CN105047642A - Port protection circuit integrated encapsulation component - Google Patents
Port protection circuit integrated encapsulation component Download PDFInfo
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- CN105047642A CN105047642A CN201510494334.3A CN201510494334A CN105047642A CN 105047642 A CN105047642 A CN 105047642A CN 201510494334 A CN201510494334 A CN 201510494334A CN 105047642 A CN105047642 A CN 105047642A
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- Prior art keywords
- matrix
- port
- circuit
- integration packaging
- guard
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- 238000005538 encapsulation Methods 0.000 title abstract 6
- 238000009826 distribution Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 239000011159 matrix material Substances 0.000 claims description 275
- 230000010354 integration Effects 0.000 claims description 191
- 238000004806 packaging method and process Methods 0.000 claims description 189
- 230000001681 protective effect Effects 0.000 claims description 102
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000004804 winding Methods 0.000 claims description 16
- 239000002002 slurry Substances 0.000 claims description 15
- 238000003475 lamination Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000001052 transient effect Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- 238000003466 welding Methods 0.000 abstract description 11
- 238000011161 development Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000003247 decreasing effect Effects 0.000 abstract 2
- 239000000306 component Substances 0.000 description 23
- 238000010586 diagram Methods 0.000 description 6
- 238000011056 performance test Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Abstract
The invention discloses a port protection circuit integrated encapsulation component. According to the port protection circuit integrated encapsulation component of the invention, longitudinally-distributed substrate structures and electric conductive encapsulation substrates are adopted to encapsulate a plurality of circuit modules, and therefore, a surface-mount area of a printed circuit board, which is occupied by components and the distribution intervals of the components can be reduced when the components are horizontally distributed, and an integrated structure is simple, and the accommodating space of an electronic device can be saved; connection can be realized through the electric conductive encapsulation substrates, and therefore, application-end welding procedures can be decreased, and fewer working hours are consumed, and production efficiency is high; each module comprises at least one circuit surge protection component, and therefore, the distribution size of the protection components can be decreased, and the miniaturization development of devices in the port protection field can be realized; and longitudinal connecting components are distributed in a staggered manner, so that protection performance and product stability can be improved. When the port protection circuit integrated encapsulation component is applied to the port circuit over-voltage protection field, contradiction between small distribution size, small accommodating space and poor over-voltage performance can be alleviated.
Description
Technical field
The application relates to port circuit protection field, is specifically related to a kind of port-guard circuit integration packaging part.
Background technology
Range throughout all trades and professions involved by current Lightning Disaster; be that the advanced electronic equipment such as computer network, measurement, monitoring, protection of core component is widely used in the industries such as electric power, aviation, national defence, security protection, communication, broadcasting and TV, finance, traffic, petrochemical industry, medical treatment with large scale integrated circuit; and being widely used in the every field of other modern life, these advanced electronic equipment ubiquities the shortcoming more weak to temporary overvoltage, overcurrent tolerance.Be not difficult to seem, along with deepen continuously research and the demand for development to miniaturized electronic devices of information industry technology, lightning protection component is the Primary Component of the protection of anti-thunder, overvoltage protection and overcurrent protection, essential, and must meet electronics miniaturization and integrated developing direction.
In port technique field, the Bob Smith circuit as electrical isolation is widely used in interface circuit as a kind of industrial standard.At present, realizing application Bob Smith circuit to the overvoltage of interface circuit, overcurrent protection scheme is all that the discrete component of Bob Smith circuit and single protective device are placed with circuits plate by repeatedly paster technique, or form module by welding discrete component and single protective device, the form again module being placed with circuits plate realizes interface protection circuit, module welding and circuit board repeatedly paster realize process many, take time and effort, testing procedure is loaded down with trivial details, reduces production efficiency; And the area that the interface protection circuit that discrete component welding and common welding module are formed takies PCB is comparatively large, reduces product serviceability.In addition, the technical requirement of common welding modular fashion to welding is high, and circuit welding stability is very poor, is not able to batch high efficiency production, can not meet electronics miniaturization, integrated, high efficiency production and high performance development trend.
Summary of the invention
The embodiment of the present application provides a kind of port-guard circuit integration packaging part, and solve existing port circuit and realize consuming time, operation is many, and the area taking PCB is comparatively large, the problem that production efficiency is low, product stability is poor.
First aspect, the embodiment of the present application provides a kind of port-guard circuit integration packaging part, comprising:
At least two matrixes spaced apart up and down, matrix described in each comprises at least one conducting connecting part for being electrically connected;
At least one circuit module distributed between adjacent described matrix, each described circuit module comprises at least one element and/or person comprises at least one integration packaging module, described in each, integration packaging module comprises at least two elements, and at least one element in all elements is circuit protective element; At least one pin link of at least one element in all circuit modules distributed between adjacent described matrix, as external electrode terminal, is distributed at least one circuit module described between adjacent described matrix and at least one matrix in adjacent described matrix and is connected by the electric connection of the conducting connecting part of described external electrode terminal and at least one matrix described; In all circuit modules, the some or all of described element with circuit interconnection relation is interconnected by its interconnection pin link; And/or,
In all circuit modules, the some or all of described element with circuit interconnection relation is interconnected by the electric connection of described interconnection pin link and same described conducting connecting part; And/or,
Described port-guard circuit integration packaging part also comprises the first cross tie part, in all circuit modules, the some or all of described element with circuit interconnection relation is connected one to one by described interconnection pin link and described conducting connecting part, and is interconnected by described first cross tie part be arranged between the described corresponding described conducting connecting part connected.
In conjunction with first aspect, in the implementation that the first is possible, matrix described in each is conductive enclosure matrix;
Matrix described in each comprises at least one for the conducting connecting part be electrically connected, and comprising:
Conductive enclosure matrix described in each is a conducting connecting part for being electrically connected.
In conjunction with the first possible implementation of first aspect, in the implementation that the second is possible, described port-guard circuit integration packaging part also comprises the first cross tie part, comprising:
Described port-guard circuit integration packaging part also comprises first longitudinal cross tie part, in all circuit modules, the some or all of described element with circuit interconnection relation is connected one to one by described interconnection pin link and described conductive enclosure matrix, and is interconnected by the described first longitudinal cross tie part be arranged between the corresponding described conductive enclosure matrix connected.
In conjunction with the implementation that the second of first aspect is possible, in the implementation that the third is possible, the arbitrary described conductive enclosure matrix in the described conductive enclosure matrix that described first longitudinal cross tie part is described correspondence connection extends longitudinally to conductive enclosure matrix described in another.
In conjunction with the third possible implementation of first aspect, in the 4th kind of possible implementation, also comprise:
For encapsulating encapsulating housing or the encapsulating obturator of all conductive enclosure matrixes in described port-guard circuit integration packaging part and all circuit modules;
For external described port-guard circuit integration packaging part to external circuit at least one described in matrix, each also comprises outer connecting connector for external described port-guard circuit integration packaging part to the described matrix of external circuit, and the described matrix of described outer connecting connector belonging to it extends described encapsulating housing or described obturator is formed.
In conjunction with the 4th kind of possible implementation of first aspect, in the 5th kind of possible implementation,
The position of the surface of matrix described at least one and the connection of described external electrode terminal is provided with grid or groove or boss.
In conjunction with the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation, the thickness of described matrix is greater than or equal to 0.05mm, and is less than or equal to 1.5mm.
In conjunction with the 4th kind of possible implementation of first aspect, in the 7th kind of possible implementation, described outer connecting connector comprises the first extension, described first extension is that the described matrix longitudinal extension comprising described outer connecting connector goes out described encapsulating housing or described encapsulating obturator, and the described outer connecting connector being positioned at the same side of described port-guard circuit integration packaging part is in staggered distribution.
In conjunction with the 7th kind of possible implementation of first aspect, in the 8th kind of possible implementation, described outer connecting connector also comprises the second extension, and described second extension is that the end horizontal expansion of described first extension is formed.
In conjunction with the 4th kind of possible implementation of first aspect, in the 9th kind of possible implementation, described outer connecting connector comprises the first extension and the second extension, described first extension is that the described matrix comprising described outer connecting connector extends longitudinally to described encapsulating housing or described obturator, described second extension is that the end of described first extension laterally extends described encapsulating housing or described obturator away from described matrix, and the described outer connecting connector being positioned at the same side of described port-guard circuit integration packaging part is in staggered distribution.
In conjunction with the first possible implementation of first aspect or first aspect to any one the possible implementation in the 9th kind of possible implementation, in the tenth kind of possible implementation,
Element in all circuit modules also comprises at least one port-guard basic circuit component, and described port-guard basic circuit component comprises any one the port-guard basic circuit component in resistance, electric capacity, inductance, fuse and surge protective device;
Described circuit protective element comprises gas discharge tube or Transient Voltage Suppressor or piezo-resistance or thermistor or semiconductor discharge tube or fuse.
