CN105022537A - Position detecting device - Google Patents

Position detecting device Download PDF

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Publication number
CN105022537A
CN105022537A CN201510173932.0A CN201510173932A CN105022537A CN 105022537 A CN105022537 A CN 105022537A CN 201510173932 A CN201510173932 A CN 201510173932A CN 105022537 A CN105022537 A CN 105022537A
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CN
China
Prior art keywords
electrode conductor
substrate
conductive pattern
position detecting
detecting device
Prior art date
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Granted
Application number
CN201510173932.0A
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Chinese (zh)
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CN105022537B (en
Inventor
原英之
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Wacom Co Ltd
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Wacom Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D9/00—Recording measured values
    • G01D9/02—Producing one or more recordings of the values of a single variable
    • G01D9/10—Producing one or more recordings of the values of a single variable the recording element, e.g. stylus, being controlled in accordance with the variable, and the recording medium, e.g. paper roll, being controlled in accordance with time
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
    • G06F3/04182—Filtering of noise external to the device and not generated by digitiser components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0442—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using active external devices, e.g. active pens, for transmitting changes in electrical potential to be received by the digitiser
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
    • G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
    • G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Quality & Reliability (AREA)
  • Position Input By Displaying (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

The invention relates to a position detecting device. The invention allows size reduction of a sensor of an electrostatic capacity position detecting device which detects an indication position of an indicator according to signals sent by the indicator. The sensor has plural electrode conductors that are disposed adjacent to each other and are configured to receive a signal from the indicator on a first surface of a substrate having the first surface and a second surface opposed to each other. The position detecting device includes a signal processing circuit including a differential amplifier circuit that calculates a difference between signals from at least two of the plural electrode conductors, and the position detecting device detects the indication position of the indicator according to the output of the differential amplifier circuit. Plural connecting lines are formed on the second surface of the substrate. The plural connecting lines each have one end connected to one of the plural electrode conductors disposed on the first surface by a through-hole or a via formed through the substrate, and the other end connected to a line-concentrated part.

Description

Position detecting device
Technical field
The present invention relates to the position detecting device of electrostatic capacitive, by receiving the signal from position indicator, detecting the position indicated by position indicator.
Background technology
In recent years, the flat information terminal having installed touch-screen is widely used.About this technology, such as extensively adopt electrostatic induction mode as disclosed in patent documentation 1 (Japanese Unexamined Patent Publication 08-179871 publication), the real estate of position-detection sensor configures multiple electrode conductor in length and breadth, the intersection point selecting these electrode conductors to be formed successively also obtains signal intensity, obtains the indicating positions of such as pen type position indicator (hereinafter referred to as stylus) according to its signal distributions.
In patent documentation 1, stylus has oscillatory circuit in inside, the oscillator signal of the predetermined frequency from this oscillatory circuit is applied to multiple electrode conductors of position-detection sensor.Further, in position detecting device, according to the signal intensity (signal level) of the induced signal obtained from each electrode conductor configured in length and breadth, the position indicated by stylus in the input face of position-detection sensor is detected.
Aforesaid device often combinationally uses with display device such as LCD (Liquid Crystal Display: liquid crystal display).In this case, accurately can not obtain the position of indication body owing to being mixed into the noise of display device generation or detecting the position of mistake, and becoming the reason of malfunction.Therefore, in the position detecting device of this electrostatic induction mode, the removal of noise becomes important problem.
About the most effective method for removing noise, adopt differential amplifier circuit in the past.Namely, select the two strip electrode lines arranged at equidirectional simultaneously, one strip electrode line is connected with the positive side input end of differential amplifier circuit, another strip electrode line is connected with the minus side input end of differential amplifier circuit, stress release treatment composition thus, make only to detect the indication bodies such as stylus close to time signal difference.Such as, the technology etc. that patent documentation 2 (Japanese Unexamined Patent Publication 5-6153 publication) and patent documentation 3 (Japanese Unexamined Patent Publication 10-20992 publication) are recorded is the example of the method.
[prior art document]
[patent documentation]
[patent documentation 1] Japanese Unexamined Patent Publication 08-179871 publication
[patent documentation 2] Japanese Unexamined Patent Publication 5-6153 publication
[patent documentation 3] Japanese Unexamined Patent Publication 10-20992 publication
Summary of the invention
The problem that invention will solve
, this position-detection sensor past is the conductive pattern by being formed on the substrate 1 be such as made up of resin as shown in figure 11, arranges above-mentioned multiple electrode conductors thus.
That is, in fig. 11, on the substrate 1 of rectangle, be such as formed with transversely many articles of the 1st electrode conductors (following, the to be referred to as Y electrode conductor) Y that (X-direction) extends 1, Y 2..., Y m(m is the integer of more than 2) and along with the direction of transverse intersection, be many articles of the 2nd electrode conductors (following, the to be referred to as X electrode conductor) X extended with the longitudinal direction of quadrature transverse (Y direction) in this embodiment 1, X 2..., X n(n is the integer of more than 2).In this case, many Y electrode conductor Y 1~ Y mwith many X electrode conductor X 1~ X nthe region (region surrounded by dotted line 2s in Figure 11) that formed of intersection point become the surveyed area 2 of indication body.
In addition, substrate 1 has as shown in figure 11 and forms with the Y electrode terminal 3 of the link of outside signal processing circuit and X electrode terminal 4 as teat.From many Y electrode conductor Y 1~ Y mthe conductive pattern extended to form respectively along substrate 1 periphery and around and line concentration in Y electrode terminal 3.Equally, from many X electrode conductor X 1~ X nthe conductive pattern extended to form respectively along substrate 1 periphery and around and line concentration in X electrode terminal 4.
Like this, in position-detection sensor in the past, distinguish line concentration many Y electrode conductor Y at Y electrode terminal 3 and X electrode terminal 4 1~ Y mwith many X electrode conductor X 1~ X n, therefore need the lead conductor pattern extended to form from each electrode conductor to carry out along the periphery 1 of substrate 1 around.Therefore, in fig. 11, the distribution region 5 (being with oblique line to illustrate in fig. 11) of the lead conductor pattern (connection line) arranged shown in dotted line 5s surrounds is needed.
Therefore, the past, substrate 1 was greater than the size of the surveyed area 2 of indication body due to the existence in this distribution region 5, there is the problem of convenience and appearance design decline.
Attempted for non-electrostatic capacitive way in the past, namely formed at position-detection sensor in the position detecting device of way of electromagnetic induction of X-direction and the use of Y-direction annulus, form connection line by through hole in the rear side (not forming the side of annulus) of substrate, eliminate the distribution region 5 of connection line thus.This can realize being because for way of electromagnetic induction, receive from stylus signal be annulus, the signal from stylus can not be received in connection line.
But, for the position-detection sensor of electrostatic capacitance mode, even also receive the signal from stylus in connection line, if thus just merely form connection line by through hole in the rear side (not forming the side of X electrode conductor and Y electrode conductor) of substrate without any measure, the problem of the position detection being difficult to carry out indication body will be there is.
In the position-detection sensor of this electrostatic capacitance mode, use from the differential amplifier circuit of Received signal strength differential amplification of two electrode conductors being loaded with approximate noise, to remove the noise produced at sensor from the Received signal strength obtained by electrode conductor.In this case, expect that the distance respectively and between the non-inverting input terminal of differential amplifier circuit and two electrode conductors of non-inverting input sub-connection is as far as possible short.Because if the distance between two electrode conductors is elongated, the approximation producing noise is disappeared, not only can not get the effect of the raising noise immunity realized by differential amplification, and the problem that circuit scale increases.
The object of the invention is, provides the position detecting device of the electrostatic capacitance mode that can overcome the above problems.
For solving the technical scheme of problem
In order to solve the problem, the invention of claim 1 provides a kind of position detecting device of electrostatic capacitance mode, and according to the input sent from indication body, the indicating positions of indication body, is characterized in that, described position detecting device has:
Substrate, have the 1st and with described 1st relative 2nd;
Multiple electrode conductor, described 1st of described substrate is disposed adjacent to each other, for receiving the described signal sent from described indication body;
Signal processing circuit, comprises the differential amplifier circuit of the difference of at least two electrode conductors selected from described multiple electrode conductor for computing, the indicating positions of indication body according to the output detections of described differential amplifier circuit; And
Many connection lines, configuration closer to each other in described 2nd of described substrate, and one end is connected with each electrode conductor in the described multiple electrode conductor arranged on described 1st by through hole or perforation,
The direction non-orthogonal with described connection line extends to form connecting portion, and this connecting portion is used for described electrode conductor arbitrary in described multiple electrode conductor to be electrically connected by being formed at the through hole of described substrate.
