CN105068244A - Resolution enhancement method realized through DMD splicing - Google Patents

Resolution enhancement method realized through DMD splicing Download PDF

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CN105068244A
CN105068244A CN 201510517575 CN201510517575A CN105068244A CN 105068244 A CN105068244 A CN 105068244A CN 201510517575 CN201510517575 CN 201510517575 CN 201510517575 A CN201510517575 A CN 201510517575A CN 105068244 A CN105068244 A CN 105068244A
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chip
dmd
fixing table
dmd2
dmdl
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CN 201510517575
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CN105068244B (en )
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任国焘
陈守谦
张旺
周程灏
党凡阳
王惠
解放
左宝君
范志刚
张辉
索恩祥
苏天琪
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哈尔滨工业大学
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Abstract

The invention discloses a resolution enhancement method realized through DMD splicing, which belongs to the technical field of DMD resolution enhancement. The method comprises steps: 1, a 4k*4k image is segmented into a 4k*2k part and a 4k*2k part on a computer in an image segmentation method; 2, a DMD1 chip is placed on a sliding guide rail of a bottom fixing table of a dual-layer fixing table, and a DMD2 chip is fixedly placed on an upper fixing table of the dual-layer fixing table; 3, a DMD control chip processes signals of the above two image parts, and the above two 4k*2k images are simultaneously transmitted to the DMD1 chip and the DMD2 chip respectively; and 4, DMD1 chip pixel imaging and DMD2 chip pixel imaging are carried out via a high-resolution CCD camera, the DMD1 chip is driven to perform precise and parallel displacement in relative to the bottom fixing table surface of the dual-layer fixing table via a precise position moving platform, and thus the distance between a DMD1 chip edge pixel and a DMD2 chip edge pixel reaches a nominal value. Two DMD chip images can be seamlessly spliced, and the resolution of the DMD chip can be greatly improved.

Description

一种通过DMD拼接实现的分辨率提高的方法 A method for improving the resolution achieved by splicing a DMD

技术领域 FIELD

[0001] 本发明属于提高DMD分辨率的技术领域。 [0001] The present invention belongs to the technical field to improve resolution DMD.

背景技术 Background technique

[0002] 现代科学技术的发展,对光学信息处理方法有了更高的要求。 [0002] The development of modern science and technology, optical information processing methods have higher requirements. 原有的各种调制器己经不能满足要求,能实时的二维输入、输出的传感器应运而生,这就是空间光调制器。 Original range of the modulator has not meet the requirements of real-time two-dimensional input, the sensor output emerged, which is the spatial light modulator.

[0003] 数字微镜器件(DMD)是一种全数字化的新型空间光调制器,它釆用销溅射工艺在半导体硅片上形成二维微镜阵列。 [0003] The digital mirror device (DMD) is an all-digital novel spatial light modulator, which preclude the use of a two-dimensional micromirror sputtering pin array on the semiconductor wafer. 每个微镜片相当于投影画面中的一个像素点,各个微镜片都可以自由偏转,微镜片偏转不同的偏转角,就会呈现不同的状态。 Each microlens corresponds to one pixel in the projection screen, each micro lens can be freely deflected micromirror different deflection deflection angle, there will be a different state. 因此,通过每个微镜片的偏转角度来控制光线的反射,进而实现图像的实时显示。 Thus, by controlling the deflection angle of the reflected light of each micro lens, thus achieving real-time display of the image. 然而DMD的分辨率提高受到加工的工艺的限制。 However DMD improve the resolution is limited by the process of processing. 在基于DMD芯片的目标模拟器的设计过程中,当我们所需要模拟的目标精度若大于DMD当下所能提供的分辨率限制,若仅仅依靠加工工艺的提升使得DMD分辨率的提高则需要等待很长的时间。 DMD chip design process based on a target simulator, as if we need to simulate a target precision greater than the resolution limit of the current DMD can be provided, if the lifting process alone such that it is necessary to improve the resolution DMD wait a long time

[0004] 突破空间光调制器(DMD)分辨率的限制本来就不是容易的事,高分辨率的空间调制器可以实现目标模拟器模拟精度的提高,应用价值很大。 [0004] breakthrough spatial light modulator (DMD) resolution limit was never easy, high-resolution spatial modulator can be improved target simulator simulation accuracy, great value.

发明内容 SUMMARY

[0005] 本发明的目的是提供一种通过DMD拼接实现的分辨率提高的方法,是为了解决在模拟的目标精度若大于DMD当下所能提供的分辨率限制时,存在在通过加工工艺的提升使得DMD分辨率的提高则需要等待很长时间的问题。 [0005] The object of the present invention is to provide a method of resolution enhancement achieved by stitching DMD, in order to solve the objective of the simulation accuracy if the current is greater than the DMD can provide resolution limits by the presence of the lifting process DMD making to improve the resolution you need to wait very long time.

