CN105042668B - Floor heating device - Google Patents
Floor heating device Download PDFInfo
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- CN105042668B CN105042668B CN201510177524.2A CN201510177524A CN105042668B CN 105042668 B CN105042668 B CN 105042668B CN 201510177524 A CN201510177524 A CN 201510177524A CN 105042668 B CN105042668 B CN 105042668B
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Abstract
The invention discloses floor heating device, including heat-insulation layer, heating layer and heat transfer layer, the heating layer is hot-water heating pipe, the hot-water heating pipe, which includes the frame pipe of " mouth " word and one, has the box body of inner chamber body, the top surface of the box body and bottom surface are all fixed in frame pipe " mouth " word for burnishing surface and the box body by blank pipe, the end of blank pipe two is respectively and fixedly connected with box body and frame pipe and connects box body inner chamber body and frame pipe, and the frame pipe is provided with water inlet, the interface of water outlet；The heat transfer layer includes heat transfer plate and the floor layer being installed on heat transfer plate, and the heating layer is placed on heat-insulation layer, and the heat transfer layer is detachably laminated on heating layer top by a supporting construction.It has the following advantages that：Heat-transfer effect is uniform, is not in local uneven in temperature, heat transfer effect is good, easy for installation, readily replaceable heating layer.
Description
Technical field
The present invention relates to floor heating device.
Background technology
Existing floor heating device, including the heat-insulation layer, heating layer and heat transfer layer of arrangement, heat transfer layer are arranged in order from lower to upper
For cement and ceramic tile.First, heat transfer layer is ceramic tile and cement, heating layer direct heat transfer is to cement layer, therefore heat-transfer effect is uneven,
Heat transfer effect is poor；Second, if cement layer is directly overlayed on heating layer, the damage of later stage hot-water heating pipe can be caused and repaired
It is difficult；The weight of earth's surface can be more caused to produce pressure to hot-water heating pipe on hot-water heating pipe third, cement layer is directly born against, this can be straight
Connect and shorten its service life；Fourth, in the connection of hot-water heating interface tube and external connecting pipe, it is existing simply by gluing that two pipes are viscous
Close, but it also result in certain difficulty in maintenance, replacing.
The content of the invention
The invention provides floor heating device, which overcomes the deficiency present in floor heating device in background technology.
The present invention solve its technical problem used technical scheme be：
Floor heating device, including the heat-insulation layer (10), heating layer (20) and heat transfer layer (30) of arrangement are arranged in order from lower to upper,
The heating layer (20) is hot-water heating pipe, and the hot-water heating pipe, which includes the frame pipe (21) of " mouth " word and one, has the box body of inner chamber body
(22), the top surface of the box body (22) and bottom surface are all fixed on frame pipe (21) for burnishing surface and the box body (22) by blank pipe (23)
In " mouth " word, the end of blank pipe (23) two is respectively and fixedly connected with box body (22) and frame pipe (21) and connects box body (22) inner chamber body and frame
Formula pipe (21), the frame pipe (21) are provided with water inlet, the interface of water outlet；The heat transfer layer (30) includes heat transfer plate (31) and is installed in biography
Floor layer on hot plate (31), the heating layer (20) are placed on heat-insulation layer (10), and the heat transfer layer (30) passes through a supporting construction
Detachably it is laminated on heating layer top.
Among one embodiment：The supporting construction includes being installed in heat transfer plate (31) lower surface (311) and extending downwardly convex
Block (312), the projection (312) surround the convex wall in a closure region, and the convex wall is provided with installation gap (313)；The heat transfer layer
(30) fold against on heating layer (20), the box body (22) of the hot-water heating pipe is located in the closure region that convex wall surrounds, the blank pipe
(23) it is enclosed in through the installation gap (313) in convex wall, the frame pipe (21) outside convex wall.
Among one embodiment：The heat-insulation layer (10) has a groove (11) and a perisporium (12) for surrounding groove (11),
The perisporium (12) is provided with least two locating notches run through from inside to outside (13)；The hot-water heating pipe is placed on heat-insulation layer (10)
In groove (11), the interface lower surface of the hot-water heating pipe is parallel to be separated by locating notch (13) bottom surface, the interface of the hot-water heating pipe
Top end face is less than the top end face of perisporium；The convex wall is supported on groove (11) bottom surface of heat-insulation layer (10).