In conjunction with the first possible implementation of first aspect or first aspect to any one the possible implementation in the 9th kind of possible implementation, in the 11 kind of possible implementation, described port-guard circuit integration packaging part comprises at least one circuit module distributed between adjacent described matrix, comprising:
Described port-guard circuit integration packaging part comprises the circuit module that at least one that distribute between adjacent described matrix comprises the integrated module of RC, the integrated module of described RC comprises first resistance and the first electric capacity with series winding relation, and the integrated module of wherein said RC comprises:
First capacitance electrode layer of lamination, the first dielectric layer and resistive layer successively.
In conjunction with the 11 kind of possible implementation of first aspect, in the 12 kind of possible implementation, described first dielectric layer comprises N number of dielectric layer of contraposition lamination, pressing, is connected with inner electrode layer between two the often adjacent dielectric layers in all N number of dielectric layers; Described N be greater than 0 integer.
In conjunction with the 12 kind of possible implementation of first aspect, in the 13 kind of possible implementation, the integrated module of described RC also comprises:
Be stacked on the second capacitance electrode layer between described first dielectric layer and described resistive layer.
In conjunction with the 13 kind of possible implementation of first aspect, in the 14 kind of possible implementation, described resistive layer comprises:
First resistance slurry printed layers of lamination and resistance electrode layer from the bottom to top.
In conjunction with the 14 kind of possible implementation of first aspect, in the 15 kind of possible implementation, the integrated module of described RC also comprises:
Be stacked on second dielectric layer on described second capacitance electrode layer surface;
Described second dielectric layer offers through hole;
Described resistive layer comprises:
For filling described through hole, and be printed in the described first resistance slurry printed layers on the described second capacitance electrode layer surface in described through hole;
Be stacked on the described resistance electrode layer on described first resistance slurry printed layers surface.
In conjunction with the 15 kind of possible implementation of first aspect, in the 16 kind of possible implementation, described first dielectric layer is the first ceramic dielectric matrix for making capacitor, and described second dielectric layer is the second ceramic dielectric matrix for making capacitor.
In conjunction with the 16 kind of possible implementation of first aspect, in the 17 kind of possible implementation, described first ceramic dielectric matrix is brium carbonate dielectric base body, calcium titanate dielectric base body or magnesium titanate dielectric base body.
In conjunction with the 17 kind of possible implementation of first aspect, in the 18 kind of possible implementation, described first capacitance electrode layer, described second capacitance electrode layer, described resistance electrode layer comprise alloy formed by handle, platinum, gold, silver, copper or nickel or above-mentioned at least two kinds of metals.
In conjunction with the 18 kind of possible implementation of first aspect, in the 19 kind of possible implementation, described first resistance slurry printed layers is ruthenium system resistance slurry.
In conjunction with the 11 kind of possible implementation of first aspect, in the 20 kind of possible implementation, the element in all circuit modules also comprises at least one port-guard basic circuit component, comprising:
Element in all circuit modules also comprises N number of resistance and N number of electric capacity, described N is more than or equal to 1, described N number of resistance and described N number of electric capacity one_to_one corresponding are electrically contacted, wherein, the first pin link of arbitrary described resistance is connected to the first pin link of the described electric capacity that connects corresponding to described resistance;
And, element in all circuit modules also comprises N-1 circuit protective element, all N number of circuit protective elements and described N number of resistance one_to_one corresponding electrical interconnects, described N number of circuit protective element and described N number of electric capacity one_to_one corresponding electrical interconnects, wherein, second pin link of resistance described in each connects one to one with two pin links of the second pin link of electric capacity described in each with the corresponding described circuit protective element be connected, and, the described second pin link interconnection of all electric capacity.
In conjunction with the 11 kind of possible implementation of first aspect, in the 21 kind of possible implementation, described port-guard circuit integration packaging part comprises at least two matrixes spaced apart up and down, comprising:
Described port-guard circuit integration packaging part comprises the first matrix spaced apart up and down, the second matrix and the 3rd matrix;
Distribute between adjacent described first matrix and described second matrix the first circuit module, described first circuit module comprises the integrated module of described RC, a pin link of described first resistance except the pin link of described first resistance and described first electric capacity series winding and a pin link of described first electric capacity are as two external electrode terminals of described first circuit module, described first circuit module is electrically connected and is connected by described two external electrode terminals of described first circuit module with the one_to_one corresponding of described first matrix and described second matrix with described first matrix and described second matrix,
Distribute between adjacent described second matrix and described 3rd matrix second circuit module, described second circuit module comprises a described circuit protective element, and two pin links of described circuit protective element are as two external electrode terminals of described second circuit module; Described second circuit module is connected by two external electrode terminals of described second circuit module and corresponding electric connection of described second matrix and described 3rd matrix with described second matrix and described 3rd matrix.
In conjunction with the 21 kind of possible implementation of first aspect, in the 22 kind of possible implementation, described circuit protective element and described first electric capacity/described first resistance are to the element of external circuit for external described port-guard circuit integration packaging part, described first matrix, described second matrix and described 3rd matrix are as external described port-guard circuit integration packaging part to three conductive enclosure matrixes of external circuit, and described first matrix, described second matrix and described 3rd matrix comprise outer connecting connector described in respectively.
In conjunction with the 22 kind of possible implementation of first aspect, in the 23 kind of possible implementation, the outer connecting connector of described first matrix and the outer connecting connector of described 3rd matrix are positioned at the same side of described port-guard circuit integration packaging part.
In conjunction with the 21 kind of possible implementation of first aspect, in the 24 kind of possible implementation, described circuit protective element is to the element of external circuit for external described port-guard circuit integration packaging part, described second matrix, described 3rd matrix are respectively as external described port-guard circuit integration packaging part to the conductive enclosure matrix of external circuit, and described second matrix and described 3rd matrix comprise outer connecting connector described in respectively;
A pin link of described first electric capacity except described first resistance and described first electric capacity series winding and two pin link one_to_one corresponding of a pin link of described first resistance and described circuit protective element interconnect, and the pin link of described first resistance/described first electric capacity except described first resistance and described first electric capacity are contacted and a pin link of described circuit protective element and described second matrix are electrically connected and realize interconnecting; And,
Described port-guard circuit integration packaging part also comprises the first cross tie part, comprising:
Described port-guard circuit integration packaging part also comprises and being connected between described first matrix and described 3rd matrix, and for realizing described first longitudinal cross tie part that described first resistance/described first electric capacity and described circuit protective element carry out interconnecting.
In conjunction with the 24 kind of possible implementation of first aspect, in the 25 kind of possible implementation,
Described first longitudinal cross tie part is that the end of described first matrix extends to described 3rd matrix towards described 3rd matrix.
In conjunction with the 21 kind of possible implementation of first aspect, in the 26 kind of possible implementation, the thickness of all substrates is greater than or equal to 0.1mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.0mm, the length of described port-guard circuit integration packaging part is less than or equal to 6mm, be greater than or equal to 1.5mm, the width of described port-guard circuit integration packaging part is less than or equal to 6mm, is greater than or equal to 1.5mm.
In conjunction with the 21 kind of possible implementation of first aspect, in the 27 kind of possible implementation, the thickness of all substrates is greater than or equal to 0.2mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.5mm, the length of described port-guard circuit integration packaging part is less than or equal to 5.5mm, be greater than or equal to 5mm, the width of described port-guard circuit integration packaging part is less than or equal to 3.6mm, is greater than or equal to 3mm.
In conjunction with first aspect, in the 28 kind of possible implementation, matrix described in each is insulation-encapsulated matrix;
Matrix described in each comprises at least one for the conducting connecting part be electrically connected, and comprising:
The outer surface of matrix described in each adheres at least one conducting connecting part for being electrically connected.
In conjunction with the 28 kind of possible implementation of first aspect, in the 29 kind of possible implementation,
The outer surface of matrix described in each adheres at least one for the conducting connecting part be electrically connected, and comprising:
The upper surface of carrier described in each and/or lower surface adhere at least one conducting connecting part for being electrically connected.
In conjunction with the 29 kind of possible implementation of first aspect, in the 30 kind of possible implementation,
Described port-guard circuit integration packaging part also comprises the first cross tie part, comprising:
Described port-guard circuit integration packaging part also comprises first longitudinal cross tie part;
Be distributed between different adjacent base, and the described element with circuit interconnection relation is connected one to one by described interconnection pin link and described conducting connecting part, and interconnected by the described first longitudinal cross tie part be arranged between the corresponding described conducting connecting part connected;
The described conducting connecting part that described correspondence connects has the first intersection area in the projection perpendicular to described matrix place plane;
Described port-guard circuit integration packaging part also comprises:
The corresponding described conducting connecting part that connects and between region in the position that described first intersection area is corresponding, the first through hole run through is set; Described first longitudinal cross tie part is connected to the described conducting connecting part of described correspondence connection through described first through hole.