[0006] 所述的目的是通过以下方案实现的:所述的一种通过DMD拼接实现的分辨率提高的方法,它的方法步骤为: [0006] The object is achieved by the following scheme: A method of according to improve the resolution DMD splicing implemented, its method steps of:

步骤一、在计算机上将4kX4k的图像通过图像分割的方法分为4kX2k、4kX2k两部分; A step, in the image on the computer 4kX4k into 4kX2k, 4kX2k two parts by a method of image segmentation;

步骤二、将DMDl芯片放置在双层固定台I的底层固定台上的滑动导轨上,DMD2芯片固定放置在双层固定台I的上层固定台上;双层固定台I搭载在精确位置移动平台上,使精确位置移动平台能驱动DMDl芯片做相对于双层固定台I的底层固定台台面做精密平行位移; Step two, the DMDl chip is placed on the slide rails fixed to the bottom stage of the double fixing table I, DMD2 chip is fixed in the upper fixed table placed double fixing table I; I double fixing table mounted at a precise location of the mobile platform on the exact location of the mobile platform can do with respect to the driving chip DMDl double bottom fixed station a fixed station table I do precise parallel displacement;

步骤三、计算机内的两部分图像信号在通过一个同步触发输出信号触发后同步发送到DMD控制芯片内,DMD控制芯片将上述两部分图像信号进行处理后,将上述两部分4KX 2K的图像分别同时传输到DMDl芯片和DMD2芯片中; Step three, two portions of the image signals from the computer after passing through a synchronous triggering the synchronization is sent to the DMD control chip after the output signal is triggered, DMD control chip to said two portions of the image signal is processed, the image of the two-part 4KX 2K are simultaneously DMDl chip and transmitted to the chip DMD2;

步骤四、通过高分辨率CCD相机对DMDl芯片像素和DMD2芯片像素成像,再通过精确位置移动平台能驱动DMDl芯片做相对于双层固定台I的底层固定台台面做精密平行位移,使DMDl芯片边缘像素与DMD2芯片边缘像素之间的距离达到标称值,然后使用真空胶将DMDl芯片与双层固定台I进行固定。 Step four, the high-resolution CCD camera and the pixel on the chip DMDl DMD2 pixel imaging chip, through the precise location of the mobile platform can be driven with respect to the bottom DMDl chip fixing table do double-deck fixing table I do precise parallel displacement of the chip DMDl distance between the edge pixel and the edge pixel DMD2 chips reach the nominal values, and then using a vacuum double glue DMDl chip fixing table I fixed.

[0007] 本发明能实现将两块DMD芯片像无缝拼接,大幅度提高DMD芯片的分辨率,可以使空间光调制器突破研发周期的限制实现分辨率的提高,也可以由于经费的限制不能购置高分辨率的空间光调制器时,使用本方法实现低分辨率的空间光调制的拼接,从而达到更高的分辨率。 [0007] The present invention can be realized as two seamless DMD chip, DMD chip greatly improve the resolution, spatial light modulator can break out development cycle improved resolution may not be due to the limitation of funds when the acquisition of high-resolution spatial light modulator, the method using a low-resolution spatial light modulator stitching, so as to achieve higher resolution. 从工业的角度上来讲,DMD芯片分辨率的提高后,可以据此制作更高分辨率的目标模拟器,从而在半实物目标模拟器的关键技术上达到质的突破。 From an industrial point of view, the increase DMD chip resolution, higher resolution can be made accordingly target simulator, so as to achieve a qualitative breakthrough in key technologies-the-loop target simulator. 而且,与传统的拼接技术相区别,本方法所得到的实物不需要额外的物理空间,因此所得到的实物目标模拟器并不会占用特别大的物理空间。 Further, the conventional splicing techniques to distinguish the present method does not require additional physical obtained physical space, so the resulting physical target simulator does not occupy a particularly large physical space. 从商业的角度来看,本方法可以用于制作更高精度的投影仪器,将极大程度促进投影产业的发展,将会带来巨大的经济效益。 From a business perspective, this method can be used to make more accurate projection equipment, will greatly promote the development of the projector industry, will bring huge economic benefits.

附图说明 BRIEF DESCRIPTION

[0008] 图1是本发明方法中涉及的双层固定台1、DMDl芯片和DMD2相对位置结构示意图。 [0008] FIG. 1 is a double fixing table involved in the process of the present invention 1, DMDl DMD2 chip and the relative positions of a schematic structure.

