CN105090902A - Plastic lamp holder with mounting surface having isolation slot, and plastic bulb having same - Google Patents

Plastic lamp holder with mounting surface having isolation slot, and plastic bulb having same Download PDF

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Publication number
CN105090902A
CN105090902A CN201410188152.9A CN201410188152A CN105090902A CN 105090902 A CN105090902 A CN 105090902A CN 201410188152 A CN201410188152 A CN 201410188152A CN 105090902 A CN105090902 A CN 105090902A
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CN
China
Prior art keywords
mentioned
installed surface
conductive
electrode
exposed
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Pending
Application number
CN201410188152.9A
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Chinese (zh)
Inventor
谢荣雅
林永富
张源炘
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GIXIA CO Ltd
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GIXIA CO Ltd
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Priority to CN201410188152.9A priority Critical patent/CN105090902A/en
Publication of CN105090902A publication Critical patent/CN105090902A/en
Pending legal-status Critical Current

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Abstract

The invention provides a plastic lamp holder with a mounting surface having isolation slots, and the lamp holder is used for mounting a light emitting diode; the light emitting diode respectively has two surface mounting terminals; the plastic lamp holder comprises an insulation pedestal made of first plastic and provided with a mounting surface and an outer side face, wherein the mounting surface is used for arranging the light emitting diode in a conductive bonding manner; the plastic lamp holder also comprises the following elements: a conductive electrode with one end exposed outside the outer side face of the insulation pedestal, and the electrode penetrates the insulation pedestal so that the other end is exposed outside the mounting surface; a grounding electrode with one end exposed outside the outer side face of the insulation pedestal and the other end exposed outside a bearing surface, and the grounding electrode and the conductive electrode are mutually insulated, and are commonly in conductive bonding with the light emitting diode. The mounting surface at least comprises one isolation slot used for isolating the conductive electrode from the grounding electrode. The invention also provides a plastic bulb having the plastic lamp holder; the isolation slot can separate the conductive electrode from the grounding electrode, thus preventing conductive bonding layer contacting possibility between the two electrodes.

