is worn, as shown in Fig. 8 (a)；Alternatively, the company in the specific embodiment of the invention one, embodiment two, embodiment three and example IV
Connecing hole 23 is stepped bore, as shown in Fig. 8 (b).In the specific implementation, the connecting hole 23 in the specific embodiment of the invention be through
Formula bellmouth or step type conical hole, certainly, in actual design process, the shape of connecting hole 23 can also be other shapes,
The specific embodiment of the invention does not limit the concrete shape of connecting hole, and the specific design method of connecting hole 23 is in subsequent side
Method part is introduced.
The specific embodiment of the invention additionally provides a kind of display device, which includes what the specific embodiment of the invention provided
Above-mentioned display panel, the display device can be liquid crystal display panel, liquid crystal display, LCD TV, Organic Light Emitting Diode
The displays such as (Organic Light Emitting Diode, OLED) panel, OLED display, OLED TV or Electronic Paper dress
It sets.
As shown in figure 9, the specific embodiment of the invention additionally provides a kind of production method of display panel, including production array
The method of substrate and color membrane substrates, array substrate include viewing area and perimeter leads area, and perimeter leads area includes ground connection cabling, should
Method further include:
S901, with array substrate perimeter leads area corresponding region at color membrane substrates on make at least one through described
The connecting hole of color membrane substrates；
S902, transparency conducting layer is made backwards to the array substrate side in the color membrane substrates；
S903, conducting resinl is made between the array substrate and the color membrane substrates, the conducting resinl is in the array
Orthographic projection on substrate is located at the perimeter leads area, and the conducting resinl is connect with the ground connection cabling, the transparency conducting layer
Pass through the connecting hole and the conductive glue connection.
The specific embodiment of the invention makes array substrate and the specific method of color membrane substrates is same as the prior art, here not
It repeats again.
Preferably, the specific embodiment of the invention makes connecting hole, shown in Figure 11, this hair using the method for laser boring
Bright specific embodiment runs through the connecting hole 23 of color membrane substrates 12 by the method production that laser 110 punches, due to the light of laser 110
Beam is smaller, and energy is larger, therefore can be good at forming the lesser connecting hole 23 of size, certainly, in the specific implementation, the present invention
Specific embodiment can also make connecting hole using other hole knockouts.
When the specific embodiment of the invention uses laser boring, it can be formed on color membrane substrates using the laser of different-energy
Different types of connecting hole can form the connecting hole of penetration type using the laser of identical energy on color membrane substrates, specific to join
See shown in Fig. 8 (a)；Stepped connecting hole can be formed on color membrane substrates using the laser of different-energy, referring specifically to Fig. 8
(b) shown in.
The specific embodiment of the invention color membrane substrates array base palte side make transparency conducting layer when method with it is existing
Technology is identical, and which is not described herein again.
The specific embodiment of the invention made between array substrate and color membrane substrates conducting resinl specific method and existing skill
The method that art makes sealant between array substrate and color membrane substrates is similar, and which is not described herein again.The specific embodiment of the invention
The conducting resinl of production is connected with ground connection cabling and the transparency conducting layer of color membrane substrates array base palte side.
The specific embodiment of the invention is in specific manufacturing process, in order to enable color membrane substrates array base palte side is transparent
Conductive layer is preferably connect with conducting resinl, it is preferable that as shown in Figure 10, the specific embodiment of the invention is in color membrane substrates backwards to array
It further include that metal, the first metal wire and the second metal wire are made on color membrane substrates before substrate-side makes transparency conducting layer,
In, the method for specific embodiment of the invention production metal, the first metal wire and the second metal wire specifically includes:
S1001, there are the two sides of the color membrane substrates of the connecting hole to distinguish deposited metal film in production, formed described in being located at
Metal in connecting hole；
S1002, the metallic film to the color membrane substrates backwards to the array substrate side form first using patterning processes
Metal wire；
S1003, second is formed using patterning processes to the metallic film of the color membrane substrates towards the array substrate side
Metal wire；Wherein, the orthographic projection of first metal wire and second metal wire in the array substrate is located at array base
Plate perimeter leads area.
