CN105047215A - mSATA-to-Type-C transfer device for solid state disk and circuit - Google Patents
mSATA-to-Type-C transfer device for solid state disk and circuit Download PDFInfo
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- CN105047215A CN105047215A CN201510512315.9A CN201510512315A CN105047215A CN 105047215 A CN105047215 A CN 105047215A CN 201510512315 A CN201510512315 A CN 201510512315A CN 105047215 A CN105047215 A CN 105047215A
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Abstract
The present invention relates to an mSATA-to-Type-C transfer device for a solid state disk and a circuit. The mSATA-to-Type-C transfer device comprises a Type-C interface, a PCB circuit board and an adapter; both the Type-C interface and the adapter are welded on the PCB circuit board; and transferring is implemented between the adapter and the Type-C interface by a line on the PCB circuit board. The adapter is an mSATA adapter. The circuit of the mSATA-to-Type-C transfer device for the solid state disk comprises a main-control-chip control circuit, a C interface signal switching control circuit, a USB interface, a large current output power supply control circuit and an upgrade firmware and storage firmware control circuit. The mSATA-to-Type-C transfer device has the advantages of reasonable structural design, low production and manufacturing cost, small volume and the like; after the solid state disk is made by the mSATA-to-Type-C transfer device, the solid state disk can be conveniently carried; meanwhile, read-write and transmission speeds are improved; efficiency is improved; serial SPIFLASH is adopted; and the mSATA-to-Type-C transfer device is suitable for the solid state disks with different capacities.
Description
Technical field
The present invention relates to solid state hard disc technical field, be specifically related to switching device and circuit that solid state hard disc mSATA turns Type-C.
Background technology
Along with the continuous innovation of memory technology, memory device is also in continuous upgrading, perfect also progressively of its performance, all bring great convenience to the work of people and life, by little memory capacity before, slower read-write and transmission speed, progressively develop into large storage capacity, faster read-write and transmission speed, thus greatly reduced read-write and the time spent by transmission, contribute to the office efficiency improving people.
As everyone knows, common memory device has USB flash disk, solid state hard disc etc., for USB flash disk, all adopt the technology of flash memory, achieve fast reading and writing and the transmission of data, but due to the volume of USB flash disk be fixing, limitation during use is larger, compared with hard disk, read-write and transmission speed relatively slow, efficiency is relatively low.For traditional mechanical hard disk, the comparatively large and heavier mass of volume occupied by self, be inconvenient to carry, the motor performance that read-write and transmission speed are subject to self limits, if be subject to external shock, very easily cause mechanical hard disk to damage and even scraps, and mechanical hard disk many employings patchcord realizes the exchanges data of mechanical hard disk and external unit, use very inconvenience, patchcord is also easily lost, and has influence on the normal use of mechanical hard disk.Traditional USB interface is in use, often easily anti-inserted, if dynamics is excessive, the interface of fragile equipment, uses comparatively inconvenience.
Summary of the invention
In order to solve deficiency existing in prior art, the present invention propose a kind of reasonable in design, manufacturing cost is low, volume is little, solid state hard disc is convenient for carrying and improves the device read and write with transmission speed simultaneously, namely solid state hard disc mSATA turns switching device and the circuit of Type-C.
Solid state hard disc mSATA turns the switching device of Type-C, comprise Type-C interface, PCB and adapter, described Type-C interface, adapter are all welded in PCB, and described adapter is transferred by the circuit in PCB and Type-C Interface realization.
Described adapter is mSATA adapter.Present invention employs mSATA adapter, and coordinate with PCB, finally achieve mSATA and turn Type-C, reduce overall volume, alleviate overall weight, be convenient for carrying, also improve overall read-write and transmission speed, stability and compatibility obtain further improvement, meanwhile, present invention employs Type-C interface, positive anti-plug can be realized, solve the problem that traditional USB interface is easily anti-inserted in use, bring conveniently to the actual use of people.
The grafting direction of described Type-C interface is vertical with the grafting direction of mSATA adapter.The mode of this vertical distribution, can reduce overall length dimension, the solid state hard disc volume made can be reduced, and is convenient for carrying.
During use, the storage unit of different capabilities can also be selected to be inserted on mSATA adapter, and to change the capacity of solid state hard disc, dirigibility is higher.
Solid state hard disc mSATA turns the circuit of the switching device of Type-C, comprise main control chip control circuit, C interface signal control switching circuit, USB interface, High-current output power control circuit, firmware updating and storing firmware control circuit, described USB interface is connected with C interface signal control switching circuit, and described C interface signal control switching circuit, USB interface, High-current output power control circuit, firmware updating are connected to realize mSATA with main control chip control circuit respectively with storing firmware control circuit and turn Type-C.The present invention adopts High-current output power control circuit to be that solid state hard disc is powered, to ensure that solid state hard disc can normally run; Adopt firmware updating and storing firmware control circuit, to realize internal upgrade ensure compatibility, thus compensate for the weak point of traditional solid state hard disc; Present invention employs small size and the electronic devices and components of precision, thus make overall stability higher; Utilize main control chip control circuit, the function realizing auto sleep can be assisted, possess the function of power and energy saving so in use; The present invention also can according to user demand, and change the capacity of solid state hard disc at any time, dirigibility is high.
Described main control chip control circuit comprises chip one, first module, the second module, the 3rd module, four module, the 5th module, the 6th module, the 7th module, the 8th module, the 9th module, the tenth module, the 11 module, the 12 module, the 13 module, the tenth four module, the 15 module, and described first module, the second module, the 3rd module, four module, the 5th module, the 7th module, the 8th module, the tenth module, the 11 module, the 13 module, the tenth four module, the 15 module are connected with chip one respectively.13 module of the present invention serves the effect of resistance current limliting, tenth four module plays capacitor filtering effect, to avoid the humorous wave interference in circuit, ensure overall stability, achieve the stable input of electric current, 15 module serves the effect of capacitor filtering, and the 8th module serves the effect of resistance current limliting.
Described 15 module comprises the 18 electric capacity, and 1 pin of described 18 electric capacity is connected with+3.3V power interface, and 1 pin of described 18 electric capacity is connected with 1 pin of described chip one, and described 2 pin of the 18 electric capacity and 47 pin of chip one also connect power supply ground after connecing.
