CN105086468A - Nanometer-sized zinc sulfide mixed high-performance organic silicon resin-polymethyl methacrylate composite for LED packaging and preparation method thereof - Google Patents
Nanometer-sized zinc sulfide mixed high-performance organic silicon resin-polymethyl methacrylate composite for LED packaging and preparation method thereof Download PDFInfo
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- CN105086468A CN105086468A CN201510500323.1A CN201510500323A CN105086468A CN 105086468 A CN105086468 A CN 105086468A CN 201510500323 A CN201510500323 A CN 201510500323A CN 105086468 A CN105086468 A CN 105086468A
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Abstract
The invention discloses a nanometer-sized zinc sulfide mixed high-performance organic silicon resin-polymethyl methacrylate composite for LED packaging. The composite is a high-performance material formed by polymerizing and curing vinyl phenyl silicone oil, hydrogen containing silicon resin, vinyl silicon resin and methyl methacrylate and has the mixed advantages of organic silicon resin and poly methyl methacrylate. Nanometer-sized zinc sulfide and graphene which are subjected to surface treatment of the silane coupling agent and coated with silica sol are mixed in the organic silicon resin-polymethyl methacrylate composite and are good in compatibility with resin, the refractive index, heat conducting and cooling performance and other performance of the material can be greatly improved, and the prepared material is good in mechanical performance, long in service life, high in transparency, good in optical performance and stable in heat sensitivity.
Description
Technical field
The present invention relates to LED encapsulation material technical field, particularly relate to high performance organo-silicon resin-composite material of polymethyl methacrylate of a kind of LED blending nano-zinc sulfide and preparation method thereof.
Background technology
LED refers to the encapsulation of luminescence chip; it works the keying action of forming a connecting link in LED industry chain; the packaged material that it uses changes to component parameter from factors such as envrionment temperature, humidity, external mechanical vibrations, surging forces for fixing and protect IC on the one hand; be on the other hand reduce chip and air refraction gap to increase light efficiency, and in time the heat of generation to be distributed.Conventional packaged material mainly contains the materials such as epoxy resin, modified epoxy and silicone resin, redix is mainly used in lower powered LED encapsulation material, it is restricted in high-power LED application, and silicone resin possesses the excellent advantage such as heat-proof aging, ultraviolet aging resistance, high permeability, low-stress, be well suited for as high-power LED encapsulation material.
The performance requriements of existing market high-power LED to packaged material mainly contains: high refractive index, high transmission rate, high thermal conductivity, resistance to ultraviolet, heat-proof aging and low thermal expansivity etc., domestic market is to the main dependence on import product of this high performance organosilicon encapsulating material, and these products also exist many defects, such as physical strength is lower, dispersiveness in silicone resin of ultraviolet light resistant poor performance, specific refractory power, transmittance, thermal conductivity and modified filler and consistency, stability etc. after encapsulation all need further lifting.
Summary of the invention
The object of the invention is exactly the defect in order to make up prior art, provides high performance organo-silicon resin-composite material of polymethyl methacrylate of a kind of LED blending nano-zinc sulfide and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of high performance silicone resin-composite material of polymethyl methacrylate of LED blending nano-zinc sulfide, this matrix material is prepared by the raw material of following weight part: phenyltrimethoxysila,e 70-80, organosilicon vinyl double-seal head agent 0.4-0.5, organosilicon hydrogeneous double-seal head agent 0.2-0.3, tetramethyl tetraphenyl cyclotetrasiloxane 10-12, Tetramethylammonium hydroxide 0.2-0.3, octamethylcyclotetrasiloxane 12-15, 2-phenyl-3-butyne-2-alcohol 3-5, erucicamide 0.1-0.2, toluene 50-60, platinum catalyst 0.01-0.02, concentration is the dilute hydrochloric acid 0.5-0.8 of 30%, deionized water 5-10, methyl methacrylate 12-15, nano-zinc sulfide 4-6, solid content is the silicon sol 10-12 of 20-25%, Graphene 0.1-0.2, silane coupling agent kh5500.1-0.2, dibenzoyl peroxide 0.01-0.02.
