CN105093092B - The method that wafer sort Summary standardization is realized using Excel - Google Patents
The method that wafer sort Summary standardization is realized using Excel Download PDFInfo
- Publication number
- CN105093092B CN105093092B CN201510402232.4A CN201510402232A CN105093092B CN 105093092 B CN105093092 B CN 105093092B CN 201510402232 A CN201510402232 A CN 201510402232A CN 105093092 B CN105093092 B CN 105093092B
- Authority
- CN
- China
- Prior art keywords
- resolution chart
- reference point
- standardization
- mother matrix
- excel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a kind of method that wafer sort Summary standardization is realized using Excel, product each first establishes clearly failure project form and the resolution chart mother matrix of standardization（Point containing canonical reference）；Then programmed using Excel VBA and probe station original document is converted into resolution chart（Reference point containing determination）；Reuse Excel VBA programmings, difference between calculating reference point and canonical reference point, the coincidence of the reference point of original resolution chart and standardized test figure mother matrix is realized, while carries out Correlation method for data processing, the generation figure consistent with standardized test figure mother matrix；Summary information extraction statistics is finally carried out to the standardized graphics after batch processing according to failure project form, finally realizes wafer sort Summary standardization.The present invention realizes the strict unification of total number measured, failure project etc., replaces the Summary forms of traditional different style, resolution chart that the resolution chart or different test foundries suitable for the generation of different type probe station provide etc..
Description
Technical field
The present invention relates to one kind wafer sort Summary is realized in ic core chip level test process using Excel
The method of standardization, the test chart provided applied to the resolution chart of different type probe station generation or different test foundries
Shape.
Background technology
For ic core chip level test process, wafer sort Summary（Note：The Summary being mentioned above is base
In probe station test patterns generation, because it is most accurate）Can be with Real-time Feedback test mode in production process（Normally/low
It is good）, it is poor with the presence or absence of testing between different test platforms to be monitored in the test of different test platforms for same batch wafer
It is different；For terminal client, batch yield, invalid cost and historical data comparison report etc., comprehensive various analysis reports can be obtained
Announcement judge whether to need to change process conditions, redesign correcting or additions and deletions test event with the product design for being optimal and
Cost performance demand.Wafer sort Summary offer also experienced the process of a gradual perfection and technological innovation.Most original
Wafer sort Summary is provided solely for the quantity of passing number and number of non-compliances, is based primarily upon two reasons：First, client does not weigh
Depending on as long as reaching expected profit；Second, probe station hardware is not supported, most probe stations use TTL communication interfaces, Zhi Nengti
For qualified and unqualified signal.With the progress of measuring technology and the increase of cost pressure, client needs the failure to circuit to have
Body reason carries out positioning analysis, formulates corresponding countermeasure, improves product test yield, reduces loss of income；Probe station increases simultaneously
GPIB communication interfaces are added, part probe station can realize 1024 failure classifications of the items, can meet most client's need
Ask.Along with the arrival in big data epoch, in order to preferably analyze product failure pattern, client is to each test clothes
Business supplier proposes a higher requirement：Standardized test Summary, total number measured, failure item setup must be strict
Unanimously, the problem of data that be able to may be thus brought with the different test factories of closed loop, test platform or probe station are inconsistent.This
Just need to carry out after-treatment to probe station resolution chart：Standardization, it is also beneficial to service provider and finds itself not by comparing
Foot.
The content of the invention
The purpose of the present invention is in ic core chip level test process, realizes that wafer sort Summary is marked using Excel
Standardization, the strict unification of total number measured, failure project etc. is realized, replace the Summary forms of traditional different style, be applied to
Resolution chart that the resolution chart of different type probe station generation or different test foundries provide etc..