In conjunction with the 30 kind of possible implementation of first aspect, in the 31 kind of possible implementation, the upper and lower parallel interval distribution of all substrates, all first longitudinal cross tie parts perpendicular to described matrix, and are positioned at described the same side of described matrix.
The port-guard circuit integration packaging part that the embodiment of the present application provides, the basal body structure of genesis analysis and the conducting connecting part of matrix is adopted to encapsulate multiple circuit module, the surface area of the printed substrate taken when reducing element cross direction profiles, distribute spacing between components and parts and the distribute spacing between PCB layout, integrated morphology is simple, saves the accommodation space of electronic equipment.In addition, can reduce application end welding sequence by the connection of conducting connecting part, can reduce PCB paster production process, man-hour used is few, and production efficiency is high.In addition, while reducing the volume of distribution of protective device, at least one circuit protective element integrated promotes port-guard performance, is achieved the device miniaturization development in port-guard field.And the regular distribution of longitudinal connector improves barrier propterty and product stability, be applied to port circuit overvoltage protection field, can solve that volume of distribution is little, accommodation space is little and contradiction between overvoltage poor performance.
In addition, this embodiment reduces the application testing standard of multiple element, only carry out adjustment to the performance test standard of this integration member and Realization of Product standard to confirm, just batch standardized production can apply the port circuit of Bob Smith port circuit overvoltage protectiving scheme.
In addition, the action of multiple element circuitry composite behaviour test when repeatedly independent performance test and complete machine are applied when the present embodiment can reduce the production of multiple discrete component, achieve port-guard circuit application Bob Smith overvoltage Protection Product, the production of a paster welding, an element primary production test, an application performance test, the operation when equipment applying this port-guard circuit is realized greatly reduces, save the device fabrication time, improve production efficiency.
In addition, the standardized production of integration member can ensure the stability that circuit application connects, and during device fabrication, the minimizing of welding circuit board number of times also can promote the stability of circuit application connection.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The front section view of a kind of port-guard circuit integration packaging part that Fig. 1 a provides for the embodiment of the present application;
The structural representation of the integrated module of a kind of RC that Fig. 1 b provides for the embodiment of the present application;
The circuit structure diagram of a kind of port-guard circuit integration packaging part that Fig. 1 c provides for the embodiment of the present application;
The application circuit of a kind of port-guard circuit integration packaging part that Fig. 1 d provides for the embodiment of the present application;
A kind of structure chart of the integrated module of RC that Fig. 2 a provides for the embodiment of the present application;
The another kind of structure chart of the integrated module of RC that Fig. 2 b provides for the embodiment of the present application;
The circuit structure of the another kind of port-guard circuit integration packaging part that Fig. 3 a provides for the embodiment of the present application;
The front cross-sectional structure chart of the another kind of port-guard circuit integration packaging part that Fig. 3 b provides for the embodiment of the present application;
The circuit structure diagram of the another kind of port-guard circuit integration packaging part that Fig. 4 provides for the present embodiment;
The circuit structure diagram of the another kind of port-guard circuit integration packaging part that Fig. 5 provides for the present embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, be clearly and completely described the technical scheme in the embodiment of the present application, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Below by specific embodiment, be described in detail respectively.
Due to the miniaturization of equipment, its area and volume had larger minimizing all more in the past, but it can be but more and more weak to jamproof ability, and this also requires more and more harsher to the lightning protection of equipment.Therefore, the present embodiment provides a kind of port-guard circuit integration packaging part, comprising:
At least two matrixes spaced apart up and down, each matrix comprises at least one conducting connecting part for being electrically connected;
At least one circuit module distributed between adjacent base, each circuit module comprises at least one element and/or person comprises at least one integration packaging module, each integration packaging module comprises at least two elements, each element comprises at least one pin link, and at least one element in all elements is circuit protective element; At least one pin link of at least one element in all circuit modules distributed between adjacent base, as external electrode terminal, is distributed at least one circuit module between adjacent base and at least one matrix in adjacent base and is connected by the electric connection of the conducting connecting part of external electrode terminal and at least one matrix; In all circuit modules, the some or all of element with circuit interconnection relation is interconnected by its interconnection pin link; And/or,
In all circuit modules, the some or all of element with circuit interconnection relation is interconnected by the electric connection of interconnection pin link and same conducting connecting part; And/or,
Port-guard circuit integration packaging part also comprises the first cross tie part, in all circuit modules, the some or all of element with circuit interconnection relation is connected one to one by interconnection pin link and conducting connecting part, and is interconnected by the first cross tie part be arranged between the corresponding conducting connecting part connected.
As the optional execution mode of one, each matrix is conductive enclosure matrix;
Each matrix comprises at least one for the conducting connecting part be electrically connected, and comprising:
Each conductive enclosure matrix is a conducting connecting part for being electrically connected.Therefore, be distributed at least one circuit module between adjacent base and at least one matrix in adjacent base and be connected by the electric connection of the conducting connecting part of external electrode terminal and at least one matrix, comprising:
Be distributed at least one circuit module between adjacent base and at least one matrix in adjacent base to be connected by the electric connection of external electrode terminal and at least one matrix.
As the optional execution mode of one, port-guard circuit integration packaging part also comprises the first cross tie part, comprising:
Port-guard circuit integration packaging part also comprises first longitudinal cross tie part, first longitudinal cross tie part is that in all circuit modules, the some or all of element with circuit interconnection relation is connected one to one by interconnection pin link and conductive enclosure matrix, and is interconnected by the first longitudinal cross tie part be arranged between the corresponding conductive enclosure matrix connected.
As the optional execution mode of one, the conductive enclosure matrix that the interconnection pin link correspondence with the element of circuit interconnection relation connects is by the first longitudinal cross tie part interconnection, and first longitudinal cross tie part is that the end of arbitrary conductive enclosure matrix in the corresponding conductive enclosure matrix connected extends longitudinally to another conductive enclosure matrix.
As the optional execution mode of one, conductive enclosure matrix is conducting connecting part, be specially conductive frame, conductive frame comprises the conductive pin that conductive tray and conductive tray extend to form, conductive tray is used for potted element, conductive pin is used for being connected with the pin link of external circuits or interconnection element, the some or all of element with interconnecting relation is interconnected by the connection of interconnection pin link and same conductive tray, or/and the some or all of element with interconnecting relation is interconnected by the conductive pin of longitudinal extension.
As the optional execution mode of one, conductive frame is metal framework.
As the optional execution mode of one, metal framework is copper lead frame.
As the optional execution mode of one, port-guard circuit integration packaging part also comprises:
For encapsulating housing or the encapsulating obturator of all conductive enclosure matrixes in enclosure ports protection circuit integration packaging part and all circuit modules;
And comprise:
For external-connected port protection circuit integration packaging part at least one matrix of external circuit, wherein, also comprise outer connecting connector for external-connected port protection circuit integration packaging part at least one matrix of external circuit, the matrix of outer connecting connector belonging to it extends encapsulating housing or obturator is formed.
As the optional execution mode of one, the position that matrix is connected to external electrode terminal is provided with grid or square groove or u-shaped groove or boss.
As the optional execution mode of one, the thickness of matrix is greater than or equal to 0.05mm, and is less than or equal to 1.5mm.
Preferably, the thickness of described matrix is greater than or equal to 0.08mm, and is less than or equal to 1.4mm.
Preferably, the thickness of described matrix is greater than or equal to 0.09mm, and is less than or equal to 1.3mm.
Preferably, the thickness of described matrix is greater than or equal to 0.1mm, and is less than or equal to 1.2mm.
Preferably, the thickness of described matrix is 0.2mm or 0.3mm or 0.4mm or 0.5mm or 0.6mm or 0.7mm or 0.8mm or 0.9mm or 1.0mm or 1.1mm or 1.2mm or 1.35mm or 1.45mm or 0.45mm or 0.55mm or 0.65mmmm or 0.75mm or 0.48mm or 0.49mm or 0.43mm, and specific implementation is not by the restriction of single embodiment.
As the optional execution mode of one, outer connecting connector comprises the first extension, first extension is that the end of the matrix comprising outer connecting connector extends encapsulating housing or encapsulating obturator along the direction perpendicular to matrix, and the outer connecting connector being positioned at the same side of port-guard circuit integration packaging part is in staggered distribution.
