CN105080996B - Manufacturing method of packaging material plate - Google Patents
Manufacturing method of packaging material plate Download PDFInfo
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- CN105080996B CN105080996B CN201410209701.6A CN201410209701A CN105080996B CN 105080996 B CN105080996 B CN 105080996B CN 201410209701 A CN201410209701 A CN 201410209701A CN 105080996 B CN105080996 B CN 105080996B
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Abstract
A manufacturing method of a packaging material plate includes the steps that mechanical peeling is conducted on the surface of a deposited round ingot, the two end faces of the deposited round ingot are flattened, the processed deposited round ingot is heated to 370-500 DEG C, and the temperature is kept for 2-6 h; according to the needed specification, an extrusion female die is assembled; after assembly, an extrusion male die and the extrusion female die are assembled on an extrusion machine, and the female die cannot move after being assembled; the dies and an ingot containing barrel are pre-heated as a whole and heated to 350-450 DEG C, and the temperature is kept for 12-18 h; hot extrusion is performed to form the plate, and the extrusion running speed of an extrusion rod is 0.5-2.5 mm/s; the extrusion ratio is 3-27; and the packaging material plate formed through extrusion is cooled to room temperature through air, and then common sawing discharging of the plate is performed. The method is simple in technology, and can achieve large-scale production and improve forming efficiency. Direct hot extrusion is conducted on the deposited round ingot to form the plate of the required specification, and therefore the material utilizing rate is greatly increased and the sampling efficiency is greatly improved; and by replacing hot isostatic pressing densification treatment with a hot extrusion procedure, structural densification is achieved, densification treatment cost is effectively reduced, and densification efficiency is improved.
Description
Technical field
The present invention relates to a kind of encapsulating material preparation of plates method is and in particular to a kind of al-si alloy package material flitch
The preparation method of material.
Background technology
Al-si alloy is a kind of more typical electronic package material of ratio, is widely used in encapsulating various electronic chips.Mesh
Before, the jet deposition preparation technology relative maturity of al-si alloy, its principle is to be carrier in nitrogen (or other inert gases etc.)
Atomizing under, al-si melt atomization is become small solid granulates and semisolid molten drop, and forms high-speed jet, jet
In particle and molten drop strike and energy conversion occurred on the sediment pan of high-speed rotation, deforms and sprawl, and cold with fast speed
But, solidification, stacking form al-si alloy deposition ingot.According to piling up theory, solid granulates and semisolid molten drop stacking deposit and shape
Space (hole) is inevitably defined in the al-si alloy deposition ingot becoming.In encapsulation product manufacture process, due to these
Space (hole) exists, drastically influence welding performance, coat of metal coating and the performance such as air-tightness of encapsulation product it is impossible to
The encapsulation meeting electronic devices and components requires.
Under normal circumstances, encapsulation product is block lid part, and in prior art, the processing technology of block lid part is: heavy
Densification (high temperature insostatic pressing (HIP)) the billet wire cutting that strips off the skin of long-pending billet becomes plate machining.This manufacturing process is mainly deposited
Manufacturing process is many, hip treatment equipment investment big, process that batch is many, efficiency is low, the defect of high cost；Billet wire cutting
Take plate sample, the process-cycle is long, and stock utilization is low, cause forming efficiency low, the deficiency such as manufacturing cost height.
Through looking into, relevant references have: Chinese invention patent " the low-density low bulk system of Patent No. zl03119606.3
Number high heat conductance silico-aluminum encapsulating material and preparation method " (Authorization Notice No. is cn1287449c)；Application No.
201110263931.7 Chinese invention patent application open " new-type high silicon aluminium alloy electronic package material and preparation method thereof "
(application publication number is cn10298485a)；A kind of open " the spray of the Chinese invention patent application of Application No. 201210058570.7
Penetrate the preparation technology of deposition si-al alloy electronic package material " (application publication number is cn102534321a).Above-mentioned patent document
Relate generally to the preparation method of encapsulating material and technique, be not directed to encapsulate preparation of plates method, document and patent needed for product
In the encapsulating material that is related to mainly adopt high temperature insostatic pressing (HIP)+wire cutting technology preparation encapsulation product slab, exist at high temperature insostatic pressing (HIP)
Manage the deficiencies such as efficiency is low, linear cutter man-hour length, stock utilization are low, manufacturing cost is high.Therefore how to improve material use
Rate, shortens forming process, reduces the process-cycle, reduces manufacturing cost, the always problem of those skilled in the art's urgent need to resolve.