2 pin of described chip one, 3 pin, 5 pin, 6 pin are connected with storing firmware control circuit with firmware updating respectively, 4 pin of described chip one are connected with+3.3V power interface, 7 pin of described chip one are connected with+1.2V power interface, 8 pin of described chip one, 35 pin, 37 pin, 42 pin are connected with the 8th module respectively, 9 pin of described chip one are connected with the second module, described second module is connected with+3.3V power interface, 10 pin of described chip one are connected with the 13 module, described 13 model calling has+5V power interface, 11 pin of described chip one are serially connected with ground connection after the 22 electric capacity, 11 pin of described chip one are connected with+5V power interface, 12 pin of described chip one are serially connected with ground connection after the 23 electric capacity, 12 pin of described chip one are connected with+3.3V power interface, 13 pin of described chip one are connected with+1.2V power interface, 14 pin of described chip one are serially connected with ground connection after the 25 electric capacity, 14 pin of described chip one are connected with+3.3V power interface, 15 pin of described chip one, 16 pin, 19 pin, 20 pin, 22 pin, 23 pin are linked into C interface signal control switching circuit after being connected with the tenth module respectively, in USB interface, 19 pin of described chip one, 20 pin are linked in the 12 module after being connected with the 11 module respectively, 22 pin of described chip one, 23 pin are connected with the 12 module respectively, 21 pin ground connection of described chip one, 24 pin of described chip one are serially connected with ground connection after the 27 electric capacity, 24 pin of described chip one are connected with+1.2V power interface, 25 pin of described chip one, 26 pin are connected with four module 7 respectively, 27 pin of described chip one are serially connected with ground connection after the 24 electric capacity, 27 pin of described chip one are connected with+3.3V power interface, 28 pin of described chip one, 36 pin are also connected with+1.2V power interface after connecing, 29 pin of described chip one, 30 pin, 21 pin, 33 pin are connected with the 7th module respectively, 31 pin ground connection of described chip one, 34 pin of described chip one connect and are connected with+3.3V power interface, 35 pin of described chip one are connected with the 8th module, 38 pin of described chip one are connected with the 3rd module, described 3rd module is connected with+3.3V power interface, be linked on+3.3V power interface after 39 pin of described chip one are connected with the first module, be linked on+1.2V power interface after 46 pin of described chip one are connected with the first module, 47 pin of described chip one are serially connected with ground connection after the 4th resistance, 48 pin of described chip one are connected with the tenth four module, described tenth four module is linked on+1.2V power interface, 49 pin ground connection of described chip one,
Described first module comprises the first electric capacity, 5th electric capacity, 6th electric capacity, tenth electric capacity, 11 electric capacity, 12 electric capacity, second electric capacity, 3rd electric capacity, 7th electric capacity, 8th electric capacity, 13 electric capacity, 1 pin of described first electric capacity, 1 pin of the 5th electric capacity, 1 pin of the 6th electric capacity, 1 pin of the tenth electric capacity, 1 pin of the 11 electric capacity, 1 pin of the 12 electric capacity is also connected with+1.2V power interface after connecing, 2 pin of described first electric capacity, 2 pin of the 5th electric capacity, 2 pin of the 6th electric capacity, 2 pin of the tenth electric capacity, 2 pin of the 11 electric capacity, 2 pin of the 12 electric capacity also connect rear ground connection, 1 pin of described second electric capacity, 1 pin of the 3rd electric capacity, 1 pin of the 7th electric capacity, 1 pin of the 8th electric capacity, 1 pin of the 13 electric capacity is also linked on+3.3V power interface after connecing, 2 pin of described second electric capacity, 2 pin of the 3rd electric capacity, 2 pin of the 7th electric capacity, 2 pin of the 8th electric capacity, 2 pin of the 13 electric capacity also connect rear ground connection,
Described second module comprises the first resistance and light emitting diode, and 1 pin of described first resistance is connected with 9 pin of chip one, and 2 pin of described first resistance are connected with 2 pin of light emitting diode, and 1 pin of described light emitting diode is connected with+3.3V power interface;
Described 3rd module comprises the second resistance and the 9th electric capacity, and be linked on 38 pin of chip one after 1 pin of described second resistance is connected with 2 pin of the 9th electric capacity, 2 pin of described second resistance are connected with+3.3V power interface, 1 pin ground connection of described 9th electric capacity;
Described four module comprises the 4th electric capacity and crystal oscillator, described 1 pin of the 4th electric capacity and 3 pin of crystal oscillator are also linked on 26 pin of chip one after connecing, described 2 pin of the 4th electric capacity and 1 pin of crystal oscillator are also linked on 25 pin of chip one after connecing, 2 pin of described crystal oscillator, 4 pin ground connection;
Described 5th module comprises the 3rd resistance, and described 1 pin of the 3rd resistance is connected with 17 pin of chip one, 2 pin ground connection of described 3rd resistance;
Described 6th module comprises mSATA interface, 9 pin of described mSATA interface, 15 pin, 21 pin, 29 pin, 35 pin, 37 pin, 43 pin connect rear ground connection, 23 pin of described mSATA interface, 25 pin, 31 pin, 33 pin are connected with the 7th module 10 respectively, 2 pin of described mSATA interface, 24 pin, 39 pin, 41 pin, 52 pin are all linked on+3.3V power interface, 4 pin of described mSATA interface, 18 pin, 26 pin, 34 pin, 40 pin, 50 pin connect rear ground connection, 53 pin of described mSATA interface, 54 pin, 55 pin, 56 pin connect rear ground connection;
Described 7th module comprises the 14 electric capacity, the 15 electric capacity, the 16 electric capacity and the 17 electric capacity, 1 pin of 1 pin of described 14 electric capacity, 1 pin of the 15 electric capacity, the 16 electric capacity, 1 pin of the 17 electric capacity are connected with 33 pin of chip one, 32 pin, 30 pin, 29 pin respectively, and 2 pin of 2 pin of described 14 electric capacity, 2 pin of the 15 electric capacity, the 16 electric capacity, 2 pin of the 17 electric capacity are connected with 33 pin of the 6th module, 31 pin, 25 pin, 23 pin respectively;
Described 8th module comprises the 6th resistance, the 7th resistance and the 8th resistance, 1 pin of 1 pin of described 6th resistance, 1 pin of the 7th resistance, the 8th resistance is connected with 37 pin of chip one, 8 pin, 35 pin respectively, and 2 pin of 2 pin of described 6th resistance, 2 pin of the 7th resistance, the 8th resistance connect rear ground connection with 42 pin of chip one respectively;
Described 9th module comprises the 29 electric capacity, the 30 electric capacity, the 31 electric capacity, the 32 electric capacity and the 33 electric capacity, described 29 electric capacity, the 30 electric capacity, the 31 electric capacity, the 32 electric capacity one end with the 33 electric capacity and after connecing is connected with+3.3V power interface, described 29 electric capacity, the 30 electric capacity, the 31 electric capacity, the 32 electric capacity and the 33 electric capacity other end ground connection after connecing;
Described tenth module realizes 15 pin of chip one, 16 pin are connected with USB interface respectively and 19 pin of chip one, 20 pin, 22 pin, 23 pin are connected with described C interface signal control switching circuit respectively;
Described 11 module comprises the 20 electric capacity, the 21 electric capacity, 2 pin of described 20 electric capacity, 2 pin of the 21 electric capacity are connected with 20 pin of chip one, 19 pin respectively, and described 1 pin of the 20 electric capacity, 1 pin of the 21 electric capacity are connected with the 12 module respectively;
Described 12 module comprises first input end, the second input end, the 3rd input end, four-input terminal, described first input end, the second input end are connected with 1 pin of the 20 electric capacity, 1 pin of the 21 electric capacity respectively, and described 3rd input end, four-input terminal are connected with 23 pin of chip one, 22 pin respectively;
Described 13 module comprises the 5th resistance, and described 1 pin of the 5th resistance is connected with 10 pin of chip one, and 2 pin of described 5th resistance are connected with+5V power interface;
Described tenth four module comprises the 19 electric capacity, the first inductance, described 1 pin of the 19 electric capacity, 1 pin of the first inductance be linked on+1.2V power interface after connecing, described 2 pin of the 19 electric capacity and 47 pin of chip one also connect power supply ground after connecing, 2 pin of described first inductance are connected with 48 pin of chip one.After the filtering process of the tenth four module, thus provide noiseless voltage, to guarantee the normal work of circuit for other electronic devices and components.
