CN105038256A - Chip packaging material for computer - Google Patents
Chip packaging material for computer Download PDFInfo
- Publication number
- CN105038256A CN105038256A CN201510408495.6A CN201510408495A CN105038256A CN 105038256 A CN105038256 A CN 105038256A CN 201510408495 A CN201510408495 A CN 201510408495A CN 105038256 A CN105038256 A CN 105038256A
- Authority
- CN
- China
- Prior art keywords
- parts
- vinyl polysiloxane
- computer
- computer chip
- glycidyl ether
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to a chip packaging material for a computer. The chip packaging material for the computer comprises the following components in parts by mass: 15-19 parts of nano magnesium oxide, 6-12 parts of diphenyl methylene diisocyanate, 4-8 parts of an acrylate polyurethane prepolymer, 18-22 parts of vinyl polysiloxane, 8-10 parts of methyl per-phenyl vinyl silicon resin, 3-5 parts of alkyl glycidyl ether, 6-10 parts of phenyltriethoxysilane, 8-12 parts of a silicone coupling agent and 8-10 parts of polyvinyl butyral. According to the material provided by the invention, the material of the chip for the computer is optimized, so that the refractive index, the hardness and the bonding strength of the chip for the computer are remarkably improved. According to the chip packaging material for the computer prepared by the method provided by the invention, the shore hardness is 68A-74A and the bonding strength is 6.8MPa to 7.6MPa.
Description
Technical field
The present invention relates to a kind of computer chip encapsulation material, belong to computer chip technology field.
Background technology
Computer chip is that an electronic component contains thousands upon thousands resistance capacitance and other little elements in a computer chip in fact.Computer has a lot of chips, the black that memory bar lastblock is one piece is rectangular is chip, and mainboard, hard disk, video card etc. have a lot of chips, and CPU is also block computer chip, and only he is more more complicated than common computer chip more accurate.Chip has South Bridge chip, north bridge chips, and chip is the heart of mainboard, and CPU is the heart of computer.But chip has divided multiple, and such as CPU also can say as being chip, and also have display card chip, sound card chip etc., their major part is calculating effect.For the encapsulation of chip, need to adopt suitable material, require to possess certain characteristic.
Summary of the invention
The object of the present invention is to provide a kind of computer chip encapsulation material, to encapsulate for computer chip better, improve the result of use of computer chip.
To achieve these goals, technical scheme of the present invention is as follows.
A kind of computer chip encapsulation material, is made up of the component of following mass fraction: nano magnesia is 15 ~ 19 parts, MDI 6 ~ 12 parts, acroleic acid polyurethane prepolymer are 4 ~ 8 parts, vinyl polysiloxane is 18 ~ 22 parts, methyl height phenyl vinyl polysiloxane is 8 ~ 10 parts, alkyl glycidyl ether is 3 ~ 5 parts, phenyl triethoxysilane 6 ~ 10 parts, silicone coupling agent 8 ~ 12 parts, polyvinyl butyral acetal 8 ~ 10 parts.
The preparation method of above-mentioned packaged material is following steps:
(1) nano magnesia, MDI, nano magnesia, the alkyl glycidyl ether of above-mentioned mass fraction is got, dissolve after nano magnesia, MDI, methyl height phenyl vinyl polysiloxane, alkyl glycidyl ether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the acroleic acid polyurethane prepolymer of above-mentioned mass fraction, vinyl polysiloxane and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C ~ 150 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
Further, above-mentioned material performance is as follows:
(1) nano magnesia: be white powder, tasteless, nontoxic, product cut size is little, specific surface area is large.There is optical, electrical, magnetic, the chemical property that are different from bulk material, there is high rigidity, high purity and high-melting-point.Chemical fibre, plastic industry fire retardant; Binding agent in high temperature water-break agent in siliconized plate production, advanced ceramic materials, electronic industrial material, industrial chemicals and additive; Radio industry high frequency magnetic rod antenna, magnetic devices filler, dielectric filler material and various carrier.
(2) MDI: white or slightly yellowish solid.Be dissolved in benzene, toluene, chlorobenzene, oil of mirbane, the third bronze medal, acetic ester.Produce the main raw material of urethane, manufacture rigid foam lagging material, high-performance flex foam, reaction injection moulding goods (fascia, bearing circle), tackiness agent, coating, synthetic leather etc.
