CN105047616B - Toughened ceramic glass-encapsulated - Google Patents
Toughened ceramic glass-encapsulated Download PDFInfo
- Publication number
- CN105047616B CN105047616B CN201510544386.7A CN201510544386A CN105047616B CN 105047616 B CN105047616 B CN 105047616B CN 201510544386 A CN201510544386 A CN 201510544386A CN 105047616 B CN105047616 B CN 105047616B
- Authority
- CN
- China
- Prior art keywords
- cone
- ceramic
- terminal
- base
- basal plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Ceramic Products (AREA)
Abstract
Formed the present invention relates to a kind of toughened ceramic glass-encapsulated by casting of heating and press, the correspondence anchoring of the basal plane of the base of ceramic thickness one extension at least two at least dyke of unitary part and extend the cone terminal of at least an array cone figure between at least two corresponding dykes and be connected with the terminal corresponding at least basal plane of an element one, and the lateral edge horizontal homogeneous of same basal plane sets and is connected with least two external connection terminals with the cone terminal of at least an array cone figure, the terminal connection, which sets to have, mutually to electrically conduct, ceramics covering is provided with the recess for accommodating base of ceramic, the sole plane extension at least at least back side of the basal plane of an element one corresponding to the cone of an array cone figure is corresponding with the cone terminal at least an array cone figure that the basal plane of base of ceramic thickness one is extended in recess, with preferable electric characteristics, higher thermal conductivity, relatively low thermal coefficient of expansion and higher anti-deforming mechanical intensity.
Description
Technical field
Formed the present invention relates to a kind of toughened ceramic glass-encapsulated by casting of heating and press, toughened ceramic glass material
With preferable electric characteristics, higher thermal conductivity, relatively low thermal coefficient of expansion and higher anti-deforming mechanical intensity.
Background technology
Because the developing direction of semiconductor technology is constantly to improve safety and reliability and life-span, existing resin polymerization
The element of thing encapsulation technology is long-term inside the encapsulation that high temperature contact causes resinous polymer partial carbonization with resinous polymer
Electric leakage or short circuit, and resinous polymer is easily dissolved, safety and reliability and the longevity of influence integrated circuit or semiconductor product
Life, so high performance ceramic package just turns into the essential key element in IC design, then through high temperature or low temperature
The ceramic bearing medium of common sintering has preferable electric characteristics, high temperature resistant and resistance to deformation feature, due to traditional
The use HTCC material of ceramic package shell sinters making at a temperature of 1400 DEG C one 1600 DEG C, during integral manufacturing
Between be up to 20 1 24 hours, LTCC material Tu sinters making, integral manufacturing time at a temperature of 850 DEG C one 870 DEG C
Up to 6-8 hours, production cost remained high always, and manufacturing expense is expensive, and the technical requirements of making are high, yield by technology,
The limitation of equipment each side, production efficiency and finished product rate reduction, far can not be satisfied with the growing market demand, by
This is visible, and the above-mentioned existing common burning porcelain encapsulating structure and its material of ceramics burned together for being used to encapsulate electronic component is in structure with making
Use, it is clear that in order to solve above-mentioned problem, seek to find the relatively low envelope of a kind of design and price more simple and easy to apply
Casing supplements and replaces existing ceramic package product necessary, it is an object of the present invention to overcome existing for encapsulating
The defect that the encapsulating structure and its material of electronic component are present, and a kind of new encapsulation knot for being used to encapsulate electronic component is provided
Structure and its fault in material, technical problem to be solved are its toughened ceramic glass material is passed through the casting shape that heats and press
There is preferable electric characteristics, higher thermal conductivity, relatively low thermal coefficient of expansion and higher into, toughened ceramic glass material
Anti- deforming mechanical intensity.
