CN105037695B - A kind of high-performance epoxy alkyd resin and preparation method thereof - Google Patents
A kind of high-performance epoxy alkyd resin and preparation method thereof Download PDFInfo
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- CN105037695B CN105037695B CN201510473943.0A CN201510473943A CN105037695B CN 105037695 B CN105037695 B CN 105037695B CN 201510473943 A CN201510473943 A CN 201510473943A CN 105037695 B CN105037695 B CN 105037695B
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- 229920000180 alkyd Polymers 0.000 title claims abstract description 42
- 239000004593 Epoxy Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 claims abstract description 40
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims abstract description 38
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000007822 coupling agent Substances 0.000 claims abstract description 34
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003822 epoxy resin Substances 0.000 claims abstract description 22
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 22
- 239000005643 Pelargonic acid Substances 0.000 claims abstract description 20
- 235000004426 flaxseed Nutrition 0.000 claims abstract description 19
- -1 ethylene glycol propandiol butyl ether Chemical compound 0.000 claims abstract description 18
- JBYXPOFIGCOSSB-GOJKSUSPSA-N 9-cis,11-trans-octadecadienoic acid Chemical compound CCCCCC\C=C\C=C/CCCCCCCC(O)=O JBYXPOFIGCOSSB-GOJKSUSPSA-N 0.000 claims abstract description 17
- 239000004342 Benzoyl peroxide Substances 0.000 claims abstract description 17
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims abstract description 17
- 235000019400 benzoyl peroxide Nutrition 0.000 claims abstract description 17
- 229940108924 conjugated linoleic acid Drugs 0.000 claims abstract description 17
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 claims abstract description 17
- 239000011787 zinc oxide Substances 0.000 claims abstract description 17
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims abstract description 16
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 claims abstract description 16
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims abstract description 16
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims abstract description 15
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 15
- 229930195729 fatty acid Natural products 0.000 claims abstract description 15
- 239000000194 fatty acid Substances 0.000 claims abstract description 15
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 15
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000005711 Benzoic acid Substances 0.000 claims abstract description 14
- 235000004431 Linum usitatissimum Nutrition 0.000 claims abstract description 14
- 240000006240 Linum usitatissimum Species 0.000 claims abstract description 14
- 235000010233 benzoic acid Nutrition 0.000 claims abstract description 14
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims abstract description 12
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims description 50
- 238000010792 warming Methods 0.000 claims description 25
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 13
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229920005552 sodium lignosulfonate Polymers 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 5
- 238000005292 vacuum distillation Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 150000008065 acid anhydrides Chemical class 0.000 claims description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims 2
- 235000013847 iso-butane Nutrition 0.000 claims 1
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 claims 1
- 235000021388 linseed oil Nutrition 0.000 claims 1
- 239000000944 linseed oil Substances 0.000 claims 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims 1
- 230000002421 anti-septic effect Effects 0.000 abstract description 3
- 239000001384 succinic acid Substances 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- MJYQFWSXKFLTAY-OVEQLNGDSA-N (2r,3r)-2,3-bis[(4-hydroxy-3-methoxyphenyl)methyl]butane-1,4-diol;(2r,3r,4s,5s,6r)-6-(hydroxymethyl)oxane-2,3,4,5-tetrol Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O.C1=C(O)C(OC)=CC(C[C@@H](CO)[C@H](CO)CC=2C=C(OC)C(O)=CC=2)=C1 MJYQFWSXKFLTAY-OVEQLNGDSA-N 0.000 description 5