Description

Installed surface has the plastic lamp base of separate slot and has the plastics bulb of this lamp socket
Technical field
The present invention relates to a kind of plastic lamp base and have the plastics bulb of this plastic lamp base, especially installed surface has the plastic lamp base of separate slot and has the plastics bulb of this lamp socket.
Background technology
Due to LED have that luminous efficiency is high, reaction speed is very fast, need not warm up lamp time (idlingtime), long service life, not fragile, power consumption is few, environmental protection and the advantage such as volume is little, add the relevant research and development of light emitting diode (LED) bulb in recent years, improvement, make LED gradually replace the occupation rate of market of conventional bulb.But new-type LED still part continues to use old specification style, the lamp socket of such as bulb is still to be made up of metal-back, and the external screw thread with specific distance and radius is as installing interface, lamp socket has a conducting protrudes from lamp socket tail end conductive electrode to externally threaded conductive electrode and one respectively; Make bulb be spirally connected install while, conductive electrode connects two feeder ears to lamp socket respectively, enable bulb accept energising and luminous.
But metal lamp holder has and makes the inferior problem of precision, the texture of destructible product and cause high expensive, also causes the difficulty that bulb recycle simultaneously, does not meet global environmental protection trend.In addition, LED element needs direct current, and required voltage is far below the civil power of general socket, therefore also must install rectifier transformer additional, input voltage rectification is downgraded and meets needed for LED bulb, unnecessarily improve cost.Therefore inventor has correlation technique, for the problems referred to above, solution is proposed.This technology utilizes the plastic lamp base of bi-material simultaneously injection moulding LED, and wherein a kind of material has conducting function, also has certain resistance simultaneously, and this material forms two electrodes exposing on plastic lamp base, and the two ends for LED are installed; Metal lamp holder before replacing accordingly.
But in use, find that structure still has improvement space.When adopting metal lamp holder, LED grain or element utilize surface mounting technique to be soldered on circuit board, and circuit board is mounted in bulb by another road formality again, and not only each element manufacturing cost is higher before, also makes processing assembly program complicated.In addition, when present invention applicant proposes above-mentioned two-component injection forming technique, the high temperature due to reflow operation exceeds the fusing point of plastic lamp base, can make plastic lamp base temperature distortion, therefore before aforementioned two-component injection bulb in case, conducting resinl need be used instead LED gluing is fixed on the installed surface of plastic lamp base.Bond processing herein, prior to two electrode place applying conductive adhesive linkages, then force pressing LED, to guarantee that LED is reliably cemented on the installed surface of plastic base, and conducting good in electrode.
But, this one to exert a force the process pressed down, when extruding conductive adhesion layer, due to LED and the upper and lower pinching of plastic base, can make that there is flexible conducting resinl to spread from two electrodes to side respectively, and existing LED grain size is quite little, if the conducting resinl at unfortunate two electrode places contacts with each other, just forms another current path and cause short circuit.Though this kind of probability is not high, under the running up of machining, still have the plastic LED bulb short circuit of part output, cause qualification rate to decline and cost and waste of time.Therefore, how avoiding the conductive adhesion layer excess diffusion at two electrode places, namely prevent two place's conductive adhesion layer mutual conduction, is the emphasis that the present invention solves.Wish to promote making qualification rate by the improvement of this structure, to reduce cost and waste of time.
Summary of the invention
One of the present invention object is to provide a kind of installed surface to have the plastic lamp base of separate slot, is broken off the chance of the conductive adhesion layer contact at two electrode places by separate slot structure.
Another object of the present invention is to provide a kind of plastics bulb with plastic lamp base, adds above-mentioned plastic lamp base, adding man-hour and significantly reduce the ratio of short circuit defective work, to promote making qualification rate.
Another object of the present invention is the plastics bulb providing a kind of tool plastic lamp base, reduces while defective work, also reduces step and the manpower expenses such as defective work makes, processes, processing, reduces production capacity, cost and the waste of process time accordingly.
For reaching above-mentioned purpose, this case provides a kind of installed surface to have the plastic lamp base of separate slot, in order to install at least one light emitting diode, aforementioned light emitting diode has two surface mount termination respectively, and this plastic lamp base comprises: to be made up of one first plastics and to have the insulating base of installed surface that an above-mentioned light emitting diode conductive adhesive of confession arranges and a lateral surface for one; An one end is exposed to this insulating base lateral surface and makes its other end be exposed to the conductive electrode of this installed surface through this insulating base; And one end be exposed to this insulating base lateral surface and the other end be exposed to this installed surface and with the earth electrode of this conductive electrode setting insulated from each other, and and above-mentioned conductive electrode jointly accept the conductive adhesive of above-mentioned light emitting diode; Wherein, this installed surface has the separate slot separating above-mentioned conductive electrode and earth electrode at least together.
