CN105068244B - A method of the resolution ratio realized by DMD splicings improves - Google Patents
A method of the resolution ratio realized by DMD splicings improves Download PDFInfo
- Publication number
- CN105068244B CN105068244B CN201510517575.5A CN201510517575A CN105068244B CN 105068244 B CN105068244 B CN 105068244B CN 201510517575 A CN201510517575 A CN 201510517575A CN 105068244 B CN105068244 B CN 105068244B
- Authority
- CN
- China
- Prior art keywords
- fixed station
- chips
- dmd1
- dmd
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000006073 displacement reaction Methods 0.000 claims abstract description 5
- 238000003709 image segmentation Methods 0.000 claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims abstract description 4
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 6
- 239000000686 essence Substances 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012938 design process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Image Processing (AREA)
Abstract
A method of the resolution ratio realized by DMD splicings improves.The invention belongs to improve the technical field of DMD resolution ratio.The image of 4k × 4k is divided into 4k × 2k, 4k × 2k two parts by its method and step one by the method for image segmentation on computers;Two, DMD1 chips are placed on the rail plate on the bottom fixed station of the double-deck fixed station, DMD2 chips fixed placement is on the upper layer fixed station of the double-deck fixed station;Three, DMD is controlled after chip handled above-mentioned two parts picture signal, will be in the image difference simultaneous transmission to DMD1 chips and DMD2 chips of above-mentioned two parts 4K × 2K;Four, DMD1 chip pixels and DMD2 chip pixels are imaged by high resolution CCD camera, DMD1 chips can be driven to do by exact position mobile platform again to do precision parallel displacement relative to the bottom fixed station table top of the double-deck fixed station, the distance between DMD1 chip edges pixel and DMD2 chip edge pixels is made to reach nominal value.The present invention can be realized two pieces of dmd chips as seamless spliced, increase substantially the resolution ratio of dmd chip.
Description
Technical field
The invention belongs to improve the technical field of DMD resolution ratio.
Background technology
The development of modern science and technology has higher requirement to optical Information Processing method.Original various modulators
Oneself cannot meet the requirements warp, and energy two dimension input in real time, the sensor exported come into being, and here it is spatial light modulators.
Digital Micromirror Device(DMD)It is a kind of new spatial optical modulator of total digitalization, it is existed using pin sputtering technology
Semiconductor silicon on piece forms two-dimensional array.Each micromirror is equivalent to a pixel in projected picture, each micro mirror
Piece can free deflection, micromirror deflects different deflection angles, just will present different states.Therefore, pass through each micro mirror
The deflection angle of piece controls the reflection of light, and then realizes the real-time display of image.However the raising of the resolution ratio of DMD is added
The limitation of the technique of work.In the design process of the target simulator based on dmd chip, when our required target essences to be simulated
The resolution ratio limitation that can be provided instantly if more than DMD is spent, if relying solely on the promotion of processing technology so that DMD resolution ratio carries
It is high then need wait for long time.
Break through spatial light modulator(DMD)The limitation of resolution ratio is not natively nothing the matter, high-resolution space tune
The raising of target simulator simulation precision may be implemented in device processed, and application value is very big.
Invention content
The object of the present invention is to provide a kind of methods that the resolution ratio realized by DMD splicings improves, and are to solve
When the resolution ratio limitation that the aimed at precision of simulation can be provided instantly if more than DMD, existing makes by the promotion of processing technology
DMD resolution ratio raising then need wait for some time the problem of.
The purpose is realized by following scheme:A kind of resolution ratio realized by DMD splicings improves
Method, its method and step is:
Step 1: the image of 4k × 4k is divided into 4k × 2k, 4k × 2k two by the method for image segmentation on computers
Part;
Step 2: DMD1 chips are placed on the rail plate on the bottom fixed station of the double-deck fixed station 1, DMD2 chips
Fixed placement is on the upper layer fixed station of the double-deck fixed station 1;The double-deck fixed station 1 is mounted on the mobile platform of exact position, makes essence
True position mobile platform can drive DMD1 chips to do and do precision parallel position relative to the bottom fixed station table top of the double-deck fixed station 1
It moves;
Step 3: the synchronous hair after by a synchronous trigger output signal triggering of two parts picture signal in computer
Be sent to DMD control chip in, DMD control chip above-mentioned two parts picture signal is handled after, by above-mentioned two parts 4K ×
In the image difference simultaneous transmission to DMD1 chips and DMD2 chips of 2K;
Step 4: DMD1 chip pixels and DMD2 chip pixels are imaged by high resolution CCD camera, then by accurate
Position mobile platform can drive DMD1 chips to do and do precision parallel displacement relative to the bottom fixed station table top of the double-deck fixed station 1,
So that the distance between DMD1 chip edges pixel and DMD2 chip edge pixels is reached nominal value, then uses vacuum glue by DMD1
Chip is fixed with the double-deck fixed station 1.
