CN105062081A - ATO powder-mixed high-performance organic silicon resin-polymethyl methacrylate composite material for LED packaging and preparation method of composite material - Google Patents

ATO powder-mixed high-performance organic silicon resin-polymethyl methacrylate composite material for LED packaging and preparation method of composite material Download PDF

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CN105062081A
CN105062081A CN201510500313.8A CN201510500313A CN105062081A CN 105062081 A CN105062081 A CN 105062081A CN 201510500313 A CN201510500313 A CN 201510500313A CN 105062081 A CN105062081 A CN 105062081A
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composite material
silicon resin
weight part
deionized water
organosilicon
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朱志
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Abstract

The invention discloses an ATO powder-mixed high-performance organic silicon resin-polymethyl methacrylate composite material for LED packaging. The composite material is a high-performance material formed by conducting polymerization solidification on vinyl phenyl silicon oil, hydrogen-containing silicon resin vinyl silicon resin and methyl methacrylate, and thus has both the advantages of organic silicon resin and methyl acrylate; the composite material is mixed with ATO and graphene mixed powder, and the mixed powder is coated with silica sol subjected to surface treatment with a silane coupling agent, so that the transparency and the heat-resisting, antistatic and anti-ultraviolet aging properties of the composite material can be greatly improved; the prepared composite material is high in mechanical property and optical property, stable to heat, applicable to high-power LEDs, and long in service life.

