CN105080996A - Manufacturing method of packaging material plate - Google Patents
Manufacturing method of packaging material plate Download PDFInfo
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- CN105080996A CN105080996A CN201410209701.6A CN201410209701A CN105080996A CN 105080996 A CN105080996 A CN 105080996A CN 201410209701 A CN201410209701 A CN 201410209701A CN 105080996 A CN105080996 A CN 105080996A
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Abstract
A manufacturing method of a packaging material plate includes the steps that mechanical peeling is conducted on the surface of a deposited round ingot, the two end faces of the deposited round ingot are flattened, the processed deposited round ingot is heated to 370-500 DEG C, and the temperature is kept for 2-6 h; according to the needed specification, an extrusion female die is assembled; after assembly, an extrusion male die and the extrusion female die are assembled on an extrusion machine, and the female die cannot move after being assembled; the dies and an ingot containing barrel are pre-heated as a whole and heated to 350-450 DEG C, and the temperature is kept for 12-18 h; hot extrusion is performed to form the plate, and the extrusion running speed of an extrusion rod is 0.5-2.5 mm/s; the extrusion ratio is 3-27; and the packaging material plate formed through extrusion is cooled to room temperature through air, and then common sawing discharging of the plate is performed. The method is simple in technology, and can achieve large-scale production and improve forming efficiency. Direct hot extrusion is conducted on the deposited round ingot to form the plate of the required specification, and therefore the material utilizing rate is greatly increased and the sampling efficiency is greatly improved; and by replacing hot isostatic pressing densification treatment with a hot extrusion procedure, structural densification is achieved, densification treatment cost is effectively reduced, and densification efficiency is improved.
Description
Technical field
The present invention relates to a kind of encapsulating material preparation of plates method, be specifically related to a kind of Al-Si alloy encapsulating material preparation of plates method
Background technology
Al-Si alloy is the more typical electronic package material of one, is widely used in encapsulating various electronic chip.At present, the jet deposition preparation technology relative maturity of Al-Si alloy, its principle is under the atomizing of carrier at nitrogen (or other inert gases etc.), Al-Si melt is atomized into small solid granulates and semisolid molten drop, and form high-speed jet, there is power conversion in the sediment pan that the particle in jet and molten drop strike High Rotation Speed, be out of shape and sprawl, and cool with fast speed, solidify, stacking forms Al-Si alloy deposition ingot.Theoretical according to accumulation, inevitably define space (hole) in the Al-Si alloy deposition ingot that solid granulates and semisolid molten drop stacking deposit and formed.In encapsulation product manufacture process, because these spaces (hole) exists, drastically influence the performances such as the welding performance of encapsulation product, coat of metal coating and air-tightness, the encapsulation requirement of electronic devices and components cannot be met.
Under normal circumstances, encapsulation product is block lid part, and in prior art, the processing technology of block lid part is: deposition billet-densification (the high temperature insostatic pressing (HIP))-billet Linear cut that strips off the skin becomes plate-machining.This manufacturing process mainly exists that manufacturing process is many, hip treatment equipment investment is large, more than process batch, efficiency is low, cost is high defect; Billet Linear cut gets plate sample, and the process-cycle is long, and stock utilization is low, causes forming efficiency low, the high deficiency of manufacturing cost.
Through looking into, relevant references has: the patent No. is Chinese invention patent " low-density low-expansion coefficient high heat conductance silico-aluminum encapsulating material and preparation method " (Authorization Notice No. is CN1287449C) of ZL03119606.3; Application number is open " new-type high silicon aluminium alloy electronic package material and preparation method thereof " (application publication number is CN10298485A) of Chinese invention patent application of 201110263931.7; Application number is open " a kind of preparation technology of Si-Al alloy electronic packaging material by spray deposition " (application publication number is CN102534321A) of Chinese invention patent application of 201210058570.7.Above-mentioned patent document relate generally to encapsulating material preparation method and technique, do not relate to encapsulation product needed for preparation of plates method, the encapsulating material related in document and patent mainly adopts high temperature insostatic pressing (HIP)+wire cutting technology preparation encapsulation product slab, has that hip treatment efficiency is low, linear cutter man-hour is long, stock utilization is low, the high deficiency of manufacturing cost.Therefore how to improve stock utilization, shorten forming process, reduce the process-cycle, reduce manufacturing cost, be the problem that those skilled in the art need solution badly always.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of encapsulating material preparation of plates method of technique advantages of simple, low cost of manufacture, substantially increases the utilization rate of material, shortens manufacturing process.