According to technical scheme provided by the invention, the method that wafer sort Summary standardization is realized using Excel
For：（1）Clearly failure project form and the resolution chart mother matrix of standardization, the resolution chart are established to each product first
Mother matrix includes canonical reference point；（2）Then programmed using Excel VBA and probe station original document is converted into original test chart
Shape, and determine according to the canonical reference point position of standard pattern mother matrix the original resolution chart reference point of each product；（3）
Excel VBA programmings are reused, calculate the reference point of the original resolution chart and the canonical reference point of resolution chart mother matrix
Between shift differences, reference point described in original resolution chart and resolution chart mother matrix and canonical reference are clicked through into line position and put weight
Close, by the original test patterns generation figure consistent with resolution chart mother matrix；（4）Finally, according to the failure project of each product
Form carries out Summary information extraction statistics to the resolution chart after standardization, realizes wafer sort Summary standardization.
Specifically, step（1）When formulating the canonical reference point of resolution chart mother matrix, for there is the crystalline substance at obvious photoetching right angle
Circle, using right angle joint as canonical reference point；For the wafer in no notable feature region, manual ink dot positioning is selected as mark
Quasi- reference point.Step（2）When determining the reference point of original resolution chart, also corresponding selection has obvious photoetching right angle to refer to, or
There is the point of manual ink dot positioning reference.
One setting character representation of the canonical reference point, such as " # " or " * ".
Step（3）In, first the canonical reference point of resolution chart mother matrix is scanned for positioning, determine coordinate position（X1,
Y1）, then the reference point of original resolution chart is scanned for positioning, determine coordinate position（X2, Y2）, so as to draw two figures
Between existing shift differences, X-direction：X1-X2；Y-direction：Y1-Y2, determine original resolution chart in X, Y according to shift differences
Displacement on axle, re-start the displacement of all data using software and calculate actual data segment in X and the length of Y-direction
Degree, the reference point of original resolution chart is forced and the canonical reference of resolution chart mother matrix clicks through line position and puts coincidence.Then, according to
The test dies sum and attribute of resolution chart mother matrix carry out data processing to treated original resolution chart：Resolution chart
Tube core outside mother matrix region, reject without exception, tube core attribute is newly defined as non-test；In resolution chart mother matrix, but handle
Original resolution chart afterwards is supplied without exception either with or without test mode is embodied, and tube core attribute is newly defined as testing defective products；Its
The tube core matching test figure mother matrix of his conventional sense.
Step（4）The failure project form of the middle each product of basis, matching is scanned to the resolution chart after standardization,
Draw the failure number of each test event.
It is an advantage of the invention that：During whole operation, changed by technology, the test that different type probe station is generated
Resolution chart that figure or different test foundries provide etc. is generated by Excel VBA programmed to pass through original figure, standardization
The steps such as mother matrix is compared and Summary is extracted realize probe station Summary standardization, have reached the demand of client.Software
Batch processing also significantly simplifies the cumbersome flows such as traditional manual data typing, the fine setting of indivedual expired entries and secondary-confirmation, has
Effect improves production efficiency.
Brief description of the drawings
Fig. 1 present invention applies preceding original resolution chart schematic diagram.
The standardized test figure mother matrix schematic diagram that Fig. 2 present invention uses.
The standardized test pictorial diagram that Fig. 3 present invention generates.
The standardization Summary schematic diagrames that Fig. 4 present invention generates.
Note：" # " in diagram represents reference point.
Embodiment
The present invention overall procedure be：Project each first establishes clearly failure project form and the test chart of standardization
Shape mother matrix（Point containing canonical reference）；Then programmed using Excel VBA and probe station original document is converted into resolution chart（Containing true
Fixed reference point）；Excel VBA programmings are reused, the difference between calculating reference point and canonical reference point, realize original survey
Attempt the coincidence of shape and the reference point of standardized test figure mother matrix, while carry out relevant treatment, generation and standardized test figure
The consistent figure of shape mother matrix；Summary Information Statistics finally are carried out to the standardized graphics after batch processing, realize wafer sort
Summary standardization.
The invention will be further described with reference to the accompanying drawings and examples.
