CN105025659B - A kind of method for improving lamp bar plate punching dielectric layer and falling silk - Google Patents
A kind of method for improving lamp bar plate punching dielectric layer and falling silk Download PDFInfo
- Publication number
- CN105025659B CN105025659B CN201510383704.6A CN201510383704A CN105025659B CN 105025659 B CN105025659 B CN 105025659B CN 201510383704 A CN201510383704 A CN 201510383704A CN 105025659 B CN105025659 B CN 105025659B
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- China
- Prior art keywords
- lamp bar
- bar plate
- waste material
- material side
- dielectric layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The present invention discloses a kind of method for improving lamp bar plate punching dielectric layer and falling silk, wherein, including step：A, made on the enterprising row line film design of lamp bar plate, wherein waste material side using paving copper mode；B, by microetch board-washing, patch dry film, contraposition, exposure and etching process, circuit is made；C, anti-welding film design, waste material side lid anti-solder ink, makes waste material side be opened a window without welding resistance；E, by printing, pre-baked, contraposition, exposure, development and rear roasting processing, made anti-welding；F, punching is carried out to lamp bar plate.Circuit waste material side is taken paving copper mode to make by the present invention, adds waste material side hardness so that is fallen a problem and is greatly improved, reduces dielectric layer and drop and weigh the risk scrapped wounded caused by table top.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, more particularly to a kind of lamp bar plate punching dielectric layer that improves to fall silk
Method.
Background technology
With the progress of modern science and technology, LCD TV develops towards thinner, broader direction, and this means that lamp bar
The size of plate will increasingly be grown.Because lamp bar board size is longer, gong plate mode is taken to be molded not only time-consuming, and finished size is difficult
With control.And take the mode of punching to be molded not only efficiency high, and quality can be ensured well.But lamp bar plate is rushing
Easily occur the problem of dielectric layer falls thread during plate, if cleaning is not clean, there is the risk for causing circuit surface to weigh wounded.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, improve lamp bar plate punching dielectric layer it is an object of the invention to provide one kind and fall
A method of silk, it is intended to solve the problems, such as that lamp bar plate easily falls thread during punching in the prior art.
Technical scheme is as follows：
A kind of method for improving lamp bar plate punching dielectric layer and falling silk, wherein, including step：
A, made on the enterprising row line film design of lamp bar plate, wherein waste material side using paving copper mode；
B, by microetch board-washing, patch dry film, contraposition, exposure and etching process, circuit is made；
C, anti-welding film design, waste material side lid anti-solder ink, makes waste material side be opened a window without welding resistance；
E, by printing, pre-baked, contraposition, exposure, development and rear roasting processing, made anti-welding；
F, punching is carried out to lamp bar plate.
The method that described improvement lamp bar plate punching dielectric layer falls silk, wherein, the travelling speed 2800mm/ of microetch board-washing
min。
The method that described improvement lamp bar plate punching dielectric layer falls silk, wherein, pre-baked temperature is 75 DEG C, and the time is
35min。
The method that described improvement lamp bar plate punching dielectric layer falls silk, wherein, developing powder 3500mm/min.
The method that described improvement lamp bar plate punching dielectric layer falls silk, wherein, the speed for pasting dry film is 3m/min.
The method that described improvement lamp bar plate punching dielectric layer falls silk, wherein, roasting temperature is 150 DEG C afterwards, and the time is
60min。
The method that described improvement lamp bar plate punching dielectric layer falls silk, wherein, copper paving area is more unilateral than waste material side small
0.04mm。
Beneficial effect：Circuit waste material side is taken paving copper mode to make by the present invention, adds waste material side hardness so that fall silk
Problem is greatly improved, and reduces dielectric layer and drops and weighs the risk scrapped wounded caused by table top.
Brief description of the drawings
Fig. 1 is a kind of flow chart for improving lamp bar plate punching dielectric layer and falling the method preferred embodiment of silk of the present invention.
Fig. 2 is the structural representation for the lamp bar plate that the method for the present invention makes.
Embodiment
The present invention provides a kind of method for improving lamp bar plate punching dielectric layer and falling silk, to make the purpose of the present invention, technical side
Case and effect are clearer, clear and definite, and the present invention is described in more detail below.It is it should be appreciated that described herein specific real
Example is applied only to explain the present invention, is not intended to limit the present invention.
Referring to Fig. 1, Fig. 1 is that the method that a kind of improvement lamp bar plate punching dielectric layer provided by the present invention falls silk is preferably real
The flow chart of example is applied, it includes step：
S1, made using paving copper mode on the design of the lamp bar plate enterprising row line film, wherein waste material side；
S2, by microetch board-washing, patch dry film, contraposition, exposure and etching process, circuit is made；
S3, the design of the anti-welding film, waste material side lid anti-solder ink, make waste material side be opened a window without welding resistance；
S4, by printing, pre-baked, contraposition, exposure, development and rear roasting processing, made anti-welding；
S5, punching is carried out to lamp bar plate.
Traditional lamp bar printed line road be designed as waste material side take do not spread copper, full etching mode make, welding resistance waste material side design
For windowing, cause the reduction of sheet material hardness because waste material side does not spread copper, have dielectric layer during punching and fall a phenomenon, if being cleared up after punching
It is unclean, then there is the risk for causing circuit surface to weigh wounded.As shown in Fig. 2 circuit 120 and waste material are arranged at intervals on lamp bar plate 100
Waste material side is taken paving copper mode to make, adds waste material side hardness so that fall a problem and obtain changing greatly very much by side 110, the present invention
It is kind, reduce dielectric layer and drop and weigh the risk scrapped wounded caused by table top.
In the step S2, the travelling speed 2800mm/min of microetch board-washing.
The speed for pasting dry film is 3m/min.It can be specifically dry film is adhering closely to lamp bar plate by pressure sintering to paste dry film
Copper face on, temperature makes dry film good bond at 110 DEG C.
IR light sources, 7 ~ 10KW may be selected in exposure process（Such as 8KW）Energy, and pass through cooling system and maintain table top temperature 25
~30℃（Such as 25 DEG C）.Development treatment is carried out after exposure：Using Na2CO3Liquid medicine（Mass percent 1 ~ 2%, such as 1.2%）, temperature is
30 DEG C, spray as 2.5 ~ 3kg/cm2（Such as 2.7kg/cm2）, developing time was at 50 ~ 60 seconds（Such as 55 seconds）It is interior.Developing powder is
3500mm/min。
It can be etched after development, be specifically etched in etching solution, etching condition is 40 DEG C, and the time is
5min.Etching solution is liquor ferri trichloridi（Mass percent is 34 ~ 38%, such as 35%）.
In the step S4, printing uses liquid photosensitive ink, and its method is that hole and orifice ring are only done on web plate
Shelves point resistance ink, is prevented in ink ostium.
Pre-baked purpose is to drive the solvent in ink away, hardens ink portions, is unlikely to stick egative film when being exposed.
Pre-baked temperature is 75 DEG C, time 35min.
In exposure process：Select IR light sources, 7 ~ 10KW（Such as 9KW）Energy, and pass through cooling system maintain table top temperature
25~30℃（Such as 28 DEG C）.
Development conditions are to use Na2CO3Liquid medicine（Mass percent 1 ~ 2%, such as 1.5%）, temperature is 30 DEG C, spray as 2.5 ~
3kg/cm2（Such as 2.8kg/cm2）, developing time was at 50 ~ 60 seconds（Such as 55 seconds）It is interior.Developing powder is 3500mm/min.
Roasting purpose is that the epoxy resin for making ink thoroughly hardens afterwards, and roasting condition is 150 DEG C afterwards, time 60min.
In the present invention, copper paving area small 0.04mm more unilateral than waste material side.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (4)
- A kind of 1. method for improving lamp bar plate punching dielectric layer and falling silk, it is characterised in that including step：A, made on the enterprising row line film design of lamp bar plate, wherein waste material side using paving copper mode；B, by microetch board-washing, patch dry film, contraposition, exposure and etching process, circuit is made；C, anti-welding film design, waste material side lid anti-solder ink, makes waste material side be opened a window without welding resistance；E, by printing, pre-baked, contraposition, exposure, development and rear roasting processing, made anti-welding；F, punching is carried out to lamp bar plate；Circuit and waste material side are arranged at intervals on the lamp bar plate；Copper paving area small 0.04mm more unilateral than waste material side；The travelling speed 2800mm/min of microetch board-washing described in above-mentioned steps B；It is described patch dry film be：Dry film is made by pressure sintering It is adhering closely on the copper face of lamp bar plate, the speed for pasting dry film is 3m/min；Temperature is at 110 DEG C.
- 2. the method according to claim 1 for improving lamp bar plate punching dielectric layer and falling silk, it is characterised in that pre-baked temperature For 75 DEG C, time 35min.
- 3. the lamp bar plate punching dielectric layer according to claim 1 that improves falls the method for silk, it is characterised in that developing powder is 3500mm/min。
- 4. the method according to claim 1 for improving lamp bar plate punching dielectric layer and falling silk, it is characterised in that roasting temperature afterwards For 150 DEG C, time 60min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383704.6A CN105025659B (en) | 2015-07-03 | 2015-07-03 | A kind of method for improving lamp bar plate punching dielectric layer and falling silk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383704.6A CN105025659B (en) | 2015-07-03 | 2015-07-03 | A kind of method for improving lamp bar plate punching dielectric layer and falling silk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105025659A CN105025659A (en) | 2015-11-04 |
| CN105025659B true CN105025659B (en) | 2018-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510383704.6A Active CN105025659B (en) | 2015-07-03 | 2015-07-03 | A kind of method for improving lamp bar plate punching dielectric layer and falling silk |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110753450B (en) * | 2019-11-25 | 2020-08-07 | 深圳市景旺电子股份有限公司 | Manufacturing method of rigid-flex board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652019A (en) * | 2008-08-14 | 2010-02-17 | 富葵精密组件(深圳)有限公司 | Circuit board prefabricated product and circuit board assembling method |
| CN101951727A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Method for producing electroplated board edge of circuit board |
| CN102223763A (en) * | 2010-04-16 | 2011-10-19 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of connecting sheet circuit board |
| CN102448249A (en) * | 2010-10-15 | 2012-05-09 | 富葵精密组件(深圳)有限公司 | Method for manufacturing double-sided circuit board |
| CN103582313A (en) * | 2012-07-18 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module group |
-
2015
- 2015-07-03 CN CN201510383704.6A patent/CN105025659B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652019A (en) * | 2008-08-14 | 2010-02-17 | 富葵精密组件(深圳)有限公司 | Circuit board prefabricated product and circuit board assembling method |
| CN102223763A (en) * | 2010-04-16 | 2011-10-19 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of connecting sheet circuit board |
| CN101951727A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Method for producing electroplated board edge of circuit board |
| CN102448249A (en) * | 2010-10-15 | 2012-05-09 | 富葵精密组件(深圳)有限公司 | Method for manufacturing double-sided circuit board |
| CN103582313A (en) * | 2012-07-18 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board module group |
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| Publication number | Publication date |
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| CN105025659A (en) | 2015-11-04 |
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