Description

High performance organo-silicon resin-composite material of polymethyl methacrylate of a kind of LED blending ATO powder and preparation method thereof
Technical field
The present invention relates to LED encapsulation material technical field, particularly relate to high performance organo-silicon resin-composite material of polymethyl methacrylate of a kind of LED blending ATO powder and preparation method thereof.
Background technology
LED refers to the encapsulation of luminescence chip; it works the keying action of forming a connecting link in LED industry chain; the packaged material that it uses changes to component parameter from factors such as envrionment temperature, humidity, external mechanical vibrations, surging forces for fixing and protect IC on the one hand; be on the other hand reduce chip and air refraction gap to increase light efficiency, and in time the heat of generation to be distributed.Conventional packaged material mainly contains the materials such as epoxy resin, modified epoxy and silicone resin, redix is mainly used in lower powered LED encapsulation material, it is restricted in high-power LED application, and silicone resin possesses the excellent advantage such as heat-proof aging, ultraviolet aging resistance, high permeability, low-stress, be well suited for as high-power LED encapsulation material.
The performance requriements of existing market high-power LED to packaged material mainly contains: high refractive index, high transmission rate, high thermal conductivity, resistance to ultraviolet, heat-proof aging and low thermal expansivity etc., domestic market is to the main dependence on import product of this high performance organosilicon encapsulating material, and these products also exist many defects, such as physical strength is lower, dispersiveness in silicone resin of ultraviolet light resistant poor performance, specific refractory power, transmittance, thermal conductivity and modified filler and consistency, stability etc. after encapsulation all need further lifting.
Summary of the invention
The object of the invention is exactly the defect in order to make up prior art, provides high performance organo-silicon resin-composite material of polymethyl methacrylate of a kind of LED blending ATO powder and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of high performance organo-silicon resin-composite material of polymethyl methacrylate of LED blending ATO powder, this matrix material is prepared by the raw material of following weight part: phenyltrimethoxysila,e 70-80, organosilicon vinyl double-seal head agent 0.4-0.5, organosilicon hydrogeneous double-seal head agent 0.2-0.3, tetramethyl tetraphenyl cyclotetrasiloxane 10-12, Tetramethylammonium hydroxide 0.2-0.3, octamethylcyclotetrasiloxane 12-15, 2-phenyl-3-butyne-2-alcohol 3-5, erucicamide 0.1-0.2, toluene 50-60, platinum catalyst 0.01-0.02, concentration is the dilute hydrochloric acid 0.5-0.8 of 30%, deionized water 5-8, methyl methacrylate 12-15, solid content is the silicon sol 10-12 of 20-25%, Graphene 0.1-0.2, ATO powder 3-5, silane coupling agent kh5500.1-0.2, dibenzoyl peroxide 0.01-0.02.
The preparation method of the high performance organo-silicon resin-composite material of polymethyl methacrylate of described a kind of LED blending ATO powder, described preparation method is:
(1) first the double-seal head agent of organosilicon vinyl and the Tetramethylammonium hydroxide of 0.2-0.3 weight part will be added after tetramethyl tetraphenyl cyclotetrasiloxane, octamethylcyclotetrasiloxane under agitation vacuum hydro-extraction, be heated to 90-100 DEG C under nitrogen atmosphere, 160-180 DEG C is warming up to after reaction 6-8h, after constant temperature 20-30min, be decompressed to 0.05-0.095MPa, obtain vinyl phenyl silicone oil after steaming low boilers completely for subsequent use;
(2) dilute hydrochloric acid of hydrogeneous to the phenyltrimethoxysila,e of 20-30 weight part and organosilicon double-seal head agent, 0.1-0.2 weight part, the deionized water of 1-2 weight part are mixed, be heated to 70-80 DEG C, stirring reaction 4-5h, add the toluene of 15-20 weight part subsequently and be warming up to 100 DEG C, unnecessary deionized water is evaporated completely, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain Silicon Containing Hydrogen resin for subsequent use;
(3) by the phenyltrimethoxysila,e of residue part, the agent of organosilicon vinyl double-seal head, dilute hydrochloric acid, deionized water mixing, be heated to 70-80 DEG C, the toluene of residue part is added after stirring reaction 3-4h, and be progressively warming up to 100 DEG C and evaporate unnecessary deionized water, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain vinyl polysiloxane for subsequent use;