As the optional execution mode of one, outer connecting connector comprises the first extension, first extension is that the end of the matrix comprising outer connecting connector extends to encapsulating housing or encapsulates the outer surface of obturator along the direction perpendicular to matrix, and the outer connecting connector being positioned at the same side of port-guard circuit integration packaging part is in staggered distribution.
As the optional execution mode of one, outer connecting connector comprises the first extension and the second extension, first extension is that the end of the matrix comprising outer connecting connector extends encapsulating housing or encapsulating obturator along the direction perpendicular to matrix, and the second extension is that the end of the first extension is formed along the direction horizontal-extending perpendicular to the first extension.
As the optional execution mode of one, outer connecting connector comprises the first extension and the second extension, first extension be the end of the matrix comprising outer connecting connector along extending encapsulating housing or encapsulating obturator perpendicular to the direction of matrix, the second extension be the first extension end along the direction level perpendicular to the first extension dorsad matrix extend to form.
As the optional execution mode of one, outer connecting connector comprises the first extension and the second extension, first extension is that the end of the matrix comprising outer connecting connector extends encapsulating housing or encapsulating obturator along the direction perpendicular to matrix, and the second extension is that the end of the first extension laterally extends to form towards matrix along the direction perpendicular to the first extension.
As the optional execution mode of one, outer connecting connector comprises the first extension and the second extension, first extension is that the end of the matrix comprising outer connecting connector extends to encapsulating housing or encapsulates the outer surface of obturator along the direction perpendicular to matrix, and the second extension is that the end of the first extension extends to form along the horizontal matrix dorsad in direction perpendicular to the first extension.
As the optional execution mode of one, outer connecting connector comprises the first extension and the second extension, first extension is that the end of the matrix comprising outer connecting connector extends to encapsulating housing or encapsulates the outer surface of obturator along the direction perpendicular to matrix, and the second extension is that the end of the first extension laterally extends to form towards matrix along the direction perpendicular to the first extension.
As the optional execution mode of one, outer connecting connector comprises the first extension and the second extension, first extension is that the matrix comprising outer connecting connector extends to the inward flange encapsulating housing or obturator along the direction perpendicular to matrix, second extension is that the end of the first extension extends encapsulating housing or encapsulating obturator along the direction perpendicular to the first extension away from matrix, and the outer connecting connector being positioned at the same side of port-guard circuit integration packaging part is in staggered distribution.
As the optional execution mode of one, also comprise at least one port-guard basic circuit component, port-guard basic circuit component comprises any one the port-guard basic circuit component in resistance, electric capacity, inductance, fuse and surge protective device, and circuit protective element comprises gas discharge tube or Transient Voltage Suppressor or piezo-resistance or thermistor or semiconductor discharge tube or fuse.
As the optional execution mode of one, surge protective device comprises gas discharge tube or Transient Voltage Suppressor or piezo-resistance or thermistor or semiconductor discharge tube or fuse.
As the optional execution mode of one, port-guard circuit integration packaging part comprises at least one circuit module distributed between adjacent base, comprising:
Port-guard circuit integration packaging part comprises the circuit module comprising the integrated module of RC distributed between adjacent base, and the integrated module of RC comprises first resistance and the first electric capacity with series winding relation, and wherein the integrated module of RC comprises:
First capacitance electrode layer, the first ceramic matrix, the second capacitance electrode layer, the resistance printed layers of lamination successively.
As the optional execution mode of one, the integrated module of RC also comprises:
Be stacked on second ceramic matrix on the second capacitance electrode layer surface, the second ceramic matrix offers through hole;
Resistance printed layers comprises:
For filling vias, and be printed in the first resistance printed layers on the second capacitance electrode layer surface in through hole;
Be printed in the resistance electrode layer on the first resistance printed layers surface.
As the optional execution mode of one, port-guard circuit integration packaging part comprise at least one circuit module distributed between adjacent base, comprising:
Port-guard circuit integration packaging part comprise the circuit module that at least one that distribute between adjacent base comprise the integrated module of RC, the integrated module of RC comprises first resistance and the first electric capacity with series winding relation, and wherein the integrated module of RC comprises:
First capacitance electrode layer of lamination, the first dielectric layer and resistive layer successively.
As the optional execution mode of one, the first dielectric layer comprises N number of dielectric layer of contraposition lamination, pressing, is connected with inner electrode layer between two the often adjacent dielectric layers in all N number of dielectric layers; N be greater than 0 integer.
As the optional execution mode of one, the integrated module of RC also comprises:
Be stacked on the second capacitance electrode layer between the first dielectric layer and resistive layer.
As the optional execution mode of one, resistive layer comprises:
First resistance slurry printed layers of lamination and resistance electrode layer from the bottom to top.
As the optional execution mode of one, the integrated module of RC also comprises:
Be stacked on second dielectric layer on the second capacitance electrode layer surface;
Second dielectric layer offers through hole;
Resistive layer comprises:
For filling vias, and be printed in the first resistance slurry printed layers on the second capacitance electrode layer surface in through hole;
Be stacked on the resistance electrode layer on the first resistance slurry printed layers surface.
As the optional execution mode of one, the first dielectric layer is the first ceramic dielectric matrix for making capacitor, and the second dielectric layer is the second ceramic dielectric matrix for making capacitor.
As the optional execution mode of one, the first ceramic dielectric matrix is brium carbonate dielectric base body, calcium titanate dielectric base body or magnesium titanate dielectric base body.
As the optional execution mode of one, the first capacitance electrode layer, the second capacitance electrode layer, resistance electrode layer comprise alloy formed by handle, platinum, gold, silver, copper or nickel or above-mentioned at least two kinds of metals.
As the optional execution mode of one, the first resistance slurry printed layers is ruthenium system resistance slurry.
As the optional execution mode of one, at least one element in all circuit modules is outside circuit protective element, also have 2N port-guard basic circuit component, N is more than or equal to 1, N number of element in 2N port-guard basic circuit component is resistance, and another N number of element is electric capacity, and N number of resistance and N number of electric capacity one_to_one corresponding are electrically contacted, wherein, the first pin link of each resistance is connected to the first pin link of the electric capacity that connects corresponding to resistance;
And, also comprise N-1 circuit protective element, all circuit protective elements and N number of resistance one_to_one corresponding electrical interconnects, all circuit protective elements and N number of electric capacity one_to_one corresponding electrical interconnects, wherein, one of them pin link in two pin links of arbitrary circuit protective element is connected to the second pin link of the resistance that connects corresponding to circuit protective element, and another pin link in two pin links of arbitrary circuit protective element is connected to the second pin link of the electric capacity that connects corresponding to circuit protective element, and, second pin link interconnection of all electric capacity.
Another embodiment
The present embodiment provides a kind of port-guard circuit integration packaging part, comprising:
At least two matrixes spaced apart up and down, each matrix comprises at least one conducting connecting part for being electrically connected;
At least one circuit module distributed between adjacent base, each circuit module comprises at least one element and/or person comprises at least one integration packaging module, each integration packaging module comprises at least two elements, each element comprises at least one pin link, and at least one element in all elements is circuit protective element; At least one pin link of at least one element in all circuit modules distributed between adjacent base, as external electrode terminal, is distributed at least one circuit module between adjacent base and at least one matrix in adjacent base and is connected by the electric connection of the conducting connecting part of external electrode terminal and at least one matrix; In all circuit modules, the some or all of element with circuit interconnection relation is interconnected by interconnection pin link; And/or,
In all circuit modules, the some or all of element with circuit interconnection relation is interconnected by the electric connection of interconnection pin link and same conducting connecting part; And/or,
Port-guard circuit integration packaging element also comprises the first cross tie part, in all circuit modules, the some or all of element with circuit interconnection relation is connected one to one by interconnection pin link and conducting connecting part, and is interconnected by the first cross tie part be arranged between the corresponding conducting connecting part connected.