Specifically, the specific embodiment of the invention has the two sides of the color membrane substrates of connecting hole to distinguish deposited metal film in production
121 and 122, referring to shown in Figure 11 and Figure 12, the specific embodiment of the invention is for making four connecting holes on color membrane substrates
It is introduced, when production has any side deposited metal film of color membrane substrates of connecting hole, the metallic film meeting of deposition
Into in connecting hole, the metal 40 being located in connecting hole is formed, when specific embodiment of the invention deposited metal film 121 and 122
The methods of evaporation coating, plating, magnetron sputtering can be used.
Then, as shown in figure 13, the specific embodiment of the invention coats photoresist 130 on the metallic film 121 of deposition, and
The photoresist 130 of coating is exposed and is developed, the light for needing to form the first metal wire corresponding position is only retained after development
Photoresist 130 later by etching the metallic film that is not covered by photoresist of removal, and removes remaining photoresist, forms the
One metal wire 71, as shown in figure 14.
Then, as shown in figure 15, the specific embodiment of the invention coats photoresist 130 on the metallic film 122 of deposition, and
The photoresist 130 of coating is exposed and is developed, the light for needing to form the second metal wire corresponding position is only retained after development
Photoresist 130 later by etching the metallic film that is not covered by photoresist of removal, and removes remaining photoresist, forms the
Two metal wires 72, as shown in figure 16.
Certainly, in the actual production process, the specific embodiment of the invention can be only in the side deposited metal of color membrane substrates
Film is respectively formed by different patterning processes: the metal in connecting hole, shown in Figure 4；In connecting hole
Metal and metal wire positioned at color membrane substrates array base palte side, it is shown in Figure 5；Metal in connecting hole and it is located at
Color membrane substrates towards array substrate side metal wire, it is shown in Figure 6.Patterning processes in the specific embodiment of the invention include light
Some or all of coating, exposure, development, etching and the removal photoresist of photoresist process.
In conclusion the specific embodiment of the invention provides a kind of display panel and preparation method thereof, display device, display surface
Plate includes the array substrate being oppositely arranged and color membrane substrates, and array substrate includes viewing area and perimeter leads area, perimeter leads area
Including being grounded cabling；Color membrane substrates include the transparency conducting layer of array base palte side, and display panel further includes being located at array base
Conducting resinl between plate and color membrane substrates, orthographic projection of the conducting resinl in array substrate are located at perimeter leads area, conducting resinl with connect
The connection of ground cabling；Color membrane substrates further include being arranged in run through color film at least one of array substrate perimeter leads area corresponding region
The connecting hole of substrate, transparency conducting layer pass through the connecting hole and conductive glue connection.The specific embodiment of the invention passes through through color film
On the transparency conducting layer and array substrate at the more stable conducting resinl conducting color membrane substrates back side of the connecting hole and performance of substrate
It is grounded cabling, to achieve the effect that color membrane substrates backwards to transparency conducting layer ground protection, elimination accumulation of static electricity.Pass through connecting hole
And the setting of conducting resinl, the transparency conducting layer and array at the color membrane substrates back side can be connected by applying elargol to avoid the prior art
The mode of ground connection cabling on substrate, so as to avoid because color membrane substrates caused by the reasons such as elargol aoxidizes, burn into falls off are quiet
Electricity accumulation, film flicker and elargol penetrate into the various undesirable generations such as picture greening caused by black matrix.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (6)
1. a kind of display panel, including the array substrate being oppositely arranged and color membrane substrates, the array substrate include viewing area and
Perimeter leads area, the perimeter leads area include ground connection cabling；The color membrane substrates include backwards to the saturating of the array substrate side
Bright conductive layer, which is characterized in that further include the conducting resinl between the array substrate and the color membrane substrates, the conduction
Orthographic projection of the glue in the array substrate is located at the perimeter leads area, and the conducting resinl is connect with the ground connection cabling；
The color membrane substrates further include be arranged in array substrate perimeter leads area corresponding region at least one through the coloured silk
The connecting hole of ilm substrate, and the metal being arranged in the connecting hole, the transparency conducting layer by the connecting hole with it is described
Conductive glue connection；
The color membrane substrates further include the setting that connect with the metal in the color membrane substrates backwards to and/or towards the array base
The metal wire of plate side, the transparency conducting layer pass through the metal wire and the metal and the conducting resinl that are arranged in the connecting hole
Connection, wherein orthographic projection of the metal wire in the array substrate is located at array substrate perimeter leads area.