In the invention of the claim 1 of said structure, multiple electrode conductor is formed adjacent to each other in the 1st face of substrate, and substrate be formed on the 2nd of the 1st opposition side of the plurality of electrode conductor, be configured for the connection line be connected with signal processing circuit by described multiple electrode conductor close to each other.
Therefore, connection line, by multiple electrode conductor electrostatic screening, can prevent or alleviate the transmission signal received in connection line from indication bodies such as such as stylus.In addition, connection line configures close to each other.In addition, the direction non-orthogonal with connection line extends to form connecting portion, this connecting portion is used for electrode conductor arbitrary in multiple electrode conductor to be electrically connected by being formed at the through hole of substrate, even thus in the part at above-mentioned connecting portion place, be also close to configuration between connection line.
Therefore, even when being loaded with noise in connection line, these noises are also in identical state in many connection lines, thus from the signal of multiple electrode conductor, can remove the noise be superimposed in connection line by calculus of differences in the differential amplifier circuit of signal processing circuit.
Situation in view of the above, invention according to claim 1, even in the position detecting device of electrostatic capacitance mode, position-detection sensor substrate be formed in the 2nd of the 1st opposition side of multiple electrode conductor, even if arrange connection line with the state relative with multiple electrode conductor, the indicating positions of indication body also accurately can be detected.
In addition, the feature of the invention of claim 2 is, in position detecting device according to claim 1, described multiple electrode conductor extends to form along the 1st direction respectively, and described multiple electrode conductor arranges close to each other in the 2nd direction crossing with described 1st direction, described many articles of connection lines extend to form along described 2nd direction.
According to the invention of this claim 2, although pass through through hole relative to many connection lines of multiple electrode conductor and connect, be extend to form along the 2nd direction crossing with the 1st direction that multiple electrode conductor extends.When that is the 1st direction forms connection line to the bearing of trend of multiple electrode conductor, orientation i.e. the 2nd direction entirety along multiple electrode conductor is needed to form connection line, but in this claim 2, the formation direction of connection line is crossing the 2nd direction, the 1st direction that extends with multiple electrode conductor, thus can form the position of through hole in multiple electrode conductor close to the 2nd direction.Therefore, easily closer to each other and form connection line abreast.
Therefore, invention according to claim 2, even in the position detecting device of electrostatic capacitance mode, position-detection sensor substrate be formed in the 2nd of the 1st opposition side of multiple electrode conductor, even if arrange connection line with the state relative with multiple electrode conductor, also can alleviate noise, and accurately detect the indicating positions of indication body.
Invention effect
According to the present invention, in the position detecting device of electrostatic capacitance mode, the indicating positions accurately detecting indication body can be ensured, substrate be formed in the 2nd of the 1st opposition side of multiple electrode conductor, with the state relative with multiple electrode conductor, connection line is set.Therefore, for the connection line formed at the 2nd of substrate do not need along substrate peripheral part around, thus can eliminate the distribution region for this connection line that connects up, correspondingly can reduce substrate, can prevent convenience and appearance design from declining.
Accompanying drawing explanation
Fig. 1 is the figure of the overall overview of embodiment for illustration of position detecting device of the present invention.
Fig. 2 is the figure observing an example of the sensor used the 1st embodiment of position detecting device of the present invention from the face side of substrate.
Fig. 3 is the figure observing an example of the sensor used the 1st embodiment of position detecting device of the present invention from the rear side of substrate.
Fig. 4 is the partial enlarged drawing observing an example of the sensor used the 1st embodiment of position detecting device of the present invention from the face side of substrate.
Fig. 5 is the partial enlarged drawing observing an example of the sensor used the 2nd embodiment of position detecting device of the present invention from the face side of substrate.
Fig. 6 is the figure of the shape of the substrate of an example for illustration of the sensor used in the 2nd embodiment of position detecting device of the present invention.
Fig. 7 is the figure of the example for illustration of the sensor used in the 3rd embodiment of position detecting device of the present invention.
Fig. 8 is the figure of another example of conductive pattern for illustration of the sensor used in the embodiment of position detecting device of the present invention.
Fig. 9 is the figure of another example of conductive pattern for illustration of the sensor used in the embodiment of position detecting device of the present invention.
Figure 10 is the figure of another example of conductive pattern for illustration of the sensor used in the embodiment of position detecting device of the present invention.
Figure 11 is the figure of the position detecting device for illustration of the past.
Embodiment
[the 1st embodiment]
Fig. 1 is the figure of the schematic configuration of the 1st embodiment representing position detecting device of the present invention.In FIG, it is (following that position detecting device has position-detection sensor 10, in order to simplify referred to as sensor) and signal processing circuit 20, the position that signal processing circuit 20 is indicated by stylus 40 according to the input received by sensor 10.
Sensor 10 forms the 1st electrode conductor group 12 on the substrate 11 be such as made up of resin and the 2nd electrode conductor group 13 is formed.In this embodiment, substrate 11 is formed as the flat board of rectangular shape, has mutually relative 1st i.e. surperficial 11a and the 2nd i.e. back side 11b (with reference to Fig. 3).
1st electrode conductor group 12 is such as the multiple 1st electrode conductor 12Y transversely (X-direction) extended 1, 12Y 2..., 12Y mbe arranged obtain with the state that is not electrically connected each other, at predetermined spaced intervals.In addition, the 2nd electrode conductor group 13 is by multiple 2nd electrode conductor 13X 1, 13X 2..., 13X nspacedly predetermined be spaced that configuration obtains, these the 2nd electrode conductor 13X 1, 13X 2..., 13X nedge and the 1st electrode conductor 12Y 1, 12Y 2..., 12Y mthe direction of intersecting, be that orthogonal longitudinal direction (Y direction) extends in this embodiment.
1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nall be formed on the surperficial 11a of substrate 11.But, in the 1st embodiment, as hereinafter described, the 1st electrode conductor 12Y 1~ 12Y mcomprise and the 2nd electrode conductor 13X 1~ 13X ncross section be all formed on the surperficial 11a of substrate 11 interior, and the 2nd electrode conductor 13X 1~ 13X nwith the 1st electrode conductor 12Y 1~ 12Y mcross section be electrically connected by the 11b side, the back side of through hole at substrate 11.
Further, in the 1st embodiment, teat 14A and 15A is formed with in the end side of the Y direction of the substrate 11 of rectangular shape, for the formation of the line concentration portion 14 of the 2nd electrode conductor group 13 and the line concentration portion 15 of the 1st electrode conductor group 12.Teat 14A and 15A being formed with line concentration portion 14 and 15 plays the effect with the connecting connector of signal processing circuit 20.
The line concentration portion 14 of the 2nd electrode conductor group 13 is located at the surperficial 11a side of substrate 11, and the line concentration portion 15 of the 1st electrode conductor group 12 is located at the rear side of substrate 11.Further, the line concentration portion 15 of the 1st electrode conductor group 12 is by through hole and each the 1st electrode conductor 12Y 1~ 12Y melectrical connection.
As mentioned above, the position detecting device of the 1st embodiment forms the position detecting device with the electrostatic capacitance mode of sensor, in this sensor, the 1st electrode conductor group 12 and the 2nd electrode conductor group 13 are set to make the orthogonal mode of the bearing of trend of the bearing of trend of the 1st electrode conductor group 12 and the 2nd electrode conductor group 13.Further, this position detecting device is according to the 1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nthe change of electrostatic capacitance of intersection point, detect the position that stylus 40 indicates.
Stylus 40 has oscillatory circuit 41 in inside.This oscillatory circuit 41 is circuit of the signal of frequency for generation of such as 1.8MHz.Further, stylus 40 is externally sent in the signal that oscillatory circuit 41 produces from nib portion 42.Sensor 10 receives the signal sent from this stylus 40 in the 1st electrode conductor group 12 and the 2nd electrode conductor group 13.Further, the signal received in the 1st electrode conductor group 12 and the 2nd electrode conductor group 13 supplies signal processing circuit 20 respectively.