In the present embodiment, an element in all elements is circuit protective element, also comprises two port-guard basic circuit components, is the first resistance and first electric capacity with series winding interconnected relationship respectively.The circuit structure carrying out contacting for the first resistance and the first electric capacity below, and composition graphs 1a to Fig. 5 is specifically described the port-guard circuit integration packaging part that the present embodiment realizes this circuit structure corresponding.Refer to Fig. 1 a to Fig. 2 b, the front section view of a kind of port-guard circuit integration packaging part that Fig. 1 a provides for the embodiment of the present application; The structural representation of the integrated module of a kind of RC that Fig. 1 b provides for the embodiment of the present application; The circuit structure diagram of a kind of port-guard circuit integration packaging part that Fig. 1 c provides for the embodiment of the present application; The application circuit of a kind of port-guard circuit integration packaging part that Fig. 1 d provides for the embodiment of the present application.Be described for a circuit module of three each distributions between matrix and adjacent base below, as shown in Figure 1a, the port-guard circuit integration packaging part that the present embodiment provides comprises the first matrix Z1, the second matrix Z2 and the 3rd matrix Z3, and comprise the first circuit module M1 be distributed between the first adjacent matrix Z1 and the second matrix Z2, and comprise the second circuit module M2 be distributed between the second adjacent matrix Z2 and the 3rd matrix Z3; And, first circuit module M1 comprises the integrated module of RC, as shown in Figure 1 b, the integrated module of RC comprises the first resistance R and the first electric capacity C with series winding interconnected relationship, wherein the first resistance R and the first electric capacity C is vertical structure distribution, and namely the two ends opposing upper and lower of the integrated module of RC are the pin link of its external circuits.Second circuit module M2 comprises a circuit protective element, and the first matrix Z1 comprises outer connecting connector 110, second matrix Z2 and comprises outer connecting connector the 120, three matrix Z3 and comprise outer connecting connector 130.Wherein, the first matrix Z1, the second matrix Z2 and the 3rd matrix Z3 are spaced apart up and down, are all conductive enclosure matrix.
In the present embodiment, the first pin link of the first resistance R and the first pin link of the first electric capacity C are as two external electrode terminals of the first circuit module M1, the second pin link series winding of the second pin link of the first resistance R and the first electric capacity C, the first circuit module M1 and the first matrix Z1 and the second matrix Z2 are connected by two external electrode terminals of the first circuit module M1 and corresponding electric connection of the first matrix Z1 and the second matrix Z2.And two pin links of circuit protective element are as two external electrode terminals of second circuit module M2; Second circuit module M2 is connected by two external electrode terminals of second circuit module M2 and corresponding electric connection of the second matrix Z2 and the 3rd matrix Z3 with the second matrix Z2 and the 3rd matrix Z3.As illustrated in figure 1 c, in the port-guard circuit integration packaging part that the present embodiment provides except the first resistance R and the first electric capacity C interconnects, also there is interconnected relationship in the first resistance R and circuit protective element, in the present embodiment, the integrated module of RC that is interconnected by of the first resistance R and the first electric capacity C realizes, and the first resistance R and circuit protective element realize interconnecting by following structure:
First resistance R and circuit protective element are by the first pin link of the first resistance R and a pin link of circuit protective element and same matrix, and namely the common electric connection of the second matrix Z2 interconnects.
In other embodiments, can distribute the first resistance R and the first electric capacity C between different matrix, and the first resistance R carries out being connected with same matrix the interconnection realizing the first resistance R and the first electric capacity C with the first electric capacity C.
Particularly, in the present embodiment, the circuit structure of the port-guard circuit integration packaging part that the present embodiment provides is described according to Fig. 1 c, as illustrated in figure 1 c, there is interconnected relationship in the first resistance R in the present embodiment and circuit protective element, and first exists interconnected relationship between resistance R and the first electric capacity C, particularly, first resistance R is connected to a pin link of circuit protective element by its first pin link, and the second pin link of the first resistance R and the second pin link of the first electric capacity C have series winding relation.In the present embodiment, the upper end in the two ends opposing upper and lower of the integrated module of setting RC is the first pin link of the first electric capacity C, and the lower end in the two ends opposing upper and lower of the integrated module of RC is the first pin link of the first resistance R.It is the first electric capacity C and circuit protective element that the present embodiment setting is used for external-connected port protection circuit integration packaging part to the element of external circuit, then the first pin link of the first electric capacity C and two pin links of circuit protective element are used for external-connected port protection circuit integration packaging part to external circuit.Particularly, the first pin link of the first electric capacity C is connected to external circuit by the first matrix Z1 be electrically connected corresponding to it, and two pin links of circuit protective element are connected to external circuit by the second matrix Z2 of being connected respectively with it and the 3rd matrix Z3.As shown in Figure 1 d, the port-guard circuit integration packaging part that the present embodiment provides is when applying, first electric capacity C and circuit protective element interconnect, therefore, the outer connecting connector 110 of the first matrix Z1 in port-guard circuit integration packaging part and the outer connecting connector 130 of the 3rd matrix Z3 are positioned at the same side of port-guard circuit integration packaging part, when applying paster, the interconnected pin link of the first electric capacity C and circuit protective element realizes interconnection when applying by outer connecting connector 110 and outer connecting connector 130 with the connection of the same pad on printed substrate.
Preferably, as shown in Figure 1a, the port-guard circuit integration packaging part that the present embodiment provides also comprises encapsulating housing (or the encapsulating obturator) P for all conductive enclosure matrixes in enclosure ports protection circuit integration packaging part and all circuit modules.
In the present embodiment, the conductive enclosure matrix connected for external-connected port protection circuit integration packaging part to the element correspondence of external circuit also comprises conductive enclosure matrix and extends encapsulating housing or obturator and the outer connecting connector that formed, preferably, in the present embodiment, outer connecting connector 110, outer connecting connector 120 and outer connecting connector 130 matrix be respectively belonging to it extend encapsulating housing or obturator is formed.Particularly, outer connecting connector 110, outer connecting connector 120 and outer connecting connector 130 comprise the first extension and the second extension respectively, first extension is that the matrix comprising outer connecting connector extends to encapsulating housing or encapsulates the inward flange of obturator along the direction perpendicular to matrix, second extension is that the end of the first extension extends encapsulating housing P (or encapsulating obturator) along the direction perpendicular to the first extension away from matrix, and the outer connecting connector of the same side being positioned at port-guard circuit integration packaging part is in staggered distribution.
As the optional execution mode of one, refer to a kind of structure chart of the integrated module of RC that Fig. 2 a and Fig. 2 b, Fig. 2 a provides for the embodiment of the present application, the another kind of structure chart of the integrated module of RC that Fig. 2 b provides for the embodiment of the present application, as shown in Figure 2 a, the integrated module of RC comprises:
First capacitance electrode layer 200, first ceramic matrix 210, second capacitance electrode layer 220, the resistance printed layers 230 of lamination successively.
Preferably, the realization of Bob Smith circuit can adopt the integrated modular structure of RC as shown in Figure 2 b, and particularly, the integrated module of RC comprises:
First capacitance electrode layer 200, first ceramic matrix 210, second capacitance electrode layer 220 of lamination successively;
Be stacked on the resistance printed layers 230 on the second capacitance electrode layer 220 surface, resistance printed layers 230 comprises the second ceramic matrix 231, second ceramic matrix 231 and offers through hole 232;
For filling vias 232, and be printed in the first resistance printed layers 233 on the second capacitance electrode layer 220 surface in through hole 232;
Be printed in the resistance electrode layer 234 on the first resistance printed layers 233 surface.
In other embodiments, as the optional execution mode of one, upper end in the two ends opposing upper and lower of the integrated module of setting RC is the first pin link of the first resistance R, and the lower end in the two ends opposing upper and lower of the integrated module of RC is the first pin link of the first electric capacity C.And the circuit connecting relation in present embodiment is the first electric capacity C and circuit protective element there is interconnected relationship, and first exists interconnected relationship between resistance R and the first electric capacity C, particularly, interconnected relationship in present embodiment is that the first electric capacity C is connected to a pin link of circuit protective element by its first pin link, and the second pin link of the first resistance R and the second pin link of the first electric capacity C have series winding relation.It is the first resistance R and circuit protective element that the present embodiment setting is used for external-connected port protection circuit integration packaging part to the element of external circuit, then the first pin link of the first resistance R and two pin links of circuit protective element are used for external-connected port protection circuit integration packaging part to external circuit.Particularly, the first pin link of the first resistance R is connected to external circuit by the first matrix Z1 be electrically connected corresponding to it, and two pin links of circuit protective element are connected to external circuit by the second matrix Z2 of being connected respectively with it and the 3rd matrix Z3.The port-guard circuit integration packaging part that the present embodiment provides is when applying, first resistance R and circuit protective element interconnect, therefore, the outer connecting connector 110 of the first matrix Z1 in port-guard circuit integration packaging part and the outer connecting connector 130 of the 3rd matrix Z3 are positioned at the same side of port-guard circuit integration packaging part, when applying paster, the interconnected pin link of the first resistance R and circuit protective element realizes interconnection when applying by outer connecting connector 110 and outer connecting connector 130 with the connection of the same pad on printed substrate.In present embodiment, the integrated module of RC that is interconnected by of the first resistance R and the first electric capacity C realizes, and the first electric capacity and circuit protective element realize interconnecting by following structure:
First electric capacity C and circuit protective element are by the first pin link of the first electric capacity C and a pin link of circuit protective element and same matrix, and namely the common electric connection of the second matrix Z2 interconnects.