Content of the invention
The technical problem to be solved be provide a kind of process is simple rationally, the package material flitch of low cost of manufacture
The preparation method of material, substantially increases the utilization rate of material, shortens manufacturing process.
The technical scheme that present invention solution above-mentioned technical problem is adopted is: a kind of encapsulating material preparation of plates method,
It is characterized in that comprising the following steps:
1) deposit billet machining: deposition billet surface carries out machinery and strips off the skin and piece flat deposition billet both ends of the surface, processing
Blank diameter ф 100mm～ф 250mm afterwards, blank height 300mm～800mm, deposition billet si component content 20～
40wt%, remaining composition is al；
2) deposition billet heating: by step 1) processing after deposition billet heated, heating-up temperature to 370 DEG C～500
DEG C, temperature retention time 2h～6h；
3) mould is equipped with: according to required sheet material specification, equipped Extruding die, will extrude punch and matrix and be equipped with after the completion of being equipped with
On extruder, wherein, die is irremovable after being equipped with；
4) mould and ingot-containing tube integrally preheat: then start extruder, move extruding punch and ingot-containing tube, after putting in place, close
Close extruder, open extruder heating system, heating-up temperature to 350 DEG C～450 DEG C, temperature retention time 12h～18h；
5) hot-pressed sheet material: open extruder, extruding punch and ingot-containing tube backhaul to initial position, extrude convex,
Lubricant is smeared in die operative end surface；Will be through step 2) the deposition billet after heating and thermal insulation loads in extruder ingot-containing tube, enters
Andante material is hot-pressed, and the pressure ram extruding speed of service is 0.5mm/s～2.5mm/s；Extrusion ratio is 3～27；Extruding completes
Afterwards, extruding punch and ingot-containing tube backhaul, to initial position, carry out discard shearing；
6) the common sawing of plate: the encapsulating material sheet material of above-mentioned extrusion molding is carried out being air cooled to after room temperature, according to
Dimensional requirement carries out the common sawing of plate.
As improvement, described step 3) in sheet material specification be plate thickness scope 5mm～20mm, width range 80～
300mm.
Improving again, described step 4) specific requirement of mobile extruding punch and ingot-containing tube is: extruding punch movement requirement is squeezed
Spacing between the operative end surface of pressure punch and matrix is not less than 15mm；Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.
Compared with prior art, it is an advantage of the current invention that: after the technology of the present invention, block lid part manufacturing process
Strip off the skin hot-pressed sheet metal plate sampling (common sawing) for: deposition billet, process is simple rationally, achievable scale
Produce, improve forming efficiency；Directly it is hot extruded into the sheet material of required specification by depositing Round Billet, substantially increase follow-up plate
The stock utilization of sampling operation and sampling efficiency；High temperature insostatic pressing (HIP) densification can be substituted by hot extrusion operation, realize
Dense structure, effectively reduces densification cost, improves efficiency of densification.
Brief description
Fig. 1 is al-27si encapsulating material extrusion plate microscopic structure in the embodiment of the present invention 1；
Al-40si encapsulating material extrusion plate microscopic structure in Fig. 2 embodiment of the present invention 2.
Specific embodiment
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
Embodiment 1
(1) deposit billet machining
Deposition billet surface carries out machinery and strips off the skin and piece flat deposition billet both ends of the surface.Blank diameter ф 180mm after processing,
Blank height 300mm, deposits billet si component content 27%, and remaining composition is al.
(2) deposition billet heating
Deposition billet after processing through step (1) is heated, and is incubated, temperature retention time 3h after being heated to 370 DEG C.
(3) mould is equipped with
According to required sheet material specification (15mm thickness, 150mm width), equipped Extruding die；Punch and matrix will be extruded after the completion of equipped
It is fitted on extruder, wherein, die is irremovable after being equipped with.
(4) mould and Sheng safety barrel integrally preheat.
After step (3), start extruder, move extruding punch and ingot-containing tube, extruding punch movement requirement extruding punch
The spacing and operative end surface of die between is not less than 15mm；Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.Close
Extruder, opens extruder heating system, is incubated, temperature retention time 12h after being heated to 400 DEG C.
(5) hot-pressed sheet material
After step (4) heating and insulation, open extruder, extruding punch and ingot-containing tube backhaul, to initial position, extrude
Lubricant is smeared in punch and matrix operative end surface.Extruder ingot-containing tube will be loaded through the deposition billet after step (2) heating and insulation
Interior, it is hot-pressed to carry out sheet material, and pressure ram extrudes speed of service 2.5mm/s；Extrusion ratio is 11.3.After the completion of extruding, extruding
Punch and ingot-containing tube backhaul, to initial position, carry out discard shearing.