Described C interface signal control switching circuit comprises chip two and Current Limits resistance module, and described Current Limits resistance module comprises the second current-limiting resistance, 3rd current-limiting resistance, 4th current-limiting resistance, 5th current-limiting resistance and the 6th current-limiting resistance, 1 pin of described chip two, 2 pin, 6 pin respectively with one end of the second current-limiting resistance, one end of 6th current-limiting resistance, one end of 4th current-limiting resistance is connected, and the other end of described second current-limiting resistance is linked on+3.3V power interface, the other end of described 4th current-limiting resistance, the other end ground connection respectively of the 6th current-limiting resistance, be connected with the 11 auxiliary capacitor between 9 pin of described chip two and 12 pin, 9 pin ground connection of described chip two, 12 pin of described chip two are connected with+3.3V power interface, 11 pin of described chip two, 13 pin, 14 pin, 15 pin, 16 pin are connected with USB interface respectively, 17 pin of described chip two, 21 pin, 24 pin ground connection, 18 pin of described chip two, 19 pin are respectively through 22 pin of the tenth module and chip one, 23 pin are connected, and 20 pin of described chip two are serially connected with ground connection after the 8th current-limiting resistance, and 20 pin of described chip two are connected with+3.3V power interface, 22 pin of described chip two, 23 pin are respectively through 19 pin of the tenth module and chip one, 20 pin are connected, 25 pin of described chip two, 26 pin, 27 pin, 28 pin are connected with USB interface respectively, and 29 pin of described chip two are serially connected with ground connection after the 5th auxiliary capacitor, and 30 pin of described chip two are serially connected with ground connection after the first current-limiting resistance, 31 pin of described chip two, 32 pin respectively with one end of the 5th current-limiting resistance, one end of 3rd current-limiting resistance is connected, the other end ground connection of described 5th current-limiting resistance, and the other end of described 3rd current-limiting resistance is linked on+3.3V power interface, 33 pin ground connection of described chip two,
1 pin of described USB interface, 2 pin, 3 pin, 4 pin, 5 pin, 6 pin, A1 pin, A12 pin, B1 pin, the equal ground connection of B12 pin, the A2 pin of USB interface, A3 pin is serially connected with the tenth auxiliary capacitor respectively, with 25 pin of chip two after 9th auxiliary capacitor, 26 pin are connected, the A4 pin of described USB interface, A9 pin, B4 pin, B9 pin is also connected with 11 pin of chip two after connecing, the A6 pin of described USB interface, B6 pin is connected with 15 pin of chip one by the tenth module, the A7 pin of described USB interface, B7 pin is connected with 16 pin of chip one by the tenth module 13, the A10 pin of described USB interface, A11 pin respectively with 13 pin of chip two, 14 pin are connected, the B2 pin of described USB interface, B3 pin is serially connected with the 6th auxiliary capacitor respectively, with 27 pin of chip two after 7th auxiliary capacitor, 28 pin are connected, the B10 pin of described USB interface, 15 pin of B11 pin difference chip two, 16 pin are connected.
Described High-current output power control circuit comprises high electric current out-put supply, 37 electric capacity, 38 electric capacity, 39 electric capacity, 40 electric capacity, second inductance, 16 resistance, 17 resistance, described 37 electric capacity, 38 electric capacity one end ground connection after connecing, described 37 electric capacity, 38 electric capacity 1 pin of the other end after connecing and high electric current out-put supply, 4 pin are also linked on+5V power interface after connecing, 2 pin ground connection of described high electric current out-put supply, be linked on+3.3V power interface after 3 pin of described high electric current out-put supply are connected in series with the second inductance, be linked on+3.3V power interface after 5 pin of described high electric current out-put supply are connected in series with the 16 resistance, 5 pin of described high electric current out-put supply are connected in series rear ground connection with the 17 resistance, described 39 electric capacity, 40 electric capacity one end ground connection after connecing, described 39 electric capacity, 40 electric capacity the other end after connecing are linked on+3.3V power interface.The present invention adopts high electric current out-put supply, thus powers for solid state hard disc, ensures to run normally.
Described firmware updating and storing firmware control circuit comprise cd-rom recorder, 1 pin of described cd-rom recorder, 2 pin are connected with 6 pin of chip one, 2 pin respectively, 3 pin of described cd-rom recorder are linked on+3.3V power interface, 5 pin of described cd-rom recorder, 6 pin are connected with 5 pin of chip one, 3 pin respectively, 7 pin of described cd-rom recorder, 8 pin be serially connected with the 35 electric capacity after connecing, described 35 capacity earth, 7 pin of described cd-rom recorder, 8 pin being linked into after connecing on+3.3V power interface.Cd-rom recorder of the present invention, employing is serial SPIFLASH, and internal upgrade can be utilized to solve compatible problem.
The invention has the beneficial effects as follows: the present invention has reasonable in design, the advantages such as the low and volume of manufacturing cost is little, can be convenient for carrying after making solid state hard disc, use for people provides conveniently, improve read-write and transmission speed simultaneously, save the time spent when people use, improve efficiency, simultaneously, present invention employs serial SPIFLASH, internal upgrade can be utilized to solve compatible problem, be applicable to the solid state hard disc of different capabilities, widely applicable, compensate for the limitation that the interface of traditional solid state hard disc existence is single, improve the portability of solid state hard disc.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is perspective view of the present invention;
Fig. 2 is the structural representation of chip one of the present invention;
Fig. 3 is the structural representation of the first module of the present invention;
Fig. 4 is the structural representation of the second module of the present invention;
Fig. 5 is the structural representation of the 3rd module of the present invention;
Fig. 6 is the structural representation of four module of the present invention;
Fig. 7 is the structural representation of the 5th module of the present invention;
Fig. 8 is the structural representation of the 6th module of the present invention;
Fig. 9 is the structural representation of the 7th module of the present invention;
Figure 10 is the structural representation of the 8th module of the present invention;
Figure 11 is the structural representation of the 9th module of the present invention;
Figure 12 is the structural representation of the tenth module of the present invention;
Figure 13 is the structural representation of the 11 module of the present invention;
Figure 14 is the structural representation of the 12 module of the present invention;
Figure 15 is the structural representation of the 13 module of the present invention;
Figure 16 is the structural representation of the tenth four module of the present invention;
Figure 17 is the structural representation of the 15 module of the present invention;
Figure 18 is the structural representation of Current Limits of the present invention resistance module;
Figure 19 is the structural representation of chip two of the present invention;
Figure 20 is the structural representation of USB interface of the present invention;
Figure 21 is the structural representation of High-current output power control circuit of the present invention;
Figure 22 is the structural representation of firmware updating of the present invention and storing firmware control circuit.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below the present invention being set forth further.
As shown in Figure 1, solid state hard disc mSATA turns the switching device of Type-C, comprise Type-C interface 1, PCB 2 and adapter 3, described Type-C interface 1, adapter 3 are all welded in PCB 2, and described adapter 3 realizes transferring by the circuit in PCB 2 and Type-C interface 1.
Described adapter 3 is mSATA adapter.Present invention employs mSATA adapter, and coordinate with PCB 2, finally achieve mSATA and turn Type-C, reduce overall volume, alleviate overall weight, be convenient for carrying, also improve overall read-write and transmission speed, stability and compatibility obtain further improvement, meanwhile, present invention employs Type-C interface 1, positive anti-plug can be realized, solve the problem that traditional USB interface is easily anti-inserted in use, bring conveniently to the actual use of people.
