CN105023866A - Silicon wafer cleaning device - Google Patents
Silicon wafer cleaning device Download PDFInfo
- Publication number
- CN105023866A CN105023866A CN201510464497.7A CN201510464497A CN105023866A CN 105023866 A CN105023866 A CN 105023866A CN 201510464497 A CN201510464497 A CN 201510464497A CN 105023866 A CN105023866 A CN 105023866A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- basket
- cleaning device
- frame
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 78
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 23
- 239000010703 silicon Substances 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 6
- 230000006872 improvement Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 241000208340 Araliaceae Species 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses a silicon wafer cleaning device. The silicon wafer cleaning device comprises a cleaning basket and nine cleaning wafer cassettes which are placed in the cleaning basket in an array manner, wherein the long sides of the cleaning wafer cassettes are parallel with the long sides of the cleaning basket, and the short sides of the cleaning wafer cassettes are parallel with the short sides of the cleaning basket. The silicon wafer cleaning device has the advantages as follows: (1), due to an improvement on the silicon cleaning device provided by the invention, a single-tank cleaning batch is varied from 8 boxes per basketful and 200 pieces to 9 boxes per basketful and 225 pieces, so that single-item improvement yield is improved by 12.5%; (2), the consumption of wafer cassette tools is reduced, so that the costs of materials are reduced; (3), the operation stability of single-basket cleaning is ensured.
Description
Technical field
The application belongs to technical field of solar batteries, particularly relates to a kind of silicon chip cleaning device.
Background technology
In prior art, the cleaning of silicon chip needs first silicon chip to be positioned over the cleaning gaily decorated basket usually, and then is loaded into by multiple cleaning gaily decorated basket in cleaning basket, finally whole cleaning basket is carried out single groove cleaning.But in traditional cleaning method, only can place 8 cleaning gailys decorated basket in each cleaning basket, the long limit of each cleaning gaily decorated basket is vertical with the long side direction of cleaning basket.This cleaning method, each basket can only clean 200 silicon chips simultaneously, and efficiency is low.
Summary of the invention
The object of the present invention is to provide a kind of silicon chip cleaning device, to overcome deficiency of the prior art.
For achieving the above object, the invention provides following technical scheme:
The embodiment of the present application discloses a kind of silicon chip cleaning device, comprise cleaning basket and array is positioned in described cleaning basket 9 the cleaning gailys decorated basket, the long limit of the described cleaning gaily decorated basket is parallel with the long limit of described cleaning basket, and the minor face of the described cleaning gaily decorated basket is parallel with the minor face of described cleaning basket.
Preferably, in above-mentioned silicon chip cleaning device, the bottom frame that described cleaning frame comprises rectangle, the first side frame be oppositely arranged and the second side frame be oppositely arranged, described first side frame is fixed on the edge of described bottom frame and is positioned at vertical direction, described second side frame is connected between the frame of described first side, described in spacing between the second side frame that is oppositely arranged be greater than the length of described bottom frame minor face.
Preferably, in above-mentioned silicon chip cleaning device, the material of the described cleaning gaily decorated basket is PFA Kynoar.
Preferably, in above-mentioned silicon chip cleaning device, in described each cleaning gaily decorated basket, be mounted with 25 silicon chips.
Compared with prior art, the invention has the advantages that:
(1), improve before single groove cleaning batch by 8 boxes/basket 200 change improve after single groove clean batch 9 boxes/basket 225, individual event improves output and promotes 12.5%.
(2) consumption of cleaning gaily decorated basket frock, is improved thus the cost of saving material.
(3), ensure that the stability that single frame cleaning runs.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Figure 1 shows that the structural representation of silicon chip cleaning device in the specific embodiment of the invention;
Figure 2 shows that the end view of silicon chip cleaning device in the specific embodiment of the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be described in detail the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of protection of the invention.
Shown in ginseng Fig. 1, silicon chip cleaning device, comprises cleaning basket 1 and array is positioned over 9 the cleaning gailys decorated basket 2 cleaned in basket, and the long limit of the cleaning gaily decorated basket 2 is parallel with the long limit of cleaning basket 1, and the minor face of the cleaning gaily decorated basket 2 is parallel with the minor face cleaning basket 1.