A light emitting diode is arranged on above-mentioned plastic lamp base, is the plastics bulb of this case, comprises: at least one light emitting diode, there are at least two surface mount termination; A plastic lamp base, comprising: to be made up of one first plastics and to have the insulating base of installed surface that an above-mentioned light emitting diode conductive adhesive of confession arranges and a lateral surface for one; An one end is exposed to this insulating base lateral surface and makes its other end be exposed to the conductive electrode of this installed surface through this insulating base, and the surface mount termination for above-mentioned light emitting diode is installed; One end be exposed to this insulating base lateral surface and the other end be exposed to this installed surface and with the earth electrode of this conductive electrode setting insulated from each other, another surface mount termination for above-mentioned light emitting diode is installed; And wherein, this installed surface has the separate slot separating above-mentioned conductive electrode and earth electrode at least together; And a conductive adhesion layer, at least comprise respectively bonding be arranged at one on this conductive electrode and this earth electrode conduct electricity colloid and a ground connection colloid, for above-mentioned light emitting diode above-mentioned surface mount termination respectively conductive mounting to above-mentioned conductive electrode and above-mentioned earth electrode; By this separate slot, when above-mentioned conduction colloid or above-mentioned ground connection colloid overflow across above-mentioned conductive electrode or above-mentioned earth electrode, this separate slot will be housed inside and can not short circuit each other.
Installed surface disclosed by the invention has the plastic lamp base of separate slot and has the plastics bulb of this lamp socket, by the setting of separate slot, separate conductive electrode and earth electrode, the possibility of the conductive adhesion layer contact at isolated two electrode places, thus reach raising making qualification rate to reduce the effects such as production capacity, cost and the waste of process time.
Accompanying drawing explanation
Fig. 1 is the stereogram of the present invention first preferred embodiment, in order to primary structure and the plastic lamp base of plastic lamp base to be described and to send out
The annexation of optical diode;
Fig. 2 is the perspective view of the present invention first preferred embodiment, in order to the counter structure of separate slot and two colloids to be described;
Fig. 3 is the partial enlarged drawing of Fig. 2, in order to the flow impedance effect that separate slot plays two colloids to be described;
Fig. 4 is auxiliary view 3, if in order to illustrate that two colloids break through impedance, separate slot still effectively can increase by two colloid flowings each other
Distance;
Fig. 5 is the stereogram of the present invention second preferred embodiment, arranges state in order to what present heat abstractor;
Fig. 6 is the perspective view of the present invention second preferred embodiment, in order to illustrate heat-conducting piece with heat radiation adhesive linkage structural relation with comparatively
Good conduction heat flow direction;
Fig. 7 is the situation that this case light emitting diode is encapsulated by fluorescent colloid.
Reference numeral illustrates:
1,1 '-light emitting diode; 11,12-surface mount termination;
3,3 '-plastic lamp base; 30,30 '-insulating base;
300,300 '-installed surface; 301,301 '-lateral surface;
31-conductive electrode; 32-earth electrode;
33,33 '-separate slot; 341 '-heat-conducting piece;
342 '-heat radiation adhesive linkage; 51,51 '-conduction colloid;
52,52 '-ground connection colloid; 310-is most advanced and sophisticated;
320-screw thread.
Detailed description of the invention
Aforementioned and other technology contents, feature and effect for the present invention, in the detailed description of following cooperation with reference to graphic preferred embodiment, can know and present; In addition, in embodiments, identical element is represented by similar symbol.
The present invention first preferred embodiment is that installed surface has the plastic lamp base of separate slot and has the plastics bulb of this lamp socket, as shown in Figures 1 and 2, the mode that plastic lamp base 3 is shaped by extra quality cascode makes insulating base 30 with the first plastics, these first plastics optionally can be adjusted to the higher colloid of heat conduction, such as be mixed with nonconducting metal dust etc., simultaneously be coated on the second plastics and one conductive electrode 31 and the setting insulated from each other of earth electrode 32, two electrode that the conductive layer on second plastics forms; Wherein conductive electrode 31 is strip with the outward appearance of earth electrode 32, coated by insulating base 30, and the tip 310 exposing to lamp holder respectively with screw thread 320 to be connected civil power.Electrode one end of two strips exposes on the bottom surface (non-label) in the lateral surface 301 of insulating base 30, and the other end then exposes to the installed surface 300 of insulating base 30, is electrically connected for external power source.The installation of the routine conductive adhesion layer for conducting resinl is sticky establishes on the installed surface 300 of insulating base 30 by releasing to release the light emitting diode 1 that example is LED element, wherein conductive adhesion layer is divided into two parts, for ease of explanation, what title was arranged at conductive electrode 31 place herein is conduction colloid 51, be located at the then title ground connection colloid 52 at earth electrode 32 place, two surface mount termination 11,12 of each electric cementation light emitting diode 1 of two colloids, make light emitting diode 1 conductive mounting to two electrode.