(6) the common sawing of plate
Encapsulating material sheet material through step (5) extrusion molding is carried out being air cooled to after room temperature, andante is entered according to dimensional requirement
The common sawing of block.
Embodiment 2
(1) deposition billet strips off the skin
Deposition billet surface carries out machinery and strips off the skin and piece flat deposition billet both ends of the surface, the blank diameter ф 250mm after processing,
Blank height 500mm.Wherein, deposit billet si component content 40%, remaining composition is al.
(2) deposition billet heating
Deposition billet after processing through step (1) carries out heating-up temperature, 440 DEG C of heating-up temperature, is incubated to after temperature, insulation
Time 6h.
(3) mould is equipped with
According to required sheet material specification (20mm thickness, 250mm width), equipped Extruding die；Punch and matrix will be extruded after the completion of equipped
It is fitted on extruder, die is irremovable after being equipped with.
(4) mould and Sheng safety barrel integrally preheat
After step (3), start extruder, move extruding punch and ingot-containing tube, extruding punch movement requirement extruding punch
The spacing and operative end surface of die between is not less than 15mm；Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.Close
Extruder, opens extruder heating system, is incubated, temperature retention time 16h after being heated to 450 DEG C.
(5) hot-pressed sheet material
After step (4) heating and insulation, open extruder, extruding punch and ingot-containing tube backhaul, to initial position, extrude
Lubricant is smeared in punch and matrix operative end surface.Extruder ingot-containing tube will be loaded through the deposition billet after step (2) heating and insulation
Interior, it is hot-pressed to carry out sheet material, pressure ram speed of service 0.5mm/s；Extrusion ratio is 12.3.After the completion of extruding, extruding punch
With ingot-containing tube backhaul to initial position, carry out discard shearing.
(6) the common sawing of plate
Encapsulating material sheet material through step (5) extrusion molding is carried out being air cooled to after room temperature, according to the use of encapsulation product
Dimensional requirement carries out the common sawing of plate.
Embodiment 3
(1) deposition billet strips off the skin
Deposition billet surface carries out machinery and strips off the skin and piece flat deposition billet both ends of the surface, the blank diameter ф 250mm after processing,
Blank height 500mm.Wherein, deposit billet si component content 35%, remaining composition is al.
(2) deposition billet heating
Deposition billet after processing through step (1) carries out heating-up temperature, 400 DEG C of heating-up temperature, temperature retention time 6h.
(3) mould is equipped with
According to required sheet material specification (18mm thickness, 200mm width), equipped Extruding die；Punch and matrix will be extruded after the completion of equipped
It is fitted on extruder, die is irremovable after being equipped with.
(4) mould and Sheng safety barrel integrally preheat
After step (3), start extruder, move extruding punch and ingot-containing tube, extruding punch movement requirement extruding punch
The spacing and operative end surface of die between is away from not less than 15mm；Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.Close
Close extruder, open extruder heating system, be incubated after being heated to 430 DEG C, temperature retention time 16h.
(5) hot-pressed sheet material
After step (4) heating and insulation, open extruder, extruding punch and ingot-containing tube backhaul, to initial position, extrude
Lubricant is smeared in punch and matrix operative end surface.Extruder ingot-containing tube will be loaded through the deposition billet after step (2) heating and insulation
Interior, it is hot-pressed to carry out sheet material, pressure ram speed of service 1.5mm/s；Extrusion ratio is 13.6.After the completion of extruding, extruding punch
With ingot-containing tube backhaul to initial position, carry out discard shearing.
(6) the common sawing of plate
Encapsulating material sheet material through step (5) extrusion molding is carried out being air cooled to after room temperature, according to the use of encapsulation product
Dimensional requirement carries out the common sawing of plate.
