CN105038129A - Epoxy resin composition for flip-chip packaging - Google Patents
Epoxy resin composition for flip-chip packaging Download PDFInfo
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- CN105038129A CN105038129A CN201510410029.1A CN201510410029A CN105038129A CN 105038129 A CN105038129 A CN 105038129A CN 201510410029 A CN201510410029 A CN 201510410029A CN 105038129 A CN105038129 A CN 105038129A
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Abstract
The invention relates to an epoxy resin composition for flip-chip packaging. The epoxy resin composition contains epoxy resin, phenol-formaldehyde resin, inorganic filler, a flame retardant, a curing accelerator and a silane coupling agent and is prepared through accurately weighing all ingredients, then, carrying out melt milling on a double-roller mill mixer for 2-20 minutes at the milling temperature of 90-110 DEG C, pressing the mixed material into thin sheets with the thickness of 1.5mm, cooling the thin sheets, and then, crushing the cooled thin sheets. According to the epoxy resin composition for flip-chip packaging, through selecting appropriate particle size distribution for silicon micropowder, the particle size distribution D50 is 4-6 microns, the part with the particle size of 1-6 microns accounts for 60-75% the total weight of the silicon micropowder, the part with the particle size of 6-12 microns accounts for 20-25% the total weight of the silicon micropowder, and the part with the particle size of 12-48 microns accounts for 5-20% the total weight of the silicon micropowder, so that the prepared epoxy resin composition for flip-chip packaging has high fluidity and good filling property. The epoxy resin composition can be used for excellently filling gaps of 80 microns between chips and circuit boards in flip-chip integrated circuits and coating ball bumps.
Description
Technical field
The present invention relates to a kind of semiconductor sealing material technical field, particularly a kind of composition epoxy resin of Flip-Chip Using.
Background technology
In recent years, along with developing rapidly of electronics and information industry, electronic devices and components are gradually to miniaturization, slimming and highly integrated future development, in the process of lsi package, the form of encapsulation is also more and more integrated, traditional lead packages, because can not miniaturization be met, also be unfavorable for the development of unicircuit, and replaced the connection carrying out circuit substrate and chip by soldered ball, become the focus of current extensive concern.
At present, in Flip-Chip Using process, the process chips of circuit layout and the spacing of substrate are generally at 70 ~ 80 μm.Therefore, the height determining soldered ball also controls within the scope of this.
Summary of the invention
The technical problem to be solved in the present invention is for the deficiencies in the prior art, proposes a kind of composition epoxy resin of Flip-Chip Using.Meet and meet the high workability of Flip-Chip Using, and can meet the filling that occurs in encapsulated moulding process completely, the requirement of operability.
The technical problem to be solved in the present invention is achieved through the following technical solutions, and a kind of composition epoxy resin of Flip-Chip Using, is characterized in:
It comprises epoxy resin 5 ~ 30 mass parts, resol 5 ~ 20 mass parts, mineral filler 70 ~ 90 mass parts, fire retardant 1 ~ 10 mass parts, curing catalyst 0.5 ~ 2.5 mass parts, silane coupling agent 0.5 ~ 4.5 mass parts; After each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, and mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, pulverizes and make after cooling;
Wherein: epoxy resin adopts has low viscosity, high workability, the naphthalane-contained type of high glass transition temperature or biphenyl structural type epoxy resin;
Resol adopts the resol containing biphenyl structures or multiple hydroxyl structure with good mobility;
Mineral filler used is ball-shaped silicon micro powder, and its size-grade distribution D50 is 4 ~ 6 μm, and 60 ~ 75%, 6 ~ 12 μm of part silicon powders that 1 ~ 6 μm of part silicon powder accounts for total amount account for 20 ~ 25% of total amount.12 ~ 48 μm of part silicon powders account for 5 ~ 20% of total amount.
The technical problem to be solved in the present invention can also be come to realize further by the following technical programs, and silane coupling agent used is epoxy radicals silicone hydride.
The technical problem to be solved in the present invention can also be come to realize further by the following technical programs, when the Ratio control of the epoxy equivalent (weight) of epoxy resin and the hydroxyl equivalent of resol is in 0.8-1.3 scopes, composition epoxy resin, when shaping, shows good curing characteristics.
The technical problem to be solved in the present invention can also be come to realize further by the following technical programs, releasing agent used be bar wax, polyethylene wax, stearic acid or montanin wax any one.
The technical problem to be solved in the present invention can also be come to realize further by the following technical programs, and described curing catalyst is: imidazoles or phosphorus species, comprises 2-methyl 4-phenyl imidazoles; Or be tertiary amine compound, comprise benzyldimethylamine, triethylamine benzyldimethylamine, 1,8-diazabicyclo (5,4,0) undecylene-7; Or be organic phosphine compound, comprise triphenylphosphine, tetraphenyl phosphine, three (p-methylphenyl) phosphine.