Clearly failure project form, while make the test of standardization is established to each product according to customer demand first
Figure mother matrix（Client provides or made according to customer demand service provider oneself）, specify test chip sum, test dies attribute
With yield control line etc..Resolution chart mother matrix needs to implement a committed step：Canonical reference point is formulated, for there is obvious photoetching
The wafer at right angle, using right angle joint as canonical reference point；For the wafer in no notable feature region, manual ink can be selected
Point location can use the character representation such as " # " or " * " as canonical reference point, this point（Such as the point highlighted in Fig. 2 circles）.
The conventional nonnumeric and ASCII character of English alphabet in theory, due to that it is widely recognized that " # " and " * " two characters, institute
Have selected the two characters according to masses' accreditation.Improving one by one for information above indicates building for each standardization of products mother matrix
It is vertical.As shown in Fig. 2 blank cell represents non-test region, " M " cell represents to force dotted areas, and " T " cell represents
Test zone, " # " cell represent canonical reference point.
Second step uses Excel VBA programming languages（Office softwares substantially every PC can all be installed, and have extensive
Cognition degree and familiarity.Excel herein refers both to Microsoft Office Excel 2007.）To the generation of different probe platform
Binary file carries out batch processing, generates the original resolution charts of needs, file format * .maskb, and according to standard testing
The canonical reference point position of figure mother matrix determines the original resolution chart reference point of each product（Relative position）, according to rule such as
Under：1st, obvious photoetching right angle refers to；Or 2, have the positioning reference of manual ink dot.The original resolution chart of the embodiment of the present invention is as schemed
Shown in 1, the " # " of right side edge is reference point.
3rd step is continuing with Excel VBA programmings and carries out " scratching figure " processing, first to the standard of standard pattern mother matrix
Reference point scans for positioning, and determines coordinate position（X1, Y1）, then the reference point of original resolution chart is scanned for positioning,
Determine coordinate position（X2, Y2）, so as to draw existing shift differences between two figures, X-direction：X1-X2；Y-direction Y1-
Y2.According to the displacement of the original resolution chart of positive and negative determination upper and lower, left and right in X, Y-axis of respective difference, software weight is utilized
Newly carry out the displacement of all data and calculate actual data segment in X and the length of Y-direction.The step for passing through, by original survey
The reference point for attempting shape forces to put coincidence with the canonical reference of standard pattern mother matrix click-through line position.
4th step is according to the resolution chart mother matrix of standardization（File format * .xls or * .xlsx）Test dies sum and
Attribute by pretreated original resolution chart to carrying out data processing, it then follows principle：Standardized test figure mother matrix region
Outer tube core, is rejected without exception, and tube core attribute is newly defined as " non-test "；In standardized test figure mother matrix, but handle
Original resolution chart afterwards is supplied, tube core attribute is newly defined as " test defective products " without exception either with or without test mode is embodied；
The tube core matching standardized test figure mother matrix of other conventional senses.After this road software processing, it is formed and marks
The consistent figure of standardization resolution chart mother matrix, that is, the resolution chart being standardized, simply the attribute of each test dies is not in the presence of
Unanimously.As shown in figure 3, establishing criteria reference pattern, automatically removes unnecessary test dies, augments insufficient tube core.Concern top
Contrast district A, there occurs great changes for figure after standardization.
Final step is the Summary batch extractings of the resolution chart after being standardized, again by Excel
VBA is programmed to, and according to the failure project form of each product, is scanned matching to the resolution chart after standardization, is obtained
Go out the failure number of each test event.So far, the processing that wafer sort Summary standardization is realized using Excel is completed,
The standardization Summary of generation is as shown in Figure 4.
The present invention is because the use of Excel VBA development platforms, closed loop may deposit between different probe platform or testing factory
Data format compatibility issue.Client is non-for the test Summary of standardization uniqueness, accuracy and referring to property
It is often satisfied.