(4) drop in silicon sol by ATO powder, Graphene, carry out heated drying after ultrasonic disperse is even, remove moisture completely, subsequently by the powder of gained and silane coupling agent kh550 mixing and stirring, gained material is for subsequent use;
(5) successively step (1), (2), (3), (4) and other leftover materials are added in reaction vessel, through deaeration process after being uniformly mixed, be heated to 70-80 DEG C of solidification 1.5-2h subsequently, after being finally warming up to 140-150 DEG C with the speed of 5 DEG C/min again, isothermal curing 0.5-1h, obtains described matrix material.
Advantage of the present invention is: utilize vinyl phenyl silicone oil, Silicon Containing Hydrogen resin, vinyl polysiloxane and methyl methacrylate polymerization solidify to form a kind of high performance material having silicone resin concurrently and mix advantage with poly-methyl esters methacrylate resin, the ATO that the silicon sol after silane coupling agent surface treatment of simultaneously blending is wherein coated and Graphene mixed powder, this powder and resin compatible good, can greatly improve the transparency of material and heat-resisting, antistatic, the performances such as anti-ultraviolet ageing, the mechanical property of materials prepared is good, optical property is good, to thermally-stabilised, be applied to great power LED long service life.
Embodiment
Embodiment
The matrix material of this embodiment is prepared by the raw material of following weight part: phenyltrimethoxysila,e 70, organosilicon vinyl double-seal head agent 0.4, the hydrogeneous double-seal head agent 0.2 of organosilicon, tetramethyl tetraphenyl cyclotetrasiloxane 10, Tetramethylammonium hydroxide 0.2, octamethylcyclotetrasiloxane 12, 2 phenylbutynol 3, erucicamide 0.1, toluene 50, platinum catalyst 0.01, concentration is the dilute hydrochloric acid 0.5 of 30%, deionized water 5, methyl methacrylate 12, solid content is the silicon sol 10 of 20%, Graphene 0.1, ATO powder 3, silane coupling agent kh5500.1, dibenzoyl peroxide 0.01.
The preparation method of the high performance organo-silicon resin composite material of polymethyl methacrylate of described a kind of LED blending ATO powder is:
(1) first the double-seal head agent of organosilicon vinyl and the Tetramethylammonium hydroxide of 0.2 weight part will be added after tetramethyl tetraphenyl cyclotetrasiloxane, octamethylcyclotetrasiloxane under agitation vacuum hydro-extraction, be heated to 90 DEG C under nitrogen atmosphere, 160 DEG C are warming up to after reaction 6h, after constant temperature 20min, be decompressed to 0.05MPa, obtain vinyl phenyl silicone oil after steaming low boilers completely for subsequent use;
(2) dilute hydrochloric acid of hydrogeneous to the phenyltrimethoxysila,e of 20 weight parts and organosilicon double-seal head agent, 0.1 weight part, the deionized water of 1 weight part are mixed, be heated to 70 DEG C, stirring reaction 4h, add the toluene of 15 weight parts subsequently and be warming up to 100 DEG C, unnecessary deionized water is evaporated completely, finally be decompressed to 0.05MPa again, steam low-boiling point material completely, obtain Silicon Containing Hydrogen resin for subsequent use;
(3) by the phenyltrimethoxysila,e of residue part, the agent of organosilicon vinyl double-seal head, dilute hydrochloric acid, deionized water mixing, be heated to 70 DEG C, the toluene of residue part is added after stirring reaction 3h, and be progressively warming up to 100 DEG C and evaporate unnecessary deionized water, finally be decompressed to 0.05MPa again, steam low-boiling point material completely, obtain vinyl polysiloxane for subsequent use;
(4) drop in silicon sol by ATO powder, Graphene, carry out heated drying after ultrasonic disperse is even, remove moisture completely, subsequently by the powder of gained and silane coupling agent kh550 mixing and stirring, gained material is for subsequent use;
(5) successively step (1), (2), (3), (4) and other leftover materials are added in reaction vessel, through deaeration process after being uniformly mixed, be heated to 70 DEG C of solidification 1.5h subsequently, after being finally warming up to 140 DEG C with the speed of 5 DEG C/min again, isothermal curing 0.5h, obtains described matrix material.
The thick sample of 3mm made by matrix material obtained by the present embodiment, and relevant criterion followed by this sample, and measured performance index are as follows:
Transmittance >=96% under 400-800nm visible light conditions; Specific refractory power is 1.745; The yellowness index of ultraviolet resistance burn-in test is 24; Hardness: 85A; Thermotolerance: toast 24h material without considerable change under 150 DEG C of conditions.