The grafting direction of described Type-C interface 1 is vertical with the grafting direction of mSATA adapter.The mode of this vertical distribution, can reduce overall length dimension, the solid state hard disc volume made can be reduced, and is convenient for carrying.
During use, the storage unit of different capabilities can also be selected to be inserted on mSATA adapter, and to change the capacity of solid state hard disc, dirigibility is higher.
As shown in Fig. 2 to Figure 22, solid state hard disc mSATA turns the circuit of the switching device of Type-C, comprise main control chip control circuit, C interface signal control switching circuit 20, USB interface 21, High-current output power control circuit 22, firmware updating and storing firmware control circuit 23, described USB interface 21 is connected with C interface signal control switching circuit 20, described C interface signal control switching circuit 20, USB interface 21, High-current output power control circuit 22, firmware updating and storing firmware control circuit 23 are connected to realize mSATA with main control chip control circuit respectively and turn Type-C.The present invention adopts High-current output power control circuit 22 to power, to ensure that solid state hard disc can normally run for solid state hard disc; Adopt firmware updating and storing firmware control circuit 23, to realize internal upgrade ensure compatibility, thus compensate for the weak point of traditional solid state hard disc; Present invention employs small size and the electronic devices and components of precision, thus make overall stability higher; Utilize main control chip control circuit, the function realizing auto sleep can be assisted, possess the function of power and energy saving so in use; The present invention also can according to user demand, and change the capacity of solid state hard disc at any time, dirigibility is high.
Described main control chip control circuit comprises chip 1, first module 4, second module 5, 3rd module 6, four module 7, 5th module 8, 6th module 9, 7th module 10, 8th module 11, 9th module 12, tenth module 13, 11 module 14, 12 module 15, 13 module 16, tenth four module 17, 15 module 18, described first module 4, second module 5, 3rd module 6, four module 7, 5th module 8, 7th module 10, 8th module 11, tenth module 13, 11 module 14, 13 module 16, tenth four module 17, 15 module 18 is connected with chip 1 respectively.13 module 16 of the present invention serves the effect of resistance current limliting, tenth four module 17 plays capacitor filtering effect, to avoid the humorous wave interference in circuit, ensure overall stability, achieve the stable input of electric current, 15 module 18 serves the effect of capacitor filtering, and the 8th module 11 serves the effect of resistance current limliting.
Described 15 module 18 comprises the 18 electric capacity C18,1 pin of described 18 electric capacity C18 is connected with+3.3V power interface, 1 pin of described 18 electric capacity C18 is connected with 1 pin of described chip 1, and described 2 pin of the 18 electric capacity C18 and 47 pin of chip 1 also connect power supply ground after connecing.
2 pin of described chip 1, 3 pin, 5 pin, 6 pin are connected with storing firmware control circuit 23 with firmware updating respectively, 4 pin of described chip 1 are connected with+3.3V power interface, 7 pin of described chip 1 are connected with+1.2V power interface, 8 pin of described chip 1, 35 pin, 37 pin, 42 pin are connected with the 8th module 11 respectively, 9 pin of described chip 1 are connected with the second module 5, described second module 5 is connected with+3.3V power interface, 10 pin of described chip 1 are connected with the 13 module 16, described 13 module 16 is connected with+5V power interface, 11 pin of described chip 1 are serially connected with ground connection after the 22 electric capacity C22, 11 pin of described chip 1 are connected with+5V power interface, 12 pin of described chip 1 are serially connected with ground connection after the 23 electric capacity C23, 12 pin of described chip 1 are connected with+3.3V power interface, 13 pin of described chip 1 are connected with+1.2V power interface, 14 pin of described chip 1 are serially connected with ground connection after the 25 electric capacity C25, 14 pin of described chip 1 are connected with+3.3V power interface, 15 pin of described chip 1, 16 pin, 19 pin, 20 pin, 22 pin, 23 pin are linked into C interface signal control switching circuit 20 after being connected with the tenth module 13 respectively, in USB interface 21, 19 pin of described chip 1, 20 pin are linked in the 12 module 15 after being connected with the 11 module 14 respectively, 22 pin of described chip 1, 23 pin are connected with the 12 module 15 respectively, 21 pin ground connection of described chip 1, 24 pin of described chip 1 are serially connected with ground connection after the 27 electric capacity, 24 pin of described chip 1 are connected with+1.2V power interface, 25 pin of described chip 1, 26 pin are connected with four module 7 respectively, 27 pin of described chip 1 are serially connected with ground connection after the 24 electric capacity C24, 27 pin of described chip 1 are connected with+3.3V power interface, 28 pin of described chip 1, 36 pin are also connected with+1.2V power interface after connecing, 29 pin of described chip 1, 30 pin, 21 pin, 33 pin are connected with the 7th module 10 respectively, 31 pin ground connection of described chip 1, 34 pin of described chip 1 connect and are connected with+3.3V power interface, 35 pin of described chip 1 are connected with the 8th module 11, 38 pin of described chip 1 are connected with the 3rd module 6, described 3rd module 6 is connected with+3.3V power interface, be linked on+3.3V power interface after 39 pin of described chip 1 are connected with the first module 4, be linked on+1.2V power interface after 46 pin of described chip 1 are connected with the first module 4, 47 pin of described chip 1 are serially connected with ground connection after the 4th resistance R4, 48 pin of described chip 1 are connected with the tenth four module 17, described tenth four module 17 is linked on+1.2V power interface, 49 pin ground connection of described chip 1.
Described first module 4 comprises the first electric capacity C1, 5th electric capacity C5, 6th electric capacity C6, tenth electric capacity C10, 11 electric capacity C11, 12 electric capacity C12, second electric capacity C2, 3rd electric capacity C3, 7th electric capacity C7, 8th electric capacity C8, 13 electric capacity C13,1 pin of described first electric capacity C1, 1 pin of the 5th electric capacity C5, 1 pin of the 6th electric capacity C6, 1 pin of the tenth electric capacity C10, 1 pin of the 11 electric capacity C11, 1 pin of the 12 electric capacity C12 is also connected with+1.2V power interface after connecing, 2 pin of described first electric capacity C1, 2 pin of the 5th electric capacity C5, 2 pin of the 6th electric capacity C6, 2 pin of the tenth electric capacity C10, 2 pin of the 11 electric capacity C11, 2 pin of the 12 electric capacity C12 also connect rear ground connection, 1 pin of described second electric capacity C2, 1 pin of the 3rd electric capacity C3, 1 pin of the 7th electric capacity C7, 1 pin of the 8th electric capacity C8, 1 pin of the 13 electric capacity C13 is also linked on+3.3V power interface after connecing, 2 pin of described second electric capacity C2, 2 pin of the 3rd electric capacity C3, 2 pin of the 7th electric capacity C7, 2 pin of the 8th electric capacity C8, 2 pin of the 13 electric capacity C13 also connect rear ground connection.
Described second module 5 comprises the first resistance R1 and LED, described 1 pin of the first resistance R1 is connected with 9 pin of chip 1, described 2 pin of the first resistance R1 are connected with 2 pin of LED, and 1 pin of described LED is connected with+3.3V power interface;
Described 3rd module 6 comprises the second resistance R2 and the 9th electric capacity C9, be linked on 38 pin of chip 1 after 1 pin of described second resistance R2 is connected with 2 pin of the 9th electric capacity C9,2 pin of described second resistance R2 are connected with+3.3V power interface, the 1 pin ground connection of described 9th electric capacity C9;
Described four module 7 comprises the 4th electric capacity C4 and crystal oscillator X1, described 1 pin of the 4th electric capacity C4 and 3 pin of crystal oscillator X1 are also linked on 26 pin of chip 1 after connecing, described 2 pin of the 4th electric capacity C4 and 1 pin of crystal oscillator X1 are also linked on 25 pin of chip 1 after connecing, 2 pin of described crystal oscillator X1,4 pin ground connection.