Heat transfer plate (31) the lower surface peripheral part is also convexly equipped with a downward annular wall (315), the perisporium (12) top
Periphery edge is arranged with the step breach (15) of annular, the step breach (15) of annular wall (315) thickness and heat-insulation layer (10)
Width is identical, and the heat transfer plate (31) is placed on heat-insulation layer (10), and the step that the annular wall (315) is socketed in heat-insulation layer (10) lacks
Heat-insulation layer (10) groove (11) and hot-water heating pipe are simultaneously enclosed in the inside by mouth (15).
Among one embodiment：Hot-water heating pipe height, heat transfer plate (31) convex wall height, heat-insulation layer (10) groove (11) depth phase
Deng.
Among one embodiment：The locating notch (13) of heat-insulation layer (10) perisporium (12) is highly more than heat-insulation layer (10) perisporium
(12) top surface to groove (11) bottom surface spacing.
Among one embodiment：The interface top end face of the hot-water heating pipe is less than frame pipe (21) upper surface, the interface of the hot-water heating pipe
Lower surface is less than frame pipe (21) lower surface.
Among one embodiment：Also include connecting tube, the hot-water heating interface tube is mutually fixed with connecting tube by connecting structure and connects
It is logical.
Among one embodiment：The connecting structure includes a fastener being located in connecting tube and one is located at hot-water heating pipe and connects
Pit-holes (26) on mouth, the fastener are tightly stuck in hot-water heating interface tube fovea superior and fallen into hole (26).
Among one embodiment：The heat-insulation layer (10) is XPS extruded sheets.
Among one embodiment：Convex wall in the hot-water heating pipe, heat transfer plate (31) lower surface is all metallic plate or alloy sheets.
Compared with background technology, it has the following advantages that the technical program：
Heat transfer layer includes heat transfer plate and floor layer, and heating layer is placed on heat-insulation layer, and heat transfer layer can by a supporting construction
Heating layer top is laminated on to separate type, one side heat-transfer effect is uniform, is not in local uneven in temperature, heat transfer effect
It is good, easy for installation, the readily replaceable heating layer of another aspect.
Hot-water heating pipe is provided with box body, frame pipe and blank pipe, expand flowing water speed and increase heat transfer plate contact area,
The heat transfer rate of increase and heat transfer are uniform.
The setting of supporting construction has reduced or remitted the load-bearing material on heat transfer layer and top to the pressure of hot-water heating pipe, extends it and uses the longevity
Life, from the point of view of angle of conducting heat, increase heat transfer area, improve heat-transfer effect, reduce thermal losses.
The interface of hot-water heating pipe is connected with external connecting pipe using detachable clamping structure, improve change simplification and
Cost.
The height of breach on heat-insulation layer perisporium is more than perisporium to the bottom of groove, makes its easy for installation.
Brief description of the drawings
The invention will be further described with reference to the accompanying drawings and examples.
Fig. 1 depicts the structural representation of the floor heating device of embodiment one.
Fig. 2 depicts the dimensional structure diagram of heat transfer plate.
Fig. 3 depicts the structural representation of the floor heating device of embodiment two.
Embodiment
Embodiment one
Fig. 1 and Fig. 2, floor heating device are refer to, including is arranged in order the heat-insulation layer 10 of arrangement, the and of heating layer 20 from lower to upper
Heat transfer layer 30.
The heating layer 20 is hot-water heating pipe, and the hot-water heating pipe includes the box body of the frame pipe 21 and one with inner chamber body of " mouth " word
22, the top surface of the box body 22 and bottom surface are all fixed in frame pipe 21 " mouth " word for burnishing surface and the box body 22 by blank pipe 23,
23 liang of ends of the blank pipe are respectively and fixedly connected with box body 22 and frame pipe 21 and connect the inner chamber body of box body 22 and frame pipe 21, the frame pipe 21
Interface provided with water inlet, water outlet.In concrete structure：The interface is divided into two water inlet interfaces and two water outlet mouthpieces, two water inlet interfaces and
Two water outlet mouthpiece crosses are arranged；If four blank pipes 23, blank pipe 23 connects the corresponding corner of frame pipe 21 and the edge of box body 22.