2. display panel according to claim 1, which is characterized in that the connecting hole is penetration type hole or stepped bore.
3. display panel according to claim 2, which is characterized in that the connecting hole is penetration type bellmouth or staged
Bellmouth.
4. a kind of display device, which is characterized in that the display device includes the described in any item display surfaces of claim 1-3
Plate.
5. a kind of production method of display panel, the method including making array substrate and color membrane substrates, the array substrate packet
Viewing area and perimeter leads area are included, perimeter leads area includes ground connection cabling, which is characterized in that the method also includes:
With array substrate perimeter leads area corresponding region at color membrane substrates on make at least one through the color membrane substrates
Connecting hole；
Metal is made on the color membrane substrates；
There are the two sides of the color membrane substrates of the connecting hole to distinguish deposited metal film in production, is formed and be located in the connecting hole
Metal；
Metallic film to the color membrane substrates backwards to the array substrate side forms the first metal wire using patterning processes；
The second metal wire is formed using patterning processes to the metallic film of the color membrane substrates towards the array substrate side；Its
In, the orthographic projection of first metal wire and second metal wire in the array substrate is located at array substrate perimeter leads
Area；
Transparency conducting layer is made backwards to the array substrate side in the color membrane substrates；
Make conducting resinl between the array substrate and the color membrane substrates, the conducting resinl in the array substrate just
Projection is located at the perimeter leads area, and the conducting resinl is connect with the ground connection cabling, and the transparency conducting layer passes through the company
Connect hole and the conductive glue connection.
6. according to the method described in claim 5, it is characterized in that, the method using laser boring makes the connecting hole.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105739201B (en) * | 2016-04-22 | 2019-05-28 | 厦门天马微电子有限公司 | A kind of display panel and display device |
| US10290495B2 (en) | 2016-07-29 | 2019-05-14 | Japan Display Inc. | Electronic apparatus and manufacturing method of the same |
| JP2018025757A (en) * | 2016-07-29 | 2018-02-15 | 株式会社ジャパンディスプレイ | Electronic apparatus and method for producing the same |
| JP6716384B2 (en) * | 2016-07-29 | 2020-07-01 | 株式会社ジャパンディスプレイ | Display device |
| CN106648258B (en) * | 2017-01-03 | 2020-11-20 | 京东方科技集团股份有限公司 | Array substrate, touch display panel and touch display device |
| CN106773430B (en) * | 2017-03-30 | 2022-01-18 | 京东方科技集团股份有限公司 | Display substrate and display device |
| CN107065272A (en) * | 2017-06-09 | 2017-08-18 | 京东方科技集团股份有限公司 | Display panel and display device |
| KR102575030B1 (en) * | 2018-08-24 | 2023-09-05 | 삼성디스플레이 주식회사 | Liquid crystal display |
| CN109116606B (en) * | 2018-09-14 | 2021-08-24 | Oppo（重庆）智能科技有限公司 | Display screen, manufacturing method of display screen and electronic equipment |
| CN108983520B (en) * | 2018-09-29 | 2021-04-02 | 武汉华星光电技术有限公司 | Display panel with anti-electrostatic discharge |
| CN110706596B (en) * | 2019-10-21 | 2022-06-21 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN112415801B (en) * | 2020-11-27 | 2023-04-07 | 厦门天马微电子有限公司 | Display panel and display device |
| CN113589596B (en) * | 2021-07-16 | 2023-01-10 | 惠州华星光电显示有限公司 | Display panel and preparation method thereof |
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