The preparation method of the high performance organo-silicon resin-composite material of polymethyl methacrylate of described a kind of LED blending nano-zinc sulfide, described preparation method is:
(1) first the double-seal head agent of organosilicon vinyl and the Tetramethylammonium hydroxide of 0.2-0.3 weight part will be added after tetramethyl tetraphenyl cyclotetrasiloxane, octamethylcyclotetrasiloxane under agitation vacuum hydro-extraction, be heated to 90-100 DEG C under nitrogen atmosphere, 160-180 DEG C is warming up to after reaction 6-8h, after constant temperature 20-30min, be decompressed to 0.05-0.095MPa, obtain vinyl phenyl silicone oil after steaming low boilers completely for subsequent use;
(2) dilute hydrochloric acid of hydrogeneous to the phenyltrimethoxysila,e of 20-30 weight part and organosilicon double-seal head agent, 0.1-0.2 weight part, the deionized water of 1-2 weight part are mixed, be heated to 70-80 DEG C, stirring reaction 4-5h, add the toluene of 15-20 weight part subsequently and be warming up to 100 DEG C, unnecessary deionized water is evaporated completely, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain Silicon Containing Hydrogen resin for subsequent use;
(3) by the phenyltrimethoxysila,e of residue part, the agent of organosilicon vinyl double-seal head, dilute hydrochloric acid, deionized water mixing, be heated to 70-80 DEG C, the toluene of residue part is added after stirring reaction 3-4h, and progressively intensification 100 DEG C evaporates unnecessary deionized water, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain vinyl polysiloxane for subsequent use;
(4) drop in silicon sol by nano-zinc sulfide, Graphene, carry out heated drying after ultrasonic disperse is even, remove moisture completely, subsequently by the powder of gained and silane coupling agent kh550 mixing and stirring, gained material is for subsequent use;
(5) successively step (1), (2), (3), (4) and other leftover materials are added in reaction vessel, through deaeration process after being uniformly mixed, be heated to 70-80 DEG C of solidification 1.5-2h subsequently, after being finally warming up to 140-150 DEG C with the speed of 5 DEG C/min again, isothermal curing 0.5-1h, obtains described matrix material.
Advantage of the present invention is: the present invention utilizes vinyl phenyl silicone oil, Silicon Containing Hydrogen resin, vinyl polysiloxane and methyl methacrylate polymerization solidify to form a kind of high performance material having silicone resin concurrently and mix advantage with poly-methyl esters methyl acrylate, the silicon sol clad nano zinc sulphide after silane coupling agent surface treatment of blending wherein simultaneously and Graphene, good with resin compatible, can greatly improve specific refractory power and the heat conduction of material, the performances such as heat radiation, the mechanical property of materials prepared is good, long service life, transparency is high, optical property is good, to thermally-stabilised.
Embodiment
Embodiment
The matrix material of this embodiment is prepared by the raw material of following weight part: phenyltrimethoxysila,e 70, organosilicon vinyl double-seal head agent 0.4, the hydrogeneous double-seal head agent 0.2 of organosilicon, tetramethyl tetraphenyl cyclotetrasiloxane 10, Tetramethylammonium hydroxide 0.2, octamethylcyclotetrasiloxane 12, 2 phenylbutynol 3, erucicamide 0.1, toluene 50, platinum catalyst 0.01, concentration is the dilute hydrochloric acid 0.5 of 30%, deionized water 5, methyl methacrylate 12, nano-zinc sulfide 4, solid content is the silicon sol 10 of 20%, Graphene 0.1, silane coupling agent kh5500.1, dibenzoyl peroxide 0.01.
