CN105023893A - Integrated power control unit - Google Patents

Integrated power control unit Download PDF

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Publication number
CN105023893A
CN105023893A CN201510423979.8A CN201510423979A CN105023893A CN 105023893 A CN105023893 A CN 105023893A CN 201510423979 A CN201510423979 A CN 201510423979A CN 105023893 A CN105023893 A CN 105023893A
Authority
CN
China
Prior art keywords
control unit
power semiconductor
power control
cooler
integrated power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510423979.8A
Other languages
Chinese (zh)
Inventor
邵建根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANTONG MINGNUO MACHINERY CO Ltd
Original Assignee
NANTONG MINGNUO MACHINERY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANTONG MINGNUO MACHINERY CO Ltd filed Critical NANTONG MINGNUO MACHINERY CO Ltd
Priority to CN201510423979.8A priority Critical patent/CN105023893A/en
Publication of CN105023893A publication Critical patent/CN105023893A/en
Pending legal-status Critical Current

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  • Inverter Devices (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)

Abstract

The invention provides an integrated power control unit. The integrated power control unit comprises a transformer, a capacitor, an inverter, a buck-boost converter and a cooling mechanism, wherein the cooling mechanism is composed of a power semiconductor component, an insulating plate, a heat dissipation plate and a cooler, wherein the power semiconductor component, the insulating plate, the heat dissipation plate and the cooler are connected with one another sequentially from top to bottom, the cooler is composed of a cooling channel and stacked cooling plates, and the power semiconductor component is a silicon carbide power semiconductor component. According to the integrated power control unit of the invention, current higher than 300A can pass through each component based on the high-performance power semiconductor; and since the components supporting high current are adopted, the number of the components can be decreased, so that miniaturization can be realized.

Description

A kind of integrated power control unit
Technical field
the present invention relates to a kind of integrated power control unit (PCU), belong to technical field of semiconductors.
Background technology
Integrated power control unit (PCU) is used for managing the electric current flowing to speed control motor from battery, and the energy regenerating that brake produces by it also sends battery storage back to.If adopt traditional silicon-based power electronic device, even if the ratio adjustment of heavy current and high pressure is well talked about, the heat distributed in the middle of this accounts for greatly 1/4th of vehicle electric energy loss.Except the energy loss in conductive process, the contactor that power electronics unit also will be stood and the energy loss caused.Existing integrated power control unit (PCU) has the weak points such as efficiency is low, caloric value is large, switching speed is slow.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part, a kind of integrated power control unit (PCU) is provided.
Integrated power control unit (PCU) of the present invention, comprise transformer, capacitor, inverter, type of voltage step-up/down converter and cooling body, described cooling body is made up of power semiconductor, insulation board, heating panel and cooler, described power semiconductor, insulation board, heating panel are connected from top to bottom successively with cooler, described cooler is made up of cooling channel and overlapping coldplate, and described power semiconductor is silicon carbide power semiconductor element.
Preferably,
Described heating panel is copper coin or copper alloy plate;
Described coldplate is that aluminium alloy compression casting forms.
Integrated power control unit (PCU) of the present invention, has following technique effect: integrated power control unit (PCU) is by high performance power semiconductor, and each element flows through the electric current of more than 300A.Adopt the element supporting big current, reduce number of elements to realize miniaturization.
Embodiment
Integrated power control unit (PCU) of the present invention, comprise transformer, capacitor, inverter, type of voltage step-up/down converter and cooling body, described cooling body is made up of power semiconductor, insulation board, heating panel and cooler, described power semiconductor, insulation board, heating panel are connected from top to bottom successively with cooler, described cooler is made up of cooling channel and overlapping coldplate, and described power semiconductor is silicon carbide power semiconductor element.
Described heating panel is copper coin or copper alloy plate;
Described coldplate is that aluminium alloy compression casting forms.
The course of work of the present invention is as follows: heat, by insulation board, passes to heating panel, dispelled the heat by cooler.Cooling water circulates in cooler, by heating panel, and cooling semiconductor element.

Claims (3)

1. an integrated power control unit, it is characterized in that, comprise transformer, capacitor, inverter, type of voltage step-up/down converter and cooling body, described cooling body is made up of power semiconductor, insulation board, heating panel and cooler, described power semiconductor, insulation board, heating panel are connected from top to bottom successively with cooler, described cooler is made up of cooling channel and overlapping coldplate, and described power semiconductor is silicon carbide power semiconductor element.
2. integrated power control unit according to claim 1, is characterized in that, described heating panel is copper coin or copper alloy plate.
3. integrated power control unit according to claim 1, is characterized in that, described coldplate is that aluminium alloy compression casting forms.
CN201510423979.8A 2015-07-20 2015-07-20 Integrated power control unit Pending CN105023893A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510423979.8A CN105023893A (en) 2015-07-20 2015-07-20 Integrated power control unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510423979.8A CN105023893A (en) 2015-07-20 2015-07-20 Integrated power control unit

Publications (1)

Publication Number Publication Date
CN105023893A true CN105023893A (en) 2015-11-04

Family

ID=54413748

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510423979.8A Pending CN105023893A (en) 2015-07-20 2015-07-20 Integrated power control unit

Country Status (1)

Country Link
CN (1) CN105023893A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11923716B2 (en) 2019-09-13 2024-03-05 Milwaukee Electric Tool Corporation Power converters with wide bandgap semiconductors

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1820559A (en) * 2003-11-18 2006-08-16 丰田自动车株式会社 Cooling structure of electric device
WO2009136591A1 (en) * 2008-05-08 2009-11-12 トヨタ自動車株式会社 Semiconductor device
US20130009168A1 (en) * 2011-07-04 2013-01-10 Toyota Jidosha Kabushiki Kaisha Semiconductor module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1820559A (en) * 2003-11-18 2006-08-16 丰田自动车株式会社 Cooling structure of electric device
WO2009136591A1 (en) * 2008-05-08 2009-11-12 トヨタ自動車株式会社 Semiconductor device
US20130009168A1 (en) * 2011-07-04 2013-01-10 Toyota Jidosha Kabushiki Kaisha Semiconductor module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11923716B2 (en) 2019-09-13 2024-03-05 Milwaukee Electric Tool Corporation Power converters with wide bandgap semiconductors

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: No. 99 Haian County, Jiangsu province 226600 Nantong City Libao Tonghai Road

Applicant after: Nantong Mingnuo electric Polytron Technologies Inc

Address before: No. 99 Haian County, Jiangsu province 226600 Nantong City Libao Tonghai Road

Applicant before: Nantong Mingnuo Machinery Co., Ltd.

COR Change of bibliographic data
RJ01 Rejection of invention patent application after publication

Application publication date: 20151104

RJ01 Rejection of invention patent application after publication