(3) acroleic acid polyurethane prepolymer: there is higher laser curing velocity, good sticking power, snappiness, wear resistance and temperature tolerance and outstanding snappiness and elongation, be widely used in the aspects such as metal, timber, plastic coating, ink printing, textile printing, fibre coating.
(4) vinyl polysiloxane: constant product quality, fugitive constituent is low, is the main raw material of add-on type liquid silicon rubber, silicone potting material, Silica hydrogel etc., the properties-correcting agent of rubber unvulcanizate.
(5) methyl height phenyl vinyl polysiloxane: under normal temperature, outward appearance is clear viscous shape liquid, mainly for the manufacture of high-power height refraction computer chip organic silicon packaging glue, the embedding of photoelectricity, electronics and microelectronic industry, sealing, bonding and coating, high printing opacity, high rigidity eyeglass and user other purposes independently developed, film hardness after this product solidification is large, specific refractory power is high, light transmission is good, there is stronger solvent resistant water tolerance and resistance to ablating radiation, simultaneously resistance to elevated temperatures is good, not the advantage such as thickening.Made product have that ageing resistance is strong, anti-ultraviolet property is good and life-time service without the excellent specific property of xanthochromia.
(6) alkyl glycidyl ether: colourless viscous liquid, can because of oxidation yellowish when Heating temperature is too high.For the preparation of glyceryl ether, tensio-active agent etc., more deep before research comparatively at present, as intermediate to probe into out a lot of compound.
(7) phenyl triethoxysilane: colourless transparent liquid.To wet sensitive sense.Chance alkaline solution decomposes.Be dissolved in organic solvent.As the raw material preparing macromolecular organic compound.
(8) silicone coupling agent: as the tackifier of sealing agent, caking agent and coating.The performances such as their bonding strength, water-fast, weather can be improved.
(9) polyvinyl butyral acetal: obtained film is for making the sandwich material of shatter proof glass, and this shatter proof glass transparency is good, shock strength is large, is widely used in aviation and automotive field.Coatings industry is strong for the manufacture of anticorrosive coating, antirust ability, the metallic base coat of sticking power, water-tolerant and cold-proof paint.Ceramic industry, for the manufacture of the bright-coloured film marble paper of decorative pattern, can replace ceramic marble paper.Resin Industry, for the manufacture of the compression molding material replacing the non-ferrous metal such as steel, lead, can be made into multiple tackiness agent.Be widely used in the bonding of timber, pottery, metal, plastics, leather, laminating material etc.Textile industry is for the manufacture of fabric-treating agent and spool.Foodstuffs industry is for the manufacture of non-toxic packaging materials.Paper industry is for the manufacture of paper treating agent.In addition, also can be used for manufacturing sanforzing agent, stiffening agent and other water-proof materials.
This beneficial effect of the invention is: the present invention, by being optimized the material of computer chip, improves the specific refractory power of computer chip, hardness and cohesive strength significantly.The computer chip encapsulation material shore hardness that method of the present invention prepares is 68A to 74A, and cohesive strength is 6.8MPa to 7.6MPa.
Embodiment
Below in conjunction with embodiment, the specific embodiment of the present invention is described, better to understand the present invention.
Embodiment 1
Computer chip encapsulation material in the present embodiment, is made up of the component of following mass fraction: nano magnesia is 15 parts, MDI 6 parts, acroleic acid polyurethane prepolymer are 4 parts, vinyl polysiloxane is 18 parts, methyl height phenyl vinyl polysiloxane is 8 parts, alkyl glycidyl ether is 3 parts, phenyl triethoxysilane 6 parts, silicone coupling agent 8 parts, polyvinyl butyral acetal 8 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) nano magnesia of above-mentioned mass fraction, MDI, methyl height phenyl vinyl polysiloxane, alkyl glycidyl ether is got, dissolve after nano magnesia, MDI, methyl height phenyl vinyl polysiloxane, alkyl glycidyl ether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the acroleic acid polyurethane prepolymer of above-mentioned mass fraction, vinyl polysiloxane and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 140 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
The computer chip encapsulation material shore hardness that method of the present invention prepares is 68A, and cohesive strength is 6.8MPa.