The present invention compared with prior art, well can fill 80 μm of gaps between flip chip integrated circuit chips and circuit card and coated ball salient point.The present invention is by selecting suitable silicon powder size-grade distribution, its size-grade distribution D50 is 4 ~ 6um, 1 ~ 6um part silicon powder accounts for 60 ~ 75% of total amount, 6 ~ 12um part silicon powder accounts for 20 ~ 25% of total amount, 12 ~ 48um part silicon powder accounts for 5 ~ 20% of total amount, can prepare the composition epoxy resin of the Flip-Chip Using of high workability and good fillibility.
Embodiment
A composition epoxy resin for Flip-Chip Using, it comprises epoxy resin 5 ~ 30 mass parts, resol 5 ~ 20 mass parts, mineral filler 70 ~ 90 mass parts, fire retardant 1 ~ 10 mass parts, curing catalyst 0.5 ~ 2.5 mass parts, silane coupling agent 0.5 ~ 4.5 mass parts; After each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, and mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, pulverizes and make after cooling;
Wherein: epoxy resin adopts has low viscosity, high workability, the naphthalane-contained type of high glass transition temperature or biphenyl structural type epoxy resin;
Resol adopts the resol containing biphenyl structures or multiple hydroxyl structure with good mobility;
The upper limit of the resol used is in 3%-10% scope, and when super going beyond the scope, material has good mobility, when lower than this scope, occurs the problem of mobility and poor reliability.
When the Ratio control of the epoxy equivalent (weight) of epoxy resin and the hydroxyl equivalent of resol is in 0.8-1.3 scopes, composition epoxy resin, when shaping, shows good curing characteristics.
Mineral filler used is ball-shaped silicon micro powder, and its size-grade distribution D50 is 4 ~ 6 μm, and 60 ~ 75%, 6 ~ 12 μm of part silicon powders that 1 ~ 6 μm of part silicon powder accounts for total amount account for 20 ~ 25% of total amount.12 ~ 48 μm of part silicon powders account for 5 ~ 20% of total amount.
Silane coupling agent used is epoxy radicals silicone hydride.
Silane coupling agent used is the mixture of several coupling agent of epoxy radicals silicone hydride, adopts wherein two kinds or several used in combination.It and inorganic materials, organism has good cohesive force.
Described curing catalyst is: imidazoles or phosphorus species, comprises 2-methyl 4-phenyl imidazoles; Or be tertiary amine compound, comprise benzyldimethylamine, triethylamine benzyldimethylamine, 1,8-diazabicyclo (5,4,0) undecylene-7; Or be organic phosphine compound, comprise triphenylphosphine, tetraphenyl phosphine, three (p-methylphenyl) phosphine.Imidazoles or phosphorus species, comprise 2MZ-A or can be used alone or as a mixture, and preferentially selecting can catalyzed reaction under the high temperature conditions, and material can be made to have better mobility.
Below further describe concrete technical scheme of the present invention, so that those skilled in the art understands the present invention further, and do not form the restriction to its right.
Experimental example 1.Fill a prescription described in embodiment 1 in A after each component precise, double roll mill carries out melting mixing, and melting temperature is 90 ~ 110 DEG C, mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, through to be mixed evenly after, cooling crush, carries out performance test.
Experimental example 2.In formula B described in embodiment 2 after each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, through to be mixed evenly after, cooling crush, carries out performance test.
Experimental example 3.In formula described in embodiment 3 after each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, through to be mixed evenly after, cooling crush, carries out performance test.
Experimental example 4.In formula described in embodiment 4 after each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, through to be mixed evenly after, cooling crush, carries out performance test.
Comparative example 1.In described formula after each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, through to be mixed evenly after, cooling crush, carries out performance test.
Comparative example 2.In described formula after each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, through to be mixed evenly after, cooling crush, carries out performance test.
Comparative example 3.In described formula after each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, through to be mixed evenly after, cooling crush, carries out performance test.
In contrast experiment, main performance index uses following method to carry out testing:
A) gel time: hot plate method, is heated to 175 ± 1 DEG C by hot plate, get 2-3g sample powder and be placed on hot plate, is terminal when powder becomes colloidal state by fluid gradually, reads required time.
B) mobility: measure by EMMI-1-66 helicoidal flow metal die on transfer mould press, forming pressure is 70Kgf/cm
2die temperature is at 175 ± 2 DEG C, and sample thief 15g tests.
C) melt viscosity: the melt viscosity of epoxy composite described in the capillary rheometer determining utilizing Japanese Shimadzu Corporation.Test condition: mouth mould is 0.5 × 1.0mm, pressure is 25 kilograms, and temperature is 175 DEG C.