The present invention solves the problems of the technologies described above adopted technical scheme: a kind of encapsulating material preparation of plates method, is characterized in that comprising the following steps:
1) billet machining is deposited: deposition billet surface is carried out machinery and stripped off the skin and sheet flat deposition billet both ends of the surface, blank diameter Ф 100mm ~ Ф 250mm after processing, blank height 300mm ~ 800mm, deposition billet Si component content is at 20 ~ 40wt%, and all the other compositions are Al;
2) billet heating is deposited: by step 1) deposition billet after processing heats, heating-up temperature to 370 DEG C ~ 500 DEG C, temperature retention time 2h ~ 6h;
3) mould is equipped with: according to required sheet material specification, and equipped Extruding die, is fitted on extruder by extruding punch and matrix after being equipped with, wherein, irremovable after die is equipped;
4) the overall preheating of mould and ingot-containing tube: then start extruder, mobile extruding punch and ingot-containing tube, after putting in place, close extruder, open extruder heating system, heating-up temperature to 350 DEG C ~ 450 DEG C, temperature retention time 12h ~ 18h;
5) hot-pressed sheet material: open extruder, extruding punch and ingot-containing tube backhaul, to initial position, extruding punch and matrix operative end surface smear lubricant; Will through step 2) deposition billet after heating and thermal insulation loads in extruder ingot-containing tube, and it is hot-pressed to carry out sheet material, and the pressure ram extruding speed of service is 0.5mm/s ~ 2.5mm/s; Extrusion ratio is 3 ~ 27; After having extruded, extruding punch and ingot-containing tube backhaul, to initial position, are carried out pressing remaining shearing;
6) the common sawing of plate: after the encapsulating material sheet material of above-mentioned extrusion molding is carried out air cooling to room temperature, carry out the common sawing of plate according to dimensional requirement.
As improvement, described step 3) in sheet material specification be plate thickness scope 5mm ~ 20mm, width range 80 ~ 300mm.
Improving again, described step 4) specific requirement of mobile extruding punch and ingot-containing tube is: the spacing between the operative end surface of extruding punch movement requirement extruding punch and matrix is not less than 15mm; Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.
Compared with prior art, the invention has the advantages that: after adopting the technology of the present invention, block lid part manufacturing process is: deposit billet to strip off the skin-hot-pressed sheet material-plate sampling (common sawing), technique advantages of simple, can accomplish scale production, improve forming efficiency; Directly be hot extruded into the sheet material of required specification by deposition Round Billet, substantially increase stock utilization and the sampling efficiency of follow-up plate sampleman sequence; High temperature insostatic pressing (HIP) densification can be substituted by hot extrusion operation, realize dense structure, effectively reduce densification cost, improve efficiency of densification.
Accompanying drawing explanation
Fig. 1 is Al-27Si encapsulating material extrusion plate microscopic structure in the embodiment of the present invention 1;
Al-40Si encapsulating material extrusion plate microscopic structure in Fig. 2 embodiment of the present invention 2.
Detailed description of the invention
Below in conjunction with accompanying drawing embodiment, the present invention is described in further detail.
Embodiment 1
(1) billet machining is deposited
Deposition billet surface is carried out machinery and is stripped off the skin and sheet flat deposition billet both ends of the surface.Blank diameter Ф 180mm after processing, blank height 300mm, deposition billet Si component content 27%, all the other compositions are Al.
(2) billet heating is deposited
Deposition billet after step (1) process heats, and is incubated, temperature retention time 3h after being heated to 370 DEG C.
(3) mould is equipped with
According to required sheet material specification (15mm is thick, 150mm is wide), equipped Extruding die; After being equipped with, extruding punch and matrix is fitted on extruder, wherein, irremovable after die is equipped.
(4) mould and the overall preheating of Sheng safety barrel.
After step (3), start extruder, mobile extruding punch and ingot-containing tube, the spacing between extruding punch movement requirement extruding punch and the operative end surface of die is not less than 15mm; Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.Close extruder, open extruder heating system, be incubated after being heated to 400 DEG C, temperature retention time 12h.
(5) hot-pressed sheet material
After step (4) heating and insulation, open extruder, extruding punch and ingot-containing tube backhaul, to initial position, extruding punch and matrix operative end surface smear lubricant.Loaded in extruder ingot-containing tube by deposition billet after step (2) heating and insulation, it is hot-pressed to carry out sheet material, pressure ram extruding speed of service 2.5mm/s; Extrusion ratio is 11.3.After having extruded, extruding punch and ingot-containing tube backhaul, to initial position, are carried out pressing remaining shearing.