- 235000019197 fats Nutrition 0.000 description 5
- 239000004519 grease Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- GOLXRNDWAUTYKT-UHFFFAOYSA-N 3-(1H-indol-3-yl)propanoic acid Chemical group C1=CC=C2C(CCC(=O)O)=CNC2=C1 GOLXRNDWAUTYKT-UHFFFAOYSA-N 0.000 description 1
- AOJJSUZBOXZQNB-VTZDEGQISA-N 4'-epidoxorubicin Chemical group O([C@H]1C[C@@](O)(CC=2C(O)=C3C(=O)C=4C=CC=C(C=4C(=O)C3=C(O)C=21)OC)C(=O)CO)[C@H]1C[C@H](N)[C@@H](O)[C@H](C)O1 AOJJSUZBOXZQNB-VTZDEGQISA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 231100001244 hazardous air pollutant Toxicity 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Epoxy Resins (AREA)
- Polyesters Or Polycarbonates (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of high-performance epoxy alkyd resins, its raw material includes: epoxy resin 30-50 by weight, linseed fatty acid 50-80, conjugated linoleic acid 7-10, pelargonic acid 5-15, modified coupling agent 1-2, benzoic acid 5-10, succinic acid 2-8, pentaerythrite 15-30, trimethylolpropane 15-25, phthalic anhydride 15-25, trimellitic anhydride 5-20, diethylenetriamine 1.5-4, ethylene glycol monobutyl ether 15-35, ethylene glycol propandiol butyl ether 5-12, benzoyl peroxide 0.01-0.08, zinc oxide 0.1-0.5, paraxylene 20-30.The invention also discloses a kind of preparation methods of high-performance epoxy alkyd resin.Stability of the present invention is good, and wear-resisting and antiseptic property is extremely excellent, and preparation method is simple.
Description
Technical field
The present invention relates to epoxy alkyd resin technical field more particularly to a kind of high-performance epoxy alkyd resins
And preparation method thereof.
Background technique
With the continuous enhancing of scientific and technological level being constantly progressive with people's environmental consciousness, be free of or less containing volatile organic matter
Oneself becomes the developing direction of new material with the system without hazardous air pollutants, and the exploitation of water-base resin is increasingly by people
Attention, alkyd resin molecule have polarity main chain and non-polar sidechain, can be with many resins, compound preferably
It is miscible, premise is provided to carry out various physical modifications；There is hydroxyl, carboxyl and double bond isoreactivity base on alkyd resin molecule
Group, this is the basis to alkyd resin chemical modification；Epoxy resin is the polymer containing epoxy group, not only can at
Make crosslinking agent using alkyd resin in membrane process, can also be introduced in alkyd resin synthesis process and be used for modified alkyd resin.Mesh
Demand is also not achieved in the stability of preceding epoxy alkyd resin, wear-resisting and antiseptic property.
Summary of the invention
The invention proposes a kind of high-performance epoxy alkyd resins and preparation method thereof, and stability is good, wear-resisting and anti-
Rotten performance is extremely excellent, and preparation method is simple.
A kind of high-performance epoxy alkyd resin proposed by the present invention, raw material include: epoxy resin 30- by weight
It is 50 parts, 50-80 parts of linseed fatty acid, 7-10 parts of conjugated linoleic acid, 5-15 parts of pelargonic acid, coupling agent 1-2 parts modified, benzene first
It is 5-10 parts sour, 2-8 parts of succinic acid, 15-30 parts of pentaerythrite, 15-25 parts of trimethylolpropane, 15-25 parts of phthalic anhydride,
5-20 parts of trimellitic anhydride, 1.5-4 parts of diethylenetriamine, 15-35 parts of ethylene glycol monobutyl ether, ethylene glycol propandiol butyl ether 5-12
Part, 0.01-0.08 parts of benzoyl peroxide, 0.1-0.5 parts of zinc oxide, 20-30 parts of paraxylene.
Preferably, in the preparation process of modified coupling agent, by weight by 100 parts of paraxylene, 20-30 parts of silicon carbide
Powder, 1-2 part phenyltrimethoxysila,e, 1-3 parts of titanate coupling agents 105 are sent into reaction flask, under nitrogen protection, heating
To 80-88 DEG C, it is stirred to react 1-3h, 2-4 parts of sodium lignosulfonates are then added and stir 15-30min, filter while hot, wash, then
It is sent into baking oven and heats, heating temperature is 105-115 DEG C, and crushing obtains modified coupling agent.