As the optional execution mode of one, circuit protective element is gas discharge tube or Transient Voltage Suppressor or piezo-resistance or thermistor or semiconductor discharge tube or fuse.
Preferably, the position that matrix is connected to external electrode terminal is provided with grid or square groove or u-shaped groove or boss.Particularly, the position that in the present embodiment, the first matrix Z1 is connected to external electrode terminal is provided with boss, and the position that the second matrix Z2 is connected to external electrode terminal is provided with groove.And the 3rd the position being connected to external electrode terminal of matrix Z3 be provided with boss.
As the optional execution mode of one, the thickness of matrix is greater than or equal to 0.05mm, and is less than or equal to 1.5mm.
As the optional execution mode of one, the thickness of matrix is greater than or equal to 0.08mm, and is less than or equal to 1.2mm.
As the optional execution mode of one, the thickness of matrix is greater than or equal to 1mm, and is less than or equal to 1.3mm.
Preferably, the thickness of all substrates is greater than or equal to 0.1mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.0mm, the length of described port-guard circuit integration packaging part is less than or equal to 6mm, be greater than or equal to 1.5mm, the width of described port-guard circuit integration packaging part is less than or equal to 6mm, is greater than or equal to 1.5mm.
Preferably, the thickness of all substrates is greater than or equal to 0.2mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.5mm, the length of described port-guard circuit integration packaging part is less than or equal to 5.5mm, be greater than or equal to 5mm, the width of described port-guard circuit integration packaging part is less than or equal to 3.6mm, is greater than or equal to 3mm.
Another embodiment
Refer to Fig. 3 a to Fig. 3 b, the circuit structure of the another kind of port-guard circuit integration packaging part that Fig. 3 a provides for the embodiment of the present application, the front cross-sectional structure chart of the another kind of port-guard circuit integration packaging part that Fig. 3 b provides for the embodiment of the present application.As shown in Fig. 3 a to Fig. 3 b, based on the circuit structure shown in Fig. 1 c, the first pin link of the first electric capacity C in the present embodiment is connected with another pin link of circuit protective element, directly realizes the interconnected relationship of the first electric capacity C and circuit protective element with the port-guard circuit integration packaging part provided by the present embodiment.In the present embodiment, as shown in Figure 3 b, port-guard circuit integration packaging part also comprises first longitudinal cross tie part 300, first longitudinal cross tie part is have the first electric capacity C of circuit interconnection relation and circuit protective element connects one to one by needing the pin link of interconnection and the first matrix Z1 and the 3rd matrix Z3 separately, and interconnected by the first longitudinal cross tie part 300 be arranged between the corresponding conductive enclosure matrix (the first matrix Z1 and the 3rd matrix Z3) connected, first longitudinal cross tie part 300 is positioned at inside or the outside of encapsulating housing or obturator.
Particularly, please refer to the port-guard circuit integration packaging part that Fig. 3 b provides, the end of the first matrix Z1 of the first pin link correspondence connection of the first electric capacity C extends to the 3rd matrix, extends to the plane domain at the place, position that the 3rd matrix is connected with external electrode terminal particularly.In addition, the difference of the port-guard circuit integration packaging part shown in the present embodiment from Fig. 1 a is that the structure of outer connecting connector is different, in the present embodiment, it is circuit protective element that setting is used for external-connected port protection circuit integration packaging part to the element of external circuit, namely two pin links of initialization circuit protective element are used for external-connected port protection circuit integration packaging part to external circuit, particularly, two pin links of circuit protective element are connected to external circuit by the second matrix Z2 of being connected respectively with it and the 3rd matrix Z3, namely the second matrix Z2 comprises outer connecting connector 310,3rd matrix Z3 comprises outer connecting connector 320, outer connecting connector 310 is that the end of the second matrix Z2 is formed with the lower surface extending longitudinally to encapsulating housing P (or encapsulating obturator) perpendicular to the direction of the second matrix, and outer connecting connector 320 is that the end of the 3rd matrix Z3 is to extend longitudinally to the lower surface formation of encapsulating housing P (or encapsulating obturator) perpendicular to the direction of the 3rd matrix Z3.
Another embodiment
The present embodiment also provides a kind of port-guard circuit integration packaging part, comprising:
At least two matrixes spaced apart up and down, each matrix comprises at least one conducting connecting part for being electrically connected;
At least one circuit module distributed between adjacent base, each circuit module comprises at least one element and/or person comprises at least one integration packaging module, each integration packaging module comprises at least two elements, each element comprises at least one pin link, and at least one element in all elements is circuit protective element; At least one pin link of at least one element in all circuit modules distributed between adjacent base, as external electrode terminal, is distributed at least one circuit module between adjacent base and at least one matrix in adjacent base and is connected by the electric connection of the conducting connecting part of external electrode terminal and at least one matrix; In all circuit modules, the some or all of element with circuit interconnection relation is interconnected by interconnection pin link; And/or,
In all circuit modules, the some or all of element with circuit interconnection relation is interconnected by the electric connection of interconnection pin link and same conducting connecting part; And/or,
Port-guard circuit integration packaging element also comprises the first cross tie part, in all circuit modules, the some or all of element with circuit interconnection relation is connected one to one by interconnection pin link and conducting connecting part, and is interconnected by the first cross tie part be arranged between the corresponding conducting connecting part connected.
As the optional execution mode of one, circuit protective element comprises gas discharge tube or Transient Voltage Suppressor or piezo-resistance or thermistor or semiconductor discharge tube or fuse.
As the optional execution mode of one, all circuit modules also comprise at least one port-guard basic circuit component, and port-guard basic circuit component comprises at least one port-guard basic circuit component in resistance, electric capacity, inductance, fuse and surge protective device.
As the optional execution mode of one,
Element in all circuit modules also comprises at least one port-guard basic circuit component, comprising:
Element in all circuit modules also comprises N number of resistance and N number of electric capacity, N is more than or equal to 1, N number of resistance and N number of electric capacity one_to_one corresponding are electrically contacted, and wherein, the first pin link of arbitrary resistance is connected to the first pin link of the electric capacity that connects corresponding to resistance;
And, element in all circuit modules also comprises N-1 circuit protective element, all N number of circuit protective elements and N number of resistance one_to_one corresponding electrical interconnects, N number of circuit protective element and N number of electric capacity one_to_one corresponding electrical interconnects, wherein, second pin link of each resistance connects one to one with two pin links of the second pin link of each electric capacity with the corresponding circuit protective element be connected, and, the second pin link interconnection of all electric capacity.Concrete refers to Fig. 4, the circuit structure diagram of the another kind of port-guard circuit integration packaging part that Fig. 4 provides for the present embodiment, as shown in Figure 4, be described for 2 circuit protective elements in the port-guard circuit that the present embodiment realizes, in the port-guard circuit that the present embodiment provides, circuit protective element also comprises second circuit protective element G2, port-guard basic circuit component also comprises the second resistance R2 and the second electric capacity C2, wherein a pin link of second circuit protective element G2 and a pin link of the second resistance R2 are respectively as the common port realizing second circuit protective element G2 and the second resistance R2 series winding, another pin link of second circuit protective element G2 and a pin link of the second electric capacity C2 are respectively as the common port realizing second circuit protective element G2 and the second electric capacity C2 and contact, and second resistance R2 another pin link and another pin link of the second electric capacity C2 respectively as the common port realizing the second resistance R2 and the second electric capacity C2 and interconnect,
The one pin link of the first electric capacity C is connected to a pin link of the second electric capacity C2.
Refer to Fig. 5, the circuit structure diagram of the another kind of port-guard circuit integration packaging part that Fig. 5 provides for the present embodiment, as shown in Figure 5, based on the port-guard circuit shown in Fig. 5, in the port-guard circuit that the present embodiment provides, circuit protective element also comprises tertiary circuit protective element G3 and the 4th circuit protective element G4, port-guard basic circuit component also comprises the 3rd resistance R3, 4th resistance R4, 3rd electric capacity C3 and the 4th electric capacity C4, wherein a pin link of tertiary circuit protective element G3 and a pin link of the 3rd resistance R3 are respectively as the common port realizing tertiary circuit protective element G3 and the 3rd resistance R3 series winding, another pin link of tertiary circuit protective element G3 and a pin link of the 3rd electric capacity C3 are respectively as the common port realizing tertiary circuit protective element G3 and the 3rd electric capacity C3 and contact, and the 3rd resistance R3 another pin link and another pin link of the 3rd electric capacity C3 respectively as the common port realizing the 3rd resistance R3 and the 3rd electric capacity C3 and interconnect, the one pin link of the 4th circuit protective element G4 and a pin link of the 4th resistance R4 are respectively as the common port realizing the 4th circuit protective element G4 and the 4th resistance R4 series winding, another pin link of 4th circuit protective element G4 and a pin link of the 4th electric capacity C4 are respectively as the common port realizing the 4th circuit protective element G4 and the 4th electric capacity C4 and contact, and another pin link of the 4th resistance R4 and another pin link of the 4th electric capacity C4 are respectively as the common port realizing the 4th resistance R4 and the 4th electric capacity C4 and interconnect,
The one pin link of the first electric capacity C is connected to a pin link of the 3rd electric capacity C3 and a pin link of the 4th electric capacity C4.