When pressing down for avoiding light emitting diode 1 two surface mount termination 11,12, conduction colloid 51 can overflow conductive electrode 31 and earth electrode 32 place respectively with ground connection colloid 52, and even contact with each other initiation short circuit; Therefore this routine installed surface 300 is formed with one separate slot 33, between conduction colloid 51 and ground connection colloid 52.The object that arranges of separate slot 33 realizes barriering effect, do not hinder the surface of light emitting diode 1 to install simultaneously; Therefore the separate slot 33 of up concave type is designed to.Shown in Fig. 3, if conduction colloid 51 suffers oppression with ground connection colloid 52, because two kinds of colloids have flexibility, to expand outwardly everywhere along installed surface 300, but due to the viscosity that colloid tool is suitable, when the width of separate slot 33 is greater than the height of colloid, can form an obstacle, colloid leading edge cannot be crossed over easily.Even if as shown in Figure 4, conductive adhesion layer has a small amount of inflow among separate slot 33, and because separate slot 33 still has certain depth, the colloid of inflow still cannot fill up this separate slot 33 easily, and the probability that conduction colloid 51 and ground connection colloid 52 are contacted each other is very little.
This case second preferred embodiment as shown in Figure 5 to Figure 6, in plastic lamp base 3 ', a newly-increased thermal conductivity factor is higher than the heat abstractor of insulating base 30 ', the heat-conducting piece 341 ' that heat abstractor is mainly arranged among insulating base 30 ' by one dispels the heat, heat-conducting piece 341 ' is designed to one end and is exposed to the outside on side 301 ', contacts with air; The other end is then exposed on installed surface 300 ', and is provided with the good heat radiation adhesive linkage 342 ' of one deck thermal conductivity factor as thermal paste etc., and its setting position is just to the installation place of light emitting diode 1 ', and it is a LED grain that the light emitting diode 1 ' in this example releases example.Light emitting diode 1 ' is by heat radiation adhesive linkage 342 ', and the one end being exposed to installed surface 300 ' with heat-conducting piece 341 ' is mutually cemented.By this structure, light emitting diode 1 ' produce most heat energy and can conduct to heat-conducting piece 341 ' from the heat-conducting effect adhesive linkage 342 ' that dispels the heat preferably, then touch extraneous air to reach the object of heat radiation; Thus avoid a large amount of heat energy to be gathered on the insulating base 30 ' of heat-conducting effect difference, and then affect the service life of product.
Consider that heat-conducting piece 341 ' take metal as the possibility of material first-selection, touch heat-conducting piece 341 ' formation when scattering for avoiding conductive adhesion layer to be electrically connected and short circuit, the area of this example in the middle of installed surface 300 ' conducts electricity colloid 51 ' and ground connection colloid 52 ' forms twice separate slot 33 ', and the position that heat-conducting piece 341 ' exposes is then between two separate slots 33 '.Thus, the colloid of conductive adhesion layer, by the impedance of separate slot 33 ', makes the intermediate zone of two separate slots 33 ' form a barrier region, stops the possibility that conductive adhesion layer conducting heat-conducting piece 341 ' causes short circuit.In addition, the composition of the improvement of this example conductive electrode and earth electrode, directly to arrange in pairs or groups the first plastics two-component injection shaping to be mixed with second plastics of conductive materials as iron powder.
Certainly, above-mentioned second plastics are also unrestricted, also can directly imbed mould as two electrodes by metal, and reinject the first plastics forming insulating base.It should be noted that plastic lamp base of the present invention can depart from whole group of bulb and make separately, sell.And adding man-hour, due to the light emitting diode in the second preferred embodiment and incomplete LED element, but release example for the Blue LED Die that do not encapsulate as shown in Figure 7, therefore last layer yellow fluorescent colloid can be dripped thereon encapsulate, to reach the effect sending naked eyes visible white light; Or directly on plastic lamp base, install the transparent lamp shade of airtight, a yellow phosphor powder of tool additional, the mixing of collocation Blue LED Die sends macroscopic white light.
Visible the present invention is by the design of separate slot in sum, breaks off the chance of the conductive adhesion layer contact at two electrode places; Significantly improve the qualification rate of bond processing accordingly, help cannot reflow plastic lamp base solve trouble and worry.Also step and the manpower expenses such as defective work makes, processes, processing is reduced, reduction production capacity, cost and the waste of process time.But above said content, be only preferred embodiment of the present invention, when not limiting scope of the invention process with this, the simple equivalence namely generally done according to claims of the present invention and description changes and modifies, and all still remains within the scope of the patent.

