CN104980860A - Reinforced backplate and method for using the backplate to an acoustic device - Google Patents
Reinforced backplate and method for using the backplate to an acoustic device Download PDFInfo
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- CN104980860A CN104980860A CN201510223859.3A CN201510223859A CN104980860A CN 104980860 A CN104980860 A CN 104980860A CN 201510223859 A CN201510223859 A CN 201510223859A CN 104980860 A CN104980860 A CN 104980860A
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- backboard
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- support layer
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Abstract
The present invention relates to a backplate used on a microphone of a micro electro mechanical system (MEMS). The backplate includes: a conducting layer; a mechanical supporting layer, wherein, the mechanical supporting layer is arranged close to the conducting layer; at least one column, wherein, the at least one column forms a groove of the mechanical supporting layer, and the at least one column is arranged around the backplate; and a material depositing layer, wherein, the material depositing layer is arranged in the groove of the column at least partially. The material depositing layer provides a buffer for a force applied to the at least one column.
Description
Technical field
The application relates to acoustic apparatus, more specifically, relates to the backboard of these equipment.
Background technology
Use various types of acoustic apparatus for many years.A kind of example of acoustic apparatus is microphone.Generally, sound wave is converted to the signal of telecommunication by microphone.Microphone comprises multiple parts sometimes, and described parts comprise MEMS (micro electro mechanical system) (MEMS) and integrated circuit (such as, application-specific integrated circuit (ASIC) (ASIC)).MEMS chip (die) has setting vibrating diaphragm thereon and backboard usually.The change of acoustic energy makes vibrating diaphragm move, and this changes the electric capacity involving backboard, produces the signal of telecommunication thus.MEMS chip is arranged on base or substrate usually together with ASIC, and then the two fences up by covering or covering together.
As described in, backboard is generally used in these equipment.The parts that backboard is normally very sensitive.In some applications, and for the equipment of some type, to testing equipment.Such as, test of dropping is carried out.Dropping in test, backboard and its equipment disposed therein (such as, cell phone or personal computer) drop together.Although this contributes to determining the object whether equipment is suitable for expecting or meets industrial standard, pawn when shaving one's head raw, vibrating diaphragm may be subject to power upwards and contact backboard.When it happens, backboard can be broken.
The method before addressing these and other problems the fragility alleviating backboard is usually successful all not.This has caused some users to be discontented with method representation before these.
Summary of the invention
Describe following method, described method deposition ductile metal or other suitable material to cover the shoulder height of backboard, thus reduce broken or other possibilities damaged.The method cost-effective described in literary composition, be easy to realize and significantly reduce (or alleviating) damage at the length of life backboard of acoustic apparatus (such as microphone).
In a lot of execution mode, the backboard that one is used on MEMS (micro electro mechanical system) (MEMS) microphone comprises: conducting shell; Mechanical support layer, this mechanical support layer is arranged near described conducting shell; At least one post, at least one post described forms the groove of described mechanical support layer, and at least one post described is arranged around the periphery of described backboard; And material deposits, this material deposits is at least partially disposed in the described groove of described post.Described material deposits provides buffering to the power putting at least one post described.
In some respects, described conducting shell is made up of polysilicon.In other side, described mechanical support layer is made up of silicon nitride.
In other example, described backboard also comprises at least one hole, and at least one hole described is arranged through described conducting shell and described mechanical support layer.In some respects, at least one hole described is for providing at least one in transfer voice, earth pressure release and isostasy.
In other example, at least one post described is formed or presents step profile.In some other examples, described power is applied by the vibrating diaphragm of movement.
In some respects, at least one post described is for supporting described silicon nitride layer.In other example, at least one post described comprises multiple post, and described multiple post is spaced apart radially around central axis.
In some respects, described material deposits is ductile metal material.In other example, described ductile metal material is gold.
Accompanying drawing explanation
In order to comprehend present disclosure, with reference to following detailed description and accompanying drawing, wherein:
Figure 1A comprises the stereogram of multiple parts of the microphone according to the various execution mode of the present invention;
Figure 1B comprises the cutaway view of the microphone of the Figure 1A according to each execution mode of the present invention;
Fig. 2 comprises the sectional block diagram of the backboard according to each execution mode of the present invention;
Fig. 3 comprises the vertical view of the backboard of the Fig. 2 according to each execution mode of the present invention.