The heat transfer layer 30 includes heat transfer plate 31 and the floor layer being installed on heat transfer plate 31, and the floor layer includes being installed in biography
Cement layer 32 on hot plate 31 and the ceramic tile 33 being attached to admittedly on cement layer 32.The heating layer 20 is placed on heat-insulation layer 10, the biography
Thermosphere 30 is detachably laminated on heating layer top by supporting construction.
The heat-insulation layer 10 has the perisporium 12 of a groove 11 and an encirclement groove 11, and the perisporium 12 is provided with four crosses
Arrangement, the locating notch 13 run through from inside to outside；The hot-water heating pipe is placed in the groove 11 of heat-insulation layer 10, the interface of the hot-water heating pipe
Lower surface is parallel to be separated by the bottom surface of locating notch 13, and the interface top end face of the hot-water heating pipe is less than the top end face of perisporium.
The supporting construction includes being installed in the lower surface 311 of heat transfer plate 31 and the projection 312 extended downwardly, and the projection 312 encloses
Into the convex wall in a closure region, the convex wall is provided with installation gap 313；The box body 22 of the hot-water heating pipe is located at the envelope that convex wall surrounds
In closing property region, the blank pipe 23 is through the installation gap 313 in convex wall, and the frame pipe 21 is enclosed in outside convex wall, to cause：This is convex
Wall is supported on the bottom surface of groove 11 of heat-insulation layer 10, and the edge of heat transfer layer 30 is supported by perisporium 12, and the heat transfer layer 30, which folds against, to be sent out
On thermosphere 20, on the one hand, directly fold against raising heat transference efficiency, by projection increase area of heat transfer, on the other hand, avoid by
Heating layer bears heat transfer plate and weight thereon.Preferably, the frame pipe 21, box body 22 and blank pipe 23 surround first through hole 24, should
First through hole 24 and projection 312 are adapted to, and on the one hand improve heat transfer effect, on the other hand with synthesis buckle structure, increase structure
Stability；The second through hole 25 is set in the box body 22, second through hole does not influence the sealing of box body inner chamber body, under the heat transfer plate 31
End face 311 and the projection 314 extended downwardly, second through hole 25 and projection 314 are adapted to, and on the one hand improve heat transfer effect, separately
On the one hand increase structural stability.As needed, described heat transfer layer 30 is installed in hot-water heating pipe top by a rock-steady structure.
Described rock-steady structure includes at least one recessed being installed in heat transfer in the positioning hole 14 of the perisporium top surface of heat-insulation layer 10 and at least one
30 bottom surface of layer and the pillar 34 extended down, described pillar 34 and described positioning hole 14 are adapted.
As needed, in addition to connecting tube, the hot-water heating interface tube pass through connecting structure mutually fixed and connection with connecting tube.Should
Connecting structure includes a fastener being located in connecting tube and the pit-holes 26 being located on hot-water heating interface tube, the fastener
The tight hot-water heating interface tube fovea superior that is stuck in is fallen into hole 26.
It is best：Hot-water heating pipe height, the convex wall of heat transfer plate 31 height, the depth of 10 groove of heat-insulation layer 11, perisporium 12 are highly equal；
The height of locating notch 13 of the perisporium 12 of heat-insulation layer 10 is more than the top surface of 10 perisporium of heat-insulation layer 12 to the spacing of the bottom surface of groove 11；Hot-water heating
The interface top end face of pipe is less than the upper surface of frame pipe 21, and the interface lower surface of the hot-water heating pipe is less than the lower surface of frame pipe 21；The guarantor
Warm layer 10 is XPS extruded sheets, and the convex wall in the hot-water heating pipe, the lower surface of heat transfer plate 31 is all metallic plate or alloy sheets.