The content of the invention
In summary, the invention relates to it is a kind of used encapsulation electronic component toughened ceramic glass package structure and its
Toughened ceramic glass material has preferable electric characteristics, higher thermal conductivity, relatively low thermal coefficient of expansion and higher anti-
Deforming mechanical intensity, toughened ceramic glass package structure includes：Base of ceramic, ceramics covering and external connection terminal minor structure, its
Middle toughened ceramic glass-encapsulated is whereby by base of ceramic and ceramics covering by the polymer or high temperature vitreous agent of ceramic glaze in height
Quickly it is bonded together under the localized hyperthermia of frequency, the present invention can technically have significantly to enter using toughened ceramic glass-encapsulated
Step, and with obvious good effect, domain is a new and innovative, progressive, practical new design.
Its solution is：A kind of toughened ceramic glass-encapsulated for internal installation at least unitary part, including：Pass through pottery
Porcelain pedestal, ceramics covering and external connection terminal minor structure, at least unitary is accommodated in base of ceramic structure to keep having
The ceramics that the internal cavities of part are airtight are covered, and safety glass ceramic packaging structure formation external connection terminals, the terminal is used for
Signal exchange is carried out with outside, and formation is connected cone terminal with the inside that at least an element is connected in internal cavities,
It is characterized in that the correspondence of the basal plane of base of ceramic thickness one extension at least two anchors at least dyke of unitary part and at least two
The basal plane of thickness one institute for extending the cone terminal and an at least element of at least an array cone figure between individual corresponding dyke is right
The terminal connection answered, and the lateral edge horizontal homogeneous of the basal plane of thickness one are provided with least two external connection terminals and at least one
The cone terminal connection of array cone figure, the terminal connection, which sets to have, mutually to be electrically conducted, and ceramics covering, which is provided with, to be held
Receive the recess of base of ceramic, the thickness of sole plane extension at least element at least corresponding to the cone of an array cone figure in recess
The cone terminal for spending the back side of a basal plane with least an array cone figure that the basal plane of base of ceramic thickness one is extended is corresponding, institute
The cone at least an array cone figure that the basal plane of base of ceramic thickness one stated is extended is by biting or vacuum sputtering mode
Alloy material is attached to cone surface formation terminal, by its key under sticking temperature between described base of ceramic and ceramics covering
It is combined.
The technical program dyke described further is exactly to extend boss in the basal plane of base of ceramic thickness one, and the boss has
∟ shapes and/or [shape and ╦ shapes and ╬ shapes, at least one pair of dyke answered can accurately anchor at least unitary part, make at least
One element can not above and below, move around, it is to avoid noise is produced in work.
Interior and ceramics cover between the technical program cone terminal described further is evenly distributed on the dyke of base of ceramic
The cone correspondence of array cone figure is formed in lid recess on sole plane, the cone terminal on base of ceramic is by biting or vacuum
Alloy material is attached to cone surface formation cone terminal by sputtering mode, and the cone terminal alloy material attachment extends to outside and connected
Connection sets to have and mutually electrically conducted between connecting terminal, the terminal.
The technical program bonding described further is to use the poly- of ceramic glaze in base of ceramic and ceramics covering joint
Compound or high temperature vitreous agent are bonded together under the localized hyperthermia of high frequency.
Above-described toughened ceramic glass-encapsulated, causes to be formed on substrate in well known materials.
Described above is to be that technical solution of the present invention and products thereof new innovative designs applied thermodynamics and casting technique are former
The general introduction of design is managed, its cost is low, simple and compact for structure, easy to assembly, with larger application value, in order to more
The technological means of the present invention is had a clear understanding of, and can hold according to the Inner of specification and be practiced, and in order to allow the present invention's above-mentioned
It can be become apparent with other purposes, feature and advantage, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail such as
Under.
Brief description of the drawings：
Fig. 1 is sectional view of the embodiment of the present invention.
Fig. 2 is the dyke top view for the ceramic base seat ∟ shapes that Fig. 1 present invention implements an element.