具体实施方式 detailed description

[0009] 具体实施方式一:结合图1所示,说明本实施方式的技术方案,它的方法步骤为: 步骤一、在计算机上将4kX4k的图像通过图像分割的方法分为4kX2k、4kX2k两部分; [0009] In a particular embodiment: in conjunction with Figure 1, illustrate the technical solutions according to the present embodiment, it is the method step: a step, in the image on the computer 4kX4k into 4Kx2K by a method of image segmentation, the two parts 4Kx2K ;

步骤二、将DMDl芯片放置在双层固定台I的底层固定台上的滑动导轨上,DMD2芯片固定放置在双层固定台I的上层固定台上;双层固定台I搭载在精确位置移动平台上,使精确位置移动平台能驱动DMDl芯片做相对于双层固定台I的底层固定台台面做精密平行位移; Step two, the DMDl chip is placed on the slide rails fixed to the bottom stage of the double fixing table I, DMD2 chip is fixed in the upper fixed table placed double fixing table I; I double fixing table mounted at a precise location of the mobile platform on the exact location of the mobile platform can do with respect to the driving chip DMDl double bottom fixed station a fixed station table I do precise parallel displacement;

步骤三、计算机内的两部分图像信号在通过一个同步触发输出信号触发后同步发送到DMD控制芯片内,DMD控制芯片将上述两部分图像信号进行处理后,将上述两部分4KX 2K的图像分别同时传输到DMDl芯片和DMD2芯片中; Step three, two portions of the image signals from the computer after passing through a synchronous triggering the synchronization is sent to the DMD control chip after the output signal is triggered, DMD control chip to said two portions of the image signal is processed, the image of the two-part 4KX 2K are simultaneously DMDl chip and transmitted to the chip DMD2;

步骤四、通过高分辨率CCD相机对DMDl芯片像素和DMD2芯片像素成像,再通过精确位置移动平台能驱动DMDl芯片做相对于双层固定台I的底层固定台台面做精密平行位移,使DMDl芯片边缘像素与DMD2芯片边缘像素之间的距离达到标称值,然后使用真空胶将DMDl芯片与双层固定台I进行固定。 Step four, the high-resolution CCD camera and the pixel on the chip DMDl DMD2 pixel imaging chip, through the precise location of the mobile platform can be driven with respect to the bottom DMDl chip fixing table do double-deck fixing table I do precise parallel displacement of the chip DMDl distance between the edge pixel and the edge pixel DMD2 chips reach the nominal values, and then using a vacuum double glue DMDl chip fixing table I fixed.

[0010] 工作原理:模拟仿真计算机给DMD驱动模块提供一副高分辨率图像(4KX4K),该图像的分辨率要高于DMD的本征分辨率(4KX2K),在计算机上将4kX4k的图像通过图像分割的方法分为4kX2k、4kX2k两部分,经过DMD控制芯片的处理使得两块DMD芯片分别显示原图像的二分之一,通过DMD驱动模块使得两块DMD芯片同时工作,微透镜阵列同时翻转。 [0010] Principle: The computer simulation to provide a drive module DMD high resolution image (4KX4K), the resolution of the image is higher than the intrinsic resolution of the DMD (4KX2K), the image on the computer by 4kX4k the method of image segmentation into 4kX2k, 4kX2k two parts, the control treated DMD chip DMD chip are displayed such that two one-half of the original image, so that the drive module by two DMD DMD chip simultaneously, while inversion microlens array . 同时LED驱动模块驱动两部分照明系统开始工作,DMD翻转后经照明系统照明产生图像,两块DMD经过精密机械拼接部分后,边缘紧密相连接,精度在一个像素以内。 LED driver module simultaneously driving two partial illumination system to work, the image generated by the DMD flip illumination lighting system, after two DMD precision mechanical splice section, tightly connected to the edge, within the accuracy of one pixel. 经过光学补偿部分后,两个DMD上图像得到光程补偿,之后经过准直光学系统后完成整个拼接过程。 After the optical compensation section, the two images obtained DMD optical path compensation, after the collimating optical system to complete the splicing process. 整个拼接过程完成之后,拼接后的图像成像在CCD相机上,CCD相机与DMD控制芯片共享同一个触发信号,在DMD控制芯片透射出图像的同时,CCD相机开始接受图像。 After the whole splicing process is completed, the image forming the stitched on the CCD camera, a CCD camera and DMD chips share the same control trigger signal, an image transmission control chip while a DMD, CCD camera receives image starts. 最后通过拼接检验模块判断是拼接效果,拼接成功的图像不会产生缝隙,从而实现真正的无缝拼接。 Finally, the splice is determined by verification module is a mosaic effect, images will not be successful splicing a gap, allowing for true seamless splicing.