Claims (7)
1. the method for wafer sort Summary standardization is realized using Excel, it is characterized in that：（1）Each product is built first
Vertical clearly failure project form and the resolution chart mother matrix of standardization, the resolution chart mother matrix include canonical reference point；（2）
Then programmed using Excel VBA and probe station original document is converted into original resolution chart, and it is female according to standard pattern
The canonical reference point position of version determines the original resolution chart reference point of each product；（3）Excel VBA programmings are reused,
The shift differences between the reference point of the original resolution chart and the canonical reference point of resolution chart mother matrix are calculated, by original survey
Attempt reference point described in shape and resolution chart mother matrix and canonical reference and click through line position to put coincidences, by original test patterns generation with
The consistent figure of resolution chart mother matrix；（4）Finally, according to the failure project form of each product to the resolution chart after standardization
Summary information extraction statistics is carried out, realizes wafer sort Summary standardization.
2. the method according to claim 1 that wafer sort Summary standardization is realized using Excel, it is characterised in that
Step（1）Formulate resolution chart mother matrix canonical reference point when, for there is the wafer at obvious photoetching right angle, using right angle joint as
Canonical reference point；For the wafer in no notable feature region, manual ink dot positioning is selected to be used as canonical reference point.
3. the method according to claim 2 that wafer sort Summary standardization is realized using Excel, it is characterised in that
Step（2）When determining the reference point of original resolution chart, also corresponding selection has obvious photoetching right angle to refer to, or has manual ink dot
The point of positioning reference.
4. the method according to claim 1 that wafer sort Summary standardization is realized using Excel, it is characterised in that
One setting character representation of the canonical reference point.
5. the method according to claim 1 that wafer sort Summary standardization is realized using Excel, it is characterised in that
Step（3）In, first the canonical reference point of resolution chart mother matrix is scanned for positioning, determine coordinate position（X1, Y1）, then to original
The reference point of beginning resolution chart scans for positioning, and determines coordinate position（X2, Y2）, it is existing between two figures so as to draw
Shift differences, X-direction：X1-X2；Y-direction：Y1-Y2, displacement of the original resolution chart in X, Y-axis is determined according to shift differences
Amount, re-start the displacement of all data using software and calculate actual data segment in X and the length of Y-direction, by original survey
The reference point for attempting shape forces to put coincidence with the canonical reference of resolution chart mother matrix click-through line position.
6. the method according to claim 4 that wafer sort Summary standardization is realized using Excel, it is characterised in that
After the reference point and canonical reference point position overlap, according to the test dies of resolution chart mother matrix sum and attribute at
The original resolution chart of reason carries out data processing：Tube core outside resolution chart mother matrix region, reject without exception, tube core attribute is again fixed
Justice is non-test；In resolution chart mother matrix, but the original resolution chart after handling is either with or without test mode is embodied, without exception
Supply, tube core attribute is newly defined as testing defective products；The tube core matching test figure mother matrix of other conventional senses.