Embodiment 2
Computer chip encapsulation material in the present embodiment, is made up of the component of following mass fraction: nano magnesia is 17 parts, MDI 9 parts, acroleic acid polyurethane prepolymer are 6 parts, vinyl polysiloxane is 20 parts, methyl height phenyl vinyl polysiloxane is 9 parts, alkyl glycidyl ether is 4 parts, phenyl triethoxysilane 8 parts, silicone coupling agent 10 parts, polyvinyl butyral acetal 9 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) nano magnesia, MDI, nano magnesia, the alkyl glycidyl ether of above-mentioned mass fraction is got, dissolve after nano magnesia, MDI, methyl height phenyl vinyl polysiloxane, alkyl glycidyl ether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the acroleic acid polyurethane prepolymer of above-mentioned mass fraction, vinyl polysiloxane and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 145 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
The shore hardness of the computer chip encapsulation material that method of the present invention prepares is 72A, and cohesive strength is 7.4MPa.
Embodiment 3
Computer chip encapsulation material in the present embodiment, is made up of the component of following mass fraction: nano magnesia is 19 parts, MDI 12 parts, acroleic acid polyurethane prepolymer are 8 parts, vinyl polysiloxane is 22 parts, methyl height phenyl vinyl polysiloxane is 10 parts, alkyl glycidyl ether is 5 parts, phenyl triethoxysilane 10 parts, silicone coupling agent 12 parts, polyvinyl butyral acetal 10 parts.
Above-mentioned encapsulation preparation method is following steps:
(1) nano magnesia, MDI, nano magnesia, the alkyl glycidyl ether of above-mentioned mass fraction is got, dissolve after nano magnesia, MDI, methyl height phenyl vinyl polysiloxane, alkyl glycidyl ether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the acroleic acid polyurethane prepolymer of above-mentioned mass fraction, vinyl polysiloxane and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is 3h;
(4) added in mould by mixture and be cured, solidification value is 150 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
The shore hardness of the computer chip encapsulation material that method of the present invention prepares is 74A, and cohesive strength is 7.6MPa.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (2)
1. a computer chip encapsulation material, is characterized in that: be made up of the component of following mass fraction: nano magnesia is 15 ~ 19 parts, MDI 6 ~ 12 parts, acroleic acid polyurethane prepolymer are 4 ~ 8 parts, vinyl polysiloxane is 18 ~ 22 parts, methyl height phenyl vinyl polysiloxane is 8 ~ 10 parts, alkyl glycidyl ether is 3 ~ 5 parts, phenyl triethoxysilane 6 ~ 10 parts, silicone coupling agent 8 ~ 12 parts, polyvinyl butyral acetal 8 ~ 10 parts.
2. computer chip encapsulation material according to claim 1, is characterized in that: the preparation method of described packaged material is following steps:
(1) nano magnesia of above-mentioned mass fraction, MDI, methyl height phenyl vinyl polysiloxane, alkyl glycidyl ether is got, dissolve after nano magnesia, MDI, methyl height phenyl vinyl polysiloxane, alkyl glycidyl ether four kinds of composition heating, be stirred to after dissolving and mix;
(2) add the acroleic acid polyurethane prepolymer of above-mentioned mass fraction, vinyl polysiloxane and clout again, stir;
(3) mixture is carried out deaeration in vacuum defoamation machine, inclined heated plate is about 3h;
(4) added in mould by mixture and be cured, solidification value is about 140 DEG C ~ 150 DEG C, is cooled to room temperature after solidification, prepares computer chip encapsulation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510408495.6A CN105038256A (en) | 2015-07-13 | 2015-07-13 | Chip packaging material for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510408495.6A CN105038256A (en) | 2015-07-13 | 2015-07-13 | Chip packaging material for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105038256A true CN105038256A (en) | 2015-11-11 |
Family