Embodiment two
It is with the difference of embodiment one：Fig. 3 is refer to, does not set the pillar and positioning hole of an embodiment, the biography
The lower surface peripheral part of hot plate 31 is also convexly equipped with a downward annular wall 315, and the top peripheral edge of perisporium 12 is arranged with annular
Step breach 15, the thickness of annular wall 315 is identical with the width of step breach 15 of heat-insulation layer 10, and the heat transfer plate 31 is placed on guarantor
On warm layer 10, the annular wall 315 is socketed in the step breach 15 of heat-insulation layer 10 and surrounds the groove 11 of heat-insulation layer 10 and hot-water heating pipe
Inside.
It is described above, only present pre-ferred embodiments, therefore the scope that the present invention is implemented can not be limited according to this, i.e., according to
The equivalent changes and modifications that the scope of the claims of the present invention and description are made, all should still it belong in the range of the present invention covers.
Claims (10)
1. floor heating device, including the heat-insulation layer (10), heating layer (20) and heat transfer layer (30) of arrangement are arranged in order from lower to upper, its
It is characterised by：The heating layer (20) is hot-water heating pipe, and the frame pipe (21) and one that the hot-water heating pipe includes " mouth " word has inner chamber body
Box body (22), the top surface of the box body (22) and bottom surface are all fixed on frame for burnishing surface and the box body (22) by blank pipe (23)
Manage in (21) " mouth " word, the end of blank pipe (23) two is respectively and fixedly connected with box body (22) and frame pipe (21) and connects box body (22) inner chamber
Body and frame pipe (21), the frame pipe (21) are provided with water inlet, the interface of water outlet；The heat transfer layer (30) is including heat transfer plate (31) and admittedly
The floor layer being located on heat transfer plate (31), the heating layer (20) are placed on heat-insulation layer (10), and the heat transfer layer (30) passes through one
Support structure is detachably laminated on heating layer top.
2. floor heating device according to claim 1, it is characterised in that：The supporting construction includes being installed under heat transfer plate (31)
End face (311) and the projection (312) extended downwardly, the projection (312) surround the convex wall in a closure region, the convex wall is provided with
Installation gap (313)；The heat transfer layer (30) is folded against on heating layer (20), and the box body (22) of the hot-water heating pipe is located at what convex wall surrounded
In closure region, the blank pipe (23) is enclosed in outside convex wall through the installation gap (313) in convex wall, the frame pipe (21).
3. floor heating device according to claim 2, it is characterised in that：The heat-insulation layer (10) has a groove (11) and one
The perisporium (12) of groove (11) is surrounded, the perisporium (12) is provided with least two locating notches run through from inside to outside (13)；Should
Hot-water heating pipe is placed in the groove (11) of heat-insulation layer (10), and the interface lower surface of the hot-water heating pipe is parallel to be separated by positioned at locating notch
(13) on bottom surface, the interface top end face of the hot-water heating pipe is less than the top end face of perisporium；The convex wall is supported on the groove of heat-insulation layer (10)
(11) bottom surface.
4. according to the floor heating device described in claim 3 claim, it is characterised in that：Heat transfer plate (31) the lower surface peripheral part
A downward annular wall (315) is also convexly equipped with, perisporium (12) the top peripheral edge is arranged with the step breach (15) of annular,
Annular wall (315) thickness is identical with step breach (15) width of heat-insulation layer (10), and the heat transfer plate (31) is placed on heat-insulation layer
(10) on, the annular wall (315) is socketed in the step breach (15) of heat-insulation layer (10) and by heat-insulation layer (10) groove (11) and water
Heating coil is enclosed in the inside.
5. floor heating device according to claim 3, it is characterised in that：The hot-water heating pipe height, heat transfer plate (31) convex wall height,
Heat-insulation layer (10) groove (11) deep equality.
6. floor heating device according to claim 3, it is characterised in that：The locating notch of heat-insulation layer (10) perisporium (12)
(13) highly it is more than heat-insulation layer (10) perisporium (12) top surface to the spacing of groove (11) bottom surface.
7. according to the floor heating device described in claim 1 or 2 or 3 or 4 or 5 or 6, it is characterised in that：The interface top of the hot-water heating pipe
End face is less than frame pipe (21) upper surface, and the interface lower surface of the hot-water heating pipe is less than frame pipe (21) lower surface.