(6) the common sawing of plate
After carrying out air cooling to room temperature through the encapsulating material sheet material of step (5) extrusion molding, carry out the common sawing of plate according to dimensional requirement.
Embodiment 2
(1) deposit billet to strip off the skin
Deposition billet surface is carried out machinery and is stripped off the skin and sheet flat deposition billet both ends of the surface, the blank diameter Ф 250mm after processing, blank height 500mm.Wherein, deposition billet Si component content 40%, all the other compositions are Al.
(2) billet heating is deposited
Deposition billet after step (1) process carries out heating-up temperature, and heating-up temperature 440 DEG C, is incubated, temperature retention time 6h after temperature.
(3) mould is equipped with
According to required sheet material specification (20mm is thick, 250mm is wide), equipped Extruding die; After being equipped with, extruding punch and matrix is fitted on extruder, irremovable after die is equipped.
(4) mould and the overall preheating of Sheng safety barrel
After step (3), start extruder, mobile extruding punch and ingot-containing tube, the spacing between extruding punch movement requirement extruding punch and the operative end surface of die is not less than 15mm; Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.Close extruder, open extruder heating system, be incubated after being heated to 450 DEG C, temperature retention time 16h.
(5) hot-pressed sheet material
After step (4) heating and insulation, open extruder, extruding punch and ingot-containing tube backhaul, to initial position, extruding punch and matrix operative end surface smear lubricant.Loaded in extruder ingot-containing tube by deposition billet after step (2) heating and insulation, it is hot-pressed to carry out sheet material, pressure ram speed of service 0.5mm/s; Extrusion ratio is 12.3.After having extruded, extruding punch and ingot-containing tube backhaul, to initial position, are carried out pressing remaining shearing.
(6) the common sawing of plate
After carrying out air cooling to room temperature through the encapsulating material sheet material of step (5) extrusion molding, the use dimensional requirement according to encapsulation product carries out the common sawing of plate.
Embodiment 3
(1) deposit billet to strip off the skin
Deposition billet surface is carried out machinery and is stripped off the skin and sheet flat deposition billet both ends of the surface, the blank diameter Ф 250mm after processing, blank height 500mm.Wherein, deposition billet Si component content 35%, all the other compositions are Al.
(2) billet heating is deposited
Deposition billet after step (1) process carries out heating-up temperature, heating-up temperature 400 DEG C, temperature retention time 6h.
(3) mould is equipped with
According to required sheet material specification (18mm is thick, 200mm is wide), equipped Extruding die; After being equipped with, extruding punch and matrix is fitted on extruder, irremovable after die is equipped.
(4) mould and the overall preheating of Sheng safety barrel
After step (3), start extruder, mobile extruding punch and ingot-containing tube, the spacing between extruding punch movement requirement extruding punch and the operative end surface of die is apart from being not less than 15mm; Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.Close extruder, open extruder heating system, be incubated after being heated to 430 DEG C, temperature retention time 16h.
(5) hot-pressed sheet material
After step (4) heating and insulation, open extruder, extruding punch and ingot-containing tube backhaul, to initial position, extruding punch and matrix operative end surface smear lubricant.Loaded in extruder ingot-containing tube by deposition billet after step (2) heating and insulation, it is hot-pressed to carry out sheet material, pressure ram speed of service 1.5mm/s; Extrusion ratio is 13.6.After having extruded, extruding punch and ingot-containing tube backhaul, to initial position, are carried out pressing remaining shearing.
(6) the common sawing of plate
After carrying out air cooling to room temperature through the encapsulating material sheet material of step (5) extrusion molding, the use dimensional requirement according to encapsulation product carries out the common sawing of plate.