Fig. 3 is base of ceramic [the dyke top view of shape that Fig. 1 present invention implements an element.
Fig. 4 is the dyke top view for the ceramic base Zuo ∟ shapes that Fig. 1 present invention implements two elements.
Fig. 5 is that Fig. 1 present invention implements the ceramic base Zuo ∟ shapes of two elements He the dyke top view of/Huo ╦ shapes.
Fig. 6 is that Fig. 1 present invention implements the ceramic base Zuo ∟ shapes of four elements He/Huo ╦ shapes are He the dyke of/Huo ╬ shapes is overlooked
Figure.
Fig. 7 is the base of ceramic A-A sectional views of the element of Fig. 2 or Fig. 3 embodiment of the present invention one.
Fig. 8 is the ceramics covering top view that Fig. 1 present invention implements an element.
Fig. 9 is the ceramics covering B-B sectional views that Fig. 8 present invention implements an element.
Figure 10 is that Fig. 1 present invention implements dyke top view.
Wherein：
1- ceramics coverings；
2- ∟ shapes and/or [shape is He/Huo ╦ shapes are He the dyke of/Huo ╬ shapes；
3- elements；
4- ceramic coated cones；
5- is bonded；
6- external connection terminals；
The cone terminal of 7- base of ceramic；
8- base of ceramic.
Embodiment one：
It is used for internal installation at least unitary with reference to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10 one kind
The toughened ceramic glass-encapsulated of part 3, including：By base of ceramic 8, ceramics covering 1 and the structure of external connection terminals 6, it is arranged on
In the structure of base of ceramic 81, safety glass pottery are covered with the ceramics for keeping the internal cavities with a receiving at least element 3 airtight
Porcelain encapsulating structure formation external connection terminals 6, the terminal 6 is used to carry out signal exchange with outside, and forms empty with inside
The inside that at least an element is connected connection cone terminal 4 in chamber, it is characterised in that the basal plane of 8 thickness of base of ceramic one is extended to
Few two correspondences anchor at least dyke 2 of unitary part 3 and extend at least an array cone between at least two corresponding dykes 2
The cone terminal 7 of volume graphic is connected with the terminal corresponding to the basal plane of thickness one of an at least element 3, and the basal plane of thickness one side
Edge horizontal homogeneous is set, and there are at least two external connection terminals 6 to be connected with the cone terminal 7 of at least an array cone figure,
The connection of terminal 7, which sets to have, mutually to electrically conduct, and ceramics covering 1 is provided with bottom in the recess for accommodating base of ceramic, recess
Basal plane the extension back side of the basal plane of thickness one of an at least element 3 and ceramic base at least corresponding to the cone 4 of an array cone figure
The correspondence of cone terminal 7 at least an array cone figure that the seat basal plane of 8 thickness one is extended, the described thickness one of base of ceramic 7
The cone terminal 7 at least an array cone figure that basal plane is extended is by biting or alloy material is attached to by vacuum sputtering mode
Cone surface formation terminal, is bonded 5 together between described base of ceramic 8 and ceramics covering 1 under sticking temperature, is entered
Dyke 2 described in one step is exactly to extend boss in the basal plane of 8 thickness of base of ceramic one, boss You ∟ shapes and/or [shape and/or
╦ shapes and ╬ shapes, at least one pair of dyke 2 answered can accurately anchor at least unitary part 3, prevent an at least element 3 from
Under, move around, it is to avoid noise is produced in work, cone terminal 7 described further is evenly distributed on base of ceramic 8
Dyke 2 between in and ceramics 1 recess of covering in formed on sole plane on the correspondence of cone 4 of array cone figure, base of ceramic 8
Cone terminal 7 by biting or alloy material is attached to cone surface formation cone terminal 7, the cone by vacuum sputtering mode
The attachment of the alloy material of terminal 7 extends to connection between external connection terminals 6, the terminal and set with mutually electrically conducting, and enters one
The described bonding 5 of step is in height in base of ceramic 8 and ceramics 1 joint of covering using the polymer or high temperature vitreous agent of ceramic glaze
Together, above-described toughened ceramic glass-encapsulated causes shape on substrate in well known materials for bonding 5 under the localized hyperthermia of frequency
Into.