The present invention can be realized two pieces of dmd chips as seamless spliced, increased substantially the resolution ratio of dmd chip, can be made
Spatial light modulator breaks through the raising of the limitation realization resolution ratio of R&D cycle, can also cannot purchase height due to the limitation of funds
When the spatial light modulator of resolution ratio, the splicing of the space light modulation of low resolution is realized using this method, to reach higher
Resolution ratio.From the angle of industry, after the raising of dmd chip resolution ratio, the mesh of higher resolution can be made accordingly
Simulator is marked, to reach the breakthrough of matter in the key technology of half target simulator in kind.Moreover, with traditional splicing
It distinguishes, the obtained material object of this method does not need additional physical space, therefore obtained target simulator in kind is not
King-sized physical space can be occupied.From the perspective of business, this method can be used for making the projection device of higher precision,
High degree is promoted to the development of projection industry, it will bring huge economic benefit.
Description of the drawings
Fig. 1 is the double-deck fixed station 1, DMD1 chips and the DMD2 relative position structural schematic diagrams involved in the method for the present invention.
Specific implementation mode
Specific implementation mode one:In conjunction with shown in Fig. 1, illustrate the technical solution of present embodiment, its method and step is:
Step 1: the image of 4k × 4k is divided into 4k × 2k, 4k × 2k two by the method for image segmentation on computers
Part;
Step 2: DMD1 chips are placed on the rail plate on the bottom fixed station of the double-deck fixed station 1, DMD2 chips
Fixed placement is on the upper layer fixed station of the double-deck fixed station 1;The double-deck fixed station 1 is mounted on the mobile platform of exact position, makes essence
True position mobile platform can drive DMD1 chips to do and do precision parallel position relative to the bottom fixed station table top of the double-deck fixed station 1
It moves;
Step 3: the synchronous hair after by a synchronous trigger output signal triggering of two parts picture signal in computer
Be sent to DMD control chip in, DMD control chip above-mentioned two parts picture signal is handled after, by above-mentioned two parts 4K ×
In the image difference simultaneous transmission to DMD1 chips and DMD2 chips of 2K;
Step 4: DMD1 chip pixels and DMD2 chip pixels are imaged by high resolution CCD camera, then by accurate
Position mobile platform can drive DMD1 chips to do and do precision parallel displacement relative to the bottom fixed station table top of the double-deck fixed station 1,
So that the distance between DMD1 chip edges pixel and DMD2 chip edge pixels is reached nominal value, then uses vacuum glue by DMD1
Chip is fixed with the double-deck fixed station 1.
Operation principle:Analog simulation computer provides a secondary high-definition picture to DMD drive modules(4K×4K), the figure
The resolution ratio of picture is higher than the eigenresolution of DMD(4K×2K), the image of 4k × 4k is passed through into image segmentation on computers
Method be divided into 4k × 2k, 4k × 2k two parts, by DMD control chip processing make two pieces of dmd chips show original respectively
The half of image makes two pieces of dmd chips work at the same time by DMD drive modules, and microlens array is overturn simultaneously.Simultaneously
LED drive module drives two parts lighting system to start to work, and is illuminated through lighting system after DMD overturnings and generates image, two pieces of DMD
After precision machinery splicing part, edge is closely coupled to be connect, and precision is within a pixel.Behind optical compensation part,
Two DMD epigraphs obtain optical path compensation, complete entire splicing after collimating optical system later.Entire splicing
After completion, spliced image is imaged in CCD camera, and CCD camera shares the same trigger signal with DMD control chips,
While DMD control chips transmit image, CCD camera starts to receive image.It is finally by splicing inspection module judgement
Splicing effect splices successful image and not will produce gap, really seamless spliced to realize.
In specifically used, since two pieces of DMD spatially have mistake by formed after precision machinery splicing part
The relationship of position, i.e., the optical path difference of two pieces DMD to collimating optical systems below is different, therefore can influence follow-up image quality.This
Place's addition optical compensation module is exactly to cut down optical path difference.Optical compensation module cuts away wherein one by one flat plate K9 glass
Get, the thickness and size of monoblock K9 glass are the relationships spatially agreed with mutually with mechanical splice part.Specific design
It processes obtained thickness and chooses mathematical computations that are related, therefore not carrying out here with corresponding DMD.Image passes through optics
To be in parallel light emergence by collimating optical system after compensating module.The parameter needs of collimating optical system are wanted according to design
It asks, and specific DMD selections could be designed accordingly.