8. according to the floor heating device described in claim 1 or 2 or 3 or 4 or 5 or 6, it is characterised in that：Also include connecting tube, the water
Heating coil interface is mutually fixed with connecting tube by connecting structure and connects.
9. floor heating device according to claim 8, it is characterised in that：The connecting structure is located in connecting tube including one
Fastener and the pit-holes (26) being located on hot-water heating interface tube, the fastener are tightly stuck in hot-water heating interface tube fovea superior and fall into hole (26)
It is interior.
10. according to the floor heating device described in claim 1 or 2 or 3 or 4 or 5 claims, it is characterised in that：The heat-insulation layer
(10) it is XPS extruded sheets；Convex wall in the hot-water heating pipe, heat transfer plate (31) lower surface is all metallic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510177524.2A CN105042668B (en) | 2015-04-15 | 2015-04-15 | Floor heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510177524.2A CN105042668B (en) | 2015-04-15 | 2015-04-15 | Floor heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105042668A CN105042668A (en) | 2015-11-11 |
| CN105042668B true CN105042668B (en) | 2018-02-16 |
Family
ID=54449444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510177524.2A Active CN105042668B (en) | 2015-04-15 | 2015-04-15 | Floor heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105042668B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109680899B (en) * | 2019-01-24 | 2020-10-02 | 温州立胜建设有限公司 | Floor structure is built in room |
| CN111396959A (en) * | 2020-04-22 | 2020-07-10 | 宁波奥克斯电气股份有限公司 | Floor heating module and floor heating equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003120948A (en) * | 2001-10-11 | 2003-04-23 | Matsushita Electric Works Ltd | Heat source panel, its manufacturing method and hot water type floor heater using heat source panel |
| WO2010083834A2 (en) * | 2009-01-21 | 2010-07-29 | Danfoss Ventures A/S | A building element |
| CN201635320U (en) * | 2010-01-14 | 2010-11-17 | 蒋龙钰 | Thin type dry ground heating system |
| CN201972356U (en) * | 2010-11-30 | 2011-09-14 | 吕国华 | Water and ground heating module integration |
| CN202055472U (en) * | 2011-04-28 | 2011-11-30 | 吕国华 | Water heating floor tile |
| KR101168836B1 (en) * | 2011-06-30 | 2012-07-25 | 정연현 | Energy saving-type heating floor |
| CN204717820U (en) * | 2015-04-15 | 2015-10-21 | 沈赛勇 | A kind of floor heating device |
-
2015
- 2015-04-15 CN CN201510177524.2A patent/CN105042668B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003120948A (en) * | 2001-10-11 | 2003-04-23 | Matsushita Electric Works Ltd | Heat source panel, its manufacturing method and hot water type floor heater using heat source panel |
| WO2010083834A2 (en) * | 2009-01-21 | 2010-07-29 | Danfoss Ventures A/S | A building element |
| CN201635320U (en) * | 2010-01-14 | 2010-11-17 | 蒋龙钰 | Thin type dry ground heating system |
| CN201972356U (en) * | 2010-11-30 | 2011-09-14 | 吕国华 | Water and ground heating module integration |
| CN202055472U (en) * | 2011-04-28 | 2011-11-30 | 吕国华 | Water heating floor tile |
| KR101168836B1 (en) * | 2011-06-30 | 2012-07-25 | 정연현 | Energy saving-type heating floor |
| CN204717820U (en) * | 2015-04-15 | 2015-10-21 | 沈赛勇 | A kind of floor heating device |
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| Publication number | Publication date |
|---|---|
| CN105042668A (en) | 2015-11-11 |
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Effective date of registration: 20201016 Address after: No.2299 rugang Road, group 9, the second case neighborhood committee, Changjiang Town, Rugao City, Nantong City, Jiangsu Province, 226500 Patentee after: Nantong Jinxin window industry Co., Ltd Address before: 351100 Fujian Province, Putian city Xiuyu District Shanting Zhen Dong Xian Cun CuO 19-2 Giantreed Patentee before: Shen Saiyong |
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