Signal processing circuit 20 is the circuit signal received by sensor 10 being carried out to prearranged signal process.This signal processing circuit 20 has selection circuit 21,22 and differential amplifier circuit 23,24 and control circuit 25.
The signal received by sensor 10 is by the selection circuit 21,22 of signal processing circuit 20 and differential amplifier circuit 23,24 input control circuit 25.Control circuit 25 controls each electrode conductor 12Y of the 1st electrode conductor group 12 1~ 12Y mand the 2nd each electrode conductor 13X of electrode conductor group 13 1~ 13X nthe level of Received signal strength, and detect that the level that stylus 40 is positioned at the signal of 1.8MHz is on the electrode conductor of high level.
Each the 1st electrode conductor 12Y 1~ 12Y mbe connected with selection circuit 22 by line concentration portion 15.Equally, each the 2nd electrode conductor 13X 1~ 13X nbe connected with selection circuit 21 by line concentration portion 14.Selection circuit 22 is connected with differential amplifier circuit 23,24 with selection circuit 21.
Selection circuit 21 is such as made up of microprocessor, and the selection accepted from control circuit 25 controls, from each the 2nd electrode conductor 13X 1~ 13X nmiddle selection and differential amplifier circuit 23+electrode conductor that is connected of side input terminal (non-inverting input terminal) and with differential amplifier circuit 23-electrode conductor that is connected of side input terminal (inversing input terminal).Further, selection circuit 22 accepts to control from the selection of control circuit 25, from each the 1st electrode conductor 12Y 1~ 12Y mmiddle selection and differential amplifier circuit 24+electrode conductor that is connected of side input terminal and with differential amplifier circuit 24-electrode conductor that is connected of side input terminal.
Differential amplifier circuit 23 and differential amplifier circuit 24, by carrying out input signal to+side input terminal and the calculus of differences of the input signal to-side input terminal, are eliminated and are mixed into the 1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nin noise, to control circuit 25 export with at the 1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nthe output signal that the intensity of the signal received is corresponding.In this case, the output signal of differential amplifier circuit 23 and differential amplifier circuit 24 is transformed to digital signal by ADC (Analog Digital Converter, analog-digital converter) and is supplied to control circuit 25, but eliminates diagram.
Control circuit 25 is according to the intensity of the output signal of differential amplifier circuit 23 and the 2nd electrode conductor 13X 1~ 13X nmiddle the 2nd electrode conductor selected by selection circuit 21, detects the position coordinates of the X-direction of the position indicated by stylus 40 on sensor 10.Further, according to intensity and the 1st electrode conductor 12Y of the output signal of differential amplifier circuit 24 1~ 12Y mmiddle the 1st electrode conductor selected by selection circuit 22, detects the position coordinates of the Y direction of the position indicated by stylus 40 on sensor 10.Like this, control circuit 25 detects the coordinate of the indicating positions of stylus 40.
In addition, also can be, by selection circuit 21 and selection circuit 22 by the electrode conductor of each many and differential amplifier circuit 23 and differential amplifier circuit 24+side input terminal and-side input terminal be connected, and carries out the detection of the position indicated by stylus 40 according to the electrode conductor entirety of general unit to sensor 10.In this case, after the approximate location detecting stylus 40, for the multiple 1st electrode conductor 12Y near the position that this detects 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X n, carry out the concrete detection of the indicating positions of stylus 40.In the detection of this concrete indicating positions, selection circuit 21 and selection circuit 22 by the control of control circuit 25, select respectively the electrode conductor of each as with differential amplifier circuit 23 and differential amplifier circuit 24+electrode conductor that is connected of side input terminal and-side input terminal.
[structure example of sensor 10]
Below, the structure of conductive pattern comprising the 1st electrode conductor group 12, the 2nd electrode conductor group 13, line concentration portion 14 and line concentration portion 15 formed at sensor 10 is described with reference to Fig. 2 ~ Fig. 4.Fig. 2 represents the concrete structure example of the conductive pattern of the surperficial 11a side of the substrate 11 of sensor 10.In addition, Fig. 3 represents the concrete structure example of the conductive pattern of the 11b side, the back side of the substrate 11 of sensor 10.In addition, Fig. 4 represents the partial enlarged drawing of the sensor 10 observed from the surperficial 11a side of substrate 11.
As shown in Figure 2, the surperficial 11a of substrate 11 is formed with diamond shape, is foursquare multiple conductive pattern 31 in this embodiment.This conductive pattern 31 to be formed as making in two articles of diagonal line one article cornerwise towards with the 1st electrode conductor 12Y 1~ 12Y mbearing of trend and X-direction towards parallel.Equally, another article of conductive pattern 31 cornerwise towards being formed as and the 2nd electrode conductor 13X 1~ 13X nbearing of trend and Y direction towards parallel.The conductive pattern 31 of such formation is formed as longitudinally, transverse direction and vergence direction are paved with on the surperficial 11a of substrate 11.Further, between adjacent conductive pattern 31, small gap g is formed with.This gap g is formed between along inclined direction adjacent conductive pattern 31, and its size d (with reference to Fig. 4) is set to the size can guaranteeing along inclined direction adjacent conductive pattern 31 insulation to each other.
In addition, as shown in Figure 2, multiple conductive patterns 31 along each row of X-direction arrangement are formed as in its diagonal line diagonal line is positioned on straight line along X-direction, and are formed as another diagonal line in its diagonal line is positioned on straight line along Y direction along the conductive pattern 31 of each row of Y direction arrangement.By forming multiple conductive pattern 31 like this, the row towards X-direction arrangement multiple conductive patterns 31 is point-blank arranged multirow along Y direction by the surperficial 11a of substrate 11.
In addition, as shown in Figure 2, in the multiple conductive patterns 31 along this X-direction arrangement each row point-blank, at the conductive pattern 31 formed relative to the right-hand member in X-direction extreme direction arrangement left multiple conductive patterns 31 point-blank each other, the 1st connecting portion 32Y shown in Fig. 4 is formed.1st connecting portion 32Y is used for conductive pattern 31 adjacent to be in the X-axis direction electrically connected to each other, and is extend to form to X-direction on the surperficial 11a of substrate 11.The 1st connecting portion 32Y is utilized to be electrically connected to each other by conductive pattern 31 adjacent in the X-axis direction, each the 1st electrode conductor 12Y shown in pie graph 1 1~ 12Y m.Below, by formation the 1st electrode conductor 12Y 1~ 12Y mconductive pattern 31 be called conductive pattern 31Y.In addition, conductive pattern 31Y and the 1st connecting portion 32Y is integrally formed as printed patterns.
Form the 1st electrode conductor 12Y 1~ 12Y mmultiple conductive pattern 31Y beyond multiple conductive patterns 31 (hereinafter referred to as conductive pattern 31X) as described below, the conductive pattern 31X be included on the straight line of Y direction is electrically connected to each other, and forms each the 2nd electrode conductor 13X 1~ 13X n.
As shown in Figure 3 and Figure 4, multiple through hole 33X is formed with at substrate 11.This through hole 33X is used for conductive pattern 31X adjacent to be in the Y-axis direction electrically connected to each other, and configures in the mode overlapping with conductive pattern 31X.Further, be provided with this through hole 33X at the conductive pattern 33X at two ends of the Y direction being configured in substrate 11, be provided with two this through hole 33X at conductive pattern 31X in addition.In addition, this through hole 33X is formed as becoming row along Y direction, and the row this being arranged in multiple through hole 33X of row arrange multiple row in the X-axis direction.In addition, the end of the surperficial 11a side of this through hole 33X and the conductive pattern 31X overlapping with this through hole 33X are electrically connected.
In addition, as shown in Figure 3 and Figure 4, multiple 2nd connecting portion 34X is provided with in the 11b side, the back side of substrate 11, for being electrically connected to each other by conductive pattern 31X adjacent in the Y-axis direction.2nd connecting portion 34X is formed as extending along Y direction, and is electrically connected to each other by two through hole 33X close to each other in the through hole 33X overlapped to form respectively with adjacent two conductive pattern 31X.Like this, utilize multiple through hole 33X and multiple 2nd connecting portion 34X, conductive pattern 31X adjacent is in the Y-axis direction electrically connected to each other, form each the 2nd electrode conductor 13X extended along Y direction 1~ 13X n(with reference to Fig. 2 and Fig. 3).
In addition, as shown in Figure 2, the surperficial 11a of substrate 11 is formed with many connection line 35X 1~ 35X n.These many connection line 35X 1~ 35X nbe formed as its one end and form the 2nd corresponding electrode conductor 13X 1~ 13X nconductive pattern 31X in the conductive pattern 31X that formed in the lower end of Y direction be electrically connected, the other end is directed to the line concentration portion 14 formed at the teat 14A of substrate 11.These many connection line 35X 1~ 35X nbe configured to equally with the past be formed in the distribution region 36 arranged in the lower end side of the Y direction of substrate 11, along substrate 11 peripheral ring around and be directed to line concentration portion 14.
On the other hand, about the 1st electrode conductor 12Y 1~ 12Y mconnection line 38Y 1~ 38Y mas described below, be by be parallel to each other in the 11b side, the back side of substrate 11, the region relative with the conductive pattern 31 (31Y, 31X) be paved with on the surperficial 11a of substrate 11 and closely to arrange and intensive formation.
That is, as shown in Figure 3 and Figure 4, through hole 37Y is formed with at substrate 11, this through hole 37Y and formation the 1st electrode conductor 12Y 1~ 12Y mmultiple conductive pattern 31Y in conductive pattern 31Y overlapping.This through hole 37Y is used for connection line 38Y 1~ 38Y mwith the 1st corresponding electrode conductor 12Y 1~ 12Y mconnect.In this through hole 37Y in the end of the surperficial 11a side of this substrate 11, with and the overlapping conductive pattern 31Y of this through hole 37X be electrically connected.Further, connection line 38Y 1~ 38Y mrespective one end with forming each corresponding the 1st electrode conductor 12Y 1~ 12Y mconductive pattern 31Y formed through hole 37Y be electrically connected.
At this, be provided with the 2nd electrode conductor 13X at the back side 11b of substrate 11 1~ 13X nthe 2nd connecting portion 34X, the through hole 37Y thus overlapped to form with conductive pattern 31Y adjacent in the Y-axis direction staggers a little along X-direction and is formed.Because connection line 38Y 1~ 38Y mnot overlapping with the 2nd connecting portion 34X, and its length shortens.
In addition, as shown in Figure 3, each bar connection line 38Y 1~ 38Y mone end by forming the 1st corresponding electrode conductor 12Y 1~ 12Y mconductive pattern 31Y formed through hole 37Y be electrically connected.At this, each bar connection line 38Y 1~ 38Y mbe formed as at least extending along Y direction straight line in the region relative with conductive pattern 31.Further, each bar connection line 38Y 1~ 38Y mthe other end be directed to the line concentration portion 15 of teat 15A arranged in the bottom of the Y direction of substrate 11.
Like this, by making bearing of trend and the connection line 38Y of the 2nd connecting portion 34X 1~ 38Y mbearing of trend parallel, connection line 38Y can be formed close to the 2nd connecting portion 34X 1~ 38Y m.Therefore, it is possible to shorten the distance respectively and between the non-inverting input terminal of differential amplifier circuit 24 and two electrode conductors of non-inverting input sub-connection, the raising of the noise immunity obtained by differential amplification can be realized.In addition, due to connection line 38Y can be shortened further 1~ 38Y mbetween distance, thus can by connection line 38Y 1~ 38Y mthe decline of closeness control in Min..In addition, about relative to the 2nd electrode conductor 13X 1~ 13X nconnection line 35X 1~ 35X n, the same with the past is be formed in distribution region 36 in the surperficial 11a side of substrate 11.
Therefore, according to this embodiment, compare the distribution region that can reduce connection line on the whole over, thus can reduce substrate, can prevent convenience and appearance design from declining.
Further, relative to the 2nd electrode conductor 13X 1~ 13X nconnection line 35X 1~ 35X nequally with the past be formed in distribution region, thus for from the 2nd electrode conductor 13X 1~ 13X nreceived signal strength, the testing result of the indicating positions of stylus can be obtained with the precision identical with the past.
, relative to the 1st electrode conductor 12Y 1~ 12Y mconnection line 38Y 1~ 38Y mbe formed as the 11b side, the back side at substrate 11, overlapping with formation the 1st electrode conductor group 12 of the surperficial 11a side of substrate 11 and the conductive pattern 31 (31X, 31Y) of the 2nd electrode conductor group 13, thus from stylus 40 to connection line 38Y 1~ 38Y mthe impact leapt to of transmission signal become problem.
But, connection line 38Y 1~ 38Y mby multiple conductive patterns 31 (31X, 31Y) of arranging at the surperficial 11a of substrate 11 by electrostatic screening, the transmission signal that can prevent or alleviate from stylus 40 is connected circuit 38Y 1~ 38Y mreceive.Further, connection line 38Y 1~ 38Y mconfigure close to each other, thus suppose at these connection lines 38Y 1~ 38Y min when being loaded with signal and noise, being loaded with these signals and noise equally to each other at adjacent connection line, thus by carrying out calculus of differences to the signal from multiple electrode conductor in the differential amplifier circuit of signal processing circuit, realizing at connection line 38Y 1~ 38Y mthe signal of middle superposition and the removed effect of noise.
In addition, relative to the 1st electrode conductor 12Y 1~ 12Y mconnection line 38Y 1~ 38Y mbe formed as extending along Y direction in the 11b side, the back side of substrate 11, this Y direction and the 1st electrode conductor 12Y 1~ 12Y mthe X-direction extended intersects (orthogonal), and thus the easy 11b side, the back side at substrate 11 walks abreast and closely forms connection line 38Y 1~ 38Y m.
In addition, for by connection line 38Y 1~ 38Y mthe direction extended is as the 2nd electrode conductor 13X of its bearing of trend 1~ 13X n, in the 11b side, the back side of substrate 11, conductive pattern 31X is connected each other by through hole at the 2nd connecting portion 34X of Y direction, thus connection line 38Y 1~ 38Y mparallel with the 2nd connecting portion 34X.Therefore, connection line 38Y is formed at leap the 2nd connecting portion 34X 1~ 38Y mwhen, also can shorten the distance between the connection line crossing over the 2nd connecting portion 34X, also having can by connection line 38Y 1~ 38Y mthe decline of closeness suppress for minimal effect.
[the 2nd embodiment]
2nd embodiment is the variation of the 1st embodiment.The difference of the sensor 10 in the sensor 10B in the 2nd embodiment and the 1st embodiment is, at formation the 2nd electrode conductor 13X that the surperficial 11a of the substrate 11 of the sensor 10B of the 2nd embodiment is formed 1~ 13X meach conductive pattern 31X be connected on the surperficial 11a of substrate 11, form the 1st electrode conductor 12Y 1~ 12Y meach conductive pattern 31Y be connected in the 11b side, the back side of substrate 11.
Fig. 5 is the figure of the structure example of the major part of the sensor 10B of the position detecting device that the 2nd embodiment is described, marks identical reference label to the part identical with the 1st embodiment.This Fig. 5 is the figure corresponding with Fig. 4 of aforesaid 1st embodiment, represents the enlarged drawing of the part of the sensor 10B observed from the surperficial 11a side of the substrate 11 of sensor 10B.Further, Fig. 6 represents the position of jut 14B and 15B in the line concentration portion arranged at the substrate 11 of the sensor 10B of the 2nd embodiment.
In the 2nd embodiment, in the multiple conductive patterns 31 along Y direction arrangement each row point-blank, observe relative to the surperficial 11a side from substrate 11 be configured in the upper end of Y direction conductive pattern 31, be arranged in multiple conductive patterns 31 on straight line each other towards the lower extreme direction of Y direction, be formed with the 3rd connecting portion 32X for being electrically connected to each other by adjacent conductive pattern 31.3rd connecting portion 32X extends to form to Y direction on the surperficial 11a of substrate 11.The 3rd connecting portion 32X is utilized to be electrically connected to each other by conductive pattern 31X adjacent in the Y-axis direction, each the 2nd electrode conductor 13X shown in pie graph 1 1~ 13X n(figure 5 illustrates 13X j, 13X j+1, 13X j+2).In addition, conductive pattern 31X and the 3rd connecting portion 32X is integrally formed as printed patterns.