Claims (1)
1. a kind of method that the resolution ratio realized by DMD splicings improves, it is characterised in that its method and step is:
Step 1: the image of 4k × 4k is divided into 4k × 2k, 4k × 2k two parts by the method for image segmentation on computers;
Step 2: DMD1 chips are placed on the double-deck fixed station(1)Bottom fixed station on rail plate on, DMD2 chips are solid
Surely it is placed on the double-deck fixed station(1)Upper layer fixed station on;The double-deck fixed station(1)It is mounted on the mobile platform of exact position, makes
Exact position mobile platform can drive DMD1 chips to do relative to the double-deck fixed station(1)Bottom fixed station table top do precision parallel
Displacement;
Step 3: two parts picture signal in computer is simultaneously sent to after by a synchronous trigger output signal triggering
DMD is controlled in chip, after DMD control chips are handled above-mentioned two parts picture signal, by above-mentioned two parts 4K × 2K's
Image is distinguished in simultaneous transmission to DMD1 chips and DMD2 chips;
Step 4: being imaged to DMD1 chip pixels and DMD2 chip pixels by high resolution CCD camera, then pass through exact position
Mobile platform can drive DMD1 chips to do relative to the double-deck fixed station(1)Bottom fixed station table top do precision parallel displacement, make
The distance between DMD1 chip edges pixel and DMD2 chip edge pixels reach nominal value, then use vacuum glue by DMD1 cores
Piece and the double-deck fixed station(1)It is fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510517575.5A CN105068244B (en) | 2015-08-22 | 2015-08-22 | A method of the resolution ratio realized by DMD splicings improves |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510517575.5A CN105068244B (en) | 2015-08-22 | 2015-08-22 | A method of the resolution ratio realized by DMD splicings improves |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105068244A CN105068244A (en) | 2015-11-18 |
CN105068244B true CN105068244B (en) | 2018-09-07 |
Family
ID=54497650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510517575.5A Expired - Fee Related CN105068244B (en) | 2015-08-22 | 2015-08-22 | A method of the resolution ratio realized by DMD splicings improves |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105068244B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106412536A (en) * | 2016-09-29 | 2017-02-15 | 西安中科晶像光电科技有限公司 | System for realizing high-resolution projection display through DMD chip splicing |
CN108881873B (en) * | 2018-07-31 | 2019-12-17 | 杭州一隅千象科技有限公司 | Method, device and system for fusing high-resolution images |
CN112484857B (en) * | 2020-11-04 | 2023-04-07 | 西北工业大学宁波研究院 | Spectral imaging system and method based on DMD |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1210649B1 (en) * | 2000-03-31 | 2011-03-02 | Imax Corporation | Digital projection equipment and techniques |
CN204256356U (en) * | 2014-09-09 | 2015-04-08 | 宁波蓝科电子工程有限公司 | A kind of DLP high definition rear-projection 0 physics piece combination screen |
CN204418506U (en) * | 2014-12-31 | 2015-06-24 | 无锡贝斯特精机股份有限公司 | Can quick position splicing truss |
CN104570331A (en) * | 2015-01-31 | 2015-04-29 | 哈尔滨工业大学 | Method for improving resolution of DMD (digital micro-mirror device) by means of optical assembling |
-
2015
- 2015-08-22 CN CN201510517575.5A patent/CN105068244B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN105068244A (en) | 2015-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI592678B (en) | Solid state lidar circuit | |
US10884343B2 (en) | System and method for micro-nano machining by femtosecond laser two-photon polymerization | |
JP5737647B2 (en) | Optical sheet laminating method | |
CN105068244B (en) | A method of the resolution ratio realized by DMD splicings improves | |
CN104570331A (en) | Method for improving resolution of DMD (digital micro-mirror device) by means of optical assembling | |
CN101807012B (en) | Automatic focus light path structure of direct-write lithography machine | |
CN104515773A (en) | Systems and methods for measuring physical characteristics of semiconductor device elements using structured light | |
CN104093547A (en) | 3d printing system | |
CN103048862A (en) | DLP (digital light projector) micro projector and projection method thereof | |
CN107331643B (en) | Alignment device and method thereof | |
CN108062005B (en) | Splicing improvement method of direct-writing type silk screen plate making system | |
CN104950587A (en) | Exposure device and exposure method | |
CN102890430B (en) | A kind of device and method directly writing exposure machine adjustment plane of exposure Power uniformity | |
CN102573308A (en) | Correction method of graphic splicing errors of printed circuit board (PCB) | |
CN110244516A (en) | A kind of big field stitching formula exposure machine | |
CN102445861A (en) | Photoetching machine system with position triggered scanning mode and method thereof | |
CN106363909B (en) | A kind of optical projection system for realizing large scale photocuring 3D printing | |
WO2023279810A1 (en) | Welding apparatus and welding method using same | |
WO2024065381A1 (en) | Microthree-dimensional printing device | |
CN207965475U (en) | A kind of big field stitching formula exposure machine | |
CN108152985B (en) | Optical imaging system and target simulation system | |
CN202886840U (en) | Device for making mask plate | |
CN103028842B (en) | Device and method for processing laser direct imaging | |
US9864265B2 (en) | Multi-prism mechanism for laser exposure system of 3D images and method thereof | |
CN203076787U (en) | Processing device by using laser direct imaging technology |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180907 |
|
CF01 | Termination of patent right due to non-payment of annual fee |