Preferably, the weight ratio of epoxy resin, linseed fatty acid, conjugated linoleic acid and pelargonic acid is 40-45:60-
64:8-9:8-10.
Preferably, the weight ratio 20-24:16-20 of pentaerythrite and trimethylolpropane.
Preferably, the weight ratio of ethylene glycol monobutyl ether and ethylene glycol propandiol butyl ether is 20-24:6-10.
Preferably, raw material includes: 40-45 parts of epoxy resin by weight, 60-64 parts of linseed fatty acid, is conjugated
It is 8-9 parts of linoleic acid, 8-10 parts of pelargonic acid, coupling agent 1.4-1.6 parts modified, 6-8 parts of benzoic acid, 4-6 parts of succinic acid, pentaerythrite
20-24 parts, 16-20 parts of trimethylolpropane, 16-20 parts of phthalic anhydride, 8-12 parts of trimellitic anhydride, diethylenetriamine
1.7-2.1 parts, 20-24 parts of ethylene glycol monobutyl ether, 6-10 parts of ethylene glycol propandiol butyl ether, 0.04-0.06 parts of benzoyl peroxide,
0.2-0.3 parts of zinc oxide.
A kind of preparation method for high-performance epoxy alkyd resin that the present invention also proposes, includes the following steps:
S1, linseed fatty acid, pelargonic acid, epoxy resin are added into reaction kettle, are warming up to 80- under stirring
95 DEG C, keep the temperature and zinc oxide, benzoyl peroxide is added after 15-35min continues to stir 20-30min, be warming up to 130-145 DEG C after
Continuous stirring 1-3h, is then cooled to 105-115 DEG C, and modified coupling agent is added and continues to stir 15-30min, obtains A material；
S2, succinic acid, benzoic acid, phthalic anhydride, pentaerythrite, trimethylolpropane are continuously added into A material
And paraxylene, it is warming up to 160-170 DEG C, stirring to acid value is 20-30mgKOH/g；It is cooled to 140-145 DEG C, inclined benzene is added
Three acid anhydrides are warming up to 176-180 DEG C, and stirring to acid value is 45-48mgKOH/g；
S3, vacuum distillation removal paraxylene, are added ethylene glycol monobutyl ether, ethylene glycol propandiol butyl ether, are cooled to 100-
120 DEG C, addition diethylenetriamine, conjugated linoleic acid stir evenly, and obtain aqueous high-performance epoxy alkyd resin.
Preferably, in S1, linseed fatty acid, pelargonic acid, epoxy resin are added into reaction kettle, in stirring
Under be warming up to 85-90 DEG C, keep the temperature and zinc oxide be added after 20-24min, benzoyl peroxide continues to stir 24-26min, be warming up to
140-143 DEG C is continued to stir 1.5-2h, is then cooled to 110-112 DEG C, and modified coupling agent is added and continues to stir 20-24min, obtains
To A material.
In the present invention, epoxy resin is reacted into synthesizing epoxy ester with linseed fatty acid, pelargonic acid, then again with react
The alkyd resin of generation carries out transesterification, synthesizes aqueous epoxy alkyd resin, and water-soluble, stability and anti-corrosive properties are excellent
It is good, diethylenetriamine and conjugated linoleic acid is added, not only there is neutralization, and generate spiral knot due to having introduced conjugated double bond
Structure body, protects ester bond, can significantly improve the wear-resisting of resin, stability and anti-corrosive properties.By being closed in epoxy resin
Modification by copolymerization is carried out to alkyd resin at middle addition modified coupling agent, with carboxyl self-crosslinking reaction can occur for silicone hydroxyl, and product is hard
Spend that big, water-fast, ageing-resistant performance is excellent, and silicon carbide powder therein and sodium lignosulfonate by phenyltrimethoxysila,e and
Titanate coupling agent 105 is modified, and other components collective effect in product, and storeroom is uniformly dispersed strong, and product is steady
Qualitative, wear-resisting and antiseptic property is fabulous.