The port-guard circuit integration packaging part that circuit shown in Fig. 4 and Fig. 5 is corresponding based on the structure shown in Fig. 1 a, can carry out stacked processing further, realizes the Top-down design of the module of multiple circuit protective element and the module of multiple Bob Smith circuit.
As the optional execution mode of one, the thickness of all substrates is greater than or equal to 0.1mm, is less than or equal to 0.4mm; Port-guard circuit integration packaging part is square or cuboid, the thickness of port-guard circuit integration packaging part is less than or equal to 1.8mm, be greater than or equal to 0.5mm, the length of port-guard circuit integration packaging part is less than or equal to 1.8mm, be greater than or equal to 1.5mm, the width of port-guard circuit integration packaging part is less than or equal to 1.8mm, is greater than or equal to 1.5mm.
As the optional execution mode of one, the thickness of all substrates is greater than or equal to 0.2mm, is less than or equal to 0.3mm; Port-guard circuit integration packaging part is square or cuboid, the thickness of port-guard circuit integration packaging part is less than or equal to 1.5mm, be greater than or equal to 0.7mm, the length of port-guard circuit integration packaging part is less than or equal to 1.5mm, be greater than or equal to 0.7mm, the width of port-guard circuit integration packaging part is less than or equal to 1.5mm, is greater than or equal to 0.7mm.
Preferably, the thickness of all substrates is greater than or equal to 0.1mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.0mm, the length of described port-guard circuit integration packaging part is less than or equal to 6mm, be greater than or equal to 1.5mm, the width of described port-guard circuit integration packaging part is less than or equal to 6mm, is greater than or equal to 1.5mm.
Preferably, the thickness of all substrates is greater than or equal to 0.2mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.5mm, the length of described port-guard circuit integration packaging part is less than or equal to 5.5mm, be greater than or equal to 5mm, the width of described port-guard circuit integration packaging part is less than or equal to 3.6mm, is greater than or equal to 3mm.
In several embodiments that the application provides; should be understood that; more than describe; be only the embodiment of the application; but the protection range of the application is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the application discloses, amendment or the replacement of various equivalence can be expected easily, these amendments or replace all should be encompassed in the application protection range within.
Claims (32)
1. a port-guard circuit integration packaging part, is characterized in that, comprising:
At least two matrixes spaced apart up and down, matrix described in each comprises at least one conducting connecting part for being electrically connected;
At least one circuit module distributed between adjacent described matrix, each described circuit module comprises at least one element and/or person comprises at least one integration packaging module, described in each, integration packaging module comprises at least two elements, and at least one element in all elements is circuit protective element; At least one pin link of at least one element in all circuit modules distributed between adjacent described matrix, as external electrode terminal, is distributed at least one circuit module described between adjacent described matrix and at least one matrix in adjacent described matrix and is connected by the electric connection of the conducting connecting part of described external electrode terminal and at least one matrix described; In all circuit modules, the some or all of described element with circuit interconnection relation is interconnected by its interconnection pin link; And/or,
In all circuit modules, the some or all of described element with circuit interconnection relation is interconnected by the electric connection of described interconnection pin link and same described conducting connecting part; And/or,
Described port-guard circuit integration packaging part also comprises the first cross tie part, in all circuit modules, the some or all of described element with circuit interconnection relation is connected one to one by described interconnection pin link and described conducting connecting part, and is interconnected by described first cross tie part be arranged between the described corresponding described conducting connecting part connected.
2. port-guard circuit integration packaging part as claimed in claim 1, it is characterized in that, matrix described in each is conductive enclosure matrix;
Matrix described in each comprises at least one for the conducting connecting part be electrically connected, and comprising:
Conductive enclosure matrix described in each is a conducting connecting part for being electrically connected.
3. port-guard circuit integration packaging part as claimed in claim 2, it is characterized in that, described port-guard circuit integration packaging part also comprises the first cross tie part, comprising:
Described port-guard circuit integration packaging part also comprises first longitudinal cross tie part, in all circuit modules, the some or all of described element with circuit interconnection relation is connected one to one by described interconnection pin link and described conductive enclosure matrix, and is interconnected by the described first longitudinal cross tie part be arranged between the corresponding described conductive enclosure matrix connected.
4. port-guard circuit integration packaging part as claimed in claim 3, is characterized in that, the arbitrary described conductive enclosure matrix in the described conductive enclosure matrix that described first longitudinal cross tie part is described correspondence connection extends longitudinally to conductive enclosure matrix described in another.
5. port-guard circuit integration packaging part as claimed in claim 4, is characterized in that, also comprise:
For encapsulating encapsulating housing or the encapsulating obturator of all conductive enclosure matrixes in described port-guard circuit integration packaging part and all circuit modules;
For external described port-guard circuit integration packaging part to external circuit at least one described in matrix, each also comprises outer connecting connector for external described port-guard circuit integration packaging part to the described matrix of external circuit, and the described matrix of described outer connecting connector belonging to it extends described encapsulating housing or described obturator is formed.
6. port-guard circuit integration packaging part as claimed in claim 5, is characterized in that,
The position of the surface of matrix described at least one and the connection of described external electrode terminal is provided with grid or groove or boss.
7. port-guard circuit integration packaging part as claimed in claim 6, it is characterized in that, the thickness of described matrix is greater than or equal to 0.05mm, and is less than or equal to 1.5mm.
8. port-guard circuit integration packaging part as claimed in claim 5, it is characterized in that, described outer connecting connector comprises the first extension, described first extension is that the described matrix longitudinal extension comprising described outer connecting connector goes out described encapsulating housing or described encapsulating obturator, and the described outer connecting connector being positioned at the same side of described port-guard circuit integration packaging part is in staggered distribution.
9. port-guard circuit integration packaging part as claimed in claim 8, it is characterized in that, described outer connecting connector also comprises the second extension, and described second extension is that the end horizontal expansion of described first extension is formed.
10. port-guard circuit integration packaging part as claimed in claim 5, it is characterized in that, described outer connecting connector comprises the first extension and the second extension, described first extension is that the described matrix comprising described outer connecting connector extends longitudinally to described encapsulating housing or described obturator, described second extension is that the end of described first extension laterally extends described encapsulating housing or described obturator away from described matrix, and the described outer connecting connector being positioned at the same side of described port-guard circuit integration packaging part is in staggered distribution.
11., as the port-guard circuit integration packaging part as described in arbitrary in claim 1 to 10, is characterized in that,
Element in all circuit modules also comprises at least one port-guard basic circuit component, and described port-guard basic circuit component comprises any one the port-guard basic circuit component in resistance, electric capacity, inductance, fuse and surge protective device;
Described circuit protective element comprises gas discharge tube or Transient Voltage Suppressor or piezo-resistance or thermistor or semiconductor discharge tube or fuse.
12. as the port-guard circuit integration packaging part as described in arbitrary in claim 1 to 10, and it is characterized in that, described port-guard circuit integration packaging part comprises at least one circuit module distributed between adjacent described matrix, comprising:
Described port-guard circuit integration packaging part comprises the circuit module that at least one that distribute between adjacent described matrix comprises the integrated module of RC, the integrated module of described RC comprises first resistance and the first electric capacity with series winding relation, and the integrated module of wherein said RC comprises:
First capacitance electrode layer of lamination, the first dielectric layer and resistive layer successively.
13. port-guard circuit integration packaging parts as claimed in claim 12, it is characterized in that, described first dielectric layer comprises N number of dielectric layer of contraposition lamination, pressing, is connected with inner electrode layer between two the often adjacent dielectric layers in all N number of dielectric layers; Described N be greater than 0 integer.
14. port-guard circuit integration packaging parts as claimed in claim 13, it is characterized in that, the integrated module of described RC also comprises:
Be stacked on the second capacitance electrode layer between described first dielectric layer and described resistive layer.
15. port-guard circuit integration packaging parts as claimed in claim 14, it is characterized in that, described resistive layer comprises:
First resistance slurry printed layers of lamination and resistance electrode layer from the bottom to top.