The preparation method of the high performance organo-silicon resin composite material of polymethyl methacrylate of described a kind of LED blending nano-zinc sulfide is:
(1) first the double-seal head agent of organosilicon vinyl and the Tetramethylammonium hydroxide of 0.2 weight part will be added after tetramethyl tetraphenyl cyclotetrasiloxane, octamethylcyclotetrasiloxane under agitation vacuum hydro-extraction, be heated to 90 DEG C under nitrogen atmosphere, 160 DEG C are warming up to after reaction 6h, after constant temperature 20min, be decompressed to 0.05MPa, obtain vinyl phenyl silicone oil after steaming low boilers completely for subsequent use;
(2) dilute hydrochloric acid of hydrogeneous to the phenyltrimethoxysila,e of 20 weight parts and organosilicon double-seal head agent, 0.1 weight part, the deionized water of 1 weight part are mixed, be heated to 70 DEG C, stirring reaction 4h, add the toluene of 15 weight parts subsequently and be warming up to 100 DEG C, unnecessary deionized water is evaporated completely, finally be decompressed to 0.05MPa again, steam low-boiling point material completely, obtain Silicon Containing Hydrogen resin for subsequent use;
(3) by the phenyltrimethoxysila,e of residue part, the agent of organosilicon vinyl double-seal head, dilute hydrochloric acid, deionized water mixing, be heated to 70 DEG C, the toluene of residue part is added after stirring reaction 3h, and progressively intensification 100 DEG C evaporates unnecessary deionized water, finally be decompressed to 0.05MPa again, steam low-boiling point material completely, obtain vinyl polysiloxane for subsequent use;
(4) drop in silicon sol by nano-zinc sulfide, Graphene, carry out heated drying after ultrasonic disperse is even, remove moisture completely, subsequently by the powder of gained and silane coupling agent kh550 mixing and stirring, gained material is for subsequent use;
(5) successively step (1), (2), (3), (4) and other leftover materials are added in reaction vessel, through deaeration process after being uniformly mixed, be heated to 70 DEG C of solidification 1.5h subsequently, after being finally warming up to 140 DEG C with the speed of 5 DEG C/min again, isothermal curing 0.5h, obtains described matrix material.
The thick sample of 3mm made by matrix material obtained by the present embodiment, and relevant criterion followed by this sample, and measured performance index are as follows:
Transmittance >=94% under 400-800nm visible light conditions; Specific refractory power is 1.742; The yellowness index of ultraviolet resistance burn-in test is 28; Hardness: 82A; Thermotolerance: toast 24h material without considerable change under 150 DEG C of conditions.
Claims (2)
1. the LED high performance organo-silicon resin-composite material of polymethyl methacrylate of blending nano-zinc sulfide, it is characterized in that, this matrix material is prepared by the raw material of following weight part: phenyltrimethoxysila,e 70-80, organosilicon vinyl double-seal head agent 0.4-0.5, organosilicon hydrogeneous double-seal head agent 0.2-0.3, tetramethyl tetraphenyl cyclotetrasiloxane 10-12, Tetramethylammonium hydroxide 0.2-0.3, octamethylcyclotetrasiloxane 12-15, 2-phenyl-3-butyne-2-alcohol 3-5, erucicamide 0.1-0.2, toluene 50-60, platinum catalyst 0.01-0.02, concentration is the dilute hydrochloric acid 0.5-0.8 of 30%, deionized water 5-10, methyl methacrylate 12-15, nano-zinc sulfide 4-6, solid content is the silicon sol 10-12 of 20-25%, Graphene 0.1-0.2, silane coupling agent kh5500.1-0.2, dibenzoyl peroxide 0.01-0.02.