Above to a kind of design method provided by the present invention, device and a kind of magnetic cumulative Gauss sniper rifle, herein
Apply specific case to the present invention principle and embodiment carried out it is detailed implementation lock state, so itself and be not used to limit this hair
Bright those of ordinary skill in the art, in the range of the method and its core concept for not departing from the present invention, are used to help understand this
The explanation of the embodiment of invention, according to the method and its core concept of the present invention, in specific embodiments and applications may be used
Make various changes with adding, therefore in summary, protection scope of the present invention is only defined by the appended claims.
Claims (4)
1. it is a kind of for the internal toughened ceramic glass-encapsulated for installing at least unitary part, including：Pass through base of ceramic, ceramics covering
And external connection terminal minor structure, it is airtight with the internal cavities for accommodating an at least element with holding in base of ceramic structure
Ceramics covering, safety glass ceramic packaging structure formation external connection terminals, the terminal is used for and outside carries out signal friendship
Change, and formation is connected cone terminal with the inside that at least an element is connected in internal cavities, it is characterised in that ceramic base
The correspondence of seat thickness one basal plane extension at least two anchors at least dyke of unitary part and between at least two corresponding dykes
The extension at least cone terminal of an array cone figure is connected with the terminal corresponding to the basal plane of thickness one of an at least element, and thick
The lateral edge horizontal homogeneous for spending a basal plane is provided with the cone of at least two external connection terminals and at least an array cone figure
Body end son connection, the terminal connection, which sets to have, mutually to electrically conduct, and ceramics covering is provided with the recess for accommodating base of ceramic,
In recess sole plane extension at least corresponding to the cone of an array cone figure the back side of the basal plane of thickness one of an at least element with
The cone terminal correspondence at least an array cone figure that the basal plane of base of ceramic thickness one is extended, described base of ceramic thickness
The cone at least an array cone figure that one basal plane is extended is by biting or alloy material is attached to cone by vacuum sputtering mode
Body surface face forms terminal, is bonded together between described base of ceramic and ceramics covering under sticking temperature.
2. toughened ceramic glass-encapsulated according to claim 1, it is characterised in that：Described dyke is exactly in base of ceramic
The basal plane of thickness one extends boss, boss You " ∟ " shape or " [" shape Huo " ╦ " shape Huo " ╬ " shape, at least one pair of dike answered
Portion can accurately anchor at least unitary part, an at least element is moved from above and below, around, it is to avoid produce and make an uproar in work
Sound.
3. toughened ceramic glass-encapsulated according to claim 1 or 2, it is characterised in that：Described cone terminal uniformly divides
Cloth is interior corresponding with array cone figure is formed on sole plane in ceramics covering recess cone between the dyke of base of ceramic, pottery
Cone terminal on porcelain pedestal is by biting or alloy material is attached to cone surface formation cone terminal, institute by vacuum sputtering mode
State the attachment of cone terminal alloy material and extend between external connection terminals, the terminal connection and set to have and mutually electrically conduct.