16. port-guard circuit integration packaging parts as claimed in claim 15, it is characterized in that, the integrated module of described RC also comprises:
Be stacked on second dielectric layer on described second capacitance electrode layer surface;
Described second dielectric layer offers through hole;
Described resistive layer comprises:
For filling described through hole, and be printed in the described first resistance slurry printed layers on the described second capacitance electrode layer surface in described through hole;
Be stacked on the described resistance electrode layer on described first resistance slurry printed layers surface.
17. port-guard circuit integration packaging parts as claimed in claim 16, it is characterized in that, described first dielectric layer is the first ceramic dielectric matrix for making capacitor, and described second dielectric layer is the second ceramic dielectric matrix for making capacitor.
18. port-guard circuit integration packaging parts as claimed in claim 17, it is characterized in that, described first ceramic dielectric matrix is brium carbonate dielectric base body, calcium titanate dielectric base body or magnesium titanate dielectric base body.
19. port-guard circuit integration packaging parts as claimed in claim 18, it is characterized in that, described first capacitance electrode layer, described second capacitance electrode layer, described resistance electrode layer comprise alloy formed by handle, platinum, gold, silver, copper or nickel or above-mentioned at least two kinds of metals.
20. port-guard circuit integration packaging parts as claimed in claim 19, it is characterized in that, described first resistance slurry printed layers is ruthenium system resistance slurry.
21. port-guard circuit integration packaging parts as claimed in claim 12, it is characterized in that, the element in all circuit modules also comprises at least one port-guard basic circuit component, comprising:
Element in all circuit modules also comprises N number of resistance and N number of electric capacity, described N is more than or equal to 1, described N number of resistance and described N number of electric capacity one_to_one corresponding are electrically contacted, wherein, the first pin link of arbitrary described resistance is connected to the first pin link of the described electric capacity that connects corresponding to described resistance;
And, element in all circuit modules also comprises N-1 circuit protective element, all N number of circuit protective elements and described N number of resistance one_to_one corresponding electrical interconnects, described N number of circuit protective element and described N number of electric capacity one_to_one corresponding electrical interconnects, wherein, second pin link of resistance described in each connects one to one with two pin links of the second pin link of electric capacity described in each with the corresponding described circuit protective element be connected, and, the described second pin link interconnection of all electric capacity.
22. port-guard circuit integration packaging parts as claimed in claim 12, is characterized in that, described port-guard circuit integration packaging part comprises at least two matrixes spaced apart up and down, comprising:
Described port-guard circuit integration packaging part comprises the first matrix spaced apart up and down, the second matrix and the 3rd matrix;
Distribute between adjacent described first matrix and described second matrix the first circuit module, described first circuit module comprises the integrated module of described RC, a pin link of described first resistance except the pin link of described first resistance and described first electric capacity series winding and a pin link of described first electric capacity are as two external electrode terminals of described first circuit module, described first circuit module is electrically connected and is connected by described two external electrode terminals of described first circuit module with the one_to_one corresponding of described first matrix and described second matrix with described first matrix and described second matrix,
Distribute between adjacent described second matrix and described 3rd matrix second circuit module, described second circuit module comprises a described circuit protective element, and two pin links of described circuit protective element are as two external electrode terminals of described second circuit module; Described second circuit module is connected by two external electrode terminals of described second circuit module and corresponding electric connection of described second matrix and described 3rd matrix with described second matrix and described 3rd matrix.
23. port-guard circuit integration packaging parts as claimed in claim 22, it is characterized in that, described circuit protective element and described first electric capacity/described first resistance are to the element of external circuit for external described port-guard circuit integration packaging part, described first matrix, described second matrix and described 3rd matrix are as external described port-guard circuit integration packaging part to three conductive enclosure matrixes of external circuit, and described first matrix, described second matrix and described 3rd matrix comprise outer connecting connector described in respectively.
24. port-guard circuit integration packaging parts as claimed in claim 23, is characterized in that, the outer connecting connector of described first matrix and the outer connecting connector of described 3rd matrix are positioned at the same side of described port-guard circuit integration packaging part.
25. port-guard circuit integration packaging parts as claimed in claim 22, it is characterized in that, described circuit protective element is to the element of external circuit for external described port-guard circuit integration packaging part, described second matrix, described 3rd matrix are respectively as external described port-guard circuit integration packaging part to the conductive enclosure matrix of external circuit, and described second matrix and described 3rd matrix comprise outer connecting connector described in respectively;
A pin link of described first electric capacity except described first resistance and described first electric capacity series winding and two pin link one_to_one corresponding of a pin link of described first resistance and described circuit protective element interconnect, and the pin link of described first resistance/described first electric capacity except described first resistance and described first electric capacity are contacted and a pin link of described circuit protective element and described second matrix are electrically connected and realize interconnecting; And,
Described port-guard circuit integration packaging part also comprises the first cross tie part, comprising:
Described port-guard circuit integration packaging part also comprises and being connected between described first matrix and described 3rd matrix, and for realizing described first longitudinal cross tie part that described first resistance/described first electric capacity and described circuit protective element carry out interconnecting.
26. port-guard circuit integration packaging parts as claimed in claim 25, is characterized in that,
Described first longitudinal cross tie part is that the end of described first matrix extends to described 3rd matrix towards described 3rd matrix.
27. port-guard circuit integration packaging parts as claimed in claim 22, it is characterized in that, the thickness of all substrates is greater than or equal to 0.1mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.0mm, the length of described port-guard circuit integration packaging part is less than or equal to 6mm, be greater than or equal to 1.5mm, the width of described port-guard circuit integration packaging part is less than or equal to 6mm, is greater than or equal to 1.5mm.
28. port-guard circuit integration packaging parts as claimed in claim 22, it is characterized in that, the thickness of all substrates is greater than or equal to 0.2mm, is less than or equal to 0.3mm; Described port-guard circuit integration packaging part is square or cuboid, the thickness of described port-guard circuit integration packaging part is less than or equal to 2.5mm, be greater than or equal to 1.5mm, the length of described port-guard circuit integration packaging part is less than or equal to 5.5mm, be greater than or equal to 5mm, the width of described port-guard circuit integration packaging part is less than or equal to 3.6mm, is greater than or equal to 3mm.
29. port-guard circuit integration packaging parts as claimed in claim 1, it is characterized in that, matrix described in each is insulation-encapsulated matrix;
Matrix described in each comprises at least one for the conducting connecting part be electrically connected, and comprising:
The outer surface of matrix described in each adheres at least one conducting connecting part for being electrically connected.
30. port-guard circuit integration packaging parts as claimed in claim 29, is characterized in that,
The outer surface of matrix described in each adheres at least one for the conducting connecting part be electrically connected, and comprising:
The upper surface of carrier described in each and/or lower surface adhere at least one conducting connecting part for being electrically connected.
31. port-guard circuit integration packaging parts as claimed in claim 30, is characterized in that,
Described port-guard circuit integration packaging part also comprises the first cross tie part, comprising:
Described port-guard circuit integration packaging part also comprises first longitudinal cross tie part;
Be distributed between different adjacent base, and the described element with circuit interconnection relation is connected one to one by described interconnection pin link and described conducting connecting part, and interconnected by the described first longitudinal cross tie part be arranged between the corresponding described conducting connecting part connected;
The described conducting connecting part that described correspondence connects has the first intersection area in the projection perpendicular to described matrix place plane;
Described port-guard circuit integration packaging part also comprises:
The corresponding described conducting connecting part that connects and between region in the position that described first intersection area is corresponding, the first through hole run through is set; Described first longitudinal cross tie part is connected to the described conducting connecting part of described correspondence connection through described first through hole.
32. port-guard circuit integration packaging parts as claimed in claim 31, is characterized in that, the upper and lower parallel interval distribution of all substrates, all first longitudinal cross tie parts perpendicular to described matrix, and are positioned at described the same side of described matrix.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510494334.3A CN105047642B (en) | 2015-08-12 | 2015-08-12 | Port protection circuit integrated package |
| PCT/CN2016/094533 WO2017025043A1 (en) | 2015-08-12 | 2016-08-11 | Port protection circuit integrated package |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510494334.3A CN105047642B (en) | 2015-08-12 | 2015-08-12 | Port protection circuit integrated package |
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| CN105047642B CN105047642B (en) | 2024-01-19 |
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Cited By (1)
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| WO2017025043A1 (en) * | 2015-08-12 | 2017-02-16 | 深圳市槟城电子有限公司 | Port protection circuit integrated package |
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| WO2017025043A1 (en) | 2017-02-16 |
| CN105047642B (en) | 2024-01-19 |
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