Claims (10)

1. installed surface has a plastic lamp base for separate slot, and in order to install at least one light emitting diode, aforementioned light emitting diode has two surface mount termination respectively, and this plastic lamp base comprises:
To be made up of one first plastics and there is the insulating base of installed surface that an above-mentioned light emitting diode conductive adhesive of confession arranges and a lateral surface for one;
An one end is exposed to this insulating base lateral surface and makes its other end be exposed to the conductive electrode of this installed surface through this insulating base; And
One end be exposed to this insulating base lateral surface and the other end be exposed to this installed surface and with the earth electrode of this conductive electrode setting insulated from each other, jointly accept the conductive adhesive of above-mentioned light emitting diode with above-mentioned conductive electrode;
It is characterized in that this installed surface having the separate slot separating above-mentioned conductive electrode and earth electrode at least together.
2. installed surface as claimed in claim 1 has the plastic lamp base of separate slot, it is characterized in that, the second plastics that above-mentioned conductive electrode and above-mentioned earth electrode contain conductive materials by are respectively made.
3. installed surface as claimed in claim 1 has the plastic lamp base of separate slot, it is characterized in that, above-mentioned conductive electrode and above-mentioned earth electrode comprise the second plastics and that one deck conducts electricity respectively and be arranged at conductive layer on these second plastics.
4. the installed surface as described in claim 1,2 or 3 has the plastic lamp base of separate slot, it is characterized in that, also comprise the heat abstractor of at least one thermal conductivity factor higher than this insulating base, wherein this installed surface is formed with twice separate slot, one end that above-mentioned heat abstractor is exposed to this installed surface is arranged between above-mentioned twice separate slot.
5. installed surface as claimed in claim 4 has the plastic lamp base of separate slot, it is characterized in that, this heat abstractor comprises one and is exposed to this installed surface with one end and makes its part be exposed to the heat-conducting piece of this insulating base lateral surface through this insulating base, and be arranged at above-mentioned heat-conducting piece and be exposed to a heat radiation adhesive linkage on one end of this installed surface, and the thermal conductivity factor of this heat radiation adhesive linkage is higher than this insulating base.
6. a plastics bulb, comprising:
At least one light emitting diode, has at least two surface mount termination;
A plastic lamp base, comprising:
To be made up of one first plastics and there is the insulating base of installed surface that an above-mentioned light emitting diode conductive adhesive of confession arranges and a lateral surface for one;
An one end is exposed to this insulating base lateral surface and makes its other end be exposed to the conductive electrode of this installed surface through this insulating base, and the surface mount termination for above-mentioned light emitting diode is installed;
One end be exposed to this insulating base lateral surface and the other end be exposed to this installed surface and with the earth electrode of this conductive electrode setting insulated from each other, another surface mount termination for above-mentioned light emitting diode is installed;
It is characterized in that this installed surface having the separate slot separating above-mentioned conductive electrode and earth electrode at least together;
Also comprise: a conductive adhesion layer, at least comprise respectively bonding be arranged at one on this conductive electrode and this earth electrode conduct electricity colloid and a ground connection colloid, for above-mentioned light emitting diode above-mentioned surface mount termination respectively conductive mounting to above-mentioned conductive electrode and above-mentioned earth electrode; By this separate slot, when above-mentioned conduction colloid or above-mentioned ground connection colloid overflow across above-mentioned conductive electrode or above-mentioned earth electrode, this separate slot will be housed inside and can not short circuit each other.
7. plastics bulb as claimed in claim 6, is characterized in that, the second plastics that above-mentioned conductive electrode and above-mentioned earth electrode contain conductive materials by are respectively made.
8. plastics bulb as claimed in claim 6, is characterized in that, above-mentioned conductive electrode and above-mentioned earth electrode comprise the second plastics and that one deck conducts electricity respectively and be arranged at conductive layer on these second plastics.
9. plastics bulb as claimed in claim 6, it is characterized in that, this plastic lamp base also comprises the heat abstractor of at least one thermal conductivity factor higher than this insulating base, and this heat abstractor comprises one is exposed to this installed surface with one end and makes its part be exposed to the heat-conducting piece of this insulating base lateral surface through this insulating base, and be arranged at above-mentioned heat-conducting piece be exposed on one end of this installed surface one heat radiation adhesive linkage, the thermal conductivity factor of this heat radiation adhesive linkage is higher than this insulating base; In addition this installed surface is formed with twice separate slot, one end system that above-mentioned heat abstractor is exposed to this installed surface is arranged between above-mentioned twice separate slot.
10. plastics bulb as claimed in claim 6, is characterized in that, also comprise a transparent lamp shade be arranged on above-mentioned plastic lamp base.
CN201410188152.9A 2014-05-06 2014-05-06 Plastic lamp holder with mounting surface having isolation slot, and plastic bulb having same Pending CN105090902A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410188152.9A CN105090902A (en) 2014-05-06 2014-05-06 Plastic lamp holder with mounting surface having isolation slot, and plastic bulb having same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410188152.9A CN105090902A (en) 2014-05-06 2014-05-06 Plastic lamp holder with mounting surface having isolation slot, and plastic bulb having same