7. the method according to claim 1 that wafer sort Summary standardization is realized using Excel, it is characterised in that
Step（4）The failure project form of the middle each product of basis, is scanned matching to the resolution chart after standardization, draws each
The failure number of test event.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510402232.4A CN105093092B (en) | 2015-07-09 | 2015-07-09 | The method that wafer sort Summary standardization is realized using Excel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510402232.4A CN105093092B (en) | 2015-07-09 | 2015-07-09 | The method that wafer sort Summary standardization is realized using Excel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105093092A CN105093092A (en) | 2015-11-25 |
| CN105093092B true CN105093092B (en) | 2018-01-05 |
Family
ID=54573974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510402232.4A Active CN105093092B (en) | 2015-07-09 | 2015-07-09 | The method that wafer sort Summary standardization is realized using Excel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105093092B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108693459A (en) * | 2017-10-19 | 2018-10-23 | 曹宁 | Two point VI curved scannings for various circuit boards compare method for diagnosing faults |
| CN111190093A (en) * | 2020-01-10 | 2020-05-22 | 上海知白智能科技有限公司 | Chip testing method and device |
| CN112666448A (en) * | 2020-12-18 | 2021-04-16 | 江苏艾科半导体有限公司 | DELP series probe station driving configuration method in chip CP test |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1149385B1 (en) * | 1998-11-13 | 2005-03-16 | FEI Company | Ic test software system for mapping logical functional test data of logic integrated circuits to physical representation |
| CN102592201A (en) * | 2012-02-17 | 2012-07-18 | 四川省农业科学院作物研究所 | Method for summarizing rice regional test information rapidly |
| CN102902663A (en) * | 2012-10-11 | 2013-01-30 | 无锡中微腾芯电子有限公司 | Method for manufacturing menu of TSK series probe stations in offline mode by utilizing Excel |
| CN103970938A (en) * | 2014-04-22 | 2014-08-06 | 上海华力微电子有限公司 | Wafer test result map mark modification method |
-
2015
- 2015-07-09 CN CN201510402232.4A patent/CN105093092B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1149385B1 (en) * | 1998-11-13 | 2005-03-16 | FEI Company | Ic test software system for mapping logical functional test data of logic integrated circuits to physical representation |
| CN102592201A (en) * | 2012-02-17 | 2012-07-18 | 四川省农业科学院作物研究所 | Method for summarizing rice regional test information rapidly |
| CN102902663A (en) * | 2012-10-11 | 2013-01-30 | 无锡中微腾芯电子有限公司 | Method for manufacturing menu of TSK series probe stations in offline mode by utilizing Excel |
| CN103970938A (en) * | 2014-04-22 | 2014-08-06 | 上海华力微电子有限公司 | Wafer test result map mark modification method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105093092A (en) | 2015-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105093092B (en) | The method that wafer sort Summary standardization is realized using Excel | |
| CN110009172A (en) | Asset life cycle Data Modeling Method based on SG-CIM model | |
| CN101256631B (en) | Method and apparatus for character recognition | |
| CN111553303A (en) | Remote sensing ortho image dense building extraction method based on convolutional neural network | |
| CN104990926A (en) | TR element locating and defect detecting method based on vision | |
| CN113592231A (en) | Engineering quality control method based on BIM technology | |
| CN101556303A (en) | Wafer test system for integrating radio frequency identification and test method thereof | |
| CN107590638A (en) | Match the acquisition methods and relevant device of the track traffic product model of user's request | |
| CN104463920A (en) | Two-level optimization Hough transformation rapid detection positioning method oriented to circular identifier | |
| CN111813951A (en) | Key point identification method based on technical map | |
| CN110047072A (en) | A kind of gravel size identification processing system and processing method based on mobile interchange | |
| CN112926840A (en) | Hydropower engineering civil engineering test data statistical analysis method and system | |
| CN104376174B (en) | Alternating current line parameter identification and correction method based on line impedance ratio | |
| CN106773544A (en) | A kind of OPC modeling methods of control secondary graphics signal rate of false alarm | |
| CN105740540B (en) | The lookup method of the pattern image of domain in mask plate design | |
| CN110120035A (en) | A kind of tire X-ray defect detection method differentiating defect grade | |
| CN108345732A (en) | A kind of industry spot construction quality intelligent detecting method | |
| CN103895343B (en) | A kind of printed article detection method for quality and system | |
| CN107356601A (en) | A kind of automatic defect of defect checking machine platform is presorted method for reporting | |
| CN110377768A (en) | It is a kind of intelligently to know drawing system and method | |
| CN109816640A (en) | A kind of product method of calibration based on picture comparison | |
| CN101398899B (en) | System and method for auto- recognizing metal plate part edge type | |
| CN101739408A (en) | Semiconductor test data-based data processing method | |
| CN110910008B (en) | One-key cost accounting management system and management method for visual accounting flow | |
| CN103677474A (en) | High-precision small-piece collaging system for preparing monolithic integrated capacitive touch screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |