CN105009305A - Resin composition for solar cell sealing materials, master batch for solar cell sealing materials, and solar cell sealing material - Google Patents
Resin composition for solar cell sealing materials, master batch for solar cell sealing materials, and solar cell sealing material Download PDFInfo
- Publication number
- CN105009305A CN105009305A CN201580000288.5A CN201580000288A CN105009305A CN 105009305 A CN105009305 A CN 105009305A CN 201580000288 A CN201580000288 A CN 201580000288A CN 105009305 A CN105009305 A CN 105009305A
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- CN
- China
- Prior art keywords
- solar cell
- encapsulating material
- trapping agent
- inorganic ions
- cell sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004594 Masterbatch (MB) Substances 0.000 title claims description 21
- 239000003566 sealing material Substances 0.000 title abstract 7
- 239000011342 resin composition Substances 0.000 title abstract 4
- 229910001410 inorganic ion Inorganic materials 0.000 claims abstract description 56
- 229920001038 ethylene copolymer Polymers 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 82
- 239000003795 chemical substances by application Substances 0.000 claims description 58
- 229910044991 metal oxide Inorganic materials 0.000 claims description 24
- 150000004706 metal oxides Chemical class 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 11
- 229910019142 PO4 Inorganic materials 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 10
- 239000010452 phosphate Substances 0.000 claims description 10
- 150000003839 salts Chemical class 0.000 claims description 9
- 238000007493 shaping process Methods 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 abstract description 15
- 239000011521 glass Substances 0.000 abstract description 8
- 150000002739 metals Chemical class 0.000 abstract 3
- 239000002516 radical scavenger Substances 0.000 abstract 3
- 230000007774 longterm Effects 0.000 abstract 1
- 229910001463 metal phosphate Chemical class 0.000 abstract 1
- 125000002467 phosphate group Chemical class [H]OP(=O)(O[H])O[*] 0.000 abstract 1
- 239000008393 encapsulating agent Substances 0.000 description 26
- -1 vanadium pentoxide Chemical class 0.000 description 19
- 239000005038 ethylene vinyl acetate Substances 0.000 description 18
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 17
- 238000012360 testing method Methods 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- 229920001577 copolymer Polymers 0.000 description 15
- 238000009413 insulation Methods 0.000 description 14
- 239000002253 acid Substances 0.000 description 12
- 239000006059 cover glass Substances 0.000 description 12
- 230000006978 adaptation Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- 239000002585 base Substances 0.000 description 10
- 239000003431 cross linking reagent Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 9
- 229910000077 silane Inorganic materials 0.000 description 9
- 238000004132 cross linking Methods 0.000 description 8
- 239000004611 light stabiliser Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 6
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000012965 benzophenone Substances 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- WQEVDHBJGNOKKO-UHFFFAOYSA-K vanadic acid Chemical compound O[V](O)(O)=O WQEVDHBJGNOKKO-UHFFFAOYSA-K 0.000 description 4
- 229940117958 vinyl acetate Drugs 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000005341 cation exchange Methods 0.000 description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 230000036571 hydration Effects 0.000 description 3
- 238000006703 hydration reaction Methods 0.000 description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 description 3
- 229960001545 hydrotalcite Drugs 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 150000008301 phosphite esters Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005349 anion exchange Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 150000001767 cationic compounds Chemical group 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 2
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 description 2
- 229910052588 hydroxylapatite Inorganic materials 0.000 description 2
- 229910001411 inorganic cation Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 2
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 229940070710 valerate Drugs 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- OMWSZDODENFLSV-UHFFFAOYSA-N (5-chloro-2-hydroxyphenyl)-phenylmethanone Chemical compound OC1=CC=C(Cl)C=C1C(=O)C1=CC=CC=C1 OMWSZDODENFLSV-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- ZHKBLALOBMBJLL-UHFFFAOYSA-N 1-hexylperoxyhexane Chemical group CCCCCCOOCCCCCC ZHKBLALOBMBJLL-UHFFFAOYSA-N 0.000 description 1
- HEJCZAMFVMNFLC-UHFFFAOYSA-N 10-oxo-10-(2,2,6,6-tetramethylpiperidin-4-yl)oxydecanoic acid Chemical compound CC1(C)CC(OC(=O)CCCCCCCCC(O)=O)CC(C)(C)N1 HEJCZAMFVMNFLC-UHFFFAOYSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- STHGLRYNMROMHZ-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)-11-methyl-3-(8-methylnonyl)dodecane-1,3-diol Chemical compound C(CCCCCCC(C)C)C(O)(C(CO)(CO)CO)CCCCCCCC(C)C STHGLRYNMROMHZ-UHFFFAOYSA-N 0.000 description 1
- QWQNFXDYOCUEER-UHFFFAOYSA-N 2,3-ditert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1C(C)(C)C QWQNFXDYOCUEER-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- IEMHIOUNBGZEAG-UHFFFAOYSA-N 4-tert-butyl-2-(5-chlorobenzotriazol-2-yl)phenol Chemical compound CC(C)(C)C1=CC=C(O)C(N2N=C3C=C(Cl)C=CC3=N2)=C1 IEMHIOUNBGZEAG-UHFFFAOYSA-N 0.000 description 1
- QLZINFDMOXMCCJ-UHFFFAOYSA-N 7-(7-hydroxyheptylperoxy)heptan-1-ol Chemical compound OCCCCCCCOOCCCCCCCO QLZINFDMOXMCCJ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- MUPIEMDDBGZNRU-UHFFFAOYSA-N C(C)(C)C(=O)O.C(C)(C)(C)OO Chemical compound C(C)(C)C(=O)O.C(C)(C)(C)OO MUPIEMDDBGZNRU-UHFFFAOYSA-N 0.000 description 1
- ZLERYKNHRBBDMH-UHFFFAOYSA-N C(OCC(CCCC)CC)(OC(C)(C)OOCCCC)=O.C(C)(C)(C)OO Chemical compound C(OCC(CCCC)CC)(OC(C)(C)OOCCCC)=O.C(C)(C)(C)OO ZLERYKNHRBBDMH-UHFFFAOYSA-N 0.000 description 1
- PQBRZGOVIXSTBR-UHFFFAOYSA-N CCC(C[PH2]=O)(CCCC)CC Chemical compound CCC(C[PH2]=O)(CCCC)CC PQBRZGOVIXSTBR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 239000003508 Dilauryl thiodipropionate Substances 0.000 description 1
- WEEGYLXZBRQIMU-UHFFFAOYSA-N Eucalyptol Chemical compound C1CC2CCC1(C)OC2(C)C WEEGYLXZBRQIMU-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- ZNRPKTMOAASBNJ-UHFFFAOYSA-N [Bi+5] Chemical compound [Bi+5] ZNRPKTMOAASBNJ-UHFFFAOYSA-N 0.000 description 1
- QYIJPFYCTROKTM-UHFFFAOYSA-N [Sn].P(O)(O)(O)=O Chemical compound [Sn].P(O)(O)(O)=O QYIJPFYCTROKTM-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- SERVIVNXSHBTLC-UHFFFAOYSA-N acetic acid;2-hydroperoxy-2-methylpropane Chemical class CC(O)=O.CC(C)(C)OO SERVIVNXSHBTLC-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 235000019593 adhesiveness Nutrition 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910001420 alkaline earth metal ion Inorganic materials 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000001449 anionic compounds Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000008485 antagonism Effects 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 1
- ZDINGUUTWDGGFF-UHFFFAOYSA-N antimony(5+) Chemical compound [Sb+5] ZDINGUUTWDGGFF-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- SODJJEXAWOSSON-UHFFFAOYSA-N bis(2-hydroxy-4-methoxyphenyl)methanone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1O SODJJEXAWOSSON-UHFFFAOYSA-N 0.000 description 1
- SXXILWLQSQDLDL-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=CC=C1 SXXILWLQSQDLDL-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(III) oxide Inorganic materials O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 1
- SFOQXWSZZPWNCL-UHFFFAOYSA-K bismuth;phosphate Chemical compound [Bi+3].[O-]P([O-])([O-])=O SFOQXWSZZPWNCL-UHFFFAOYSA-K 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexyloxide Natural products O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- VLWUKSRKUMIQAX-UHFFFAOYSA-N diethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[SiH](OCC)CCCOCC1CO1 VLWUKSRKUMIQAX-UHFFFAOYSA-N 0.000 description 1
- 235000019304 dilauryl thiodipropionate Nutrition 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical compound C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 1
- VKLYZBPBDRELST-UHFFFAOYSA-N ethene;methyl 2-methylprop-2-enoate Chemical compound C=C.COC(=O)C(C)=C VKLYZBPBDRELST-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 1
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 239000005043 ethylene-methyl acrylate Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000000413 hydrolysate Substances 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910001412 inorganic anion Inorganic materials 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- DTSDBGVDESRKKD-UHFFFAOYSA-N n'-(2-aminoethyl)propane-1,3-diamine Chemical compound NCCCNCCN DTSDBGVDESRKKD-UHFFFAOYSA-N 0.000 description 1
- KWUZCAVKPCRJPO-UHFFFAOYSA-N n-ethyl-4-(6-methyl-1,3-benzothiazol-2-yl)aniline Chemical compound C1=CC(NCC)=CC=C1C1=NC2=CC=C(C)C=C2S1 KWUZCAVKPCRJPO-UHFFFAOYSA-N 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- CSWFWSPPZMEYAY-UHFFFAOYSA-N octadecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(O)O CSWFWSPPZMEYAY-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- CJJMLLCUQDSZIZ-UHFFFAOYSA-N oxobismuth Chemical class [Bi]=O CJJMLLCUQDSZIZ-UHFFFAOYSA-N 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- CIUVRGKEJWGSOZ-UHFFFAOYSA-N phosphoric acid tantalum Chemical compound [Ta].P(O)(O)(O)=O CIUVRGKEJWGSOZ-UHFFFAOYSA-N 0.000 description 1
- 235000013446 pixi Nutrition 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000005518 polymer electrolyte Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- KOODSCBKXPPKHE-UHFFFAOYSA-N propanethioic s-acid Chemical compound CCC(S)=O KOODSCBKXPPKHE-UHFFFAOYSA-N 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- JUWGUJSXVOBPHP-UHFFFAOYSA-B titanium(4+);tetraphosphate Chemical compound [Ti+4].[Ti+4].[Ti+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O JUWGUJSXVOBPHP-UHFFFAOYSA-B 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Photovoltaic Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Abstract
The purpose of the present invention is to provide a resin composition for solar cell sealing materials, which is capable of forming a solar cell sealing material with good resistance to PID, while having good transparency and suppressing decrease of adhesion to a light receiving surface-side protection glass even after long-term use. A resin composition for solar cell sealing materials according to the present invention contains an ethylene copolymer and an inorganic ion scavenger. The inorganic ion scavenger contains one or more compounds that are selected from the group consisting of oxides of pentavalent metals, oxides of hexavalent metals, oxides of heptavalent metals and metal phosphate salts. This resin composition for solar cell sealing materials contains 0.01-0.5 part by weight of the inorganic ion scavenger per 100 parts by weight of the ethylene copolymer.
Description
Technical field
The present invention relates to a kind of encapsulating material for solar cell resin combination of using in the manufacture of encapsulating material for solar cell and encapsulating material for solar cell masterbatch.In addition, the present invention relates to a kind of encapsulating material for solar cell and solar module.
Background technology
From ecological viewpoint, solar power system (below, also referred to as solar cell) be widely used as clean energy resource, and improving solar battery efficiency further, to increase the service life etc. as the technological development of target also advances.
Solar cell is combined by multiple solar module, but the generating element be assembled in solar module is by using the semiconductors such as silicon solar energy is directly converted to electric energy thus generates electricity.But if above-mentioned semiconductor directly contacts with extraneous air, then electricity generate function can reduce, therefore, encapsulating material for solar cell (, also referred to as encapsulant) coated generating element is used to protect below.As above-mentioned encapsulant, at present, from low cost, the transparency and to viewpoints such as the adhesivenesss of generating element, cross-linked ethylene-vinyl acetate resin (, also referred to as EVA) is used below.But because EVA does not have high-insulativity, therefore, the leakage current produced during generating, various ion can move to above-mentioned semiconductor, thus cause dysgenic problem is caused to semiconductor.
In addition, various places are all arranging the large-scale photovoltaic power generation system such as huge solar power plant in recent years, but, be the conduction loss reducing generation current, system voltage be increased to the Towards Higher Voltage technology that about 600 ~ 1000V carries out carrying again and advance.Due to above-mentioned Towards Higher Voltage, the framework in solar module and the potential difference between semiconductor is caused to become large.In addition, the cover glass of sensitive surface side is compared with encapsulant, and its specific insulation is lower; therefore; between generating element and the cover glass of sensitive surface side, its potential difference also becomes large, thus constructs the environment be easy to semiconductor element direction conduction current.In addition, due to Towards Higher Voltage, the Na composition contained in glass is as Na
+and dissociate.And, above-mentioned Na
+to in glass, the direction of glass/encapsulant and encapsulant/semiconductor element moves, along with passage of time, Na
+in the accumulation of generating element surface, the degradation phenomena of the electronics movement hindering semiconductor element can be produced.In addition, Na
+can separate out at each interface time mobile, thus produce the degradation phenomena of the guard block sur-face peelings such as encapsulant.The above-mentioned solar module that causes due to the Towards Higher Voltage of solar module and semiconductor element be there is deterioration, phenomenon that conversion efficiency is reduced is called PID (potential induced degradation: Potential Induced Degradation) phenomenon.
Although will not improve PID phenomenon as direct object, the research increasing the specific insulation of encapsulant will be carried out.Patent Document 1 discloses the encapsulant that the carbon number being combined with the functional group be directly combined with silicon atom is the silane coupler of less than 4.In addition, in patent documentation 2 and 3, the encapsulant that use ethylene-alpha-olefin copolymer etc. vistanex carrys out alternative EVA is disclosed.In addition, Patent Document 4 discloses the encapsulant of the metakaolin being combined with calcined kaolinite.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 11-54766 publication;
Patent documentation 2: Japanese Unexamined Patent Publication 2006-210906 publication;
Patent documentation 3: No. 2012/046456th, International Publication;
Patent documentation 4: Japanese Unexamined Patent Publication 2013-64115 publication.
Summary of the invention
The problem that invention will solve
But if use vistanex, although specific insulation is high, the effect of additive joined together during owing to manufacturing, makes anti-PID performance step-down, and there is the not enough problem of the transparency in the encapsulant being combined with metakaolin.Therefore, expect that a kind of transparency is superior, and anti-PID is functional, and then the encapsulant that adaptation is superior.
The present invention completes in view of above-mentioned background; its object is to, can the shaping transparency well also can suppress when Long-Time Service and the encapsulating material for solar cell resin combination of the reduction of the adaptation of sensitive surface side cover glass and anti-PID encapsulating material for solar cell of good performance and encapsulating material for solar cell masterbatch and encapsulating material for solar cell even if provide a kind of.
Solve the method for problem
The present inventor etc. study intensively repeatedly, and it found that, can solve above-mentioned problem, thus complete the present invention in following scheme.
[1] an encapsulating material for solar cell resin combination, wherein,
It contains ethylene copolymer and inorganic ions trapping agent, and described inorganic ions trapping agent contains more than one that select from the group be made up of pentavalent metal oxide, sexavalence metal oxide, septivalency metal oxide, phosphate metal salt,
Further, it contains the described inorganic ions trapping agent of 0.01 ~ 0.5 weight portion relative to the described ethylene copolymer of 100 weight portions.
[2] the encapsulating material for solar cell resin combination as recorded in [1], wherein, the average grain diameter of above-mentioned inorganic ions trapping agent is 0.01 ~ 100 μm.
[3] the encapsulating material for solar cell resin combination as recorded in [1] or [2], wherein, above-mentioned pentavalent metal is antimony.
[4] the encapsulating material for solar cell resin combination as recorded in any 1 in above-mentioned [1] ~ [3], wherein, the metal used in above-mentioned phosphate metal salt is at least one selected from zirconium, bismuth, titanium, tin and tantalum.
[5] an encapsulating material for solar cell masterbatch, its encapsulating material for solar cell for the inorganic ions trapping agent ethylene copolymer relative to 100 weight portions being contained to 0.01 ~ 0.5 weight portion carries out shaping, wherein,
It contains ethylene copolymer and inorganic ions trapping agent, and described inorganic ions trapping agent contains more than one that select from the group be made up of pentavalent metal oxide, sexavalence metal oxide, septivalency metal oxide, phosphate metal salt,
Further, it contains the described inorganic ions trapping agent of 0.01 ~ 20 weight portion relative to the described ethylene copolymer of 100 weight portions.
[6] the encapsulating material for solar cell masterbatch as recorded in [5], wherein, it is formed as particle (pellet) shape.
[7] encapsulating material for solar cell, it forms by the mixture containing the encapsulating material for solar cell masterbatch recorded in the encapsulating material for solar cell resin combination recorded in [1] ~ [4] or [5] or [6] is shaping.
[8] solar module of the present invention has the encapsulating material for solar cell recorded in [7].
Invention effect
Inorganic ions trapping agent of the present invention and ethylene copolymer favorable dispersibility, therefore, the transparency and the adaptation of encapsulating material for solar cell of the present invention are good.In addition, encapsulating material for solar cell, owing to having coordinated inorganic ions trapping agent, can catch cation, thus fixing cationic effect is comparatively large, therefore, can improve the insulating properties of encapsulating material for solar cell and obtain good anti-PID performance.
According to the present invention; it a kind of encapsulating material for solar cell resin combination and encapsulating material for solar cell masterbatch can be provided, even if can the shaping transparency well also can suppress when Long-Time Service and the reduction of the adaptation of sensitive surface side cover glass and anti-PID encapsulating material for solar cell of good performance.
Accompanying drawing explanation
Fig. 1 is the schematic diagram in the cross section of the example representing solar module.
Fig. 2 represents the schematic diagram to the cross section that the sample of peeling strength test is described.
Fig. 3 is the schematic diagram in the cross section representing the sample used in anti-PID performance test.
Fig. 4 illustrates the figure being used for representing an example of the Isc value (value of short circuit current) of anti-PID performance test and the I-V curve chart of Pm value (maximum output).
Embodiment
Below, the present invention is described in detail.In addition, in this manual, the record of " more than Arbitrary Digit A, Arbitrary Digit below B " and " Arbitrary Digit A ~ Arbitrary Digit B " is Index A and the scope being greater than several A and number B and be less than the scope of several B.
Encapsulating material for solar cell resin combination of the present invention, containing ethylene copolymer and inorganic ions trapping agent.Encapsulating material for solar cell, with resin combination (below, also referred to as resin combination), uses as encapsulating material for solar cell after being preferably molded into sheet.And then, preferably use a pair encapsulating material for solar cell to clamp generating element, seal (coated), thus, use as the encapsulating material for solar cell forming solar module.
[ethylene copolymer]
In the present invention, ethylene copolymer is the copolymer of the mixture being polymerized two or more monomers.For above-mentioned ethylene copolymer, as long as be vinyl monomer at least one in the monomer that is polymerized, diene monomers, propylene, alpha-olefin etc. also can be made to carry out combined polymerization.Specifically, ethylene-vinyl acetate copolymer (EVA) can be enumerated, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene methyl methacrylate copolymer, ethylene-ethyl methacrylate copolymer, ethene-vinyl acetate system multiple copolymer, ethylene-methyl acrylate system multiple copolymer, ethylene-ethylacrylate system multiple copolymer, ethylene methyl methacrylate system multiple copolymer, ethylene-ethyl methacrylate system multiple copolymer, ethylene-propylene copolymer, ethene-butene-1 copolymer, ethene-4 methyl 1 pentene copolymer, ethene-1-hexene copolymer, ethylene-l-octane copolymer, ethylene-propylene-dicyclopentadiene copolymer, ethylene-propylene-5-ethylidene-2-norbornene copolymer, ethylene-propylene-1, 6-hexadiene copolymer etc.Among those, from the transparency, plyability (stackability) aspect, preferred EVA, more preferably employs the EVA of the vinylacetate of 15 ~ 40 % by weight, preferably employs the EVA of the vinylacetate of 25 ~ 35 % by weight further.
For above-mentioned ethylene copolymer, if from the viewpoint of mouldability, mechanical strength etc., preferred melt flow rate (MFR) (according to JIS K7210) is 0.1 ~ 60g/10 minute, is more preferably 0.5 ~ 45g/10 minute.In addition, melt flow rate (MFR) is also referred to as MFR.
[inorganic ions trapping agent]
In the present invention, being combined with the encapsulant of inorganic ions trapping agent, improving insulation property by increasing specific insulation.And then, because above-mentioned inorganic ions trapping agent can capture the conductive material (ion and free radical etc.) making insulation property and anti-PID performance reduce, therefore, good anti-PID performance can be obtained.For above-mentioned conductive material, the hydrolysate ion (H in ethylene copolymer can be enumerated
+), the Na that produced by glass electrolysis
+ion, metal ion (such as, the Ca derived from stabilizer
2+, Zn
2+, Mg
2+) etc. cation.Inorganic ions trapping agent, such as, capture above-mentioned metal ion, then can generate by ion-exchange reactions and be insoluble in the phosphate metal salt of water, the oxo-anions salt containing metal, therefore, the encapsulant with high specific insulation and good anti-PID performance can be obtained.
Above-mentioned inorganic ions trapping agent preferably shows the insoluble inorganic compound of cation exchange properties in the presence of water.Specifically, it is more than one the compound selected from the group that pentavalent metal oxide, sexavalence metal oxide, septivalency metal oxide, phosphate metal salt form.In addition, pentavalent metal oxide, sexavalence metal oxide and septivalency metal oxide also comprise hydrous oxide.
For above-mentioned pentavalent metal oxide, such as, vanadium pentoxide, hydration vanadium pentoxide, vanadic acid titanium, vanadic acid aluminium, vanadic acid zirconium, phosphorus vanadic acid, vanadium molybdic acid, ferrocyanide vanadium, niobium pentoxide, hydration niobium pentoxide, tantalum pentoxide, hydration tantalum pentoxide, antimony pentaoxide, aqua oxidation antimony (V) can be enumerated.
For above-mentioned sexavalence metal oxide, such as, antimony wolframic acid, metaantimmonic acid titanium, metaantimmonic acid zirconium, metaantimmonic acid tin, tripuhyite, metaantimmonic acid aluminium, metaantimmonic acid chromium, metaantimmonic acid tantalum, metaantimmonic acid manganese, bismuth antimonate, phosphorus metaantimmonic acid, antimony molybdic acid can be enumerated.
For above-mentioned septivalency metal oxide, such as, can enumerate and make alkali metal ion or alkaline-earth metal Ion release and the potassium permanganate, acerdol, permanganic acid aluminium etc. that obtain by acid treatment.
In addition, the mineral of above-mentioned inorganic ions trapping agent preferably containing pentavalent metal oxide, sexavalence metal oxide or septivalency metal oxide.As concrete example, can enumerate and native antimony ore and antimony bloom ore etc. are pulverized, form the mode of powder.
For above-mentioned phosphate metal salt, such as, basic zirconium phosphate, bismuth phosphate, titanium phosphate, phosphoric acid tin, phosphoric acid tantalum etc. can be enumerated.As the metal of phosphate metal salt, at least one metal preferably selected from zirconium, bismuth, titanium, tin and tantalum.
Inorganic ions trapping agent can be used alone a kind or use in conjunction with two or more.
Above-mentioned inorganic ions trapping agent, not containing the compound mainly carrying out anion exchange.As the inorganic ions trapping agent carrying out anion exchange, such as, hydrotalcite, plumbous hydroxyapatite, cadmium hydroxyapatite, hydrotalcite, bismuth trioxide, five bismuth oxides, aqua oxidation bismuth (III), aqua oxidation bismuth (V) and aqua oxidation bismuth nitrate (III) etc. can be enumerated.But, as long as in the scope that can solve problem of the present invention, do not hinder and above-claimed cpd be combined.
The average grain diameter of above-mentioned inorganic ions trapping agent is preferably 0.1 ~ 100 μm, is more preferably 0.1 ~ 50 μm, more preferably 0.1 ~ 30 μm.By average grain diameter being located in the scope of 0.1 ~ 100 μm, the capturing efficiency of conductive material and the higher encapsulant of adaptation can be obtained.In addition, average grain diameter is that enlarged photograph (thousand times ~ about 10,000 times) according to electron microscope is averaged to the particle diameters of about 10 ~ 20 and the numerical value obtained.
For above-mentioned inorganic ions trapping agent, preferably relative to 100 weight portions ethylene copolymer and coordinate the inorganic ions trapping agent of 0.01 ~ 5 weight portion, more preferably coordinate the inorganic ions trapping agent of 0.01 ~ 1 weight portion, preferably coordinate the inorganic ions trapping agent of 0.1 ~ 0.5 weight portion further.By coordinating the inorganic ions trapping agent of 0.01 ~ 5 weight portion, being easier to meet the transparency of high level and anti-PID performance simultaneously, making the more difficult reduction of adaptation.In addition, by use level is set to below 1 weight portion, its transparency can be improved further, and then, by use level is set to below 0.5 weight portion, the transparency superior especially can be realized.In addition, resin combination also can be the encapsulating material for solar cell masterbatch being combined with inorganic ions trapping agent in high concentration.In the case, preferably relative to 100 weight portions ethylene copolymer and coordinate the inorganic ions trapping agent of 1 ~ 20 weight portion, more preferably coordinate 1 ~ 10 weight portion.Using resin combination as after masterbatch manufactures, if manufacture encapsulant with it, then inorganic ions trapping agent more uniformly can be dispersed in encapsulant.Finally, the inorganic ions trapping agent in encapsulant is preferably 0.01 ~ 1 weight portion relative to the ethylene copolymer of 100 weight portions.
In addition, the BET specific surface area of above-mentioned inorganic ions trapping agent is preferably 5 ~ 200m
2/ g, more preferably 10 ~ 100m
2/ g.By specific area is located at 5 ~ 200m
2in the scope of/g, more can catch conductive material, therefore, can further improve the transparency, and adaptation is more difficult to reduce.
[encapsulating material for solar cell resin combination]
Encapsulating material for solar cell resin combination of the present invention, on the basis containing ethylene copolymer and inorganic ions trapping agent, as any composition, the additives such as crosslinking agent, crosslinking coagent, silane coupler, ultra-violet absorber, light stabilizer, antioxidant, light diffusing agent, wavelength-shifting agent, colouring agent, dispersant and flame retardant can be coordinated.In addition, above-mentioned any composition also can coordinate when manufacturing encapsulant separately.
Above-mentioned crosslinking agent is used to prevent ethylene-vinyl acetate copolymer from issuing heat-dissipating distortion at applied at elevated temperature.The preferred organic peroxide of crosslinking agent.Specifically, such as, t-butylperoxyisopropyl carbonic ester can be enumerated, tert-butyl hydroperoxide 2-ethylhexyl butylperoxyisopropyl carbonate, tert-butyl hydroperoxide acetic acid esters, tert butyl isopropyl benzene peroxide, 2,5-dimethyl-2,5-bis-(t-butyl peroxy) hexane, di-tert-butyl peroxide, 2,5-dimethyl-2,5-bis-(t-butyl peroxy) hexin-3, 2,5-dimethyl-2,5-bis-(t-butyl peroxy) hexane, 1,1-bis-(tertiary hexyl peroxide)-3,3,5-trimethyl-cyclohexanes, 1,1-bis-(t-butyl peroxy) cyclohexane, 1,1-bis-(tertiary hexyl peroxide) cyclohexane, 1,1-bis-(t-amyl peroxy) cyclohexane, 2,2-bis-(t-butyl peroxy) butane, methyl-ethyl-ketone peroxide, 2,5-dimethylhexanyl-2,5-diperoxy benzoic ether, TBHP, to terpane hydrogen peroxide, dibenzoyl peroxide, p-chlorobenzoyl peroxide, tert-butyl hydroperoxide isobutyrate, normal-butyl-4,4-bis-(t-butyl peroxy) valerate, ethyl-3,3-bis-(t-butyl peroxy) butyrate, hydroxyheptyl peroxide, Cyclohexanone peroxides (ジ Network ロ ヘ キ サ ノ ン パ ー オ キ サ イ De), 1,1-bis-(t-butyl peroxy)-3,3,5-trimethyl-cyclohexane, normal-butyl-4,4-bis-(t-butyl peroxy) valerate, and 2,2-bis-(t-butyl peroxy) butane etc.
For crosslinking agent, preferably relative to the ethylene copolymer of 100 weight portions, coordinate 0.05 ~ 3 weight portion.
Above-mentioned crosslinking coagent is for making the cross-linking reaction of crosslinking agent effectively carry out and using.Crosslinking coagent is preferably as the unsaturated compound of polyallyl, polyacrylamide oxo-compound.Specifically, such as, triallyl isocyanuric acid ester, triallyl cyanurate, diallyl phthalate, diallyl fumarate, diallyl maleate, glycol diacrylate, ethylene glycol dimethacrylate and trimethylol-propane trimethacrylate etc. can be enumerated.
For crosslinking coagent, preferably coordinate 0.05 ~ 3 weight portion relative to the ethylene copolymer of 100 weight portions.
The adaptation that above-mentioned silane coupler is used to the cover glass, generating element etc. made sensitive surface side improves.Silane coupler is the compound with the functional group of vinyl, acryloxy and methacryl etc. and the water-disintegrable functional group as alkoxyl.Specifically, such as, vinyl trichlorosilane can be enumerated, vinyl three (β methoxy ethoxy) silane, vinyltriethoxysilane, vinyltrimethoxy silane, γ-methacryloxypropyl trimethoxy silane, β-(3, 4-epoxycyclohexyl) ethyl trimethoxy silane, γ-glycidoxypropyl diethoxy silane, N-β (amino-ethyl) gamma-amino propyl trimethoxy silicane, N-β (amino-ethyl) gamma-amino hydroxypropyl methyl dimethoxysilane, γ aminopropyltriethoxy silane, N-phenyl-gamma-amino propyl trimethoxy silicane, γ-mercaptopropyl trimethoxysilane, and γ-r-chloropropyl trimethoxyl silane etc.
For silane coupler, preferably relative to total 100 weight portion of ethylene copolymer and inorganic ions trapping agent, coordinate 0.05 ~ 3 weight portion.
Above-mentioned ultra-violet absorber is for making weather resistance raising use.The preferred benzophenone based compound of ultra-violet absorber, BTA based compound, triazine based compound, salicylate based compound etc.As concrete example, ESCALOL 567 can be enumerated, 2-hydroxyl-4-methoxyl group-2'-carboxyl benzophenone, 2-hydroxyl-4-octyloxybenzophenone, 2-hydroxyl-4-positive 12-alkoxy benzophenone, 2-hydroxyl-4-n-octadecane oxygen base benzophenone, 2-hydroxyl-4-behzyloxybenzophenone, 2-hydroxyl-4-methoxyl group-5-diphenylsulfone ketone, 2-hydroxyl-5-chlorobenzophenone, 2,4-DihydroxyBenzophenone, 2,2'-dihydroxy-4-methoxy benzophenone, 2,2'-dihydroxy-4,4'-dimethoxy-benzophenone, 2,2', 4,4'-tetrahydroxybenzophenone, 2-(2-hydroxy-5-methyl base phenyl) BTA, 2-(2-hydroxyl-5-tert-butyl-phenyl) BTA, 2-(2-hydroxyl-3,5-3,5-dimethylphenyl) BTA, 2-(2-methyl-4-hydroxy phenyl) BTA, 2-(2-hydroxy-3-methyl-5-tert-butyl-phenyl) BTA, 2-(2-hydroxyl-3,5-bis--tert-butyl-phenyl) BTA, 2-(2-hydroxyl-3,5-3,5-dimethylphenyl)-5-methoxyl group-BTA, 2-(the 2-hydroxyl-3-tert-butyl group-5-aminomethyl phenyl)-5-chlorobenzotriazole, 2-(2-hydroxyl-5-tert-butyl-phenyl)-5-chlorobenzotriazole, 2-[two (2, the 4-3,5-dimethylphenyl)-1,3,5-triazines-2-base of 4,6-]-5-(octyloxy) phenol, 2-(4,6-diphenyl-1,3,5-triazines-2-base)-5-(own oxygen base) phenol, phenyl salicytate and salicylic acid are to octyl phenyl ester etc.
For ultra-violet absorber, preferably coordinate 0.01 ~ 3 weight portion relative to the ethylene copolymer of 100 weight portions.
Above-mentioned light stabilizer is used for weather resistance is improved, and if use with ultra-violet absorber and can further improve weatherability simultaneously.The preferred hindered amine based compound of light stabilizer.As concrete example, dimethyl succinate-1-(2-ethoxy)-4-hydroxyl-2 can be enumerated, 2, 6, 6-tetramethyl piperidine condensation polymer, poly-[{ 6-(1, 1, 3, 3-tetramethyl butyl) amino-1, 3, 5-triazine-2, 4-bis-base } { (2, 2, 6, 6-tetramethyl-4-piperidyl) imino group } hexa-methylene { (2, 2, 6, 6-tetramethyl-4-piperidyl) imino group }], N, two (3-aminopropyl) ethylenediamine-2 of N'-, two [N-butyl-the N-(1 of 4-, 2, 2, 6, 6-pentamethyl-4-piperidyl) amino]-6-chloro-1, 3, 5-triazine condensation product, two (2, 2, 6, 6-tetramethyl-4-piperidyl) sebacate (PVC ス (2, 2, 6, 6-テ foretells ラ メ チ Le-4-ピ ペ リ ジ Le) セ パ レ ー ト), and 2-(3, 5-bis--uncle-4-hydroxybenzyl)-2-n-butylmalonic acid two (1, 2, 2, 6, 6-pentamethyl-4-piperidyl) etc.
For light stabilizer, preferably coordinate 0.01 ~ 3 weight portion relative to the ethylene copolymer of 100 weight portions.
Above-mentioned antioxidant is used for making the stability under high temperature to improve.The preferred single phenol system compound of antioxidant, bis-phenol based compound, polymer electrolyte phenol system compound, chalcogenide compound, phosphoric acid based compound etc.As concrete example, 2,6-, bis--t-butyl-p-cresol can be enumerated, butylated hydroxyanisole (BHA), 2,6-, bis--tert-butyl group-4-ethyl-phenol, 2,2'-methylene-bis--(4-methyl-6-tert-butylphenol), 2,2'-methylene-bis--(4-ethyl-6-tert-butyl phenol), 4,4'-thiobis-(3 methy 6 tert butyl phenol), 4,4'-butylidene-bis--(3 methy 6 tert butyl phenol), 3,9-pair [{ 1,1-dimethyl-2-{ β-(3-tertiary butyl-4-hydroxy-5-aminomethyl phenyl) propionyloxy } ethyl } 2,4,8,10-tetra-oxaspiros] 5,5-hendecanes, 1,1,3-tri--(2-methyl-4-hydroxyl-5-tert-butyl-phenyl) butane, 1,3,5-trimethyl-2,4,6-tri-(3,5-, bis--tertiary butyl-4-hydroxy benzyl) benzene, four-{ methylene-3-(3', 5'-bis--tert-butyl group-4'-hydroxy phenyl) propionic ester } methane, two { (two-4'-hydroxyl-3'-tert-butyl-phenyl of 3,3'-) butyric acid } glycolate, dilauryl thiodipropionate, thio-2 acid myristyl ester, propane thioic acid distearyl ester, triphenyl phosphite, diphenylisodecyl base ester, diisodecyl phenyl phosphite, 4,4'-butylidene-bis--(3-methyl-6-tert butyl phenyl-two-tridecyl) phosphite ester, ring-type neopentane four base two (octadecyl phosphite ester), three-diphenylphosphite, diiso decyl pentaerythritol diphosphites, assorted-10-the phosphinylidyne of 9,10-dihydro-9-oxy is mixed phenanthrene-10-oxide, assorted-10-the phosphinylidyne of 10-(3,5-, bis--tertiary butyl-4-hydroxy benzyl)-9,10-dihydro-9-oxies is mixed phenanthrene-10-oxide, assorted-10-the phosphinylidyne of 10-oxygen in last of the ten Heavenly stems base-9,10-dihydro-9-oxy is assorted luxuriant and rich with fragrance, two (2, the 4-di-tert-butyl-phenyl) phosphite ester of ring-type neopentane four base, ring-type neopentane four base two (2,6-, bis--uncle-aminomethyl phenyl) phosphite ester and 2,2-di-2-ethylhexylphosphine oxide (4,6-tert-butyl-phenyl) octyl group phosphite ester etc.
For antioxidant, preferably coordinate 0.05 ~ 3 weight portion relative to the ethylene copolymer of 100 weight portions.
Encapsulating material for solar cell resin combination of the present invention, can by ethylene copolymer and inorganic ions trapping agent are dropped in the general high shear type such as Henschel mixer or super mixer mixer carry out mixing afterwards, use two rollers, three rollers, adding pressure type kneader, banbury mixers, single-screw intermixing extruder or twin-screw mixer extruder etc. carry out melting mixing thus are extrusion-molded into graininess and obtain.In addition, also can after above-mentioned melting mixing aft-loaded airfoil slabbing, reshaping is graininess.
Encapsulating material for solar cell of the present invention, can make above-mentioned encapsulating material for solar cell resin combination or encapsulating material for solar cell masterbatch be molded into sheet and manufacture by using the general forming machines such as T-shaped mould extruder, calendering formation machine.Above-mentioned shaping time, crosslinking agent, crosslinking coagent, silane coupler, ultra-violet absorber, light stabilizer and antioxidant also can be coordinated shaping to carry out.
The thickness preferably about 0.1 ~ 2mm of above-mentioned encapsulant.
Use Fig. 1 that an example of the structure of solar module of the present invention is described.The solar module of Fig. 1; can by overlapping according to the order of sensitive surface side cover glass 11, encapsulating material for solar cell 12A, generating element 13, encapsulating material for solar cell 12B, back-protective parts 14 from sun side, and carry out heating, crimping to manufacture.
At least in encapsulating material for solar cell 12A, use encapsulating material for solar cell of the present invention.Back-protective parts 14 are preferably glass or hold the sheet material formed of aluminium by pvf film or hold the sheet material etc. formed of aluminium by hydrolytic resistance PETG film.In addition, usually, vacuum laminator can be used to carry out heating, pressurizeing.In addition, solar module of the present invention is not by the restriction of the formation of Fig. 1.
Above-mentioned generating element, can use the silicon system of monocrystalline silicon, polysilicon, amorphous silicon etc.; The various solar cell devices of gallium-arsenic, copper-indium-selenium, cadmium-Di Deng I-V race, II-VI group compound semiconductor system, organic film semiconductor system etc.
Embodiment
, embodiments of the invention are shown further illustrate in detail below, but the present invention being not limited by it.In example, " part " refers to " weight portion ", and " % " refers to " % by weight ".
The raw material used in embodiment is as follows.
< ethylene copolymer >
(A-1) EVA (vinyl acetate content: 28 % by weight, MFR:20g/10 minute)
(A-2) EVA (vinyl acetate content: 33 % by weight, MFR:14g/10 minute)
< inserts >
(B-1) inorganic ions trapping agent (inorganic cation exchange agent, IXE-100 (phosphate laminate), East Asia synthesis society system, average grain diameter: 1.0 μm)
(B-2) inorganic ions trapping agent (inorganic cation exchange agent, IXE-300 (mixture of antimony oxide and metaantimmonic acid slaine), East Asia synthesis society system, average grain diameter: 0.5 μm)
(B-3) hydrous kaolin (east newly changes into society's system, average grain diameter for white bole, ASP-200: 0.4 μm)
(B-4) hydrotalcite (NAOX-91N, field, family industry society system, average grain diameter: 0.15 μm)
(B-5) ion-exchanger (inorganic anion exchanger, IXE-700F, East Asia synthesis society system, average grain diameter: 1.5 μm)
(B-6) bismuth oxide (202827, Japanese Sigma-Aldrich (シ グ マ ア Le De リ ッ チ ジ ャ パ Application) society's system, average grain diameter: 7.0 μm)
(embodiment 1)
[manufacture of encapsulating material for solar cell masterbatch]
(A-1) (B-1) inorganic ions trapping agent of the EVA of 95 parts and 5 part is put into super mixer (Chuan Tianshe (カ ワ タ society) system), temperature be 25 DEG C, the time be the condition of 3 minutes under stir, thus obtain mixture.Then, said mixture is put into double screw extruder (being manufactured by the empty company (Japanese プ ラ コ Application society) in pula), extrude, and use comminutor cutting, thus, obtain encapsulating material for solar cell masterbatch.
In addition, use (A-1) EVA of 91.25 parts, the light stabilizer of 8.75 parts, and obtain stabilizer masterbatch by method same as described above.
In addition, use (A-1) EVA of 85 parts, the crosslinking agent of 5 parts, crosslinking coagent, the silane coupler of 5 parts, and obtain crosslinking agent masterbatch by method same as described above.
[manufacture of encapsulating material for solar cell]
The encapsulating material for solar cell masterbatch that use obtains, stabilizer masterbatch, crosslinking agent masterbatch and (A-1) EVA diluted carry out preparing to reach the ratio that (A-1) EVA is 99.9 parts, (B-1) inorganic ions trapping agent is 0.1 part, thus obtain mixture.Then, after said mixture being put into T-shaped mould extruder, at 110 DEG C of temperature extrusion molding slabbings, thus, the encapsulating material for solar cell that thickness is 0.5mm is made.In addition, the raw material contained by encapsulating material for solar cell is as described below, for the use level of above-mentioned raw materials, carries out coordinating to reach following amount relative to the EVA of 100 weight portions.
(raw material)
Crosslinking agent: 2,5-dimethyl-2,5-bis-(t-butyl peroxy) hexane 0.6 part;
Crosslinking coagent: triallyl isocyanuric acid ester 0.6 part;
Silane coupler: γ-methacryloxypropyl trimethoxy silane 0.6 part;
Light stabilizer: two (3-aminopropyl) ethylenediamine of N, N'--2,4-two [N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidyl) is amino]-6-chloro-1,3,5-triazines condensation product 0.4 part.
[manufacture of solar module]
The encapsulating material for solar cell obtained is used to prepare encapsulating material for solar cell 12A and encapsulating material for solar cell 12B.Then; encapsulating material for solar cell 12A, generating element 13, encapsulating material for solar cell 12B is overlapping in order; and then; as shown in Figure 1; the sensitive surface side cover glass 11 that uses thickness to be 3mm and back-protective parts 14 carry out stacked after, drop in vacuum laminator, under vacuo, carry out heating and pressurize to make encapsulant crosslinked under the condition of 145 DEG C, 17 minutes; thus, solar module is made.In addition, vacuum laminator uses LM-50 × 50-S (Ai Pixi company (エ ヌ ピ ー シ ー society) system).
(embodiment 2 ~ 8, comparative example 1 ~ 5)
Ethylene copolymer in embodiment 1 and inserts are changed to the raw material in table 1 and table 2 and use level, in addition, carry out under the condition identical with embodiment 1, thus, obtain encapsulating material for solar cell and the solar module of embodiment 2 ~ 8 and comparative example 1 ~ 5.In addition, the use level represented in table 1 and table 2 is weight portion.
Table 1
Table 2
[ocular estimate]
With under above-mentioned identical condition (145 DEG C, 17 minutes), use above-mentioned vacuum laminator to carry out heating pressurization with crosslinked encapsulant to the encapsulating material for solar cell obtained, thus, obtain sample.To the sample obtained, use haze meter (BYK Gardner society system) to measure its total light transmittance and mist degree, thus, carry out ocular estimate.
[peel strength]
By measuring peel strength to carry out the evaluation of adaptation.
First, illustrate that Fig. 2 is to be described the manufacture method measuring sample.The encapsulating material for solar cell obtained is used to prepare encapsulating material for solar cell 22.As shown in Figure 2, be the glass plate 21 of 3mm by thickness, encapsulating material for solar cell 22, lift-off processing be that the PETG film 24 of 100 μm is overlapping to obtain laminated body 20 successively facing to fissility sheet 23 below and thickness.Use above-mentioned vacuum laminator, with above-mentioned same condition (145 DEG C, 17 minutes) under heating pressurization is carried out to laminated body 20, thus, crosslinked encapsulant.In addition, the length of fissility sheet is the half of the total length of laminated body 20, and for the part of 60% of laminated body 20 total length, PETG film 24 encapsulating material for solar cell 22 of getting along well touches.
Then, laminated body 20 is cut into the strip that width is 1cm and as sample.By said sample temperature be 23 DEG C, relative humidity leaves standstill 24 hours under being the environment of 50%, then, peeling rate be 100mm/ minute, peel angle measures peel strength under being the condition of 180 °.In addition, above the upside of Fig. 2 is set to, below downside is set to.Peel strength measures according to JIS K6854-2.
[specific insulation]
With under above-mentioned identical condition (145 DEG C, 17 minutes), use above-mentioned vacuum laminator to carry out heating pressurization with crosslinked encapsulant to the encapsulating material for solar cell obtained, thus, obtain sample.To said sample, digital ultra-high resistance/microgalvanometer R8340 (Advantest Corporation (ア De バ Application テ ス ト society) system) is used to measure specific insulation.
[conversion efficiency conservation rate]
For solar module, first, measure I-V characteristic after calculating initial conversion efficiency, above-mentioned solar module is put into and is set as 85 DEG C of temperature, relative humidity (RH) be 85% constant temperature and moisture test machine leave standstill 1000 hours, then use said method calculate conversion efficiency.Then, above-mentioned solar module is put into above-mentioned constant temperature and moisture test machine and leave standstill under the same conditions after 1000 hours again, use said method to calculate conversion efficiency.In addition, conversion efficiency is that the area of maximum output (Pm) by being calculated by incident optical energy and I-V characteristic measurement and generating element calculates.During evaluation, initial conversion efficiency is set to 100, and initial conversion efficiency is set to conversion efficiency conservation rate relative to the ratio of the conversion efficiency after the test of solar module.In the mensuration of I-V characteristic, the characteristic of solar cell somascope DKPVT-30 that the solar simulator MS-180AAA used for solar batteries using oxtail Pai Kusi company (ウ シ オ ス ペ ッ Network ス society) to make and electricity Yan company (DENKEN society) make.In addition, the current value when Isc (short circuit current) obtained by I-V characteristic measurement represents that the voltage in the I-V performance diagram shown in Fig. 4 is 0V.In addition, magnitude of voltage when Voc (open circuit voltage) represents that current value is 0A, Pm (maximum output) represent the maximum of the product of current value and magnitude of voltage.
[anti-PID performance]
Make to carry out PID test with the following method, thus antagonism PID performance is evaluated.First, the solar module shown in construction drawing 3.Specifically; be that the sensitive surface side cover glass 31 of 3mm, encapsulating material for solar cell 32A, generating element 33, encapsulating material for solar cell 32B, back-protective parts 34 are successively after overlap by thickness; with under above-mentioned identical condition; above-mentioned vacuum laminator is used to carry out adding thermo-compressed; thus obtain solar module, and then be fixed on metal framework 35.Then, as shown in Figure 3, using generating element as negative pole, metal framework as positive pole, positive output terminal and negative output terminal are connected up, thus, make sample.Then, for the sample before test, measure its initial I-V characteristic (Isc and Pm) and leakage current, thus, in whole embodiments and comparative example, confirm initial leakage current is 0A.
In addition, I-V characteristic uses solar simulator MS-180AAA used for solar batteries (oxtail Pai Kusi company (ウ シ オ ス ペ ッ Network ス society) system) and characteristic of solar cell somascope DKPVT-30 (electricity Yan company (DENKEN society) system) to measure.
In addition, for leakage current, generating element is set to negative pole, framework is set to positive pole, lead-out terminal is set according to this, and apply the voltage of 1000V, thus, measure the current value flowing to generating element from framework through encapsulant.
Then, under the following conditions PID test is carried out to said sample, thus determine the I-V characteristic after test and leakage current.Pm conservation rate=(the Pm value after initial p m value/test) × 100
(anti-PID experimental condition)
Be 60 DEG C in temperature, under relative humidity is the environment of 85%, apply 1000V voltage, through 96 hours.
In addition, for making PID phenomenon strengthen, said determination is covering sensitive surface side cover glass with water and further basis of improving the potential difference of generating element and sensitive surface side cover glass is carried out.
Table 3
Table 4
Known according to table 3, in an embodiment of the present invention, obtaining specific insulation is 3.56 × 10
15the value of more than Ω m, obtains 10
15the high specific insulation of the order of magnitude.On the other hand, in the comparative example not adding inorganic ions trapping agent of the present invention, specific insulation is 10
14the order of magnitude, known specific insulation the is low order of magnitude.
In addition, by the present embodiment, total light transmittance reaches more than 87%, and obtain the value that haze value is less than 5.21%, its transparency known is superior.That is, known obtain total light transmittance more than 85% and haze value lower than 5.5% good result.On the other hand, in the comparative example not adding inorganic ions trapping agent of the present invention, although all obtain the total light transmittance of more than 87%, for haze value, in comparative example 2,3,5, its result is more than 5.5%.
In addition, known by the present embodiment, peel strength reaches more than 113.2N, obtains the peel strength higher than 110N.On the other hand, in the comparative example not adding inorganic ions trapping agent of the present invention, except the comparative example 1 not adding the additive with ion-catching function, all obtain the result that peel strength is below 110N.
And then known by the present embodiment, the conversion efficiency conservation rate after 2000 hours reaches more than 99.8%, obtains the result more than 99%.On the other hand, in the comparative example not adding inorganic ions trapping agent of the present invention, although the conversion efficiency conservation rate after 2000 hours all remains on about 90%, entirety is lower compared with the present embodiment.
Known according to table 4, the present embodiment has superior anti-PID characteristic.Particularly PID test after Pm conservation rate and leakage current evaluation in, compared with comparative example, obtain superior effect.Specifically, in the present embodiment, the Pm conservation rate after PID test reaches more than 99.0%, and obtains the Pm conservation rate more than 95%.On the other hand, in a comparative example, Pm conservation rate is all lower than 90% (such as, the Pm conservation rate of comparative example 2 is 65.6%, and the Pm conservation rate of comparative example 5 is 8.4%).
In addition, in the present embodiment, the leakage current after PID test is 0.26 below μ A, obtains the result lower than 0.3 μ A.On the other hand, in a comparative example, for the leakage current after PID test, even if also obtain 2.67 μ A in the comparative example 4 that value is minimum, the known leakage current obtaining a high order of magnitude.
In the comparative example 1 not adding the additive with ion-catching function, as shown in table 3, although the transparency, peel strength are superior, have problems in the evaluation after PID test.In addition, known, when employing inorganic ions trapping agent (the having the inorganic ions trapping agent of anion capture function) of the comparative example 2 ~ 5 do not comprised in the present invention, haze value reduces, and adaptation also reduces.In addition, test in post-evaluation at PID, have also been obtained the result being inferior to the present embodiment.
Employing encapsulating material for solar cell resin combination and the encapsulating material for solar cell masterbatch of inorganic ions trapping agent of the present invention by adopting, can provide satisfied: the 1) transparency, 2) adaptation, 3) specific insulation, 4) conversion efficiency conservation rate, 5) PID tests the encapsulant used for solar batteries of the complete characteristic of post-evaluation.
The application advocates that the Japanese patent application laid proposed by January 20th, 2014 is willing to the priority based on No. 2014-008045, is all incorporated to herein disclosed in it.
The explanation of Reference numeral
11: sensitive surface side cover glass;
12A:(sensitive surface side) encapsulating material for solar cell;
Side, the 12B:(back side) encapsulating material for solar cell;
13: generating element;
14: back-protective parts;
20: laminated body;
21: glass plate;
22: encapsulating material for solar cell;
23: fissility sheet;
24: PETG sheet
31: sensitive surface side cover glass;
32A: encapsulating material for solar cell;
32B: encapsulating material for solar cell;
33: generating element;
34: back-protective parts;
35: metal framework;
41:Isc (short circuit current);
42:Voc (open circuit voltage);
43:Pm (maximum output).
Claims (5)
1. an encapsulating material for solar cell resin combination, wherein,
It contains ethylene copolymer and inorganic ions trapping agent, and described inorganic ions trapping agent contains more than one that select from the group be made up of pentavalent metal oxide, sexavalence metal oxide, septivalency metal oxide, phosphate metal salt,
Further, it contains the described inorganic ions trapping agent of 0.01 ~ 0.5 weight portion relative to the described ethylene copolymer of 100 weight portions.
2. encapsulating material for solar cell resin combination as claimed in claim 1, wherein, the average grain diameter of described inorganic ions trapping agent is 0.01 ~ 100 μm.
3. an encapsulating material for solar cell masterbatch, its encapsulating material for solar cell for the inorganic ions trapping agent ethylene copolymer relative to 100 weight portions being contained to 0.01 ~ 0.5 weight portion carries out shaping, wherein,
It contains ethylene copolymer and inorganic ions trapping agent, and described inorganic ions trapping agent contains more than one that select from the group be made up of pentavalent metal oxide, sexavalence metal oxide, septivalency metal oxide, phosphate metal salt,
Further, it contains the described inorganic ions trapping agent of 0.01 ~ 20 weight portion relative to the described ethylene copolymer of 100 weight portions.
4. an encapsulating material for solar cell, it carries out shaping forming to the mixture containing the encapsulating material for solar cell resin combination described in claim 1 or 2 or encapsulating material for solar cell masterbatch according to claim 3.
5. a solar module, it possesses encapsulating material for solar cell according to claim 4.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014008045A JP5648169B1 (en) | 2014-01-20 | 2014-01-20 | Resin composition for solar cell encapsulant and solar cell encapsulant |
| JP2014-008045 | 2014-01-20 | ||
| PCT/JP2015/000186 WO2015107905A1 (en) | 2014-01-20 | 2015-01-19 | Resin composition for solar cell sealing materials, master batch for solar cell sealing materials, and solar cell sealing material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105009305A true CN105009305A (en) | 2015-10-28 |
| CN105009305B CN105009305B (en) | 2017-03-15 |
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ID=52344786
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580000288.5A Active CN105009305B (en) | 2014-01-20 | 2015-01-19 | Encapsulating material for solar cell resin combination, encapsulating material for solar cell masterbatch and encapsulating material for solar cell |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5648169B1 (en) |
| KR (1) | KR101701690B1 (en) |
| CN (1) | CN105009305B (en) |
| SG (1) | SG11201506563TA (en) |
| WO (1) | WO2015107905A1 (en) |
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| CN108778991A (en) * | 2016-04-05 | 2018-11-09 | 东亚合成株式会社 | Ion capturing agent used for solar batteries and encapsulant composition used for solar batteries and solar cell module containing it |
| CN109705773A (en) * | 2018-12-29 | 2019-05-03 | 乐凯胶片股份有限公司 | Polyolefin adhesive film and solar battery |
| CN109705442A (en) * | 2018-12-14 | 2019-05-03 | 宁波能之光新材料科技股份有限公司 | A kind of photovoltaic encapsulation film anti-PID functional agglomerate and preparation method thereof of the clay containing Iraq/Mongolia |
| CN111471405A (en) * | 2020-04-22 | 2020-07-31 | 杭州福斯特应用材料股份有限公司 | Photovoltaic module packaging adhesive film and preparation method thereof |
| CN112824466A (en) * | 2019-11-19 | 2021-05-21 | 杭州福斯特应用材料股份有限公司 | Composition for forming PID (potential induced degradation) resistant packaging adhesive film, PID resistant packaging adhesive film and solar module |
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| CN112898920A (en) * | 2019-11-19 | 2021-06-04 | 杭州福斯特应用材料股份有限公司 | Composition for forming PID (potential induced degradation) resistant packaging adhesive film, PID resistant packaging adhesive film and solar module |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2015138805A (en) | 2015-07-30 |
| KR101701690B1 (en) | 2017-02-01 |
| JP5648169B1 (en) | 2015-01-07 |
| SG11201506563TA (en) | 2015-09-29 |
| KR20160085911A (en) | 2016-07-18 |
| CN105009305B (en) | 2017-03-15 |
| WO2015107905A1 (en) | 2015-07-23 |
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