Detailed description of the invention
Fig. 1 is a kind of preparation technology flow chart of high-performance epoxy alkyd resin proposed by the present invention.
Specific embodiment
As shown in Figure 1, Fig. 1 is a kind of preparation process flow of high-performance epoxy alkyd resin proposed by the present invention
Figure.
In the following, technical solution of the present invention is described in detail by specific embodiment.
Embodiment 1
A kind of high-performance epoxy alkyd resin, raw material include: 30 parts of epoxy resin by weight, flaxseed grease
80 parts of fat acid, 7 parts of conjugated linoleic acid, 15 parts of pelargonic acid, modified 1 part of coupling agent, 10 parts of benzoic acid, 2 parts of succinic acid, pentaerythrite
30 parts, 15 parts of trimethylolpropane, 25 parts of phthalic anhydride, 5 parts of trimellitic anhydride, 4 parts of diethylenetriamine, ethylene glycol only son
15 parts of ether, 12 parts of ethylene glycol propandiol butyl ether, 0.01 part of benzoyl peroxide, 0.5 part of zinc oxide, 20 parts of paraxylene.
Embodiment 2
A kind of high-performance epoxy alkyd resin, raw material include: 50 parts of epoxy resin by weight, flaxseed grease
50 parts of fat acid, 10 parts of conjugated linoleic acid, 5 parts of pelargonic acid, modified 2 parts of coupling agent, 5 parts of benzoic acid, 8 parts of succinic acid, pentaerythrite
15 parts, 25 parts of trimethylolpropane, 15 parts of phthalic anhydride, 20 parts of trimellitic anhydride, 1.5 parts of diethylenetriamine, ethylene glycol
35 parts of monobutyl ether, 5 parts of ethylene glycol propandiol butyl ether, 0.08 part of benzoyl peroxide, 0.1 part of zinc oxide, 30 parts of paraxylene.
Embodiment 3
A kind of high-performance epoxy alkyd resin, raw material include: 40 parts of epoxy resin by weight, flaxseed grease
64 parts of fat acid, 8 parts of conjugated linoleic acid, 10 parts of pelargonic acid, modified 1.4 parts of coupling agent, 8 parts of benzoic acid, 4 parts of succinic acid, Ji Wusi
24 parts of alcohol, 16 parts of trimethylolpropane, 20 parts of phthalic anhydride, 8 parts of trimellitic anhydride, 2.1 parts of diethylenetriamine, ethylene glycol
20 parts of monobutyl ether, 10 parts of ethylene glycol propandiol butyl ether, 0.04 part of benzoyl peroxide, 0.3 part of zinc oxide.
In the preparation process of modified coupling agent, by weight by 100 parts of paraxylene, 20 parts of silicon carbide powders, 2 parts of benzene
Base trimethoxy silane, 1 part of titanate coupling agent 105 are sent into reaction flask, under nitrogen protection, are warming up to 88 DEG C, stirring is anti-
1h is answered, 4 parts of sodium lignosulfonates are then added and stir 15min, filter while hot, washs, is then fed into baking oven and heats, heating temperature
It is 115 DEG C, crushing obtains modified coupling agent.