Described 5th module 8 comprises the 3rd resistance R3, and described 1 pin of the 3rd resistance R3 is connected with 17 pin of chip 1, the 2 pin ground connection of described 3rd resistance R3;
Described 6th module 9 comprises mSATA interface, 9 pin of described mSATA interface, 15 pin, 21 pin, 29 pin, 35 pin, 37 pin, 43 pin connect rear ground connection, 23 pin of described mSATA interface, 25 pin, 31 pin, 33 pin are connected with the 7th module 10 respectively, 2 pin of described mSATA interface, 24 pin, 39 pin, 41 pin, 52 pin are all linked on+3.3V power interface, 4 pin of described mSATA interface, 18 pin, 26 pin, 34 pin, 40 pin, 50 pin connect rear ground connection, 53 pin of described mSATA interface, 54 pin, 55 pin, 56 pin connect rear ground connection.
Described 7th module 10 comprises the 14 electric capacity C14, the 15 electric capacity C15, the 16 electric capacity C16 and the 17 electric capacity C17,1 pin of 1 pin of described 14 electric capacity C14,1 pin of the 15 electric capacity C15, the 16 electric capacity C16,1 pin of the 17 electric capacity C17 are connected with 33 pin of chip 1,32 pin, 30 pin, 29 pin respectively, and 2 pin of 2 pin of described 14 electric capacity C14,2 pin of the 15 electric capacity C15, the 16 electric capacity C16,2 pin of the 17 electric capacity C17 are connected with 33 pin of the 6th module 9,31 pin, 25 pin, 23 pin respectively.
Described 8th module 11 comprises the 6th resistance R6, the 7th resistance R7 and the 8th resistance R8,1 pin of 1 pin of described 6th resistance R6,1 pin of the 7th resistance R7, the 8th resistance R8 is connected with 37 pin of chip 1,8 pin, 35 pin respectively, and 2 pin of 2 pin of described 6th resistance R6,2 pin of the 7th resistance R7, the 8th resistance R8 connect rear ground connection with 42 pin of chip 1 respectively;
Described 9th module 12 comprises the 29 electric capacity C29, the 30 electric capacity C30, the 31 electric capacity C31, the 32 electric capacity C32 and the 33 electric capacity C33, described 29 electric capacity C29, the 30 electric capacity C30, the 31 electric capacity C31, the 32 electric capacity C32 one end with the 33 electric capacity C33 and after connecing is connected with+3.3V power interface, described 29 electric capacity C29, the 30 electric capacity C30, the 31 electric capacity C31, the 32 electric capacity C32 and the 33 electric capacity C33 other end ground connection after connecing.
Described tenth module 13 realizes 15 pin of chip 1,16 pin are connected with USB interface 21 respectively and 19 pin of chip 1,20 pin, 22 pin, 23 pin are connected with described C interface signal control switching circuit 20 respectively.
Described 11 module 14 comprises the 20 electric capacity C20, the 21 electric capacity C21,2 pin of described 20 electric capacity C20,2 pin of the 21 electric capacity C21 are connected with 20 pin of chip 1,19 pin respectively, and described 1 pin of the 20 electric capacity C20,1 pin of the 21 electric capacity C21 are connected with the 12 module 15 respectively.
Described 12 module 15 comprises first input end S1, the second input end S2, the 3rd input end S3, four-input terminal S4, described first input end S1, the second input end S2 are connected with 1 pin of the 20 electric capacity C20,1 pin of the 21 electric capacity C21 respectively, and described 3rd input end S3, four-input terminal S4 are connected with 23 pin of chip 1,22 pin respectively.
Described 13 module 16 comprises the 5th resistance R5, and described 1 pin of the 5th resistance R5 is connected with 10 pin of chip 1, and 2 pin of described 5th resistance R5 are connected with+5V power interface.
Described tenth four module 17 comprises the 19 electric capacity C19, the first inductance L 1,1 pin of described 19 electric capacity C19,1 pin of the first inductance L 1 be linked on+1.2V power interface after connecing, described 2 pin of the 19 electric capacity C19 and 47 pin of chip 1 also connect power supply ground after connecing, described 2 pin of the first inductance L 1 are connected with 48 pin of chip 1.After the filtering process of the tenth four module 17, thus provide noiseless voltage, to guarantee the normal work of circuit for other electronic devices and components.
Described C interface signal control switching circuit 20 comprises chip two BU2 and Current Limits resistance module 19, and described Current Limits resistance module 19 comprises the second current-limiting resistance BR2, 3rd current-limiting resistance BR3, 4th current-limiting resistance BR4, 5th current-limiting resistance BR5 and the 6th current-limiting resistance BR6,1 pin of described chip two BU2, 2 pin, 6 pin respectively with one end of the second current-limiting resistance BR2, one end of 6th current-limiting resistance BR6, one end of 4th current-limiting resistance BR4 is connected, and the other end of described second current-limiting resistance BR2 is linked on+3.3V power interface, the other end of described 4th current-limiting resistance BR4, the other end ground connection respectively of the 6th current-limiting resistance BR6, the 11 auxiliary capacitor BC11 is connected with between 9 pin of described chip two BU2 and 12 pin, the 9 pin ground connection of described chip two BU2,12 pin of described chip two BU2 are connected with+3.3V power interface, 11 pin of described chip two BU2, 13 pin, 14 pin, 15 pin, 16 pin are connected with USB interface 21 respectively, 17 pin of described chip two BU2, 21 pin, 24 pin ground connection, 18 pin of described chip two BU2, 19 pin are respectively through 22 pin of the tenth module 13 with chip 1, 23 pin are connected, and 20 pin of described chip two BU2 are serially connected with ground connection after the 8th current-limiting resistance BR8, and 20 pin of described chip two BU2 are connected with+3.3V power interface, 22 pin of described chip two BU2, 23 pin are respectively through 19 pin of the tenth module 13 with chip 1, 20 pin are connected, 25 pin of described chip two BU2, 26 pin, 27 pin, 28 pin are connected with USB interface 21 respectively, and 29 pin of described chip two BU2 are serially connected with ground connection after the 5th auxiliary capacitor BC5, and 30 pin of described chip two BU2 are serially connected with ground connection after the first current-limiting resistance BR1,31 pin of described chip two BU2, 32 pin respectively with one end of the 5th current-limiting resistance BR5, one end of 3rd current-limiting resistance BR3 is connected, the other end ground connection of described 5th current-limiting resistance BR5, and the other end of described 3rd current-limiting resistance BR3 is linked on+3.3V power interface, the 33 pin ground connection of described chip two BU2.