Claims (2)

1. the LED high performance organo-silicon resin-composite material of polymethyl methacrylate of blending ATO powder, it is characterized in that, this matrix material is prepared by the raw material of following weight part: phenyltrimethoxysila,e 70-80, organosilicon vinyl double-seal head agent 0.4-0.5, organosilicon hydrogeneous double-seal head agent 0.2-0.3, tetramethyl tetraphenyl cyclotetrasiloxane 10-12, Tetramethylammonium hydroxide 0.2-0.3, octamethylcyclotetrasiloxane 12-15, 2-phenyl-3-butyne-2-alcohol 3-5, erucicamide 0.1-0.2, toluene 50-60, platinum catalyst 0.01-0.02, concentration is the dilute hydrochloric acid 0.5-0.8 of 30%, deionized water 5-8, methyl methacrylate 12-15, solid content is the silicon sol 10-12 of 20-25%, Graphene 0.1-0.2, ATO powder 3-5, silane coupling agent kh5500.1-0.2, dibenzoyl peroxide 0.01-0.02.
2. the preparation method of the high performance organo-silicon resin-composite material of polymethyl methacrylate of a kind of LED blending ATO powder as claimed in claim 1, it is characterized in that, described preparation method is:
(1) first the double-seal head agent of organosilicon vinyl and the Tetramethylammonium hydroxide of 0.2-0.3 weight part will be added after tetramethyl tetraphenyl cyclotetrasiloxane, octamethylcyclotetrasiloxane under agitation vacuum hydro-extraction, be heated to 90-100 DEG C under nitrogen atmosphere, 160-180 DEG C is warming up to after reaction 6-8h, after constant temperature 20-30min, be decompressed to 0.05-0.095MPa, obtain vinyl phenyl silicone oil after steaming low boilers completely for subsequent use;
(2) dilute hydrochloric acid of hydrogeneous to the phenyltrimethoxysila,e of 20-30 weight part and organosilicon double-seal head agent, 0.1-0.2 weight part, the deionized water of 1-2 weight part are mixed, be heated to 70-80 DEG C, stirring reaction 4-5h, add the toluene of 15-20 weight part subsequently and be warming up to 100 DEG C, unnecessary deionized water is evaporated completely, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain Silicon Containing Hydrogen resin for subsequent use;
(3) by the phenyltrimethoxysila,e of residue part, the agent of organosilicon vinyl double-seal head, dilute hydrochloric acid, deionized water mixing, be heated to 70-80 DEG C, the toluene of residue part is added after stirring reaction 3-4h, and be progressively warming up to 100 DEG C and evaporate unnecessary deionized water, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain vinyl polysiloxane for subsequent use;
(4) drop in silicon sol by ATO powder, Graphene, carry out heated drying after ultrasonic disperse is even, remove moisture completely, subsequently by the powder of gained and silane coupling agent kh550 mixing and stirring, gained material is for subsequent use;
(5) successively step (1), (2), (3), (4) and other leftover materials are added in reaction vessel, through deaeration process after being uniformly mixed, be heated to 70-80 DEG C of solidification 1.5-2h subsequently, after being finally warming up to 140-150 DEG C with the speed of 5 DEG C/min again, isothermal curing 0.5-1h, obtains described matrix material.
CN201510500313.8A 2015-08-16 2015-08-16 ATO powder-mixed high-performance organic silicon resin-polymethyl methacrylate composite material for LED packaging and preparation method of composite material Pending CN105062081A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105623274A (en) * 2016-03-03 2016-06-01 惠州赛力珑新材料有限公司 Anti-static organosilicone synthetic leather and preparation method

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101717584A (en) * 2009-11-20 2010-06-02 陈俊光 Organic silica gel packaging material of large-power LED and preparation method thereof
CN101768363A (en) * 2010-01-28 2010-07-07 同济大学 Method for preparing addition highly heat-conducting room temperature-curing silicon rubber
CN102702441A (en) * 2012-06-06 2012-10-03 惠州市洲明节能科技有限公司 Preparation method of organic silicon-polymethyl methacrylate composite materials
CN103242801A (en) * 2013-05-14 2013-08-14 汕头市骏码凯撒有限公司 Single-component high-refractivity LED (light-emitting diode) packaging adhesive and preparation method thereof
CN104211965A (en) * 2013-06-03 2014-12-17 北京化工大学 Preparation method for net-like methyl phenyl vinyl polysiloxane for LED packaging

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101717584A (en) * 2009-11-20 2010-06-02 陈俊光 Organic silica gel packaging material of large-power LED and preparation method thereof
CN101768363A (en) * 2010-01-28 2010-07-07 同济大学 Method for preparing addition highly heat-conducting room temperature-curing silicon rubber
CN102702441A (en) * 2012-06-06 2012-10-03 惠州市洲明节能科技有限公司 Preparation method of organic silicon-polymethyl methacrylate composite materials
CN103242801A (en) * 2013-05-14 2013-08-14 汕头市骏码凯撒有限公司 Single-component high-refractivity LED (light-emitting diode) packaging adhesive and preparation method thereof
CN104211965A (en) * 2013-06-03 2014-12-17 北京化工大学 Preparation method for net-like methyl phenyl vinyl polysiloxane for LED packaging

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105623274A (en) * 2016-03-03 2016-06-01 惠州赛力珑新材料有限公司 Anti-static organosilicone synthetic leather and preparation method

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Application publication date: 20151118