It will be understood by those skilled in the art that for the sake of simplicity, the element in accompanying drawing is schematic.Also will understand, and may illustrate with specific order of occurrence or describe some action and/or step, but it will be appreciated by those skilled in the art that about this species specificity reality sequentially not necessarily.Also will understand, the term used in literary composition and expression have usual implication, give the implication of these terms and expression, unless proposed specific meanings in addition in literary composition as the respective investigation field for their correspondences.
Embodiment
With reference now to Figure 1A and Figure 1B, MEMS (micro electro mechanical system) (MEMS) microphone 100 comprises substrate 102.Substrate 102 can be the base of any type, such as printed circuit board (PCB).Other example of substrate is possible.
Being arranged at, substrate 102 is MEMS chip 104.MEMS chip 104 comprises vibrating diaphragm 106 and backboard 108.As will be discussed in more detail below, the parts of post (and material layer) supporting back board 108 are backboard 108 provide the structural support effectively.In one aspect, ductile metal is deposited on around post, which reduces the possibility damaging backboard 108.Sound enters microphone 100 by opening 103, and this opening extends through substrate 102.Alternatively, opening 103 can extend through lid or cover 111, the element that this lid or cover covered substrate 102 are arranged on substrate 102 with covering.
When observing in the cross-section, post presents " step profile ".As mentioned above, post helps to support and protection backboard (and forming layer or the film of backboard).Post has such surface, and when vibrating diaphragm is mobile by various power (such as, pressure change huge when microphone drops), vibrating diaphragm may clash into described surface.When not using this method, the destruction to all parts may be there is.
In one aspect, and in order to solve this and other problems, deposition additional materials, with the step profile of reinforced column, performs this to reduce the possibility of (film of composition backboard) film rupture.When vibrating diaphragm clashes into backboard 108, in fact described material provides cushion pad to absorb or the power of dissipation vibrating diaphragm.In these areas, the step profile of post provides reinforcement material layer.
Application-specific integrated circuit (ASIC) (ASIC) 109 is also arranged on substrate 102.ASIC 109 can perform various signal processing function, to mention an example of its purposes.MEMS chip 104 is connected to ASIC108 by wire 110.ASIC 108 is connected to substrate by wire 112.
In an operation example of microphone 100, sound enters opening 103 and mobile vibrating diaphragm 106.The mobile of vibrating diaphragm 106 changes the electric capacity involving backboard 108, produces the signal of telecommunication thus.The signal of telecommunication can be sent to ASIC 109 by wire 110.After ASIC 109 processing signals, the signal processed is sent by wire 112, and this wire is connected to the solder joint on the bottom of substrate 102.Other electronic devices can be connected to these solder joints by user.Such as, microphone can be arranged in cell phone or personal computer, and the appropriate circuitry of these devices can be connected to solder joint.
With reference now to Fig. 2 and Fig. 3, describe an example of the backboard with film, this backboard has step profile and reinforces.Backboard 200 comprises polysilicon layer 202, silicon nitride layer 204 and sound holes 206.
The function of polysilicon layer 202 is that acquisition and perception move the signal of generation by vibrating diaphragm.
The function of silicon nitride layer 204 is mechanical support polysilicon layers 202, and provides vibrating diaphragm to combine by post 210.
The function in hole 206 is to provide transfer voice, earth pressure release and/or isostasy.
Post 210 is that all parts (such as, film and layer) of backboard 200 provides support.In these areas, the silicon nitride layer 204 of post 210 supporting back board 200 and polysilicon layer 202.Post 210 is reinforced by material layer 214.Material layer 214 is the additional materials power be applied on post being provided to buffering.Material for material layer 214 is firm in structure, and reinforces the step profile 216 of backboard 200.In one example, the material for material layer 214 is gold, and gold utensil has good ductility, not easy fracture.Other example of material also can use.Material layer 214 is set to formation ring 218.