Referring to Fig.1, the preparation method of the high-performance epoxy alkyd resin, includes the following steps:
S1, linseed fatty acid, pelargonic acid, epoxy resin are added into reaction kettle, are warming up to 80 under stirring
DEG C, addition zinc oxide, benzoyl peroxide continue to stir 20min after heat preservation 35min, are warming up to 145 DEG C and continue to stir 1h, then
115 DEG C are cooled to, modified coupling agent is added and continues to stir 15min, obtains A material；
S2, succinic acid, benzoic acid, phthalic anhydride, pentaerythrite, trimethylolpropane are continuously added into A material
And paraxylene, 170 DEG C are warming up to, stirring to acid value is 20mgKOH/g；145 DEG C are cooled to, trimellitic anhydride, heating is added
To 176 DEG C, stirring to acid value is 48mgKOH/g；
S3, vacuum distillation removal paraxylene, are added ethylene glycol monobutyl ether, ethylene glycol propandiol butyl ether, are cooled to 100
DEG C, addition diethylenetriamine, conjugated linoleic acid stir evenly, and obtain aqueous high-performance epoxy alkyd resin.
Embodiment 4
A kind of high-performance epoxy alkyd resin, raw material include: 45 parts of epoxy resin by weight, flaxseed grease
60 parts of fat acid, 9 parts of conjugated linoleic acid, 8 parts of pelargonic acid, modified 1.6 parts of coupling agent, 6 parts of benzoic acid, 6 parts of succinic acid, pentaerythrite
20 parts, 20 parts of trimethylolpropane, 16 parts of phthalic anhydride, 12 parts of trimellitic anhydride, 1.7 parts of diethylenetriamine, ethylene glycol
24 parts of monobutyl ether, 6 parts of ethylene glycol propandiol butyl ether, 0.06 part of benzoyl peroxide, 0.2 part of zinc oxide.
In the preparation process of modified coupling agent, by weight by 100 parts of paraxylene, 30 parts of silicon carbide powders, 1 part of benzene
Base trimethoxy silane, 3 parts of titanate coupling agents 105 are sent into reaction flask, under nitrogen protection, are warming up to 80 DEG C, stirring is anti-
3h is answered, 2 parts of sodium lignosulfonates are then added and stir 30min, filter while hot, washs, is then fed into baking oven and heats, heating temperature
It is 105 DEG C, crushing obtains modified coupling agent.
The preparation method of the high-performance epoxy alkyd resin, includes the following steps:
S1, linseed fatty acid, pelargonic acid, epoxy resin are added into reaction kettle, are warming up to 95 under stirring
DEG C, addition zinc oxide, benzoyl peroxide continue to stir 30min after heat preservation 15min, are warming up to 130 DEG C and continue to stir 3h, then
105 DEG C are cooled to, modified coupling agent is added and continues to stir 30min, obtains A material；
S2, succinic acid, benzoic acid, phthalic anhydride, pentaerythrite, trimethylolpropane are continuously added into A material
And paraxylene, 160 DEG C are warming up to, stirring to acid value is 30mgKOH/g；140 DEG C are cooled to, trimellitic anhydride, heating is added
To 180 DEG C, stirring to acid value is 45mgKOH/g；
S3, vacuum distillation removal paraxylene, are added ethylene glycol monobutyl ether, ethylene glycol propandiol butyl ether, are cooled to 120
DEG C, addition diethylenetriamine, conjugated linoleic acid stir evenly, and obtain aqueous high-performance epoxy alkyd resin.
Embodiment 5
A kind of high-performance epoxy alkyd resin, raw material include: 43 parts of epoxy resin by weight, flaxseed grease
62 parts of fat acid, 8.5 parts of conjugated linoleic acid, 9 parts of pelargonic acid, modified 1.5 parts of coupling agent, 7 parts of benzoic acid, 5 parts of succinic acid, Ji Wusi
22 parts of alcohol, 18 parts of trimethylolpropane, 18 parts of phthalic anhydride, 10 parts of trimellitic anhydride, 2 parts of diethylenetriamine, ethylene glycol
22 parts of monobutyl ether, 8 parts of ethylene glycol propandiol butyl ether, 0.05 part of benzoyl peroxide, 0.25 part of zinc oxide.
In the preparation process of modified coupling agent, by weight by 100 parts of paraxylene, 25 parts of silicon carbide powders, 1.2 parts
Phenyltrimethoxysila,e, 2 parts of titanate coupling agents 105 are sent into reaction flask, under nitrogen protection, are warming up to 84 DEG C, stirring
2h is reacted, 3 parts of sodium lignosulfonates are then added and stir 28min, filter while hot, washs, is then fed into baking oven and heats, heating temperature
Degree is 110 DEG C, and crushing obtains modified coupling agent.
The preparation method of the high-performance epoxy alkyd resin, includes the following steps:
S1, linseed fatty acid, pelargonic acid, epoxy resin are added into reaction kettle, are warming up to 88 under stirring
DEG C, addition zinc oxide, benzoyl peroxide continue to stir 25min after heat preservation 22min, are warming up to 142 DEG C and continue to stir 1.8h, so
After be cooled to 111 DEG C, modified coupling agent is added and continues to stir 22min, obtains A material；
S2, succinic acid, benzoic acid, phthalic anhydride, pentaerythrite, trimethylolpropane are continuously added into A material
And paraxylene, 165 DEG C are warming up to, stirring to acid value is 25mgKOH/g；143 DEG C are cooled to, trimellitic anhydride, heating is added
To 178 DEG C, stirring to acid value is 46mgKOH/g；
S3, vacuum distillation removal paraxylene, are added ethylene glycol monobutyl ether, ethylene glycol propandiol butyl ether, are cooled to 110
DEG C, addition diethylenetriamine, conjugated linoleic acid stir evenly, and obtain aqueous high-performance epoxy alkyd resin.
High-performance epoxy alkyd resin described in embodiment 1-5 is coated uniformly on standard using the method for spraying
Tinplate version surface, paint film surface drying time are 20min, and thickness of dry film is 20 μm, and hardness 0.42, adhesive force is 2 grades, and impact is strong
Degree is 50cm, and flexibility 1mm, salt water resistance is that 240h is not blistering, does not crack, does not peel off.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1. a kind of high-performance epoxy alkyd resin, which is characterized in that its raw material includes: epoxy resin 30-50 by weight
Part, 50-80 parts of linseed fatty acid, 7-10 parts of conjugated linoleic acid, 5-15 parts of pelargonic acid, coupling agent 1-2 parts modified, benzoic acid
5-10 parts, 2-8 parts of succinic acid, 15-30 parts of pentaerythrite, 15-25 parts of trimethylolpropane, 15-25 parts of phthalic anhydride, partially
5-20 parts of benzenetricarboxylic anhydride, 1.5-4 parts of diethylenetriamine, 15-35 parts of ethylene glycol monobutyl ether, 5-12 parts of ethylene glycol propandiol butyl ether,
0.01-0.08 parts of benzoyl peroxide, 0.1-0.5 parts of zinc oxide, 20-30 parts of paraxylene；
Wherein in the preparation process of modified coupling agent, by weight by 100 parts of paraxylene, 20-30 parts of silicon carbide powders, 1-
2 parts of phenyltrimethoxysila,es, 1-3 parts of titanate coupling agents 105 are sent into reaction flask, under nitrogen protection, are warming up to 80-88
DEG C, it is stirred to react 1-3h, 2-4 parts of sodium lignosulfonates are then added and stir 15-30min, filter while hot, washs, is then fed into baking
It is heated in case, heating temperature is 105-115 DEG C, and crushing obtains modified coupling agent；
The wherein preparation method of the high-performance epoxy alkyd resin, includes the following steps:
S1, linseed fatty acid, pelargonic acid, epoxy resin are added into reaction kettle, are warming up to 80-95 under stirring
DEG C, addition zinc oxide, benzoyl peroxide continue to stir 20-30min after heat preservation 15-35min, are warming up to 130-145 DEG C of continuation
1-3h is stirred, is then cooled to 105-115 DEG C, modified coupling agent is added and continues to stir 15-30min, obtains A material；
S2, succinic acid, benzoic acid, phthalic anhydride, pentaerythrite, trimethylolpropane and right are continuously added into A material
Dimethylbenzene is warming up to 160-170 DEG C, and stirring to acid value is 20-30mgKOH/g；It is cooled to 140-145 DEG C, trimellitic acid is added
Acid anhydride is warming up to 176-180 DEG C, and stirring to acid value is 45-48mgKOH/g；
S3, vacuum distillation removal paraxylene, are added ethylene glycol monobutyl ether, ethylene glycol propandiol butyl ether, are cooled to 100-120
DEG C, addition diethylenetriamine, conjugated linoleic acid stir evenly, and obtain aqueous high-performance epoxy alkyd resin.
