CN105051137A - 粘合片 - Google Patents

粘合片 Download PDF

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Publication number
CN105051137A
CN105051137A CN201480016096.9A CN201480016096A CN105051137A CN 105051137 A CN105051137 A CN 105051137A CN 201480016096 A CN201480016096 A CN 201480016096A CN 105051137 A CN105051137 A CN 105051137A
Authority
CN
China
Prior art keywords
layer
adhesive sheet
binder layer
heat
expandable microsphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480016096.9A
Other languages
English (en)
Chinese (zh)
Inventor
平山高正
北山和宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN105051137A publication Critical patent/CN105051137A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
CN201480016096.9A 2013-03-15 2014-03-12 粘合片 Pending CN105051137A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013053848 2013-03-15
JP2013-053848 2013-03-15
PCT/JP2014/056548 WO2014142192A1 (fr) 2013-03-15 2014-03-12 Feuille adhésive

Publications (1)

Publication Number Publication Date
CN105051137A true CN105051137A (zh) 2015-11-11

Family

ID=51536843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480016096.9A Pending CN105051137A (zh) 2013-03-15 2014-03-12 粘合片

Country Status (5)

Country Link
JP (1) JPWO2014142192A1 (fr)
KR (1) KR102203019B1 (fr)
CN (1) CN105051137A (fr)
TW (1) TWI659084B (fr)
WO (1) WO2014142192A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107629712A (zh) * 2016-07-19 2018-01-26 日东电工株式会社 粘合片
CN107629720A (zh) * 2016-07-11 2018-01-26 日东电工株式会社 粘合片
CN110023072A (zh) * 2016-12-02 2019-07-16 3M创新有限公司 聚合物多层材料及其制备方法
CN112078123A (zh) * 2019-06-14 2020-12-15 卡西欧计算机株式会社 造形物的制造方法及造形装置
CN115141572A (zh) * 2021-03-31 2022-10-04 日东电工株式会社 粘合片

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT3040390T (pt) 2013-08-29 2019-09-05 Mitsui Chemicals Tohcello Inc Película adesiva e método para a fabricação de dispositivo semicondutor
JP6448333B2 (ja) * 2014-12-02 2019-01-09 日東電工株式会社 粘着シート
US11466185B2 (en) 2015-05-08 2022-10-11 Bando Chemical Industries, Ltd. Optical transparent adhesive sheet, method for producing optical transparent adhesive sheet, laminate and display device with touch panel
JP6163272B1 (ja) 2015-09-29 2017-07-12 バンドー化学株式会社 光学透明粘着シート、積層体、積層体の製造方法、及び、タッチパネル付き表示装置
CN108292178B (zh) * 2015-11-26 2022-03-22 阪东化学株式会社 光学透明粘着片、光学透明粘着片的制造方法、层叠体、及带有触摸屏的显示装置
WO2018139175A1 (fr) * 2017-01-26 2018-08-02 コニカミノルタ株式会社 Film stratifié fonctionnel, et procédé de production d'un film stratifié fonctionnel
CN110476241B (zh) * 2017-03-31 2023-05-09 琳得科株式会社 半导体装置的制造方法及双面粘合片
WO2018181767A1 (fr) * 2017-03-31 2018-10-04 リンテック株式会社 Procédé de production de dispositif à semiconducteur et feuille adhesive
KR20180136029A (ko) * 2017-06-13 2018-12-24 삼성디스플레이 주식회사 열박리형 접착 부재 및 이를 포함하는 표시 장치
CN110775940B (zh) * 2019-10-31 2023-08-15 潍坊歌尔微电子有限公司 Mems传感器组件制造方法、以及以该法制造的mems传感器组件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008053713A1 (fr) * 2006-11-04 2008-05-08 Nitto Denko Corporation Feuille adhésive sensible à la pression et pelable sous l'action de la chaleur, et procédé de récupération de la surface adhésive
CN102959030A (zh) * 2011-03-03 2013-03-06 日东电工株式会社 加热剥离型粘合片

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317981A (ja) * 1986-07-09 1988-01-25 F S K Kk 粘着シ−ト
JP4703833B2 (ja) 2000-10-18 2011-06-15 日東電工株式会社 エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法
JP4428908B2 (ja) * 2002-04-08 2010-03-10 日東電工株式会社 粘着シートを用いた被着体加工方法
JP4671815B2 (ja) * 2005-09-05 2011-04-20 日東電工株式会社 加熱剥離型粘着シート用セパレータ及びセパレータ付き加熱剥離型粘着シート
JP2012136717A (ja) * 2012-04-23 2012-07-19 Nitto Denko Corp 熱剥離型粘着シート及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008053713A1 (fr) * 2006-11-04 2008-05-08 Nitto Denko Corporation Feuille adhésive sensible à la pression et pelable sous l'action de la chaleur, et procédé de récupération de la surface adhésive
CN102959030A (zh) * 2011-03-03 2013-03-06 日东电工株式会社 加热剥离型粘合片

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107629720A (zh) * 2016-07-11 2018-01-26 日东电工株式会社 粘合片
CN107629720B (zh) * 2016-07-11 2021-08-10 日东电工株式会社 粘合片
CN107629712A (zh) * 2016-07-19 2018-01-26 日东电工株式会社 粘合片
CN110023072A (zh) * 2016-12-02 2019-07-16 3M创新有限公司 聚合物多层材料及其制备方法
US11097508B2 (en) 2016-12-02 2021-08-24 3M Innovative Properties Company Polymeric multilayer material and method of making the same
CN110023072B (zh) * 2016-12-02 2021-11-23 3M创新有限公司 聚合物多层材料及其制备方法
CN112078123A (zh) * 2019-06-14 2020-12-15 卡西欧计算机株式会社 造形物的制造方法及造形装置
CN115141572A (zh) * 2021-03-31 2022-10-04 日东电工株式会社 粘合片

Also Published As

Publication number Publication date
WO2014142192A1 (fr) 2014-09-18
JPWO2014142192A1 (ja) 2017-02-16
KR20150127088A (ko) 2015-11-16
KR102203019B1 (ko) 2021-01-14
TWI659084B (zh) 2019-05-11
TW201441333A (zh) 2014-11-01

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20151111

RJ01 Rejection of invention patent application after publication