Post 210 comprises baffle plate (or surface) 212, and this baffle plate moves along with vibrating diaphragm and clashes into backboard 200 and clash into vibrating diaphragm 220.In other words, once apply energetically, vibrating diaphragm 220 moves and impingement baffles 212 along the direction shown in arrow 222.Use this method, the weakness of step profile is reinforced by material layer 214, to improve reliability.Thus, if vibrating diaphragm 220 clashes into backboard 200, so can not be damaged (such as, backboard 200 can not be broken).
As shown in the figure, post 210 can be arranged to the material reinforced ring 218 around backboard 200.Reinforcement material 214 bumper post 210, thus the impact reducing or eliminate vibrating diaphragm 220.
Describe the preferred embodiment of the present invention in literary composition, comprise and known for inventorly realize best mode of the present invention.Should be appreciated that the execution mode illustrated is only schematic, should not be used for limiting the scope of the invention.
The cross reference of related application
The U.S. Provisional Application the 61/977th that the application's request on April 10th, 2014 submits to, name is called " backboard of reinforcing and the method be used for by this backboard in acoustic apparatus ", the priority of No. 860, the content of this U.S. Provisional Application is included in herein by reference of text.
Claims (11)
1. be used in the backboard on MEMS condenser microphone, described backboard comprises:
Conducting shell;
Mechanical support layer, this mechanical support layer is arranged near described conducting shell;
At least one post, at least one post described forms the groove of described mechanical support layer, and at least one post described is arranged around the periphery of described backboard;
Material deposits, this material deposits is at least partially disposed in the described groove of described post;
Wherein, described material deposits provides buffering to the power putting at least one post described.
2. backboard according to claim 1, wherein, described conducting shell is made up of polysilicon.
3. backboard according to claim 1, wherein, described mechanical support layer is made up of silicon nitride.
4. backboard according to claim 1, described backboard comprises at least one hole further, and at least one hole described is arranged through described conducting shell and described mechanical support layer.
5. backboard according to claim 4, wherein, at least one hole described is for providing at least one in transfer voice, earth pressure release and isostasy.
6. backboard according to claim 1, wherein, at least one post described is formed or presents step profile.
7. backboard according to claim 1, wherein, described power is applied by the vibrating diaphragm of movement.
8. backboard according to claim 1, wherein, at least one post described is for supporting described mechanical support layer.
9. backboard according to claim 1, wherein, at least one post described comprises multiple post, and described multiple post is spaced apart radially around central axis.
10. backboard according to claim 1, wherein, described material deposits is ductile metal material.
11. backboards according to claim 8, wherein, described ductile metal material is gold.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461977860P | 2014-04-10 | 2014-04-10 | |
| US61/977,860 | 2014-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104980860A true CN104980860A (en) | 2015-10-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510223859.3A Pending CN104980860A (en) | 2014-04-10 | 2015-04-08 | Reinforced backplate and method for using the backplate to an acoustic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104980860A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2567251A (en) * | 2017-10-05 | 2019-04-10 | Cirrus Logic Int Semiconductor Ltd | MEMS devices and processes |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070291964A1 (en) * | 2006-06-20 | 2007-12-20 | Industrial Technology Research Institute | Miniature acoustic transducer |
| CN102124755A (en) * | 2008-08-27 | 2011-07-13 | 欧姆龙株式会社 | Capacitive vibration sensor |
| CN102405654A (en) * | 2009-04-20 | 2012-04-04 | 楼氏电子亚洲有限公司 | Microphone |
-
2015
- 2015-04-08 CN CN201510223859.3A patent/CN104980860A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070291964A1 (en) * | 2006-06-20 | 2007-12-20 | Industrial Technology Research Institute | Miniature acoustic transducer |
| CN102124755A (en) * | 2008-08-27 | 2011-07-13 | 欧姆龙株式会社 | Capacitive vibration sensor |
| CN102405654A (en) * | 2009-04-20 | 2012-04-04 | 楼氏电子亚洲有限公司 | Microphone |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2567251A (en) * | 2017-10-05 | 2019-04-10 | Cirrus Logic Int Semiconductor Ltd | MEMS devices and processes |
| US10623852B2 (en) | 2017-10-05 | 2020-04-14 | Cirrus Logic, Inc. | MEMS devices and processes |
| GB2567251B (en) * | 2017-10-05 | 2021-10-27 | Cirrus Logic Int Semiconductor Ltd | MEMS devices and processes |
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Application publication date: 20151014 |
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