1 pin of described USB interface 21, 2 pin, 3 pin, 4 pin, 5 pin, 6 pin, A1 pin, A12 pin, B1 pin, the equal ground connection of B12 pin, the A2 pin of USB interface 21, A3 pin is serially connected with the tenth auxiliary capacitor BC10 respectively, with 25 pin of chip two BU2 after 9th auxiliary capacitor BC9, 26 pin are connected, the A4 pin of described USB interface 21, A9 pin, B4 pin, B9 pin is also connected with 11 pin of chip two BU2 after connecing, the A6 pin of described USB interface 21, B6 pin is connected with 15 pin of chip 1 by the tenth module 13, the A7 pin of described USB interface 21, B7 pin is connected with 16 pin of chip 1 by the tenth module 13, the A10 pin of described USB interface 21, A11 pin respectively with 13 pin of chip two BU2, 14 pin are connected, the B2 pin of described USB interface 21, B3 pin is serially connected with the 6th auxiliary capacitor BC6 respectively, with 27 pin of chip two BU2 after 7th auxiliary capacitor BC7, 28 pin are connected, the B10 pin of described USB interface 21, 15 pin of B11 pin difference chip two BU2, 16 pin are connected.
Described High-current output power control circuit 22 comprises high electric current out-put supply U5, 37 electric capacity C37, 38 electric capacity C38, 39 electric capacity C39, 40 electric capacity C40, second inductance L 2, 16 resistance R16, 17 resistance R17, described 37 electric capacity C37, 38 electric capacity C38 one end ground connection after connecing, described 37 electric capacity C37, 38 electric capacity C38 1 pin of the other end after connecing and high electric current out-put supply U5, 4 pin are also linked on+5V power interface after connecing, the 2 pin ground connection of described high electric current out-put supply U5, be linked on+3.3V power interface after 3 pin of described high electric current out-put supply U5 are connected in series with the second inductance L 2, be linked on+3.3V power interface after 5 pin of described high electric current out-put supply U5 are connected in series with the 16 resistance R16, 5 pin of described high electric current out-put supply U5 are connected in series rear ground connection, described 39 electric capacity C39 with the 17 resistance R17, 40 electric capacity C40 one end ground connection after connecing, described 39 electric capacity C39, 40 electric capacity C40 the other end after connecing are linked on+3.3V power interface.The present invention adopts high electric current out-put supply U5, thus powers for solid state hard disc, ensures to run normally.
Described firmware updating and storing firmware control circuit 23 comprise cd-rom recorder U3,1 pin of described cd-rom recorder U3,2 pin are connected with 6 pin of chip 1,2 pin respectively, 3 pin of described cd-rom recorder U3 are linked on+3.3V power interface, 5 pin of described cd-rom recorder U3,6 pin are connected with 5 pin of chip 1,3 pin respectively, 7 pin of described cd-rom recorder U3,8 pin be serially connected with the 35 electric capacity C35 after connecing, described 35 electric capacity C35 ground connection, 7 pin of described cd-rom recorder U3,8 pin being linked into after connecing on+3.3V power interface.Cd-rom recorder U3 of the present invention, employing is serial SPIFLASH, and internal upgrade can be utilized to solve compatible problem.
The invention solves that traditional solid state hard disc exists the single limitation of interface, improve the portability of solid state hard disc, and further read-write and transmission performance, save the time spent when people use, improve efficiency, simultaneously, present invention employs serial SPIFLASH, internal upgrade can be utilized to solve compatible problem, be applicable to the solid state hard disc of different capabilities, widely applicable.
More than show and describe ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; the just principle of the present invention described in above-described embodiment and instructions; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (7)
1. solid state hard disc mSATA turns the switching device of Type-C, it is characterized in that: comprise Type-C interface (1), PCB (2) and adapter (3), described Type-C interface (1), adapter (3) are all welded in PCB (2), and described adapter (3) realizes transferring by the circuit in PCB (2) and Type-C interface (1);
Described adapter (3) is mSATA adapter.
2. solid state hard disc mSATA according to claim 1 turns the switching device of Type-C, it is characterized in that: the grafting direction of described Type-C interface (1) is vertical with the grafting direction of mSATA adapter.
3. solid state hard disc mSATA according to claim 1 turns the circuit of the switching device of Type-C, it is characterized in that: comprise main control chip control circuit, C interface signal control switching circuit (20), USB interface (21), High-current output power control circuit (22), firmware updating and storing firmware control circuit (23), described USB interface (21) is connected with C interface signal control switching circuit (20), described C interface signal control switching circuit (20), USB interface (21), High-current output power control circuit (22), firmware updating is connected to realize mSATA with main control chip control circuit respectively with storing firmware control circuit (23) and turns Type-C.
4. solid state hard disc mSATA according to claim 1 turns the circuit of the switching device of Type-C, it is characterized in that: described main control chip control circuit comprises chip one (24), first module (4), second module (5), 3rd module (6), four module (7), 5th module (8), 6th module (9), 7th module (10), 8th module (11), 9th module (12), tenth module (13), 11 module (14), 12 module (15), 13 module (16), tenth four module (17), 15 module (18), described first module (4), second module (5), 3rd module (6), four module (7), 5th module (8), 7th module (10), 8th module (11), tenth module (13), 11 module (14), 13 module (16), tenth four module (17), 15 module (18) is connected with chip one (24) respectively,
Described 15 module (18) comprises the 18 electric capacity (C18), 1 pin of described 18 electric capacity (C18) is connected with+3.3V power interface, 1 pin of described 18 electric capacity (C18) is connected with 1 pin of described chip one (24), and described 2 pin of the 18 electric capacity (C18) and 47 pin of chip one (24) also connect power supply ground after connecing;
2 pin of described chip one (24), 3 pin, 5 pin, 6 pin are connected with storing firmware control circuit (23) with firmware updating respectively, 4 pin of described chip one (24) are connected with+3.3V power interface, 7 pin of described chip one (24) are connected with+1.2V power interface, 8 pin of described chip one (24), 35 pin, 37 pin, 42 pin are connected with the 8th module (11) respectively, 9 pin of described chip one (24) are connected with the second module (5), described second module (5) is connected with+3.3V power interface, 10 pin of described chip one (24) are connected with the 13 module (16), described 13 module (16) is connected with+5V power interface, 11 pin of described chip one (24) are serially connected with the 22 electric capacity (C22) ground connection afterwards, 11 pin of described chip one (24) are connected with+5V power interface, 12 pin of described chip one (24) are serially connected with the 23 electric capacity (C23) ground connection afterwards, 12 pin of described chip one (24) are connected with+3.3V power interface, 13 pin of described chip one (24) are connected with+1.2V power interface, 14 pin of described chip one (24) are serially connected with the 25 electric capacity (C25) ground connection afterwards, 14 pin of described chip one (24) are connected with+3.3V power interface, 15 pin of described chip one (24), 16 pin, 19 pin, 20 pin, 22 pin, 23 pin are linked into C interface signal control switching circuit (20) after being connected with the tenth module (13) respectively, in USB interface (21), 19 pin of described chip one (24), 20 pin are linked in the 12 module (15) after being connected with the 11 module (14) respectively, 22 pin of described chip one (24), 23 pin are connected with the 12 module (15) respectively, 21 pin ground connection of described chip one (24), 24 pin of described chip one (24) are serially connected with ground connection after the 27 electric