4. toughened ceramic glass-encapsulated according to claim 1, it is characterised in that：Described bonding be in base of ceramic and
Ceramics covering joint is bonded together using the polymer or high temperature vitreous agent of ceramic glaze under the localized hyperthermia of high frequency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510544386.7A CN105047616B (en) | 2015-08-31 | 2015-08-31 | Toughened ceramic glass-encapsulated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510544386.7A CN105047616B (en) | 2015-08-31 | 2015-08-31 | Toughened ceramic glass-encapsulated |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105047616A CN105047616A (en) | 2015-11-11 |
| CN105047616B true CN105047616B (en) | 2017-09-26 |
Family
ID=54454046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510544386.7A Expired - Fee Related CN105047616B (en) | 2015-08-31 | 2015-08-31 | Toughened ceramic glass-encapsulated |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105047616B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113922205B (en) * | 2018-01-05 | 2023-02-14 | 深圳市绎立锐光科技开发有限公司 | Substrate, method for forming packaging structure by using substrate and packaging structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840791A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Low-temperature glass-ceramic package case and crystal oscillator using the same |
| CN204905236U (en) * | 2015-08-31 | 2015-12-23 | 长乐芯聚电子科技研究所 | Encapsulation of tempering ceramic glass |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4519424B2 (en) * | 2003-06-26 | 2010-08-04 | ルネサスエレクトロニクス株式会社 | Resin mold type semiconductor device |
-
2015
- 2015-08-31 CN CN201510544386.7A patent/CN105047616B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103840791A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Low-temperature glass-ceramic package case and crystal oscillator using the same |
| CN204905236U (en) * | 2015-08-31 | 2015-12-23 | 长乐芯聚电子科技研究所 | Encapsulation of tempering ceramic glass |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105047616A (en) | 2015-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103487176B (en) | Structure and method for packaging pressure sensor | |
| CN104882418B (en) | The method of packaged semiconductor and semiconductor package body with inclined surface | |
| CN101111749B (en) | Infrared detector and its production method | |
| CN102331323B (en) | Hydrodynamic pressure sensing apparatus and pressure sensing element | |
| CN101479586B (en) | Pressure sensor using near net shape sintered ceramics | |
| US9287187B2 (en) | Power semiconductor module | |
| JP5719303B2 (en) | Sensor element and method for manufacturing sensor element | |
| JPH0464025A (en) | Temperature sensor for cooking apparatus | |
| CN111480221B (en) | Electrostatic chuck heater and method of manufacturing the same | |
| US2458748A (en) | Hermetic seal for electric terminals and the like | |
| CN108109792B (en) | Thermistor with base and preparation method thereof | |
| CN105047616B (en) | Toughened ceramic glass-encapsulated | |
| CN109642844A (en) | For reducing the obturator of the volume of pressure measurement room | |
| CN203165873U (en) | Packaging shell with cavities at two sides | |
| CN104465539A (en) | Glass-ceramic composite sealing structure for metal sealing and sealing method | |
| JP3154930U (en) | Ceramic parts with built-in electrodes | |
| CN204905236U (en) | Encapsulation of tempering ceramic glass | |
| CN106908190B (en) | A kind of electrical method for sealing through walls of highly reliable pressure sensor divider wall air-tightness | |
| CN103730426A (en) | Air cavity type packaging structure and method | |
| CN205621525U (en) | Compound insulator of glass -ceramic encapsulation shell | |
| TW202229884A (en) | Test socket and method of manufacturing the same | |
| CN108020342B (en) | A kind of quick response temperature sensor and preparation method thereof with fixinig plate | |
| CN206457250U (en) | The shielding construction and encapsulating structure of a kind of sensor | |
| JPH0669137A (en) | Ceramic heater | |
| CN206865430U (en) | A kind of cermet encapsulates photoelectric switch |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170607 Address after: Air city street Changle city Fujian province 350200 of Fuzhou city at Rende Village No. 2 Applicant after: CHANGLE XINJU ELECTRONIC TECHNOLOGY Research Institute Applicant after: Chen Yinhui Address before: Dawenli village in Taijiang District of Fuzhou City, Fujian Province, No. 803 6 350009 Applicant before: FUZHOU CITY TAIJIANG DISTRICT ZHENBIN Research Institute OF HIGH EFFICIENT ELECTROMAGNETIC AMPLITUDE TECHNOLOGY Applicant before: Chen Yinhui |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170926 Termination date: 20210831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |