CN105017542B - The preparation method of the organosilicon thermally conductive sheet of enhancing - Google Patents
The preparation method of the organosilicon thermally conductive sheet of enhancing Download PDFInfo
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Abstract
The present invention discloses a kind of preparation method of the organosilicon thermally conductive sheet of enhancing, adhesion promoters are coated on glass cloth, obtain substrate layer, the adhesion promoters include hydrogeneous organopolysiloxane, the component of silicone rubber compound including the organopolysiloxane containing vinyl, crosslinking agent, heat filling and platinum catalyst is mixed, roll compound, the organosilicon thermally conductive sheet strengthened after curing with substrate layer again.The preparation method of the present invention effectively improves the inter-layer bonding force of silicone rubber compound and glass cloth, improves the durability and reliability of sheet material by being pre-processed to glass cloth reinforcing material.
Description
Technical field
The invention belongs to organosilicon material technical field, it is related to a kind of preparation method of the organosilicon thermally conductive sheet of enhancing.
Technical background
Organosilicon material is excellent with high-low temperature resistant, electric insulation, resistance to oxidation stability, weatherability, fire retardant, corrosion-resistant etc.
Characteristic, is used widely in chemical field, and especially in heat conduction technical field, the heat-conducting interface material containing organosilicon is main
The Heat Conduction Material kind wanted.Organosilicon heat-conducting interface material be mainly used in electrical equipment heating position and heat dissipation position it
Between, play heat transfer, sealing and insulation function, product form includes silicone grease and silica gel piece, wherein silica gel piece generally comprise containing
The layer of silica gel and substrate layer of Heat Conduction Material, make silica gel piece have the performances such as anti-puncture, tear-proof, insulation, improve by substrate layer
Insulating properties, is also convenient for using and repairs.At present, usually by substrate layer in silica gel piece and other organosilicon heat-conducting composite sheets
Coated with coupling agent or bonding agent, to improve the bonding strength between layer of silica gel and enhancing base materials, prevent layer of silica gel from being sent out with substrate layer
It is estranged from improving silica gel piece reliability in the application and durability, but this mode carries different materials interlayer bonding force
It is high limited.
The content of the invention
In view of the above shortcomings of the prior art, the present invention provides a kind of preparation method of the organosilicon thermally conductive sheet of enhancing, this
The method of invention by the base material after specially treated and the compound organosilicon thermally conductive sheet that enhancing is prepared of layer of silica gel, make base material with
Silica gel inter-layer bonding force improves, and then improves sheet material reliability in practical applications and durability.
The purpose of the present invention is achieved through the following technical solutions：
The present invention provides a kind of preparation method of the organosilicon thermally conductive sheet of enhancing, comprises the following steps：
A, adhesion promoters are coated on glass cloth, obtain substrate layer, the adhesion promoters include hydrogeneous organic poly-
Siloxanes；
B, the rubber composition of the organopolysiloxane containing vinyl, crosslinking agent, heat filling and platinum catalyst will be included
The component mixing of thing, obtains mixture, and mixture and substrate layer are rolled compound, the organosilicon heat conduction strengthened after curing
Piece.
In the step B, by mixture and substrate layer calendering it is compound after, lamelliform silicone rubber compound is applied to base material
The single or double of layer, and adhesion promoters are distributed in the single or double of glass cloth simultaneously glass fibre can be carried out in substrate layer
Parcel, makes lamelliform silicone rubber compound be contacted with adhesion promoters.
In step A, coating method adhesion promoters being coated on glass cloth includes but not limited to dip-coating, brushing, spray
Apply etc., by being coated with the coating for making adhesion promoters form homogeneous thinner thickness on one or two surface of glass cloth.
In order to enable adhesion promoters to form the coating of homogeneous thinner thickness on glass cloth, when the viscosity of adhesion promoters is higher
When, preferably first dissolved with solvent, obtain treatment fluid, then treatment fluid is coated on glass cloth, it is dry to remove solvent, you can
Obtain homogeneous and thinner thickness coating.The solvent include but not limited to octyl group silicone oil, low molecular weight methyl-silicone oil, toluene,
Isopropanol, carbon tetrachloride, ethyl acetate etc..
It is described that roll compound by mixture and substrate layer can be the one or both sides in substrate layer at the same time with mixing
Thing calendering is compound.The calendering is compound using modes such as molding, roll-in, curtain coatings.
The curing is not particularly limited.Preferably, the cured condition is 65~95 DEG C of solidification temperature, hardening time
5~15min.
The hydrogeneous organopolysiloxane is the organopolysiloxane containing two or more hydrogen-baseds being connected with silicon, with
The position of the hydrogen-based of silicon connection can be on side chain, molecular end or at the same time in the molecular end and side chain, preferably with silicon
The position of the hydrogen-based of connection is in molecular end or at the same time in molecular end and side chain, and be connected containing at least three with silicon
Hydrogen-based.Preferably, the hydrogen content of the hydrogeneous organopolysiloxane is 0.3-1% (quality), is 10- in 25 DEG C of viscositys
1000mPa·s.The hydrogeneous organopolysiloxane is more preferably 10~500mPas in 25 DEG C of viscosity, most preferably 10~
300mPa·s。
Preferably, hydrogeneous organopolysiloxane is selected from the polymethyl hydrogen siloxane of trimethylsiloxy group end-blocking, trimethyl silicane
The methyl hydrogen siloxane of epoxide end-blocking and the copolymer of dimethyl siloxane, the methyl hydrogen siloxane of dimethyl hydrogen siloxy end-blocking
The copolymerization of the methyl hydrogen siloxane and dimethyl siloxane of copolymer, dimethyl hydrogen siloxy end-blocking with methyl phenyl siloxane
Thing, the dimethyl silicone polymer of dimethyl hydrogen siloxy end-blocking, the methyl hydrogen siloxane and methylbenzene of trimethylsiloxy group end-blocking
The copolymer of radical siloxane, the methyl hydrogen siloxane of trimethylsiloxy group end-blocking and methyl (3,3,3- trifluoro propyl) siloxanes
One or more in copolymer, cyclic methyl hydrogen polysiloxane or four (two methyl hydrogen silicone alkoxy) silane.
Preferably, the adhesion promoters also organopolysiloxane containing hydroxyl or organic poly- silica containing vinyl
Alkane.
Specifically, the organopolysiloxane of the hydroxyl is containing the organic of two or more hydroxyls being connected with silicon
Polysiloxanes, the position of hydroxyl can be the preferred hydroxyls on side chain, molecular end or at the same time in molecular end and side chain
Position for molecule both ends or at the same time on the molecule both ends and side chain.Preferably, the organopolysiloxane of the hydroxyl
Hydroxy radical content is 0.6-8% (quality), is 10-1000mPas in 25 DEG C of viscositys.
Preferably, the organopolysiloxane of hydroxyl be selected from dimethyl hydroxyl siloxy end-blocking dimethyl silicone polymer,
The methyl phenyl siloxane of dimethyl hydroxyl siloxy end-blocking and the copolymer of dimethyl siloxane, trimethylsiloxy group block
One or more in the copolymer of methylhydroxy siloxanes and methyl phenyl siloxane.
Preferably, the adhesion promoters contain the organopolysiloxane of hydroxyl, organic poly- silica of the hydroxyl
The ratio between mole of hydrogen-based is 0.3-0.7 in the mole of hydroxyl and hydrogeneous organopolysiloxane in alkane.
Preferably, the adhesion promoters contain the organopolysiloxane containing vinyl, this contains organic poly- silicon of vinyl
Oxygen alkane is the organopolysiloxane containing two or more vinyl being connected with silicon, and the position of vinyl can be in side chain
Upper, molecular end or at the same time in molecular end and side chain, the position of preferred vinyl is is located on side chain or at the same time molecule
On both ends and side chain.Preferably, the contents of ethylene of the organopolysiloxane containing vinyl is 0.3-5% (quality), more
Preferably 0.5-2% (quality).The organopolysiloxane containing vinyl is preferably 50-1000mPa in 25 DEG C of viscosity
s。
It is highly preferred that the organopolysiloxane containing vinyl is selected from the poly- methyl ethylene silica of trimethylsiloxy group end-blocking
Copolymer, the dimethyl ethenyl silica of alkane, the dimethyl siloxane of trimethylsiloxy group end-blocking and methyl vinyl silicone
Dimethyl silicone polymer, the methyl phenyl siloxane and methyl ethylene silica of dimethylvinyl siloxy end-blocking of base end-blocking
One kind in the copolymer of the copolymer of alkane, the methyl vinyl silicone of trimethylsiloxy group end-blocking and methyl phenyl siloxane
It is or several.
Preferably, the adhesion promoters contain the organopolysiloxane containing vinyl, in the adhesion promoters, containing second
The ratio between mole of hydrogen-based is 0.3- in the mole of the organopolysiloxane medium vinyl of alkenyl and hydrogeneous organopolysiloxane
0.7。
The glass cloth is preferably alkali-free glass cloth, and design parameter is not particularly limited, and it is 0.03- to be typically chosen thickness
The glass cloth that 0.15mm, plain weave weaving form, may be selected 2113 cloth, 2116 cloth of Guangzhou Ka Ben composite materials Co., Ltd
Or 1080 cloth, or the production of Sichuan glass fibre Co., Ltd the trade mark be EW25C, EW30, EW40 or EW60 glass cloth.
During using glass cloth described above, the adhesion promoters that 2~6g is coated with per 100g glass cloth obtain substrate layer, make adhesion promoters
It is distributed in the single or double of glass cloth and fiber therein is wrapped up, makes lamelliform silicone rubber compound and adhesion promoter
Agent contacts, you can realizes the present invention.
Preferably, the shore OO hardness of the organosilicon thermally conductive sheet of the enhancing is 25-90.The organosilicon that the present invention strengthens
The shore OO hardness of thermally conductive sheet is tested according to standard ASTM D2240.
Preferably, the thickness of the organosilicon thermally conductive sheet of the enhancing is 0.15-5mm.
In the silicone rubber compound, the organopolysiloxane containing vinyl be molecule in containing two or more with
The organopolysiloxane of the vinyl of silicon connection, the position of vinyl can be side base or be located at molecular end and side chain at the same time
On.Preferably, the organopolysiloxane medium vinyl content containing vinyl is 0.03-5%, and 25 DEG C of viscosity is 50-
50000mPa·s。
Organopolysiloxane containing vinyl described in silicone rubber compound can enumerate α, ω-divinyl polydimethyl silicon
Oxygen alkane, the dimethyl silicone polymer of methyl phenyl vinyl siloxy end-blocking, the poly- methyl of dimethylvinyl siloxy end-blocking
The copolymer of phenyl siloxane, the methyl phenyl siloxane of dimethylvinyl siloxy end-blocking and dimethyl siloxane.
The crosslinking agent is hydrogeneous organopolysiloxane, has at least three si-h bonds, and the position of si-h bond in its molecule
It can be side base or at the same time in the molecular end and side chain to put, and be preferably placed on side chain.Preferably crosslinking agent hydrogen content is
0.01%-0.3% (quality), the present invention in hydrogen content be crosslinking agent si-h bond in hydrogen atom mass percent, at 25 DEG C
Viscosity is 10-1000mPas, more preferably 30-300mPas.
Crosslinking agent can enumerate the polymethyl hydrogen siloxane of trimethylsiloxy group end-blocking, the methyl hydrogen of trimethylsiloxy group end-blocking
The methyl hydrogen siloxane and methyl phenyl siloxane of the copolymer of siloxanes and dimethyl siloxane, dimethyl hydrogen siloxy end-blocking
Copolymer, the methyl hydrogen siloxane of dimethyl hydrogen siloxy end-blocking and the copolymer etc. of dimethyl siloxane.
Preferably, the heat filling is magnesia, aluminium oxide, iron oxide, calcium oxide, titanium oxide, silica, nitridation
One or more in aluminium, boron nitride and silicon nitride, the particle diameter of the heat filling are not particularly limited.The heat filling can
Fire-retardant filler, extending fillers etc. are partly or totally replaced with, to meet property requirement.
The platinum catalyst is not particularly limited, and can enumerate the platinum network of platinum micro mist, platinum black, chloroplatinic acid, platinum tetrachloride, alkene
Compound, the platinum complex of carbonyl or the thermoplasticity organic resin powder containing above platinum group catalyst, are preferably platinum catalyst
Or chloroplatinic acid.
Preferably, in the silicone rubber compound, the mole of hydrogen-based and organic poly- silica containing vinyl in crosslinking agent
The ratio between mole of alkane medium vinyl is 0.6~1.
Preferably, the silicone rubber compound includes the following component counted in parts by weight：
It is furthermore preferred that the silicone rubber compound includes the following component counted in parts by weight：
It may be noted that 25 DEG C of the present invention of viscosity is dynamic viscosity value of the material at 25 DEG C.
The beneficial effects of the invention are as follows：The present invention makes silicon rubber by carrying out special pre-treatment to glass cloth reinforcing material
Composition significantly improves after curing with the plunger bond strength of glass cloth reinforcing material, and then improves the durability of sheet material and reliable
Property.
Embodiment
The specific embodiment of the organosilicon thermally conductive sheet that the present invention strengthens and preparation method thereof is given below.
It is used to prepare in embodiment 1~3 in the adhesion promoters and silicone rubber compound of the organosilicon thermally conductive sheet of enhancing
The dosage that the dosage and comparative example of material are used to prepare material in the silicone rubber compound of comparison sheet is shown in Table 1, and unit is
Mass fraction.
Table 1
Embodiment 1
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are
700mPas, hydrogen content are 0.3% (quality), and the organopolysiloxane of hydroxyl is α, alpha, omega-dihydroxy polydimethyl silica
Alkane, the mass percentage of hydroxyl is 0.6%, and 25 DEG C of viscositys are 1000mPas.
In silicone rubber compound, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane,
25 DEG C of viscositys are 100mPas, and the mass percentage of vinyl is 2.5%；Heat filling is the oxygen that average grain diameter is 30 μm
Change aluminium；Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 100mPas, and hydrogen content is 0.2% (quality), and platinum catalyst is
Platinum catalyst.
The preparation method of the organosilicon thermally conductive sheet of enhancing is：
A mixes the Methyl Hydrogen Polysiloxane Fluid and α in adhesion promoters, alpha, omega-dihydroxy polydimethyl siloxane, adds 1000
Part toluene dissolving, obtains treatment fluid；
Glass cloth (0.06mm, Sichuan glass fibre Co., Ltd) marked as EW60 is impregnated in treatment fluid by B
10min, toluene is removed after taking-up in 60 DEG C of dry 30min, obtains substrate layer, and sampling weighing learns that every 100g glass cloth is coated with
2g adhesion promoters；
The component that C is included silicone rubber compound is sufficiently mixed uniformly, obtains mixture, with roll squeezer by mixture with
Substrate layer calendering is compound, mixture is formed thin layer in a side of substrate layer, then cures 15min at 80 DEG C, is increased
Strong organosilicon thermally conductive sheet, thickness 1.0mm, its shore OO hardness is tested with hardometer according to testing standard ASTM D2240
For 70.
Embodiment 2
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are
20mPas, hydrogen content are 0.8% (quality), and the organopolysiloxane of hydroxyl is α, alpha, omega-dihydroxy polydimethyl siloxane,
The mass percentage of hydroxyl is 2%, and 25 DEG C of viscositys are 300mPas.
In silicone rubber compound, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane,
25 DEG C of viscositys are 40000mPas, and the mass percentage of vinyl is 0.2%；Heat filling is the oxygen that average grain diameter is 3 μm
Change aluminium and average grain diameter as 50 μm of aluminium oxide in mass ratio 2：4 are mixed to get；Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, 25 DEG C of viscositys
For 1000mPas, hydrogen content is 0.03% (quality), and platinum catalyst is platinum catalyst.
The preparation method of the organosilicon thermally conductive sheet of enhancing is：
A mixes the Methyl Hydrogen Polysiloxane Fluid and α in adhesion promoters, alpha, omega-dihydroxy polydimethyl siloxane, adds 300
Part isopropanol dissolving, obtains treatment fluid；
Glass cloth (thickness 0.06mm, Sichuan glass fibre Co., Ltd) marked as EW60 is impregnated in processing by B
10min in liquid, isopropanol is removed after taking-up in 60 DEG C of dry 30min, obtains substrate layer, and every 100g glass cloth is learnt in sampling weighing
It is coated with 3g adhesion promoters；
The component that C is included silicone rubber compound is sufficiently mixed uniformly, obtains mixture, with roll squeezer by mixture with
Substrate layer calendering is compound, mixture is formed thin layer in a side of substrate layer, then cures 15min at 85 DEG C, is increased
Strong organosilicon thermally conductive sheet, thickness 1.0mm, its shore OO hardness is tested with hardometer according to testing standard ASTM D2240
For 75.
Embodiment 3
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are
200mPas, hydrogen content are 0.4% (quality), and the organopolysiloxane containing vinyl is the diformazan of trimethylsiloxy group end-blocking
The copolymer of radical siloxane and methyl vinyl silicone, the mass percentage of vinyl is 0.9%, and 25 DEG C of viscositys are
300mPa·s。
In silicone rubber compound, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane,
25 DEG C of viscositys are 1000mPas, and the mass percentage of vinyl is 0.5%；Heat filling is the nitrogen that average grain diameter is 20 μm
Change aluminium；Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 300mPas, and hydrogen content is 0.07% (quality), and platinum catalyst is
Platinum catalyst.
The preparation method of the organosilicon thermally conductive sheet of enhancing is：
A mixes the hydrogeneous organopolysiloxane in adhesion promoters and the organopolysiloxane containing vinyl, adds 600
Part octyl group silicone oil (Jiangxi Hito Chemical Co., Ltd., trade mark H-034) dissolving, obtains treatment fluid；
Glass cloth (thickness 0.05mm, Guangzhou Ka Ben composite materials Co., Ltd) marked as 1080 is impregnated in processing by B
10min in liquid, octyl group silicone oil is removed after taking-up in 80 DEG C of dry 30min, obtains substrate layer, and every 100g glass is learnt in sampling weighing
Cloth is coated with 4g adhesion promoters；
The component that C is included silicone rubber compound is sufficiently mixed uniformly, obtains mixture, with roll squeezer by mixture with
Substrate layer calendering is compound, mixture is formed thin layer in a side of substrate layer, then cures 15min at 85 DEG C, is increased
Strong organosilicon thermally conductive sheet, thickness 1.0mm, its shore OO hardness is tested with hardometer according to testing standard ASTM D2240
For 80.
Embodiment 4
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are
50mPas, hydrogen content are 0.6% (quality).
In silicone rubber compound, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane,
25 DEG C of viscositys are 5000mPas, and the mass percentage of vinyl is 0.35%；Heat filling is that average grain diameter is 20 μm
Aluminium nitride；Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 500mPas, and hydrogen content is 0.06% (quality), platinum catalyst
For platinum catalyst.
The organosilicon heat conduction piece preparation method of enhancing is：
A is by Methyl Hydrogen Polysiloxane Fluid even application to glass cloth (thickness 0.05mm, this composite wood of Guangzhou card marked as 1080
Expect Co., Ltd) on, substrate layer is obtained, sampling weighing learns that every 100g glass cloth is coated with 5g adhesion promoters；
The component that B is included silicone rubber compound is sufficiently mixed uniformly, obtains mixture, with roll squeezer by mixture with
Substrate layer calendering is compound, mixture is formed thin layer in a side of substrate layer, then cures 15min at 85 DEG C, is increased
Strong organosilicon thermally conductive sheet, thickness 1.0mm, its shore OO hardness is tested with hardometer according to testing standard ASTM D2240
For 80.
Comparative example
Contrast thermally conductive sheet is prepared, wherein, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethyl silica
Alkane, is 4000mPas in 25 DEG C of viscositys, the mass percentage of vinyl is 0.5%；Heat filling is that average grain diameter is 3 μm
Aluminium oxide and average grain diameter be 50 μm of aluminium oxide in mass ratio 2：3 are mixed to get；Crosslinking agent is Methyl Hydrogen Polysiloxane Fluid, 25 DEG C
Viscosity is 300mPas, and hydrogen content is 0.07% (quality), and platinum catalyst is platinum catalyst.
Contrast thermally conductive sheet preparation method be：The component that the silicone rubber compound of comparative example is included mixes, and obtains
To mixture, with roll squeezer, by mixture, (0.06mm, Sichuan glass fibre Limited Liability are public with the glass cloth marked as EW60
Department) roll compound, mixture is formed thin layer in a side of glass cloth, curing 15min is carried out at 85 DEG C, obtain pair
Than composite sheet, thickness 1.0mm, its shore OO hardness is tested as 75 with hardometer according to testing standard ASTM D2240.
Testing example
The organosilicon thermally conductive sheet prepared to embodiment 1~4 and comparative example is tested for the property, including thermal conductivity factor,
Tensile strength, tearing strength, breakdown voltage, test and performance data are shown in Table 2, and test on organosilicon thermally conductive sheet silastic-layer with
The bonding strength of glass cloth, test method are：180 DEG C of disbonded test measure bond strengths, sample ruler are carried out with reference to JIS K6259
Very little is 25mm*200mm, and the organosilicon thermally conductive sheet of the enhancing for the present invention, and the glass of 10mm is reserved at the end to be held of sample
The thermally conductive sheet that glass cloth is not pre-processed and prepared, in order to test, test data is shown in Table 2.
The organosilicon thermally conductive sheet performance data that table 2 strengthens
From the data in table 2, it can be seen that the present invention is by carrying out glass cloth reinforcing material special pre-treatment, then it is for composite and solid
Change obtains thermally conductive sheet, and base material is combined with layer of silica gel by adhesion promoters in the thermally conductive sheet, and bonding strength significantly improves, can
Be effectively improved the durability and reliability of thermally conductive sheet, meet heat conduction in practical application to heat dissipation interface material, mechanical property and
The requirement of reliability, comprehensive performance protrudes, and preparation method is simple, and application prospect is wide.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention rather than the present invention is protected
The limitation of scope.It will be understood by those of skill in the art that some deductions can be carried out to technical scheme or are waited
With replacing, without departing from the spirit and scope of technical solution of the present invention.
Claims (9)
1. a kind of preparation method of the organosilicon thermally conductive sheet of enhancing, comprises the following steps：
A, adhesion promoters are coated on glass cloth, obtain substrate layer, the adhesion promoters include hydrogeneous organic poly- silica
Alkane；The hydrogeneous organopolysiloxane is the organopolysiloxane containing two or more hydrogen-baseds being connected with silicon；
B, by the silicone rubber compound including the organopolysiloxane containing vinyl, crosslinking agent, heat filling and platinum catalyst
Component mixes, and obtains mixture, and mixture and substrate layer are rolled compound, the organosilicon thermally conductive sheet strengthened after curing.
2. the preparation method of the organosilicon thermally conductive sheet strengthened as claimed in claim 1, it is characterised in that described hydrogeneous organic poly-
The hydrogen content of siloxanes is 0.3-1% (quality), is 10-1000mPas in 25 DEG C of viscositys.
3. the preparation method of the organosilicon thermally conductive sheet strengthened as claimed in claim 1, it is characterised in that the adhesion promoters
Further include the organopolysiloxane of hydroxyl or the organopolysiloxane containing vinyl.
4. the preparation method of the organosilicon thermally conductive sheet strengthened as claimed in claim 3, it is characterised in that the adhesion promoters
Organopolysiloxane including hydroxyl, in adhesion promoters, the hydroxy radical content of the organopolysiloxane of hydroxyl is 0.6-8%
(quality), is 10-1000mPas in 25 DEG C of viscositys.
5. the preparation method of the organosilicon thermally conductive sheet strengthened as claimed in claim 4, it is characterised in that the hydroxyl has
The ratio between mole of hydrogen-based is 0.3-0.7 in the mole of hydroxyl and hydrogeneous organopolysiloxane in machine polysiloxanes.
6. the preparation method of the organosilicon thermally conductive sheet strengthened as claimed in claim 3, it is characterised in that the adhesion promoters
Including the organopolysiloxane containing vinyl, the contents of ethylene of the organopolysiloxane containing vinyl is 0.3-5% (quality),
It is 50-1000mPas in 25 DEG C of viscositys.
7. the preparation method of the organosilicon thermally conductive sheet strengthened as claimed in claim 6, it is characterised in that in adhesion promoters,
The mole of organopolysiloxane medium vinyl containing vinyl is with the ratio between mole of hydrogen-based in hydrogeneous organopolysiloxane
0.3-0.7。
8. the preparation method of the organosilicon thermally conductive sheet such as the enhancing of claim 1-3 any one of them, it is characterised in that the increasing
The shore OO hardness of strong organosilicon thermally conductive sheet is 25-90.
9. the preparation method of the organosilicon thermally conductive sheet such as the enhancing of claim 1-3 any one of them, it is characterised in that the silicon
Rubber composition includes the following component counted in parts by weight：
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| CN105860540A (en) * | 2016-05-11 | 2016-08-17 | 强新正品（苏州）环保材料科技有限公司 | Manufacturing method of enhanced heat-conductive silica gel |
| CN109844048B (en) * | 2016-10-14 | 2021-10-15 | 信越化学工业株式会社 | Heat-conductive composite silicone rubber sheet and method for producing same |
| CN107283882A (en) * | 2017-07-06 | 2017-10-24 | 东莞市森捷数控设备有限公司 | Heat conductive silica gel pad calendaring line |
| CN107471784A (en) * | 2017-08-07 | 2017-12-15 | 苏州佰旻电子材料科技有限公司 | A kind of composite glass fiber heat conductive silica gel pad |
| CN108753261A (en) * | 2018-05-16 | 2018-11-06 | 苏州矽美科导热科技有限公司 | A kind of high-k heat conduction with phase change piece and preparation method thereof |
| CN111267436B (en) * | 2020-01-17 | 2022-10-11 | 江西赛欧特科新材料有限公司 | Organosilicon sun-shading material and preparation method thereof |
| CN112724685B (en) * | 2020-12-28 | 2023-01-17 | 深圳市安品有机硅材料有限公司 | Organic silicon heat-conducting sheet and preparation method thereof |
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