Publications (1)

Publication Number Publication Date
CN105090902A true CN105090902A (en) 2015-11-25

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046142A (en) * 2001-08-01 2003-02-14 Sanyo Electric Co Ltd Light emitting device and support base used therefor
EP1887637A2 (en) * 2006-08-08 2008-02-13 LG Electronics Inc. Light emitting device package and method for manufacturing the same
CN102263194A (en) * 2011-04-13 2011-11-30 日月光半导体制造股份有限公司 Semiconductor packaging and method for manufacturing same
CN102767804A (en) * 2011-05-06 2012-11-07 奇想创造事业股份有限公司 Double-material plastic lamp seat for LED lamp bulb and lamp bulb component comprising double-material plastic lamp seat
TW201304217A (en) * 2011-07-08 2013-01-16 Advanced Optoelectronic Tech LED package and method for manufacturing the same
CN202708685U (en) * 2012-06-26 2013-01-30 元宏国际股份有限公司 Light-emitting diode (LED) bulb
CN103022332A (en) * 2012-11-29 2013-04-03 芜湖德豪润达光电科技有限公司 Flip-chip substrate and manufacturing method thereof as well as flip-chip-substrate-based LED (Light Emitting Diode) packaging structure
CN203454058U (en) * 2013-08-28 2014-02-26 四川海金汇光电有限公司 Radiating LED (light-emitting diode) road lamp
CN203453844U (en) * 2013-08-28 2014-02-26 四川海金汇光电有限公司 LED (light-emitting diode) lamp with refrigeration plate
CN203477978U (en) * 2013-09-29 2014-03-12 杭州纳晶照明技术有限公司 Led candle lamp

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046142A (en) * 2001-08-01 2003-02-14 Sanyo Electric Co Ltd Light emitting device and support base used therefor
EP1887637A2 (en) * 2006-08-08 2008-02-13 LG Electronics Inc. Light emitting device package and method for manufacturing the same
CN102263194A (en) * 2011-04-13 2011-11-30 日月光半导体制造股份有限公司 Semiconductor packaging and method for manufacturing same
CN102767804A (en) * 2011-05-06 2012-11-07 奇想创造事业股份有限公司 Double-material plastic lamp seat for LED lamp bulb and lamp bulb component comprising double-material plastic lamp seat
TW201304217A (en) * 2011-07-08 2013-01-16 Advanced Optoelectronic Tech LED package and method for manufacturing the same
CN202708685U (en) * 2012-06-26 2013-01-30 元宏国际股份有限公司 Light-emitting diode (LED) bulb
CN103022332A (en) * 2012-11-29 2013-04-03 芜湖德豪润达光电科技有限公司 Flip-chip substrate and manufacturing method thereof as well as flip-chip-substrate-based LED (Light Emitting Diode) packaging structure
CN203454058U (en) * 2013-08-28 2014-02-26 四川海金汇光电有限公司 Radiating LED (light-emitting diode) road lamp
CN203453844U (en) * 2013-08-28 2014-02-26 四川海金汇光电有限公司 LED (light-emitting diode) lamp with refrigeration plate
CN203477978U (en) * 2013-09-29 2014-03-12 杭州纳晶照明技术有限公司 Led candle lamp

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Application publication date: 20151125