capacity, 24 pin of described chip one (24) are connected with+1.2V power interface, 25 pin of described chip one (24), 26 pin are connected with four module (7) respectively, 27 pin of described chip one (24) are serially connected with the 24 electric capacity (C24) ground connection afterwards, 27 pin of described chip one (24) are connected with+3.3V power interface, 28 pin of described chip one (24), 36 pin are also connected with+1.2V power interface after connecing, 29 pin of described chip one (24), 30 pin, 21 pin, 33 pin are connected with the 7th module (10) respectively, 31 pin ground connection of described chip one (24), 34 pin of described chip one (24) connect and are connected with+3.3V power interface, 35 pin of described chip one (24) are connected with the 8th module (11), 38 pin of described chip one (24) are connected with the 3rd module (6), described 3rd module (6) is connected with+3.3V power interface, be linked on+3.3V power interface after 39 pin of described chip one (24) are connected with the first module (4), be linked on+1.2V power interface after 46 pin of described chip one (24) are connected with the first module (4), 47 pin of described chip one (24) are serially connected with the 4th resistance (R4) ground connection afterwards, 48 pin of described chip one (24) are connected with the tenth four module (17), described tenth four module (17) is linked on+1.2V power interface, 49 pin ground connection of described chip one (24),
Described first module (4) comprises the first electric capacity (C1), 5th electric capacity (C5), 6th electric capacity (C6), tenth electric capacity (C10), 11 electric capacity (C11), 12 electric capacity (C12), second electric capacity (C2), 3rd electric capacity (C3), 7th electric capacity (C7), 8th electric capacity (C8), 13 electric capacity (C13), 1 pin of described first electric capacity (C1), 1 pin of the 5th electric capacity (C5), 1 pin of the 6th electric capacity (C6), 1 pin of the tenth electric capacity (C10), 1 pin of the 11 electric capacity (C11), 1 pin of the 12 electric capacity (C12) is also connected with+1.2V power interface after connecing, 2 pin of described first electric capacity (C1), 2 pin of the 5th electric capacity (C5), 2 pin of the 6th electric capacity (C6), 2 pin of the tenth electric capacity (C10), 2 pin of the 11 electric capacity (C11), 2 pin of the 12 electric capacity (C12) also connect rear ground connection, 1 pin of described second electric capacity (C2), 1 pin of the 3rd electric capacity (C3), 1 pin of the 7th electric capacity (C7), 1 pin of the 8th electric capacity (C8), 1 pin of the 13 electric capacity (C13) is also linked on+3.3V power interface after connecing, 2 pin of described second electric capacity (C2), 2 pin of the 3rd electric capacity (C3), 2 pin of the 7th electric capacity (C7), 2 pin of the 8th electric capacity (C8), 2 pin of the 13 electric capacity (C13) also connect rear ground connection,
Described second module (5) comprises the first resistance (R1) and light emitting diode (LED), 1 pin of described first resistance (R1) is connected with 9 pin of chip one (24), 2 pin of described first resistance (R1) are connected with 2 pin of light emitting diode (LED), and 1 pin of described light emitting diode (LED) is connected with+3.3V power interface;
Described 3rd module (6) comprises the second resistance (R2) and the 9th electric capacity (C9), be linked on 38 pin of chip one (24) after 1 pin of described second resistance (R2) is connected with 2 pin of the 9th electric capacity (C9), 2 pin of described second resistance (R2) are connected with+3.3V power interface, 1 pin ground connection of described 9th electric capacity (C9);
Described four module (7) comprises the 4th electric capacity (C4) and crystal oscillator (X1), described 1 pin of the 4th electric capacity (C4) and 3 pin of crystal oscillator (X1) are also linked on 26 pin of chip one (24) after connecing, described 2 pin of the 4th electric capacity (C4) and 1 pin of crystal oscillator (X1) are also linked on 25 pin of chip one (24) after connecing, 2 pin of described crystal oscillator (X1), 4 pin ground connection;
Described 5th module (8) comprises the 3rd resistance (R3), and 1 pin of described 3rd resistance (R3) is connected with 17 pin of chip one (24), 2 pin ground connection of described 3rd resistance (R3);
Described 6th module (9) comprises mSATA interface, 9 pin of described mSATA interface, 15 pin, 21 pin, 29 pin, 35 pin, 37 pin, 43 pin connect rear ground connection, 23 pin of described mSATA interface, 25 pin, 31 pin, 33 pin are connected with the 7th module (10) respectively, 2 pin of described mSATA interface, 24 pin, 39 pin, 41 pin, 52 pin are all linked on+3.3V power interface, 4 pin of described mSATA interface, 18 pin, 26 pin, 34 pin, 40 pin, 50 pin connect rear ground connection, 53 pin of described mSATA interface, 54 pin, 55 pin, 56 pin connect rear ground connection;
Described 7th module (10) comprises the 14 electric capacity (C14), 15 electric capacity (C15), 16 electric capacity (C16) and the 17 electric capacity (C17), 1 pin of described 14 electric capacity (C14), 1 pin of the 15 electric capacity (C15), 1 pin of the 16 electric capacity (C16), 1 pin of the 17 electric capacity (C17) respectively with 33 pin of chip one (24), 32 pin, 30 pin, 29 pin are connected, 2 pin of described 14 electric capacity (C14), 2 pin of the 15 electric capacity (C15), 2 pin of the 16 electric capacity (C16), 2 pin of the 17 electric capacity (C17) respectively with 33 pin of the 6th module (9), 31 pin, 25 pin, 23 pin are connected,
Described 8th module (11) comprises the 6th resistance (R6), the 7th resistance (R7) and the 8th resistance (R8), 1 pin of 1 pin of described 6th resistance (R6), 1 pin of the 7th resistance (R7), the 8th resistance (R8) is connected with 37 pin of chip one (24), 8 pin, 35 pin respectively, and 2 pin of 2 pin of described 6th resistance (R6), 2 pin of the 7th resistance (R7), the 8th resistance (R8) connect rear ground connection with 42 pin of chip one (24) respectively;
Described 9th module (12) comprises the 29 electric capacity (C29), 30 electric capacity (C30), 31 electric capacity (C31), 32 electric capacity (C32) and the 33 electric capacity (C33), described 29 electric capacity (C29), 30 electric capacity (C30), 31 electric capacity (C31), 32 electric capacity (C32) one end with the 33 electric capacity (C33) and after connecing is connected with+3.3V power interface, described 29 electric capacity (C29), 30 electric capacity (C30), 31 electric capacity (C31), 32 electric capacity (C32) and the 33 electric capacity (C33) other end ground connection after connecing,
Described tenth module (13) realizes 15 pin of chip one (24), 16 pin are connected with USB interface (21) respectively and 19 pin of chip one (24), 20 pin, 22 pin, 23 pin are connected with described C interface signal control switching circuit (20) respectively;
Described 11 module (14) comprises the 20 electric capacity (C20), the 21 electric capacity (C21), 2 pin of described 20 electric capacity (C20), 2 pin of the 21 electric capacity (C21) are connected with 20 pin of chip one (24), 19 pin respectively, and described 1 pin of the 20 electric capacity (C20), 1 pin of the 21 electric capacity (C21) are connected with the 12 module (15) respectively;
Described 12 module (15) comprises first input end (S1), the second input end (S2), the 3rd input end (S3), four-input terminal (S4), described first input end (S1), the second input end (S2) are connected with 1 pin of the 20 electric capacity (C20), 1 pin of the 21 electric capacity (C21) respectively, and described 3rd input end (S3), four-input terminal (S4) are connected with 23 pin of chip one (24), 22 pin respectively;
Described 13 module (16) comprises the 5th resistance (R5), 1 pin of described 5th resistance (R5) is connected with 10 pin of chip one (24), and 2 pin of described 5th resistance (R5) are connected with+5V power interface;
Described tenth four module (17) comprises the 19 electric capacity (C19), the first inductance (L1), described 1 pin of the 19 electric capacity (C19), 1 pin of the first inductance (L1) be linked on+1.2V power interface after connecing, described 2 pin of the 19 electric capacity (C19) and 47 pin of chip one (24) also connect power supply ground after connecing, 2 pin of described first inductance (L1) are connected with 48 pin of chip one (24).