In this technical scheme, existing 8 baskets are changed 9 baskets are super to be washed, under the state that improve wafer production capacity, pollutant washes method with cleaning performance the same before improving, and this kind of improvement has increased substantially output thus greatly reducing costs of pushing away, and popularization is convenient in such improvement.
Shown in ginseng Fig. 2, bottom frame 11, the first side frame 12 be oppositely arranged and the second side frame 13 be oppositely arranged that cleaning frame 1 comprises rectangle, first side frame 12 is fixed on the edge of bottom frame 11 and is positioned at vertical direction, second side frame 13 is connected between described first side frame 12, and the spacing between the second side frame 13 be oppositely arranged is greater than the length of described bottom frame 11 minor face.
Further, second side frame is connected to the side top position of first side frame.
In this technical scheme, this case is widened traditional cleaning frame at tip position, therefore increases the volume of cleaning frame.
Further, the material of cleaning the gaily decorated basket 2 is PFA Kynoar.
In this technical scheme, namely this gaily decorated basket cleans silicon chip in the solution such as NaoH solution .Hci solution .HF below 100 degree. and change indeformable, do not pollute silicon chip.
Further, 25 silicon chips are mounted with in each cleaning gaily decorated basket 2.
In sum, the invention has the advantages that:
(1), improve before single groove cleaning batch by 8 boxes/basket 200 change improve after single groove clean batch 9 boxes/basket 225, individual event improves output and promotes 12.5%.
(2) consumption of cleaning gaily decorated basket frock, is improved thus the cost of saving material.
(3), ensure that the stability that single frame cleaning runs.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection range of the application.
Claims (4)
1. a silicon chip cleaning device, it is characterized in that, comprise cleaning basket and array is positioned in described cleaning basket 9 the cleaning gailys decorated basket, the long limit of the described cleaning gaily decorated basket is parallel with the long limit of described cleaning basket, and the minor face of the described cleaning gaily decorated basket is parallel with the minor face of described cleaning basket.
2. silicon chip cleaning device according to claim 1, it is characterized in that: the bottom frame that described cleaning frame comprises rectangle, the first side frame be oppositely arranged and the second side frame be oppositely arranged, described first side frame is fixed on the edge of described bottom frame and is positioned at vertical direction, described second side frame is connected between the frame of described first side, described in spacing between the second side frame that is oppositely arranged be greater than the length of described bottom frame minor face.
3. silicon chip cleaning device according to claim 1, is characterized in that: the material of the described cleaning gaily decorated basket is PFA Kynoar.
4. silicon chip cleaning device according to claim 1, is characterized in that: be mounted with 25 silicon chips in described each cleaning gaily decorated basket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510464497.7A CN105023866A (en) | 2015-07-31 | 2015-07-31 | Silicon wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510464497.7A CN105023866A (en) | 2015-07-31 | 2015-07-31 | Silicon wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105023866A true CN105023866A (en) | 2015-11-04 |
Family
ID=54413731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510464497.7A Pending CN105023866A (en) | 2015-07-31 | 2015-07-31 | Silicon wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105023866A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202591197U (en) * | 2012-06-15 | 2012-12-12 | 苏州晶樱光电科技有限公司 | Cleaning basket of solar silicon chip automatic-cleaning machine |
| CN204230217U (en) * | 2014-11-18 | 2015-03-25 | 天津中环领先材料技术有限公司 | A kind of Novel silicon slice cleaning basket |
-
2015
- 2015-07-31 CN CN201510464497.7A patent/CN105023866A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202591197U (en) * | 2012-06-15 | 2012-12-12 | 苏州晶樱光电科技有限公司 | Cleaning basket of solar silicon chip automatic-cleaning machine |
| CN204230217U (en) * | 2014-11-18 | 2015-03-25 | 天津中环领先材料技术有限公司 | A kind of Novel silicon slice cleaning basket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151104 |
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| WD01 | Invention patent application deemed withdrawn after publication |