Form the 2nd electrode conductor 13X 1~ 13X nmultiple conductive pattern 31X beyond multiple conductive pattern 31Y as described below, the conductive pattern 31Y be included on the straight line of X-direction is electrically connected to each other, and forms each the 1st electrode conductor 12Y 1~ 12Y m(figure 5 illustrates 12Y i, 12Y i+1, 12Y i+2).
That is, as shown in Figure 5, be formed with through hole 33Y at substrate 11, this through hole 33Y is formed as overlapping with multiple conductive pattern 31Y, for being electrically connected to each other by conductive pattern 31Y adjacent in the X-axis direction.Be provided with this through hole 33Y at the conductive pattern 31Y at two ends of the X-direction being configured in substrate 11, be provided with two this through hole 33Y at conductive pattern 31Y in addition, but do not illustrate.Further, this through hole 33Y is formed as becoming row along X-direction, and the row this being arranged in multiple through hole 33Y of row arrange multiple row in the Y-axis direction.The end of the surperficial 11a side of substrate 11 and the conductive pattern 31Y overlapping with this through hole 33Y are electrically connected by this through hole 33Y.
In addition, as shown in Figure 5, the 4th connecting portion 34Y for being electrically connected to each other by conductive pattern 31Y adjacent is in the X-axis direction formed at the back side of substrate 11.4th connecting portion 34Y is formed as extending along X-direction, and is electrically connected to each other by two through hole 33Y close to each other in the through hole 33Y formed overlappingly with adjacent two conductive pattern 31Y respectively.Utilize multiple through hole 33Y and multiple 4th connecting portion 34Y to be electrically connected to each other by conductive pattern 31Y adjacent in the X-axis direction, form each the 1st electrode conductor 12Y extended along X-direction 1~ 12Y m(with reference to the 12Y in Fig. 5 i, 12Y i+1, 12Y i+2).
In addition, as shown in Figure 6, observe from the face side of substrate 11, be formed with jut 14B and 15B of the line concentration portion the same with the 1st embodiment 14 ' and 15 ' in left end side.Do not illustrate in figure 6, the surface of substrate 11 is formed many connection lines, so that from formation the 1st electrode conductor 12Y 1~ 12Y mconductive pattern 31Y in left end conductive pattern 31Y, guide to the line concentration portion 14 ' formed at the teat 14B of substrate 11.These many connection lines are formed in the distribution region 36B of the left end side being located at X-direction on the surface of substrate 11 with the same in the past.
On the other hand, as shown in Figure 5, about the 2nd electrode conductor 13X 1~ 13X nconnection line 38X, be the same as with the 1st embodiment to be parallel to each other in the rear side, the region relative with the conductive pattern 31 (31Y, 31X) that is paved with on the surperficial 11a of substrate 11 of substrate 11 and closely to arrange and intensive formation.
That is, as shown in Figure 5, through hole 37X is formed with at substrate 11, this through hole 37X and formation the 2nd electrode conductor 13X 1~ 13X nmultiple conductive pattern 31X in conductive pattern 31X overlapping, for by many articles of connection line 38X respectively with the 2nd corresponding electrode conductor 13X 1~ 13X nconnect.This through hole 37X by the end of the face side of substrate 11, with and the overlapping conductive pattern 31X of this through hole 37X be electrically connected.2nd electrode conductor 13X 1~ 13X nmany articles of corresponding connection line 38X one end separately, with forming each corresponding the 2nd electrode conductor 13X 1~ 13X nconductive pattern 31X formed through hole 37X be electrically connected.
In addition, as shown in Figure 5, in the rear side of substrate 11, each bar connection line 38X is formed as extending along X-direction straight line.Further, the other end of connection line 38X is directed to the line concentration portion 15 ' of the teat 15B arranged in the left part of the X-direction of substrate 11 respectively.Be parallel to each other and the through hole 37X of close conductive pattern 31X being formed along the linearly extended part of X-direction of many connection line 38X.
At this, in the 2nd embodiment, be also provided with the 4th connecting portion 34Y at the back side of substrate 11, the through hole 37X thus overlapped to form with conductive pattern 31X adjacent in the X-axis direction staggers a little along Y direction and is formed.Because connection line 38X is not overlapping with the 4th connecting portion 34Y, and its length shortens.
In addition, one end of each article of connection line 38X is by through hole 37X and the 2nd corresponding electrode conductor 13X 1~ 13X nelectrical connection.At this, each bar connection line 38X is formed as at least extending along X-direction straight line in the region relative with conductive pattern 31.Further, the other end of each bar connection line 38X is directed to the line concentration portion 15 ' of the teat 15B arranged in the left part of the X-direction of substrate 11.
In this case, the 2nd electrode conductor 13X 1~ 13X nbearing of trend be Y direction, and many connection line 38X bearing of trend is separately X-direction.Therefore, can being parallel to each other along the linearly extended part of X-direction and closely configuring of connection line 38X.
Like this, in the 2nd embodiment, the bearing of trend of the 4th connecting portion 33Y and the bearing of trend of connection line 38X are formed as parastate, thus can form connection line 38X close to the 4th connecting portion 34Y.Therefore, it is possible to shorten the distance respectively and between the non-inverting input terminal of differential amplifier circuit 24 and two electrode conductors of non-inverting input sub-connection, the raising of the noise immunity obtained by differential amplification can be realized.In addition, due to the distance between connection line 38X can be shortened further, thus the decline of the closeness of connection line 38X can be controlled in Min..
Further, in the 2nd embodiment, as mentioned above, be only relevant 1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nthe connected mode of conductive pattern 31 (31Y, 31X) different from the 1st embodiment with the lead direction of connection line, thus can obtain and the above-mentioned identical action effect of the 1st embodiment.
[the 3rd embodiment]
In the above-mentioned the 1st and the 2nd embodiment, illustrate and form the 1st electrode conductor 12Y at the back side of substrate 11 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nthe situation of the connection line of middle any one party.But, also can be form the 1st electrode conductor 12Y at the back side of substrate 11 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nthe connection line of both sides, and with formation the 1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nconductive pattern 31 (31Y, 31X) relative.3rd embodiment is the example of this situation.
Fig. 7 is the figure of the overview of sensor 10D for illustration of the 3rd embodiment.
The sensor 10D of the 3rd embodiment is made up of the 1st substrate 11D and the 2nd substrate 11E as Suo Shi Fig. 7 (A), and is formed as the structure of the 1st substrate 11D and the 2nd substrate 11E laminating.
Be formed with perforation 37XD at the 1st substrate 11D and replace through hole 37X in the 2nd embodiment, break-through the 1st substrate 11D, 11E both sides when the 1st substrate 11D and the 2nd substrate 11E is fitted.Further, be formed with perforation 33YB at the 1st substrate 11D and replace through hole 33Y in the 2nd embodiment, for the back side 11Db at the 1st substrate 11D, conductive pattern 31Y adjacent is in the X-axis direction electrically connected to each other.In addition, this perforation 37XD and perforation 33YB is formed at the position being formed with through hole 37X and 33Y in the 2nd embodiment.
In addition, as shown in Fig. 7 (B), be provided with the multiple 2nd connecting portion 32X extended along Y direction at the surperficial 11Da of the 1st substrate 11D.Utilize the 2nd connecting portion 32X to be electrically connected to each other by conductive pattern 31X adjacent in the Y-axis direction, and form each the 2nd electrode conductor 13X 1~ 13X n(figure 7 illustrates 13X j, 13X j+1, 13X j+2).Further, the multiple 1st connecting portion 34Y extended along X-direction are formed at the back side 11Db of the 1st substrate 11D.1st connecting portion 34Y is formed between conductive pattern 31Y adjacent in the X-axis direction.Further, the perforation 33YB that the 1st connecting portion 34Y and each conductive pattern 31Y adjacent in the X-axis direction at two ends are formed is electrically connected.Like this, the conductive pattern 31Y of adjacent formation is in the X-axis direction electrically connected by perforation 33YB and the 1st connecting portion 34Y, and forms each the 1st electrode conductor 12Y 1~ 12Y m(with reference to the 12Y of Fig. 7 i, 12Y i+1, 12Y i+2).
Perforation 37XD and many articles of connection line 38XD and 38YD is formed at the 2nd substrate 11E.The surperficial 11Ea of the 2nd substrate 11E is pasted onto the 11Db side, the back side of the 1st substrate 11D as shown in Fig. 7 (A).The 1st connecting portion 34Y is provided with between the surperficial 11Ea and the back side 11Db of the 1st substrate 11D of the 2nd substrate 11E.
In addition, the 2nd electrode conductor 13X is formed 1~ 13X nconductive pattern 31X in, along X-direction arrangement the conductive pattern 31X of each, perforation 37XD by arranging between the surperficial 11Da and back side 11Db of the 1st substrate 11D as Suo Shi Fig. 7 (B), is connected with many connection line 38XD one end separately.Many connection line 38XD are formed as extending along X-direction as shown in Figure 7, and be parallel to each other, close to and formed thick and fast.These many articles of connection line 38XD are located between the back side 11Db of the 1st substrate 11D and the surperficial 11Ea of the 2nd substrate 11E.
In addition, the 1st electrode conductor 12Y is formed 1~ 12Y mconductive pattern 31Y in, along X-direction arrangement the conductive pattern 31Y of each, as Suo Shi Fig. 7 (B) by break-through the 1st substrate 11D and the 2nd substrate 11E setting perforation 37YD, be connected with many connection line 38YD one end separately.
In this case, many connection line 38YD are formed as extending along X-direction as shown in Figure 7, and be parallel to each other, close to and formed thick and fast.Many articles connection line 38YD is located on the back side 11Eb of the 2nd substrate 11E, thus there is not other conductor line avoided, can improve closeness.
[variation of the shape of conductive pattern 31]
The routine > of < the 1st
In the above-described embodiment, illustrate conductive pattern 31 (31X, 31Y) and be formed as diamond shape, be especially formed as the situation of square shape, but conductive pattern 31 (31X, 31Y) as long as shape the 1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nthe same and can the shape of the surperficial 11a entirety of covered substrate 11 as much as possible to the detection sensitivity of indication body, then can be any shape.
Fig. 8 is the figure of the 1st example of other shape representing conductive pattern 31.1st example only has the shape of sensor different from the sensor 10 of the 1st above-mentioned embodiment.Namely, as shown in Fig. 8 (A), the conductive pattern 311 of the 1st example is that the distortion of the conductive pattern 31 of the square shape in above-mentioned embodiment is become the shape with 4 juts 311a, 311b, 311c, 311d, other structure is identical with the 1st embodiment, and thus description is omitted.
The 1st electrode conductor 12Y in 1st example 1~ 12Y m(in Fig. 8 (B), 12Y is shown i, 12Y i+1, 12Y i+2) and the 2nd electrode conductor 13X 1~ 13X n(in Fig. 8 (B), 13X is shown j, 13X j+1, 13X j+2) be made up of multiple conductive pattern 311X (with reference to Fig. 8 (C)) and conductive pattern 311Y (with reference to Fig. 8 (D)) respectively.Further, be configured to as shown in Fig. 8 (B), form each the 1st electrode conductor 12Y along X-direction arrangement 1~ 12Y mconductive pattern 311Y and form along X-direction arrangement each the 2nd electrode conductor 13X 1~ 13X nconductive pattern 311X, combine in the conductive pattern region using jut 311a, 311b, 311c, 311d each other to make a part enter into each other.
Conductive pattern 311 (311Y, 311X) according to the 1st example, as shown in Fig. 8 (B), adjacent conductive pattern 311 (311Y, a 311X) part each other enters in conductive pattern region each other and combines, thus receiving in the electrode conductor from the signal of stylus, second becomes large signal level and increases, can improve the detection sensitivity of stylus.Therefore, it is possible to make the 1st electrode conductor 12Y shown in Fig. 8 (B) 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nformation spacing Py and Px be greater than spacing in the past, can reduce for switching the 1st electrode conductor 12Y 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nthe quantity of multiplex adapter.
The routine > of < the 2nd
Fig. 9 is the 2nd example of the variation of conductive pattern 31.2nd example the conductive pattern of the 1st example is continued the example of the conductive pattern after distortion, marks identical label to the part identical with the 1st example.The conductive pattern 312 of the 2nd example, as shown in Fig. 9 (A), is formed with the square portion 312e not being electrically connected (float state) at the middle body with jut 311a, 311b, 311c, 311d.Conductive pattern 311 shown in other structure with the 1st example is identical.
The 1st electrode conductor 12Y in 2nd example 1~ 12Y m(in Fig. 9 (B), 12Y is shown i, 12Y i+1, 12Y i+2) and the 2nd electrode conductor 13X 1~ 13X n(in Fig. 9 (B), 13X is shown j, 13X j+1, 13X j+2) be made up of multiple conductive pattern 312X (with reference to Fig. 9 (C)) and conductive pattern 312Y (with reference to Fig. 9 (D)) respectively.Further, with the 1st electrode conductor 12Y of the 1st example 1~ 12Y mwith the 2nd electrode conductor 13X 1~ 13X nequally be configured to, form each the 1st electrode conductor 12Y along X-direction arrangement 1~ 12Y mconductive pattern 312Y and form along Y direction arrangement each the 2nd electrode conductor 13X 1~ 13X nconductive pattern 312X, combine in the conductive pattern region using jut 311a, 311b, 311c, 311d each other to make a part enter into each other.
According to the 2nd example, the square portion 312e being formed as electric float state is helpless to the reception of the transmission signal of stylus, thus receiving in the electrode conductor from the signal of stylus 40 (with reference to Fig. 1), second becomes large signal level and increases further, can improve detection sensitivity further.
The routine > of < the 3rd
Figure 10 is the 3rd example of the variation of conductive pattern 31.3rd example the conductive pattern of the 2nd example is continued the example of the conductive pattern after distortion, marks identical label to the part identical with the 2nd example.The conductive pattern 313 of the 3rd example, as shown in Figure 10 (A), is formed with the region 313f not arranging conductive pattern in the part that the square portion 312e of the conductive pattern 312 with the 2nd example is corresponding.Further, the square portion 313g outstanding, corresponding with region 313f to adjacent conductive pattern 313 side is formed with at the jut 313a of conductive pattern 313.Further, this square portion 313g is formed as in the region 313f being formed at adjacent conductive pattern 313, the conductive pattern 313 adjacent with this be electric float states.Other structure is identical with the 2nd example.
According to the 3rd example, square portion 313g is formed as entering in adjacent conductive pattern 313, thus with the same detection sensitivity that can improve stylus of conductive pattern 311,312 of the 1st and the 2nd example.
[other embodiment or variation]
Above embodiment example describes the situation of the sensor be applicable to as under type, and this sensor is according to the 1st electrode conductor extended along X-direction and the position detecting stylus 40 instruction along the change of the electrostatic capacitance of the intersection point of the electrode conductor of Y direction extension.But the present invention also can be applicable to the sensor only a kind of direction arranging electrode conductor in X-direction or Y direction.
In addition, the conductive pattern forming the 1st electrode conductor and the 2nd electrode conductor utilizes the transparency electrode conductors such as ITO to form, and the sensor of position detecting device of the present invention can overlap in the display device such as liquid crystal display thus.In addition, if the conductive pattern forming the 1st electrode conductor and the 2nd electrode conductor is not superimposed upon in the display device such as liquid crystal display, then do not need to utilize transparent conductor to form.
Label declaration
10 sensors; 11 substrates; The surface of 11a substrate 11; The back side of 11b substrate 11; 12 the 1st electrode conductor groups; 13 the 2nd electrode conductor groups; 12Y 1~ 12Y m1st electrode conductor; 13X 1~ 13X n2nd electrode conductor; 14,15 line concentration portions; 18,19 differential amplifier circuits; 21 stylus; 31,31X, 31Y conductive pattern; 32Y, 32X the 1st connecting portion; 34X, 34Y the 2nd connecting portion; 33X, 33Y through hole; 37Y, 37X through hole; 38X, 38Y connection line.

Claims (14)

1. a position detecting device for electrostatic capacitance mode, according to the input sent from indication body, the indicating positions of indication body, is characterized in that, described position detecting device has:
Substrate, have the 1st and with described 1st relative 2nd;
Multiple electrode conductor, described 1st of described substrate is disposed adjacent to each other, for receiving the described signal sent from described indication body;
Signal processing circuit, comprise differential amplifier circuit, the indicating positions of described signal processing circuit indication body according to the output detections of described differential amplifier circuit, the difference of the signal that described differential amplifier circuit computing is received by least two electrode conductors selected from described multiple electrode conductor, and export; And
Many connection lines, configuration closer to each other in described 2nd of described substrate, and one end of these many articles of connection lines is electrically connected with each electrode conductor in the described multiple electrode conductor arranged on described 1st by through hole or perforation,
The direction non-orthogonal with described connection line extends to form connecting portion, and this connecting portion is used for described electrode conductor arbitrary in described multiple electrode conductor to be electrically connected by being formed at the through hole of described substrate.
2. position detecting device according to claim 1, is characterized in that,
Described multiple electrode conductor extends to form along the 1st direction respectively, and described multiple electrode conductor arranges close to each other in the 2nd direction crossing with described 1st direction, and described many articles of connection lines extend to form along described 2nd direction.
3. position detecting device according to claim 2, is characterized in that,
Two panels had described multiple electrode conductor across insulation course, the described substrate in described connection line and line concentration portion is formed as overlapping in the mode that described 1st direction extended at described multiple electrode conductor intersects each other, and is connected with respective signal processing circuit respectively in the described line concentration portion of described two plate bases.
4. position detecting device according to claim 3, is characterized in that,
The configuration close to each other of described multiple electrode conductor, and not overlapping during described two panels substrates while stacking with on the 1st orthogonal direction of described substrate.
5. a position detecting device for electrostatic capacitance mode, according to the input sent from indication body, the indicating positions of indication body, is characterized in that, described position detecting device has:
Substrate, have the 1st and with described 1st relative 2nd;
1st electrode conductor, described 1st of described substrate extends along the 1st direction and is formed, and being configured with multiple on the 2nd direction crossing with described 1st direction;
2nd electrode conductor, described 1st of described substrate extends along described 2nd direction and is formed, and not with on described 1st direction, be configured with multiple described 1st electrode conductors be electrically connected; And
Signal processing circuit, arrange respectively for multiple described 1st electrode conductor and multiple described 2nd electrode conductor, this signal processing circuit comprises differential amplifier circuit, the indicating positions of indication body according to the output detections of described differential amplifier circuit, the difference of at least two electrode conductors that described differential amplifier circuit computing is selected from multiple described 1st electrode conductor or multiple described 2nd electrode conductor
On described 1st of described substrate, be formed with multiple conductive patterns of reservation shape in described 1st direction and described 2nd upper berth, direction set solid row with state adjacent one another are, and described conductive pattern adjacent in the multiple described conductive pattern arranged on described 1st direction is electrically connected to each other by the 1st connecting portion, thus form described 1st electrode conductor, described conductive pattern adjacent in the multiple described conductive pattern that described 2nd direction arranges is electrically connected to each other by the 2nd connecting portion, thus form described 2nd electrode conductor
Described 2nd of described substrate is formed with the many articles of connection lines configured close to each other, one end of this many articles of connection lines is connected with each electrode conductor of described 1st electrode conductor arranged on described 1st or described 2nd electrode conductor at least one party by through hole or perforation, and the other end of these many connection lines is connected with the line concentration portion of the link of described signal processing circuit with becoming.
6. position detecting device according to claim 5, is characterized in that,
Described 1st connecting portion is formed as the pattern be connected with described conductive pattern in described 1st of described substrate, forms described 1st electrode conductor thus,
Described 2nd connecting portion is connected by the described conductive pattern of through hole with described 1st in described 2nd of described substrate, forms described 2nd electrode conductor thus,
Described many articles of connection lines one end is separately connected with each electrode conductor in described multiple 1st electrode conductor by described through hole, and described many articles of connection lines extend along described 2nd direction and formed.
7. position detecting device according to claim 6, is characterized in that,
Described 2nd connecting portion is formed along described 2nd direction, and parallel with described many connection lines, makes to be connected between two described conductive patterns being disposed adjacent on described 2nd direction,
Described connection line is crossed over described 2nd connecting portion and arranges.
8. position detecting device according to claim 6, is characterized in that,
In described 1st of described substrate, the line concentration portion of multiple described 2nd electrode conductor is set highlightedly in described 2nd direction.
9. position detecting device according to claim 5, is characterized in that,
Described 1st connecting portion is formed as the pattern be connected with described conductive pattern in described 1st of described substrate, forms described 1st electrode conductor thus,
Described 2nd connecting portion is connected by the described conductive pattern of through hole with described 1st in described 2nd of described substrate, forms described 2nd electrode conductor thus,
One end of described connection line is also used as described through hole and is connected with described 2nd electrode conductor, and described many articles of connection lines extend along described 1st direction and formed.
10. position detecting device according to claim 9, is characterized in that,
In described 1st of described substrate, the line concentration portion of multiple described 1st electrode conductor is set in described 1st direction.
11. position detecting devices according to claim 5, is characterized in that,
Described conductive pattern is formed as diamond shape.
12. position detecting devices according to claim 5, is characterized in that,
Carry out combining the shape obtained in the conductive pattern region that described conductive pattern is formed as making an adjacent conductive pattern part each other to enter into each other.
13. 1 kinds of position-detection sensors, use in the position detecting device of electrostatic capacitance mode, by being received the signal sent from indication body by multiple electrode conductor, by the signal processing circuit comprising differential amplifier circuit, the signal from described multiple electrode conductor is processed, detect the indicating positions of described indication body thus, it is characterized in that, described position-detection sensor has:
Substrate, have the 1st and with described 1st relative 2nd;
Described multiple electrode conductor, described 1st of described substrate is disposed adjacent to each other, for receiving the described signal sent from described indication body;
Many connection lines, configuration closer to each other in described 2nd of described substrate, and one end of described many articles of connection lines is electrically connected with each electrode conductor in the described multiple electrode conductor arranged on described 1st by through hole or perforation; And
Line concentration portion, is connected with the other end of described many connection lines, and becomes the link with described signal processing circuit.