Claims (3)
1. an encapsulating material preparation of plates method, is characterized in that comprising the following steps:
1) billet machining is deposited: deposition billet surface is carried out machinery and stripped off the skin and sheet flat deposition billet both ends of the surface, blank diameter Ф 100mm ~ Ф 250mm after processing, blank height 300mm ~ 800mm, deposition billet Si component content is at 20 ~ 40wt%, and all the other compositions are Al;
2) billet heating is deposited: by step 1) deposition billet after processing heats, heating-up temperature to 370 DEG C ~ 500 DEG C, temperature retention time 2h ~ 6h;
3) mould is equipped with: according to required sheet material specification, and equipped Extruding die, is fitted on extruder by extruding punch and matrix after being equipped with, wherein, irremovable after die is equipped;
4) the overall preheating of mould and ingot-containing tube: then start extruder, mobile extruding punch and ingot-containing tube, after putting in place, close extruder, open extruder heating system, heating-up temperature to 350 DEG C ~ 450 DEG C, temperature retention time 12h ~ 18h;
5) hot-pressed sheet material: open extruder, extruding punch and ingot-containing tube backhaul are to initial position, extruding punch and matrix operative end surface smears lubricant, will through step 2) deposition billet after heating and thermal insulation loads in extruder ingot-containing tube, carry out sheet material hot-pressed, the pressure ram extruding speed of service is 0.5mm/s ~ 2.5mm/s; Extrusion ratio is 3 ~ 27; After having extruded, extruding punch and ingot-containing tube backhaul, to initial position, are carried out pressing remaining shearing;
6) the common sawing of plate: after the encapsulating material sheet material of above-mentioned extrusion molding is carried out air cooling to room temperature, carry out the common sawing of plate according to dimensional requirement.
2. preparation method according to claim 1, is characterized in that: described step 3) in sheet material specification be plate thickness scope 5mm ~ 20mm, width range 80 ~ 300mm.
3. preparation method according to claim 1, is characterized in that: described step 4) specific requirement of mobile extruding punch and ingot-containing tube is: the spacing between the operative end surface of extruding punch movement requirement extruding punch and matrix is not less than 15mm; Ingot-containing tube movement requirement extruding punch and matrix is in ingot-containing tube.
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| CN201410209701.6A CN105080996B (en) | 2014-05-16 | 2014-05-16 | Manufacturing method of packaging material plate |
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| CN201410209701.6A CN105080996B (en) | 2014-05-16 | 2014-05-16 | Manufacturing method of packaging material plate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0790459A (en) * | 1993-09-17 | 1995-04-04 | Mitsubishi Alum Co Ltd | Production of wear resistant aluminum alloy for extrusion and wear resistant aluminum alloy material |
| CN1530455A (en) * | 2003-03-14 | 2004-09-22 | 北京有色金属研究总院 | Ultrahigh-strength high toughness aluminium alloy material and preparing method |
| CN101280376A (en) * | 2008-05-21 | 2008-10-08 | 同济大学 | High-wear-resistant zinc-aluminum alloy and preparation thereof |
| CN101457318A (en) * | 2008-12-20 | 2009-06-17 | 中国兵器工业第五二研究所 | High-silicon aluminum alloy cylinder sleeve material and preparation method thereof |
| CN101713057A (en) * | 2009-11-24 | 2010-05-26 | 北京有色金属研究总院 | Process used for spray forming Si-Al alloy solid-liquid two-phase region hot working molding encapsulating parts |
| CN102397905A (en) * | 2011-11-25 | 2012-04-04 | 沈阳工业大学 | Hot extrusion forming method for hypereutectic Al-Si alloy |
-
2014
- 2014-05-16 CN CN201410209701.6A patent/CN105080996B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0790459A (en) * | 1993-09-17 | 1995-04-04 | Mitsubishi Alum Co Ltd | Production of wear resistant aluminum alloy for extrusion and wear resistant aluminum alloy material |
| CN1530455A (en) * | 2003-03-14 | 2004-09-22 | 北京有色金属研究总院 | Ultrahigh-strength high toughness aluminium alloy material and preparing method |
| CN101280376A (en) * | 2008-05-21 | 2008-10-08 | 同济大学 | High-wear-resistant zinc-aluminum alloy and preparation thereof |
| CN101457318A (en) * | 2008-12-20 | 2009-06-17 | 中国兵器工业第五二研究所 | High-silicon aluminum alloy cylinder sleeve material and preparation method thereof |
| CN101713057A (en) * | 2009-11-24 | 2010-05-26 | 北京有色金属研究总院 | Process used for spray forming Si-Al alloy solid-liquid two-phase region hot working molding encapsulating parts |
| CN102397905A (en) * | 2011-11-25 | 2012-04-04 | 沈阳工业大学 | Hot extrusion forming method for hypereutectic Al-Si alloy |
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Effective date of registration: 20170316 Address after: 315103 Zhejiang city of Ningbo province high tech Zone Lingyun Road No. 199 Patentee after: The Ningbo Branch of Ordnance Science Institute of China Patentee after: NO.52 Institute of China North Industries Group Corp. Address before: 315103 Ningbo science and Technology Park, Zhejiang Lingyun Road, No. 199 Patentee before: NO.52 Institute of China North Industries Group Corp. |