5. solid state hard disc mSATA according to claim 4 turns the circuit of the switching device of Type-C, it is characterized in that: described C interface signal control switching circuit (20) comprises chip two (BU2) and Current Limits resistance module (19), described Current Limits resistance module (19) comprises the second current-limiting resistance (BR2), 3rd current-limiting resistance (BR3), 4th current-limiting resistance (BR4), 5th current-limiting resistance (BR5) and the 6th current-limiting resistance (BR6), 1 pin of described chip two (BU2), 2 pin, 6 pin respectively with one end of the second current-limiting resistance (BR2), one end of 6th current-limiting resistance (BR6), one end of 4th current-limiting resistance (BR4) is connected, the other end of described second current-limiting resistance (BR2) is linked on+3.3V power interface, the other end of described 4th current-limiting resistance (BR4), the other end ground connection respectively of the 6th current-limiting resistance (BR6), the 11 auxiliary capacitor (BC11) is connected with between 9 pin of described chip two (BU2) and 12 pin, 9 pin ground connection of described chip two (BU2), 12 pin of described chip two (BU2) are connected with+3.3V power interface, 11 pin of described chip two (BU2), 13 pin, 14 pin, 15 pin, 16 pin are connected with USB interface (21) respectively, 17 pin of described chip two (BU2), 21 pin, 24 pin ground connection, 18 pin of described chip two (BU2), 19 pin are respectively through 22 pin of the tenth module (13) with chip one (24), 23 pin are connected, 20 pin of described chip two (BU2) are serially connected with the 8th current-limiting resistance (BR8) ground connection afterwards, 20 pin of described chip two (BU2) are connected with+3.3V power interface, 22 pin of described chip two (BU2), 23 pin are respectively through 19 pin of the tenth module (13) with chip one (24), 20 pin are connected, 25 pin of described chip two (BU2), 26 pin, 27 pin, 28 pin are connected with USB interface (21) respectively, 29 pin of described chip two (BU2) are serially connected with the 5th auxiliary capacitor (BC5) ground connection afterwards, 30 pin of described chip two (BU2) are serially connected with the first current-limiting resistance (BR1) ground connection afterwards, 31 pin of described chip two (BU2), 32 pin respectively with one end of the 5th current-limiting resistance (BR5), one end of 3rd current-limiting resistance (BR3) is connected, the other end ground connection of described 5th current-limiting resistance (BR5), the other end of described 3rd current-limiting resistance (BR3) is linked on+3.3V power interface, 33 pin ground connection of described chip two (BU2),
1 pin of described USB interface (21), 2 pin, 3 pin, 4 pin, 5 pin, 6 pin, A1 pin, A12 pin, B1 pin, the equal ground connection of B12 pin, the A2 pin of USB interface (21), A3 pin is serially connected with the tenth auxiliary capacitor (BC10) respectively, 9th auxiliary capacitor (BC9) afterwards with 25 pin of chip two (BU2), 26 pin are connected, the A4 pin of described USB interface (21), A9 pin, B4 pin, B9 pin is also connected with 11 pin of chip two (BU2) after connecing, the A6 pin of described USB interface (21), B6 pin is connected with 15 pin of chip one (24) by the tenth module (13), the A7 pin of described USB interface (21), B7 pin is connected with 16 pin of chip one (24) by the tenth module (13), the A10 pin of described USB interface (21), A11 pin respectively with 13 pin of chip two (BU2), 14 pin are connected, the B2 pin of described USB interface (21), B3 pin is serially connected with the 6th auxiliary capacitor (BC6) respectively, 7th auxiliary capacitor (BC7) afterwards with 27 pin of chip two (BU2), 28 pin are connected, the B10 pin of described USB interface (21), 15 pin of B11 pin difference chip two (BU2), 16 pin are connected.
6. solid state hard disc mSATA according to claim 4 turns the circuit of the switching device of Type-C, it is characterized in that: described High-current output power control circuit (22) comprises high electric current out-put supply (U5), 37 electric capacity (C37), 38 electric capacity (C38), 39 electric capacity (C39), 40 electric capacity (C40), second inductance (L2), 16 resistance (R16), 17 resistance (R17), described 37 electric capacity (C37), 38 electric capacity (C38) one end ground connection after connecing, described 37 electric capacity (C37), 38 electric capacity (C38) 1 pin of the other end after connecing and high electric current out-put supply (U5), 4 pin are also linked on+5V power interface after connecing, 2 pin ground connection of described high electric current out-put supply (U5), be linked on+3.3V power interface after 3 pin of described high electric current out-put supply (U5) are connected in series with the second inductance (L2), be linked on+3.3V power interface after 5 pin of described high electric current out-put supply (U5) are connected in series with the 16 resistance (R16), 5 pin of described high electric current out-put supply (U5) are connected in series rear ground connection with the 17 resistance (R17), described 39 electric capacity (C39), 40 electric capacity (C40) one end ground connection after connecing, described 39 electric capacity (C39), 40 electric capacity (C40) the other end after connecing are linked on+3.3V power interface.
7. solid state hard disc mSATA according to claim 4 turns the circuit of the switching device of Type-C, it is characterized in that: described firmware updating and storing firmware control circuit (23) comprise cd-rom recorder (U3), 1 pin of described cd-rom recorder (U3), 2 pin respectively with 6 pin of chip one (24), 2 pin are connected, 3 pin of described cd-rom recorder (U3) are linked on+3.3V power interface, 5 pin of described cd-rom recorder (U3), 6 pin respectively with 5 pin of chip one (24), 3 pin are connected, 7 pin of described cd-rom recorder (U3), 8 pin are also serially connected with the 35 electric capacity (C35) after connecing, described 35 electric capacity (C35) ground connection, 7 pin of described cd-rom recorder (U3), 8 pin are also linked into after connecing on+3.3V power interface.
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| CN109857337A (en) * | 2018-12-10 | 2019-06-07 | 浪潮(北京)电子信息产业有限公司 | A kind of writing speed control method, system, device and readable storage medium storing program for executing |
| CN113205853A (en) * | 2021-06-18 | 2021-08-03 | 长江存储科技有限责任公司 | Switching device for test, test system and solid state disk |
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| CN109857337A (en) * | 2018-12-10 | 2019-06-07 | 浪潮(北京)电子信息产业有限公司 | A kind of writing speed control method, system, device and readable storage medium storing program for executing |
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| CN113205853B (en) * | 2021-06-18 | 2023-10-20 | 长江存储科技有限责任公司 | Switching device for test, test system and solid state disk |
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| CN105047215B (en) | 2017-12-15 |
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Effective date of registration: 20211206 Address after: 214000 room 1920, block C, Cygnus, No. 111, Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Xinming Microelectronics Co.,Ltd. Address before: 241000 floor 2, building a, electronic industrial park, Wanchun Middle Road, Jiujiang Development Zone, Wuhu City, Anhui Province Patentee before: WUHU KINGSHARE ELECTRONIC TECHNOLOGY CO.,LTD. |