2. the preparation method of the high performance organo-silicon resin-composite material of polymethyl methacrylate of a kind of LED blending nano-zinc sulfide as claimed in claim 1, it is characterized in that, described preparation method is:
(1) first the double-seal head agent of organosilicon vinyl and the Tetramethylammonium hydroxide of 0.2-0.3 weight part will be added after tetramethyl tetraphenyl cyclotetrasiloxane, octamethylcyclotetrasiloxane under agitation vacuum hydro-extraction, be heated to 90-100 DEG C under nitrogen atmosphere, 160-180 DEG C is warming up to after reaction 6-8h, after constant temperature 20-30min, be decompressed to 0.05-0.095MPa, obtain vinyl phenyl silicone oil after steaming low boilers completely for subsequent use;
(2) dilute hydrochloric acid of hydrogeneous to the phenyltrimethoxysila,e of 20-30 weight part and organosilicon double-seal head agent, 0.1-0.2 weight part, the deionized water of 1-2 weight part are mixed, be heated to 70-80 DEG C, stirring reaction 4-5h, add the toluene of 15-20 weight part subsequently and be warming up to 100 DEG C, unnecessary deionized water is evaporated completely, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain Silicon Containing Hydrogen resin for subsequent use;
(3) by the phenyltrimethoxysila,e of residue part, the agent of organosilicon vinyl double-seal head, dilute hydrochloric acid, deionized water mixing, be heated to 70-80 DEG C, the toluene of residue part is added after stirring reaction 3-4h, and progressively intensification 100 DEG C evaporates unnecessary deionized water, finally be decompressed to 0.05-0.1MPa again, steam low-boiling point material completely, obtain vinyl polysiloxane for subsequent use;
(4) drop in silicon sol by nano-zinc sulfide, Graphene, carry out heated drying after ultrasonic disperse is even, remove moisture completely, subsequently by the powder of gained and silane coupling agent kh550 mixing and stirring, gained material is for subsequent use;
(5) successively step (1), (2), (3), (4) and other leftover materials are added in reaction vessel, through deaeration process after being uniformly mixed, be heated to 70-80 DEG C of solidification 1.5-2h subsequently, after being finally warming up to 140-150 DEG C with the speed of 5 DEG C/min again, isothermal curing 0.5-1h, obtains described matrix material.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105885427A (en) * | 2016-07-04 | 2016-08-24 | 刘雷 | Enhanced high-refractivity modified silicone material for LED (light emitting diode) package and preparation method thereof |
CN105936748A (en) * | 2016-06-21 | 2016-09-14 | 阜阳市光普照明科技有限公司 | Modified silica gel thermal conductive optically-focusing membrane for encapsulating chips of LED plant growth lamps |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101717584A (en) * | 2009-11-20 | 2010-06-02 | 陈俊光 | Organic silica gel packaging material of large-power LED and preparation method thereof |
CN101768363A (en) * | 2010-01-28 | 2010-07-07 | 同济大学 | Method for preparing addition highly heat-conducting room temperature-curing silicon rubber |
CN102702441A (en) * | 2012-06-06 | 2012-10-03 | 惠州市洲明节能科技有限公司 | Preparation method of organic silicon-polymethyl methacrylate composite materials |
CN103131189A (en) * | 2013-01-05 | 2013-06-05 | 中科院广州化学有限公司 | Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof |
CN103242801A (en) * | 2013-05-14 | 2013-08-14 | 汕头市骏码凯撒有限公司 | Single-component high-refractivity LED (light-emitting diode) packaging adhesive and preparation method thereof |
-
2015
- 2015-08-16 CN CN201510500323.1A patent/CN105086468A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101717584A (en) * | 2009-11-20 | 2010-06-02 | 陈俊光 | Organic silica gel packaging material of large-power LED and preparation method thereof |
CN101768363A (en) * | 2010-01-28 | 2010-07-07 | 同济大学 | Method for preparing addition highly heat-conducting room temperature-curing silicon rubber |
CN102702441A (en) * | 2012-06-06 | 2012-10-03 | 惠州市洲明节能科技有限公司 | Preparation method of organic silicon-polymethyl methacrylate composite materials |
CN103131189A (en) * | 2013-01-05 | 2013-06-05 | 中科院广州化学有限公司 | Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof |
CN103242801A (en) * | 2013-05-14 | 2013-08-14 | 汕头市骏码凯撒有限公司 | Single-component high-refractivity LED (light-emitting diode) packaging adhesive and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
张文飞,等: "高亮度发光二极管封装用透镜胶研究进展", 《微电子器件与技术》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105936748A (en) * | 2016-06-21 | 2016-09-14 | 阜阳市光普照明科技有限公司 | Modified silica gel thermal conductive optically-focusing membrane for encapsulating chips of LED plant growth lamps |
CN105885427A (en) * | 2016-07-04 | 2016-08-24 | 刘雷 | Enhanced high-refractivity modified silicone material for LED (light emitting diode) package and preparation method thereof |
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Application publication date: 20151125 |