ID=54445245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510408495.6A Pending CN105038256A (en) | 2015-07-13 | 2015-07-13 | Chip packaging material for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105038256A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106009175A (en) * | 2016-06-28 | 2016-10-12 | 华蓥市高科龙电子科技有限公司 | Camera encapsulation material |
| CN108659548A (en) * | 2018-05-25 | 2018-10-16 | 合肥奇呗数字科技有限公司 | A kind of preparation method of large scale integrated chip encapsulating material |
| CN112874101A (en) * | 2021-02-18 | 2021-06-01 | 石家庄康岁商贸有限公司 | Reflective warning tape and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812278A (en) * | 2010-05-20 | 2010-08-25 | 上海西怡新材料科技有限公司 | Ultraviolet curable organic silicon-acrylic resin electronic adhesive and application thereof |
| CN104004325A (en) * | 2014-06-12 | 2014-08-27 | 苏州经贸职业技术学院 | LED packaging material and preparation method thereof |
-
2015
- 2015-07-13 CN CN201510408495.6A patent/CN105038256A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101812278A (en) * | 2010-05-20 | 2010-08-25 | 上海西怡新材料科技有限公司 | Ultraviolet curable organic silicon-acrylic resin electronic adhesive and application thereof |
| CN104004325A (en) * | 2014-06-12 | 2014-08-27 | 苏州经贸职业技术学院 | LED packaging material and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106009175A (en) * | 2016-06-28 | 2016-10-12 | 华蓥市高科龙电子科技有限公司 | Camera encapsulation material |
| CN108659548A (en) * | 2018-05-25 | 2018-10-16 | 合肥奇呗数字科技有限公司 | A kind of preparation method of large scale integrated chip encapsulating material |
| CN112874101A (en) * | 2021-02-18 | 2021-06-01 | 石家庄康岁商贸有限公司 | Reflective warning tape and preparation method thereof |
| CN112874101B (en) * | 2021-02-18 | 2022-08-09 | 石家庄康岁商贸有限公司 | Reflective warning tape and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106833497B (en) | UV adhesive and preparation method thereof | |
| CN101910236B (en) | Polymerizable epoxy composition, and sealing material composition comprising the same | |
| CN103342895B (en) | A kind of compositions of thermosetting resin and the prepreg using it to make and veneer sheet | |
| CN103525080A (en) | Production technology and application method of thermoplastic polyurethane elastomer | |
| CN103748140B (en) | Curable resin composition and use its manufacture method of cured article | |
| CN102850722B (en) | Composition epoxy resin and the prepreg using it to make and copper-clad laminate | |
| CN110028923B (en) | Solvent-free two-component polyurethane pouring sealant | |
| CN105038256A (en) | Chip packaging material for computer | |
| CN101993656A (en) | Conformal coating for protecting printed circuit board, preparation method and curing method thereof | |
| CN105086916A (en) | High-light-transmittance UV-moisture dual-curing adhesive | |
| CN103189413A (en) | Cation-curable resin composition | |
| CN104024337A (en) | Silane-containing composition, curable resin composition, and sealing material | |
| CN103724999A (en) | Cyanate resin composition and application thereof | |
| CN111454456B (en) | Synthesis method of high-performance phenyl block silicone resin | |
| TWI771517B (en) | Allyl group-containing carbonate resin, manufacturing method thereof, resin varnish, and manufacturing method of laminated sheet | |
| CN102558759A (en) | Cyanate ester resin composition and prepreg and laminated material manufactured by using same | |
| CN102936477B (en) | Heat transfer printing adhesive for glass matrix, heat transfer printing film, preparation method and application | |
| CN104974475A (en) | Chip packaging material for computer | |
| CN103724998A (en) | Cyanate resin composition and application thereof | |
| CN106751389B (en) | A kind of engineering plastics and preparation method thereof for LDS technology of light color | |
| CN103342894A (en) | Thermosetting resin composition as well as prepreg and laminate prepared from same | |
| CN1033982C (en) | Production of transparent solf seal adhesive with epoxy double component | |
| CN106188473A (en) | Three part polyurethane protection insulation resins | |
| KR101322017B1 (en) | Resin composition, transparent marble chip comprising cured material thereof and artificial marble | |
| CN105368369A (en) | Method for preparing polyurethane adhesive used for timber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151111 |