Claims (3)
1. a kind of encapsulating material preparation of plates method is it is characterised in that comprise the following steps:
1) deposit billet machining: deposition billet surface carries out machinery and strips off the skin and piece flat deposition billet both ends of the surface, after processing
Blank diameter ф 100mm～ф 250mm, blank height 300mm～800mm, deposit billet si component content in 20～40wt%,
Remaining composition is al；
2) deposition billet heating: by step 1) processing after deposition billet heated, heating-up temperature to 370 DEG C～500 DEG C, protect
Warm time 2h～6h；
3) mould is equipped with: according to required sheet material specification, equipped Extruding die, is fitted in extruding punch and matrix crowded after the completion of being equipped with
On press, wherein, die is irremovable after being equipped with；
4) mould and ingot-containing tube integrally preheat: then start extruder, move extruding punch and ingot-containing tube, after putting in place, close and squeeze
Press, open extruder heating system, heating-up temperature to 350 DEG C～450 DEG C, temperature retention time 12h～18h；
5) hot-pressed sheet material: open extruder, extruding punch and ingot-containing tube backhaul, to initial position, are extruding punch and matrix
Lubricant is smeared on operative end surface, will be through step 2) the deposition billet after heating and thermal insulation loads in extruder ingot-containing tube, enters andante
Material is hot-pressed, and the pressure ram extruding speed of service is 0.5mm/s～2.5mm/s；Extrusion ratio is 3～27；After the completion of extruding, squeeze
Belling mould and ingot-containing tube backhaul, to initial position, carry out discard shearing；
6) the common sawing of plate: the encapsulating material sheet material of above-mentioned extrusion molding is carried out being air cooled to after room temperature, according to size
Requirement carries out the common sawing of plate.
2. preparation method according to claim 1 it is characterised in that: described step 3) in sheet material specification be plate thickness model
Enclose 5mm～20mm, width range 80～300mm.
3. preparation method according to claim 1 it is characterised in that: described step 4) mobile extruding punch and ingot-containing tube
Specific requirement is: the spacing that extruding punch movement requirement extrudes between the operative end surface of punch and matrix is not less than 15mm；Ingot-containing tube moves
Dynamic requirement extruding punch and matrix is in ingot-containing tube.
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| CN201410209701.6A CN105080996B (en) | 2014-05-16 | 2014-05-16 | Manufacturing method of packaging material plate |
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| CN201410209701.6A CN105080996B (en) | 2014-05-16 | 2014-05-16 | Manufacturing method of packaging material plate |
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| CN105080996B true CN105080996B (en) | 2017-01-18 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0790459A (en) * | 1993-09-17 | 1995-04-04 | Mitsubishi Alum Co Ltd | Production of wear resistant aluminum alloy for extrusion and wear resistant aluminum alloy material |
| CN1530455A (en) * | 2003-03-14 | 2004-09-22 | 北京有色金属研究总院 | Ultrahigh-strength high toughness aluminium alloy material and preparing method |
| CN101280376A (en) * | 2008-05-21 | 2008-10-08 | 同济大学 | High-wear-resistant zinc-aluminum alloy and preparation thereof |
| CN101457318A (en) * | 2008-12-20 | 2009-06-17 | 中国兵器工业第五二研究所 | High-silicon aluminum alloy cylinder sleeve material and preparation method thereof |
| CN101713057A (en) * | 2009-11-24 | 2010-05-26 | 北京有色金属研究总院 | Process used for spray forming Si-Al alloy solid-liquid two-phase region hot working molding encapsulating parts |
| CN102397905A (en) * | 2011-11-25 | 2012-04-04 | 沈阳工业大学 | Hot extrusion forming method for hypereutectic Al-Si alloy |
-
2014
- 2014-05-16 CN CN201410209701.6A patent/CN105080996B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0790459A (en) * | 1993-09-17 | 1995-04-04 | Mitsubishi Alum Co Ltd | Production of wear resistant aluminum alloy for extrusion and wear resistant aluminum alloy material |
| CN1530455A (en) * | 2003-03-14 | 2004-09-22 | 北京有色金属研究总院 | Ultrahigh-strength high toughness aluminium alloy material and preparing method |
| CN101280376A (en) * | 2008-05-21 | 2008-10-08 | 同济大学 | High-wear-resistant zinc-aluminum alloy and preparation thereof |
| CN101457318A (en) * | 2008-12-20 | 2009-06-17 | 中国兵器工业第五二研究所 | High-silicon aluminum alloy cylinder sleeve material and preparation method thereof |
| CN101713057A (en) * | 2009-11-24 | 2010-05-26 | 北京有色金属研究总院 | Process used for spray forming Si-Al alloy solid-liquid two-phase region hot working molding encapsulating parts |
| CN102397905A (en) * | 2011-11-25 | 2012-04-04 | 沈阳工业大学 | Hot extrusion forming method for hypereutectic Al-Si alloy |
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Effective date of registration: 20170316 Address after: 315103 Zhejiang city of Ningbo province high tech Zone Lingyun Road No. 199 Patentee after: The Ningbo Branch of Ordnance Science Institute of China Patentee after: NO.52 Institute of China North Industries Group Corp. Address before: 315103 Ningbo science and Technology Park, Zhejiang Lingyun Road, No. 199 Patentee before: NO.52 Institute of China North Industries Group Corp. |