14. 1 kinds of position-detection sensors, use in the position detecting device of electrostatic capacitance mode, by being received the signal sent from indication body by multiple electrode conductor, by in the signal processing circuit comprising differential amplifier circuit, the signal from described multiple electrode conductor is processed, detect the indicating positions of described indication body thus, it is characterized in that, described position-detection sensor has:
Substrate, have the 1st and with described 1st relative 2nd;
1st electrode conductor, described 1st of described substrate extends along the 1st direction and is formed, and being configured with multiple on the 2nd direction crossing with described 1st direction; And
2nd electrode conductor, described 1st of described substrate extends along described 2nd direction and is formed, and not with on described 1st direction, be configured with multiple described 1st electrode conductors be electrically connected,
On described 1st of described substrate, be formed with multiple conductive patterns of reservation shape in described 1st direction and described 2nd upper berth, direction set solid row with state adjacent one another are, and described conductive pattern adjacent in the multiple described conductive pattern arranged on described 1st direction is electrically connected to each other by the 1st connecting portion, thus form described 1st electrode conductor, described conductive pattern adjacent in the multiple described conductive pattern that described 2nd direction arranges is electrically connected to each other by the 2nd connecting portion, thus form described 2nd electrode conductor
Described 2nd of described substrate is formed with the many articles of connection lines configured close to each other, one end of this many articles of connection lines is connected with each electrode conductor of described 1st electrode conductor arranged on described 1st or described 2nd electrode conductor at least one party by through hole or perforation, and the other end of these many connection lines is connected with the line concentration portion of the link of described signal processing circuit with becoming.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106445230A (en) * 2016-09-12 2017-02-22 京东方科技集团股份有限公司 Touch panel and manufacturing method thereof and display device
CN109992167A (en) * 2018-01-02 2019-07-09 蓝思科技（长沙）有限公司 A kind of two-sided conductive structure, touch panel and preparation method thereof
CN110780352A (en) * 2018-07-27 2020-02-11 日立金属株式会社 Pinch sensor and detection device
CN112925452A (en) * 2019-12-06 2021-06-08 矽统科技股份有限公司 Touch electrode structure and capacitive touch system

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5813836B1 (en) * 2014-08-22 2015-11-17 日本航空電子工業株式会社 Capacitive touch panel
JP6406697B2 (en) * 2014-09-17 2018-10-17 株式会社ワコム Position detection apparatus and position detection method
WO2016204525A1 (en) * 2015-06-19 2016-12-22 엘지전자(주) Touch panel and display device
WO2019069696A1 (en) * 2017-10-03 2019-04-11 株式会社ワコム Sensor panel for detecting pen signal transmitted by pen
US10579193B2 (en) * 2017-12-14 2020-03-03 Cypress Semiconductor Corporation Spatial-frequency-based capacitive motion sensor and method of using the same
JP7077511B2 (en) * 2018-05-23 2022-05-31 株式会社ユーシン Input device and manufacturing method of the input device
US10754487B2 (en) * 2018-07-02 2020-08-25 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Touch sensor with reduced edge breakage
JP7346160B2 (en) * 2019-08-23 2023-09-19 株式会社ワコム Stylus and integrated circuits
TWI720722B (en) * 2019-12-06 2021-03-01 矽統科技股份有限公司 Touch electrode structure and capactive touch system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101840292A (en) * 2009-03-20 2010-09-22 宸鸿科技(厦门)有限公司 Capacitance type touch control circuit pattern and manufacturing method thereof
US20110298747A1 (en) * 2010-06-04 2011-12-08 Samsung Electro-Mechanics Co., Ltd. Capacitive touch panel
CN103034363A (en) * 2011-10-05 2013-04-10 三星电子株式会社 Touch panel and mobile device with the same
CN103309539A (en) * 2013-06-20 2013-09-18 深圳南玻伟光导电膜有限公司 Capacitive touch screen provided with in OGS structure and fabrication method of capacitive touch screen
CN203324959U (en) * 2013-06-20 2013-12-04 深圳南玻伟光导电膜有限公司 Capacitive touch screen adopting OGS structure
CN103677336A (en) * 2012-09-20 2014-03-26 株式会社和冠 Position detecting device

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS506153A (en) 1973-05-19 1975-01-22
JPH056153A (en) 1991-06-27 1993-01-14 Alps Electric Co Ltd Liquid crystal display device with touch panel
JP3264071B2 (en) * 1993-12-28 2002-03-11 ぺんてる株式会社 Apparatus and method for detecting noise-resistant capacitively coupled coordinates
JPH0895701A (en) 1994-08-24 1996-04-12 Pentel Kk Combination touch panel and transparent digitizer
JPH08179871A (en) 1994-12-20 1996-07-12 Pentel Kk Combination touch panel and transparent digitizer
JP3417225B2 (en) 1996-05-17 2003-06-16 ソニー株式会社 Solid-state imaging device and camera using it
JP3434415B2 (en) 1996-07-05 2003-08-11 アルプス電気株式会社 Coordinate input device
JP2002043807A (en) 2000-07-31 2002-02-08 Sharp Corp Waveguide-type dielectric filter
JP2005276957A (en) 2004-03-23 2005-10-06 Fujitsu Ltd Printed circuit board
US8144125B2 (en) * 2006-03-30 2012-03-27 Cypress Semiconductor Corporation Apparatus and method for reducing average scan rate to detect a conductive object on a sensing device
JP5324440B2 (en) * 2006-07-12 2013-10-23 エヌ−トリグ リミテッド Hovering and touch detection for digitizers
JP5094376B2 (en) * 2007-12-28 2012-12-12 株式会社ワコム Position detection device
JP5154316B2 (en) * 2008-06-30 2013-02-27 株式会社ジャパンディスプレイイースト Touch panel
US8711121B2 (en) 2008-12-12 2014-04-29 Wacom Co., Ltd. Architecture and method for multi-aspect touchscreen scanning
US8481872B2 (en) 2008-12-22 2013-07-09 N-Trig Ltd. Digitizer, stylus and method of synchronization therewith
TW201025108A (en) 2008-12-31 2010-07-01 Acrosense Technology Co Ltd Capacitive touch panel
JP2010198586A (en) * 2009-01-27 2010-09-09 Rohm Co Ltd Input device
US20100214247A1 (en) 2009-02-20 2010-08-26 Acrosense Technology Co., Ltd. Capacitive Touch Panel
JP5486854B2 (en) 2009-06-29 2014-05-07 株式会社ジャパンディスプレイ Information input device, display device
JP5677028B2 (en) * 2009-10-23 2015-02-25 京セラ株式会社 Display device
KR101055510B1 (en) 2010-03-26 2011-08-08 삼성전기주식회사 Touch panel
JP2012053812A (en) * 2010-09-03 2012-03-15 Citizen Electronics Co Ltd Touch panel
US9823785B2 (en) * 2010-09-09 2017-11-21 3M Innovative Properties Company Touch sensitive device with stylus support
US9158369B2 (en) * 2010-10-12 2015-10-13 Tactonic Technologies, Llc Sensors having a connecting frame and method for composite sensors
JP4683505B1 (en) * 2010-12-14 2011-05-18 株式会社ワコム Position indicator
KR101768052B1 (en) 2010-12-29 2017-08-16 삼성디스플레이 주식회사 Touch Screen Panel and Drinving Method thereof
TWM422117U (en) 2010-12-30 2012-02-01 Egalax Empia Technology Inc Capacitive touch screen
KR101793677B1 (en) 2011-01-18 2017-11-06 삼성디스플레이 주식회사 Touch Screen Panel
JP5512566B2 (en) 2011-01-31 2014-06-04 株式会社東芝 Semiconductor device
US9141244B2 (en) 2011-04-13 2015-09-22 Sharp Kabushiki Kaisha Touch panel and display device provided with same
TWI499957B (en) * 2011-06-22 2015-09-11 Sharp Kk Touch panel system and electronic device
US9024891B2 (en) * 2011-11-03 2015-05-05 Synaptics Incorporated Single substrate touch sensor
US8994673B2 (en) 2011-12-09 2015-03-31 Lg Display Co., Ltd. Display device with integrated touch screen having electrical connections provided in inactive regions of display panel
CN103197784B (en) * 2012-01-06 2016-05-25 宸鸿科技(厦门)有限公司 Contact panel and preparation method thereof
JP2013167953A (en) 2012-02-14 2013-08-29 Japan Display Central Co Ltd Touch panel and display device
US9348470B2 (en) * 2012-03-30 2016-05-24 Sharp Kabushiki Kaisha Projected capacitance touch panel with reference and guard electrode
TWI488096B (en) * 2012-06-05 2015-06-11 Acer Inc Driving method for touch panel and touch-sensing device thereof
TWI463374B (en) * 2012-06-07 2014-12-01 Mstar Semiconductor Inc Touch panel
KR101967670B1 (en) * 2012-06-15 2019-04-11 삼성전자주식회사 Wireless communication method between terminals

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101840292A (en) * 2009-03-20 2010-09-22 宸鸿科技(厦门)有限公司 Capacitance type touch control circuit pattern and manufacturing method thereof
US20110298747A1 (en) * 2010-06-04 2011-12-08 Samsung Electro-Mechanics Co., Ltd. Capacitive touch panel
CN103034363A (en) * 2011-10-05 2013-04-10 三星电子株式会社 Touch panel and mobile device with the same
CN103677336A (en) * 2012-09-20 2014-03-26 株式会社和冠 Position detecting device
CN103309539A (en) * 2013-06-20 2013-09-18 深圳南玻伟光导电膜有限公司 Capacitive touch screen provided with in OGS structure and fabrication method of capacitive touch screen
CN203324959U (en) * 2013-06-20 2013-12-04 深圳南玻伟光导电膜有限公司 Capacitive touch screen adopting OGS structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106445230A (en) * 2016-09-12 2017-02-22 京东方科技集团股份有限公司 Touch panel and manufacturing method thereof and display device
US10539819B2 (en) 2016-09-12 2020-01-21 Boe Technology Group Co., Ltd. Touch panel and manufacturing method therefor, display apparatus
CN109992167A (en) * 2018-01-02 2019-07-09 蓝思科技（长沙）有限公司 A kind of two-sided conductive structure, touch panel and preparation method thereof
CN110780352A (en) * 2018-07-27 2020-02-11 日立金属株式会社 Pinch sensor and detection device
CN110780352B (en) * 2018-07-27 2022-01-14 日立金属株式会社 Pinch sensor and detection device
CN112925452A (en) * 2019-12-06 2021-06-08 矽统科技股份有限公司 Touch electrode structure and capacitive touch system

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