Experimental result is as follows:
As can be seen from the above table, the mobility of embodiment and fillibility are all fine, and the mobility of comparative example, formability and fillibility are all very poor, can find out in Flip-Chip Using, in composition, its size-grade distribution D50 of silicon powder controls at 4 ~ 6um, 1 ~ 6um part silicon powder accounts for 60 ~ 75% of total amount, 6 ~ 12um part silicon powder accounts for 20 ~ 25% of total amount, 12 ~ 48um part silicon powder accounts for 5 ~ 20% of total amount, can prepare the composition epoxy resin of the Flip-Chip Using of high workability and good fillibility.
Claims (5)
1. a composition epoxy resin for Flip-Chip Using, is characterized in that:
It comprises epoxy resin 5 ~ 30 mass parts, resol 5 ~ 20 mass parts, mineral filler 70 ~ 90 mass parts, fire retardant 1 ~ 10 mass parts, curing catalyst 0.5 ~ 2.5 mass parts, silane coupling agent 0.5 ~ 4.5 mass parts; After each component precise, double roll mill carries out melting mixing, melting temperature is 90 ~ 110 DEG C, and mixing time is 2 ~ 20 minutes, mixing material is pressed into the thin slice that 1.5mm is thick, pulverizes and make after cooling;
Wherein: epoxy resin adopts has low viscosity, high workability, the naphthalane-contained type of high glass transition temperature or biphenyl structural type epoxy resin;
Resol adopts the resol containing biphenyl structures or multiple hydroxyl structure with good mobility;
Mineral filler used is ball-shaped silicon micro powder, and its size-grade distribution D50 is 4 ~ 6 μm, and 60 ~ 75%, 6 ~ 12 μm of part silicon powders that 1 ~ 6 μm of part silicon powder accounts for total amount account for 20 ~ 25% of total amount;
12 ~ 48 μm of part silicon powders account for 5 ~ 20% of total amount.
2. the composition epoxy resin of Flip-Chip Using according to claim 1, is characterized in that: silane coupling agent used is epoxy radicals silicone hydride.
3. the composition epoxy resin of Flip-Chip Using according to claim 1, it is characterized in that: when the Ratio control of the epoxy equivalent (weight) of epoxy resin and the hydroxyl equivalent of resol is in 0.8-1.3 scopes, composition epoxy resin, when shaping, shows good curing characteristics.
4. the composition epoxy resin of Flip-Chip Using according to claim 1, is characterized in that: releasing agent used be bar wax, polyethylene wax, stearic acid or montanin wax any one.
5. the composition epoxy resin of Flip-Chip Using according to claim 1, is characterized in that: described curing catalyst is: imidazoles or phosphorus species, comprises 2-methyl 4-phenyl imidazoles; Or be tertiary amine compound, comprise benzyldimethylamine, triethylamine benzyldimethylamine, 1,8-diazabicyclo (5,4,0) undecylene-7; Or be organic phosphine compound, comprise triphenylphosphine, tetraphenyl phosphine, three p-methylphenyl phosphines.
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Cited By (5)
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| CN105440588A (en) * | 2015-12-24 | 2016-03-30 | 江苏中鹏新材料股份有限公司 | High-thermal-conductivitymolded underfill as well as preparation method and application thereof |
| CN105462173A (en) * | 2015-12-25 | 2016-04-06 | 科化新材料泰州有限公司 | Environment-friendly epoxy resin composition and preparation method thereof |
| CN106280282A (en) * | 2016-08-15 | 2017-01-04 | 江苏中鹏新材料股份有限公司 | Filler and preparation method and application at the bottom of the moulding type epoxy of a kind of phosphorus-nitrogen containing fire retardant |
| CN112724599A (en) * | 2020-12-28 | 2021-04-30 | 江苏科化新材料科技有限公司 | Epoxy resin composition for flip chip packaging |
| CN114292613A (en) * | 2022-02-16 | 2022-04-08 | 武汉市三选科技有限公司 | Composite film, flip LED chip and manufacturing method thereof |
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| CN105440588A (en) * | 2015-12-24 | 2016-03-30 | 江苏中鹏新材料股份有限公司 | High-thermal-conductivitymolded underfill as well as preparation method and application thereof |
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| CN106280282A (en) * | 2016-08-15 | 2017-01-04 | 江苏中鹏新材料股份有限公司 | Filler and preparation method and application at the bottom of the moulding type epoxy of a kind of phosphorus-nitrogen containing fire retardant |
| CN112724599A (en) * | 2020-12-28 | 2021-04-30 | 江苏科化新材料科技有限公司 | Epoxy resin composition for flip chip packaging |
| CN114292613A (en) * | 2022-02-16 | 2022-04-08 | 武汉市三选科技有限公司 | Composite film, flip LED chip and manufacturing method thereof |
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| CN105038129B (en) | 2018-01-19 |
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