[0011] 在具体使用中,由于两块DMD通过精密机械拼接部分之后所成的在空间上具有错位的关系,即两块DMD到后面准直光学系统的光程差不一样,因此会影响后续成像质量。 [0011] In a particular use, since the two after the DMD by precision mechanical splices have an offset portion formed by spatial relationship, i.e. two DMD back to the collimating optical system of the optical path difference is not the same, thus affecting subsequent image quality. 此处添加光学补偿模块就是为了消减光程差。 The optical compensation module here is to add an optical path difference reduction. 光学补偿模块由一块平板K9玻璃切掉其中一部分得到,整块K9玻璃的厚度及大小是与机械拼接部分在空间上互相契合的关系。 The optical compensation module consists of a flat plate cut part of K9 glass obtained, the thickness and size of K9 glass piece is a mechanical splice part fit in space relationship to each other. 具体设计加工得到的厚度与相应的DMD选取有关,因此在此处并未进行的数学计算。 The specific design thickness obtained by processing the respective DMD selection, and therefore is not carried out here in the mathematical calculation. 图像经过光学补偿模块之后将通过准直光学系统,呈平行光出射。 After the optical image compensation module through a collimating optical system, light emitted in a parallel. 准直光学系统的参数需要根据设计要求,以及具体DMD选取才能进行相应的设计。 Parameter collimating optical system design needs to be appropriate depending on design requirements, and to select the particular DMD.

Claims (1)

  1. 1.一种通过DMD拼接实现的分辨率提高的方法,其特征在于它的方法步骤为: 步骤一、在计算机上将4kX4k的图像通过图像分割的方法分为4kX2k、4kX2k两部分; 步骤二、将DMDl芯片放置在双层固定台(I)的底层固定台上的滑动导轨上,DMD2芯片固定放置在双层固定台(I)的上层固定台上;双层固定台(I)搭载在精确位置移动平台上,使精确位置移动平台能驱动DMDl芯片做相对于双层固定台(I)的底层固定台台面做精密平行位移; 步骤三、计算机内的两部分图像信号在通过一个同步触发输出信号触发后同步发送到DMD控制芯片内,DMD控制芯片将上述两部分图像信号进行处理后,将上述两部分4KX 2K的图像分别同时传输到DMDl芯片和DMD2芯片中; 步骤四、通过高分辨率CCD相机对DMDl芯片像素和DMD2芯片像素成像,再通过精确位置移动平台能驱动DMDl芯片做相对于双层固定台(I)的底层固 1. A method for improving the resolution achieved by splicing a DMD, characterized in that its method steps: a step, in the image on the computer 4kX4k into 4kX2k, 4kX2k two parts by a method of image segmentation; step two, the chip is placed on the double DMDl fixing table (I) of the bottom slide rail fixed table, DMD2 chip is fixed in the upper fixed table placed double fixing table (I); a bilayer fixing table (I) is mounted at a precise the location of the mobile platform, so that the precise location of the mobile platform can do with respect to the driving chip DMDl double fixing table (I) of the underlying table fixing table do precision parallel displacement; step three, two portions of the image signals from the computer via a synchronous trigger output transmitting the synchronization signal to trigger the control chip DMD, the DMD chip controlling said two image signal processing section, the image of the two-part 4KX 2K DMDl are simultaneously transferred to the chip and chip DMD2; step 4 by high resolution CCD camera and the pixel on the chip DMDl DMD2 pixel imaging chip, through the precise location of the mobile platform to drive DMDl solid chip made with respect to the underlying double fixing table (I), 定台台面做精密平行位移,使DMDl芯片边缘像素与DMD2芯片边缘像素之间的距离达到标称值,然后使用真空胶将DMDl芯片与双层固定台(I)进行固定。 Do precision fixed platform surface parallel displacement, the distance between the pixel and the edge pixel DMDl DMD2 chip chip edge reaches the nominal value, then using a vacuum double glue DMDl chip and a fixed station (I) is fixed.
CN 201510517575 2015-08-22 2015-08-22 Ways to improve the resolution by dmd stitching implemented CN105068244B (en)

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CN204256356U (en) * 2014-09-09 2015-04-08 宁波蓝科电子工程有限公司 DLP high-definition rear-projection combination screen free of physical splicing seams
CN104570331A (en) * 2015-01-31 2015-04-29 哈尔滨工业大学 Method for improving resolution of DMD (digital micro-mirror device) by means of optical assembling
CN204418506U (en) * 2014-12-31 2015-06-24 无锡贝斯特精机股份有限公司 Truss capable of being quickly positioned and spliced

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CN204256356U (en) * 2014-09-09 2015-04-08 宁波蓝科电子工程有限公司 DLP high-definition rear-projection combination screen free of physical splicing seams
CN204418506U (en) * 2014-12-31 2015-06-24 无锡贝斯特精机股份有限公司 Truss capable of being quickly positioned and spliced
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106412536A (en) * 2016-09-29 2017-02-15 西安中科晶像光电科技有限公司 System for realizing high-resolution projection display through DMD chip splicing

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