2. high-performance epoxy alkyd resin according to claim 1, which is characterized in that epoxy resin, linseed oil
The weight ratio of fatty acid, conjugated linoleic acid and pelargonic acid is 40-45:60-64:8-9:8-10.
3. high-performance epoxy alkyd resin according to claim 1 or 2, which is characterized in that pentaerythrite and three hydroxyls
The weight ratio 20-24:16-20 of methylpropane.
4. high-performance epoxy alkyd resin according to claim 1 or 2, which is characterized in that ethylene glycol monobutyl ether with
The weight ratio of ethylene glycol propandiol butyl ether is 20-24:6-10.
5. high-performance epoxy alkyd resin according to claim 1 or 2, which is characterized in that its raw material is by weight
It include: 40-45 parts of epoxy resin, it is 60-64 parts of linseed fatty acid, 8-9 parts of conjugated linoleic acid, 8-10 parts of pelargonic acid, modified
1.4-1.6 parts of coupling agent, 6-8 parts of benzoic acid, 4-6 parts of succinic acid, 20-24 parts of pentaerythrite, 16-20 parts of trimethylolpropane,
16-20 parts of phthalic anhydride, 8-12 parts of trimellitic anhydride, 1.7-2.1 parts of diethylenetriamine, 20-24 parts of ethylene glycol monobutyl ether,
6-10 parts of ethylene glycol propandiol butyl ether, 0.04-0.06 parts of benzoyl peroxide, 0.2-0.3 parts of zinc oxide.
6. the preparation method of high-performance epoxy alkyd resin according to claim 1, which is characterized in that in S1,
Linseed fatty acid, pelargonic acid, epoxy resin are added into reaction kettle, 85-90 DEG C is warming up under stirring, heat preservation
Addition zinc oxide, benzoyl peroxide continue to stir 24-26min after 20-24min, are warming up to 140-143 DEG C and continue to stir 1.5-
Then 2h is cooled to 110-112 DEG C, modified coupling agent is added and continues to stir 20-24min, obtains A material.
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| CN102391439A (en) * | 2011-08-29 | 2012-03-28 | 华南理工大学 | Epoxy ester modified aqueous alkyd resin and preparation method thereof |
| CN102727551A (en) * | 2011-04-07 | 2012-10-17 | 上海鑫昊生物科技有限公司 | Use of effective part of traditional Chinese medicine in HIV latency-resistant treatment |
| CN104072742A (en) * | 2014-06-06 | 2014-10-01 | 华南理工大学 | Epoxy-modified water-based alkyd resin and water-based alkyd amino stoving varnish and preparation method of epoxy-modified water-based alkyd resin and water-based alkyd amino stoving varnish. |
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| CN102727551A (en) * | 2011-04-07 | 2012-10-17 | 上海鑫昊生物科技有限公司 | Use of effective part of traditional Chinese medicine in HIV latency-resistant treatment |
| CN102391439A (en) * | 2011-08-29 | 2012-03-28 | 华南理工大学 | Epoxy ester modified aqueous alkyd resin and preparation method thereof |
| CN104072742A (en) * | 2014-06-06 | 2014-10-01 | 华南理工大学 | Epoxy-modified water-based alkyd resin and water-based alkyd amino stoving varnish and preparation method of epoxy-modified water-based alkyd resin and water-based alkyd amino stoving varnish. |
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